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| 2021 | Determination of the filler distribution in an epoxy molding compound using high-resolution X-ray computed tomography
Topal, Emre; Gluch, Jürgen; Clausner, André; Cardoso, Andre; Zschech, Ehrenfried | Journal Article |
| 2021 | Packaging Technologies in Power Electronic Modules @Fraunhofer IISB
Bayer, Christoph Friedrich | Presentation |
| 2020 | A Compact SiC Power Module for Vienna Rectifiers with Bus-bar like Structure
Zhao, C.; Wang, L.; Yang, F.; Zhang, H.; Gan, Y.; Bayer, Christoph Friedrich | Conference Paper |
| 2020 | Investigations on the influence of beam shaping in laser transmission welding of multi-layer polymer films with wavelength-adapted diode laser beam sources
Brosda, Maximilian; Nguyen, Nam Phong Andrej; Olowinsky, Alexander; Gillner, Arnold | Conference Paper |
| 2019 | High-Temperature packaging for sensors
Rebenklau, Lars; Gierth, Paul; Barth, Henry | Conference Paper |
| 2018 | Analysis, design and experimental evaluation of sub-THz power amplifiers based on GaAs metamorphic HEMT technology
Amado Rey, Ana Belén
: Paul, Oliver; Ambacher, Oliver; Campos-Roca, Y. | Dissertation |
| 2018 | Effect of low-energy e-beam irradiation on presterilized COC packaging
Kleinmann, Stefan; Haag, Werner; Weidauer, André | Journal Article |
| 2018 | Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators
Herter, Jonas; Wunderlich, V.; Janeczka, C.; Zamora, V. | Journal Article |
| 2017 | Hetero-integrated GaN MMICs: Hot Islands in a (Silicon) Ocean...
Quay, Rüdiger; Brueckner, Peter; Tessmann, Axel; Ture, Erdin; Schwantuschke, Dirk; Dammann, Michael; Waltereit, Patrick | Conference Paper |
| 2017 | Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas | Conference Paper |
| 2017 | Starch based particle foam for biodegradable packaging
| Journal Article |
| 2016 | LTCC - packaging of a laser optical system for harsh environments
Ihle, Martin; Ziesche, Steffen; Beckert, Erik; Hornaff, Marcel | Conference Paper |
| 2016 | NDE applications in microelectronic industries
Meyendorf, Norbert; Oppermann, Martin; Krüger, Peter; Röllig, Mike; Wolter, Klaus-Jürgen | Conference Paper |
| 2015 | Strategies and trends in packaging logistics for industry and retail
Lange, Volker | Book Article |
| 2015 | Thermal simulation of paralleled SiC PiN diodes in a module designed for 6.5 kV/1 kA
Bayer, Christoph Friedrich; Bär, Eberhard; Kallinger, Birgit; Berwian, Patrick | Conference Paper |
| 2014 | A 600 GHz low-noise amplifier module
Tessmann, A.; Leuther, A.; Massler, H.; Hurm, V.; Kuri, M.; Zink, M.; Riessle, M.; Stulz, H.P.; Schlechtweg, M.; Ambacher, O. | Conference Paper |
| 2014 | A broadband 220-320 GHz medium power amplifier module
Tessmann, A.; Leuther, A.; Hurm, V.; Massler, H.; Wagner, S.; Kuri, M.; Zink, M.; Riessle, M.; Stulz, H.-P.; Schlechtweg, M.; Ambacher, O. | Conference Paper |
| 2014 | Characterization of AlGaN/GaN-on-Si HFETs in high-power converter applications
Weiss, B.; Reiner, R.; Quay, R.; Waltereit, P.; Müller, S.; Benkhelifa, F.; Mikulla, M.; Schlechtweg, M.; Ambacher, O. | Conference Paper |
| 2014 | Increasing the lifetime of electronic packaging by higher temperatures: Solders vs. silver sintering
Hutzler, Aaron; Tokarski, Adam; Kraft, Silke; Zischler, Sigrid; Schletz, Andreas | Conference Paper |
| 2013 | A 243 GHz LNA module based on mHEMT MMICs with integrated waveguide transitions
Hurm, V.; Weber, R.; Tessmann, A.; Massler, H.; Leuther, A.; Kuri, M.; Riessle, M.; Stulz, H.P.; Zink, M.; Schlechtweg, M.; Ambacher, O.; Närhi, T. | Journal Article |
| 2013 | Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates
Poller, T.; Lutz, J.; Boettge, B.; Knoll, H. | Conference Paper |
| 2013 | Defect analysis using high throughput plasma FIB in packaging reliability investigations
Altmann, F.; Klengel, S.; Schischka, J.; Petzold, M. | Conference Paper |
| 2013 | Extending the power cycling lifetime of SiC diodes (by increased cooling temperatures)
Hutzler, Aaron; Schletz, Andreas; Tokarski, Adam | Presentation |
| 2012 | Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Journal Article |
| 2012 | A microwave curing system for microelectronics assembly
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2011 | Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2011 | mikroMontage
: Schlenker, Dirk (Tagungsleitung) | Conference Proceedings |
| 2011 | Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris | Conference Paper |
| 2010 | Advances in the design and test of a novel open ended microwave oven
Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris | Conference Paper |
| 2010 | Evaluation of materials for high temperature IC packaging
Klieber, R.; Lerch, R.G. | Conference Paper |
| 2010 | Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Conference Paper |
| 2010 | Modular microwave-based system for packaging applications
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank | Conference Paper |
| 2010 | Monitoring intravascular pressure with a pulmonary artery pressure sensor system - assembly aspects
Müntjes, J.; Meine, S.; Flach, E.; Görtz, M.; Hartmann, R.; Schmitz-Rode, T.; Trieu, H.-K.; Mokwa, W. | Conference Paper |
| 2010 | Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y. | Conference Paper |
| 2009 | A 300 GHz mHEMT amplifier module
Tessmann, A.; Leuther, A.; Hurm, V.; Massler, H.; Zink, M.; Kuri, M.; Riessle, M.; Lösch, R.; Schlechtweg, M.; Ambacher, O. | Conference Paper |
| 2009 | Neue Konzepte der Aufbau- und Verbindungstechnik mikrooptischer Systeme
Eberhardt, R.; Beckert, E.; Burkhardt, T.; Mohaupt, M.; Bruchmann, C.; Tünnermann, A. | Conference Paper |
| 2009 | Packaging influence on laser bars of different dimensions
Westphalen, T.; Leers, M.; Werner, M.; Traub, M.; Hoffmann, H.-D.; Ostendorf, R. | Conference Paper |
| 2009 | Packaging, interconnection, assembly - packaging innovations for novel products
Jung, E.; Pötter, H.; John, L.-G. | Journal Article |
| 2009 | Stress measurement on chip level optimizes packaging and assembly of microsystems
Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H. | Journal Article |
| 2008 | A 3-D millimeterwave luggage scanner
Hägelen, M.; Stanko, S.; Essen, H.; Briese, G.; Schlechtweg, M.; Tessmann, A. | Conference Paper |
| 2008 | Assembly of ASICs for high temperature applications - material characterization and reliability testing
Klieber, R.; Trieu, H.-K. | Conference Paper |
| 2008 | Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures
Eichler, M.; Michel, B.; Thomas, M.; Gabriel, M.; Klages, C.-P. | Journal Article |
| 2008 | A high performance 200-GHz broadband experimental radar
Essen, H.; Stanko, S.; Sommer, R.; Wahlen, A.; Brauns, R.; Wilcke, J.; Johannes, W.; Tessmann, A.; Schlechtweg, M. | Conference Paper |
| 2008 | Thermal management in a passively cooled concentrator photovoltaic module
Jaus, Joachim; Hue, Rosalie; Wiesenfarth, Maike; Peharz, Gerhard; Bett, Andreas W. | Conference Paper |
| 2007 | 220 GHz low-noise amplifier MMICs and modules based on a high performance 50 nm metamorphic HEMT technology
Tessmann, A.; Leuther, A.; Massler, H.; Riessle, M.; Kuri, M.; Zink, M.; Reinert, W. | Journal Article |
| 2007 | Reliability testing of wire-bond at high temperature storage
Schelle, B.; Arik, B.; Klieber, R.; Trieu, H.-K. | Conference Paper |
| 2006 | 1.55 mu m Mach-Zehnder modulators on InP for optical 40/80 Gbit/s transmission networks
Klein, H.N.; Chen, H.; Hoffmann, D.; Staroske, S.; Steffan, A.G.; Velthaus, K.O. | Conference Paper |
| 2006 | 220 GHz low-noise amplifier modules for radiometric imaging applications
Tessmann, A.; Leuther, A.; Kuri, M.; Massler, H.; Riessle, M.; Essen, H.; Stanko, S.; Sommer, R.; Zink, M.; Stibal, R.; Reinert, W.; Schlechtweg, M. | Conference Paper |
| 2006 | Global flatness of spatial light modulators
Wagner, M.; Künzelmann, U.; Schenk, H.; Lakner, H. | Conference Paper |
| 2005 | An AlGaN/GaN push-pull HEMT amplifier with 400 MHz bandwidth and 100 W peak output power
Kappeler, O.; Quay, R.; Raay, F. van; Kiefer, R.; Reiner, R.; Walcher, H.; Müller, S.; Mikulla, M.; Schlechtweg, M.; Weimann, G. | Conference Paper |
| 2005 | Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, Torsten; Kallmayer, C. | Conference Paper |
| 2005 | GaN/AlGaN HEMTs for highly linear communication applications in L-frequency band
Quay, R.; Würfl, J.; Wiegner, D.; Fischer, G.; Schubert, C.; Magerl, G. | Conference Paper |
| 2005 | Roboter für die Verpackungstechnik - Automatisches Einschnüren von Pralinenschachteln
Fritsch, D. | Conference Paper |
| 2004 | Determination of residual stress in glass frit bonded MEMS by finite element analysis
Ebert, M.; Bagdahn, J. | Conference Paper |
| 2004 | Tendenzen 2004 - Potenzial liegen bei Handhabungstechnik, Sensorik und Hygienic Design
Kuhn, C.; Huen, E.; Huen, J. | Journal Article |
| 2002 | Application of stacked discharge setups at atmospheric pressure for packaging sterilisation
Heise, M.; Trompeter, F.-J.; Franken, O.; Lierfeld, T.; Neff, W. | Conference Paper |
| 2002 | Investigation of the spatial distribution of current density and heat dissipation in high-power-semiconductor devices
Sauerland, F.; Paschen, U.; Vogt, H. | Conference Paper |
| 2002 | Laser joining of glass with silicon
Witte, R.; Herfurth, H.; Heinemann, S. | Conference Paper |
| 2001 | Micro thermal management of high-power diode laser bars
Lorenzen, D.; Bonhaus, J.; Fahrner, E.; Kaulfersch, E.; Wörner, E.; Koidl, P.; Unger, K.; Müller, D.; Rölke, S.; Schmidt, H.; Grellmann, M. | Journal Article |
| 2000 | Assembly of Ultra Thin and Flexible ICs
Adler, C.; Klink, G.; Feil, M.; Ansorge, F.; Reichl, H. | Conference Paper |
| 2000 | Gewinnung von feinteiligem Brennstoff aus Abfällen
Wilczek, M.; Wolf, C.; Bertling, J.; Kümmel, R. | Conference Paper |
| 2000 | Optoelectronic packaging of arrayed-waveguide grating modules and their environmental stability tests
Ehlers, H.; Biletzke, M.; Kuhlow, B.; Przyrembel, G.; Fischer, U.H.P. | Journal Article |
| 2000 | Recycling of plastics in Germany
Patel, M.; Thienen, N. von; Jochem, E.; Worrell, E. | Journal Article |
| 2000 | Ultra Thin ICs Open New Dimensions for Microelectronic Systems
Klink, G.; Landesberger, C.; Feil, M.; Ansorge, F.; Aschenbrenner,R. | Journal Article |
| 1999 | 40 Gbit/s photoreceiver modules comprising InP-OEICs for RZ and NRZ coded TDM system applications
Bach, H.-G.; Schlaak, W.; Unterborsch, G.; Mekonnen, G.G.; Jacumeit, G.; Ziegler, R.; Steingrüber, R.; Seeger, A.; Engel, T.; Umbach, A.; Schramm, C.; Passenberg, W. | Conference Paper |
| 1999 | Environmental screening of packaging and interconnection technologies
Nissen, F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1999 | Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Mekonnen, G.G.; Jacumeit, G. | Conference Paper |
| 1999 | Vacuum Web Coating of Polymers. An Update on European Collaborative R&D Activities
Langowski, H.-C.; Moosheimer, U. | Conference Paper |
| 1998 | Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits
Krems, T.; Tessmann, A.; Haydl, W.H.; Schmelz, C.; Heide, P. | Conference Paper |
| 1998 | An environmental comparison of packaging and interconnection technologies
Nissen, N.F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1998 | Lichtschutz für Lebensmittel. Partieller Schutz durch UV-Filter in der Verpackung
Rieblinger, K.; Ziegleder, G.; Krug, M. | Journal Article |
| 1998 | Microwave properties of coplanar transmission lines and filters on diamond from 1-120 GHz
Steinhagen, F.; Haydl, W.H.; Krems, T.; Marsetz, W.; Locher, R.; Wild, C.; Koidl, P.; Hülsmann, A.; Kerssenbrock, T.v.; Heide, P. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Verpackte Lebensmittel unter Lichteinfluß. Anfälligkeit komplexer chlorophyllhaltiger Füllgüter
Rieblinger, K.; Ziegleder, G. | Journal Article |
| 1997 | Gesetzliche Anforderungen und Prüfmethoden bei Kartonverpackungen
Haack, G. | Conference Paper |
| 1997 | Modellentwicklung und Modellprüfung zur Kontrolle einer Wiederverwendbarkeit von Kunststoffregranulaten in Bedarfsgegenständen
Huber, M. | Dissertation |
| 1997 | Ökobilanzen zur Verwertung von Kunststoffabfällen aus Sammlungen des Dualen Systems
Heyde, M.; Holley, W.; Kremer, M. | Conference Paper |
| 1997 | PVC-Folien in der Verpackung
Langowski, H.-C. | Conference Paper |
| 1996 | Ansichten und Aussichten. Interview
Holley, W. | Journal Article |
| 1996 | Development of methods of analysis for monomers and other starting substances with SML and/or QM limits in directives 90/128/EEC and 92/39/EEC. 1993-1996. Final report
Franz, R.; Rijk, R. | Report |
| 1996 | Development of Methods of Analysis for Monomers and Other Starting Substances with SML and/or QM Limits in Directives 90/128/EEC and 92/39/EEC. 1993-1996. Final Report
Franz, R.; Rijk, R. | Report |
| 1996 | Development of methods of analysis for monomers and other starting substances with SML and/or QM limits in directives 90/128/EEC and 92/39/EEC. 1993-1996. Final report. Annex I: Analytical methods approved by CEN
Franz, R.; Rijk, R. | Report |
| 1996 | Development of methods of analysis for monomers and other starting substances with SML and/or QM limits in directives 90/128/EEC and 92/39/EEC. 1993-1996. Final report. Annex II: Analytical methods to be approved by CEN
Franz, R.; Rijk, R. | Report |
| 1996 | Development of methods of analysis for monomers and other starting substances with SML and/or QM limits in directives 90/128/EEC and 92/39/EEC. 1993-1996. Final report. Annex III: Feasibility studies and incomplete methods
Franz, R.; Rijk, R. | Report |
| 1996 | Einsatz plasmatechnologischer Prozesse im Bereich der Lebensmittelverpackung
Langowski, H.-C.; Noller, K. | Conference Paper |
| 1996 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H. | Journal Article |
| 1996 | How the migration of multiple compounds can be controlled below the threshold. Functional barriers and diffusion kinetics
Franz, R. | Conference Paper |
| 1996 | Ökobilanzen zur Verwertung von Kunststoffabfällen aus Sammlungen des Dualen Systems
Heyde, M.; Holley, W.; Kremer, M. | Conference Paper |
| 1996 | Verpackung. Materialien, Atmosphären
Hennlich, W. | Book Article |
| 1995 | Active silicon CMOS addressing matrices for light-valve projection displays
Molzow, W.-D.; Brinker, W.; Wirges, W.; Gerhard-Multhaupt, R.; Melcher, R.; Budde, W.; Fiedler, H. | Journal Article |
| 1995 | Aggregierte Sach-Ökobilanzen für Frischmilch- und Bierverpackungen. Tl. 2
Günther, A.; Holley, W. | Journal Article |
| 1995 | Application of impendance methods for corrosion protecting properties of coated substrates in metal packaging
Hollaender, J.; Brandsch, R. | Conference Paper |
| 1995 | Auswirkungen der EU-Gesetzgebung auf Kunststoffverpackungen für Lebensmittel
Höfelmann, M. | Conference Paper |
| 1995 | Barrier coatings for the packaging industry
Utz, H. | Conference Paper |
| 1995 | Biologisch abbaubare Polymere zum Verpacken von Lebensmitteln
Utz, H. | Journal Article |
| 1995 | Die Ergebnisse der Pilot-Ökobilanzen aus der Sicht des Fraunhofer-Instituts
Holley, W. | Journal Article |
| 1995 | Experimental determination of the contamination probability in a Bottelpack machine
Holländer, W.; Windt, H. | Journal Article |
| 1995 | First heterodyne receiver frontend module including a polarization diversity receiver OEIC on InP
Hamacher, M.; Trommer, D.; Heidrich, H.; Albrecht, P.; Jacumeit, G.; Passenberg, W.; Rohle, H.; Schroeter-Janssen, H.; Stenzel, R.; Unterborsch, G. | Journal Article |
| 1995 | Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H. | Conference Paper |
| 1995 | Lebensmittelschutz - Entwicklung und Optimierung insektendichter Faltschachteln und Beutel
Hennlich, W.; Wudtke, A.; Siebrasse, K.; Lenz, J.; Neubecker, K.J. | Journal Article |
| 1995 | Packen wir's ein! Die Realisierung durchgängiger Wertschöpfungsketten im Verpackungsmaschinenbau der SIG schweizerische Industrie-Gesellschaft AG
Gysi, U.; Storn, H.; Zeh, K.-P. | Book Article |
| 1995 | Permeation of flavour compounds across conventional as well as biodegradable polymer films
Franz, R. | Conference Paper |
| 1995 | Reflow properties of electrodeposited PbSn 95/5 solder bumps for FC-assembly
Jung, E.; Zakel, E.; Beutler, U.; Klöser, J.; Reichl, H. | Conference Paper |
| 1995 | Ressourcenproduktivität und Umweltlastenpotentiale von Verwertungsverfahren für gebrauchte Kunststoffe
Holley, W.; Heyde, M. | Conference Paper |
| 1995 | Untersuchung von Kunststoffen für die Verpackung von Lebensmitteln und Arzneimitteln mit Hilfe der Superkritischen Fluid-Extraktion und -Chromatographie sowie eines Bewertungsverfahrens für die spezifische Migration
Bücherl, T. | Dissertation |
| 1994 | Beeinträchtigung der Qualität verpackter Lebensmittel durch verringerten Lichtschutz
Sandmeier, D.; Ziegleder, G. | Journal Article |
| 1994 | Life-cycle analyses of packaging systems
Langowski, H.-C. | Conference Paper |
| 1994 | Packaging and Environment
Ziegahn, K.-F. | Conference Paper |
| 1993 | Branchenübergreifendes Qualitätssicherungssystem "Lebensmittelverpackung"
Müller, K. | Journal Article |
| 1993 | The call for minimizing the use of packaging materials requires new and optimized logistical structures
Frerich-Sagurna, R. | Conference Paper |
| 1993 | Elements of compact architectures for photonic switching
Giglmayr, J. | Conference Paper |
| 1993 | Methodenentwicklung am Fraunhofer-Institut für Lebensmitteltechnologie und Verpackung für reale Verpackungssysteme
Goldhan, G. | Conference Paper |
| 1993 | Multi fiber/chip coupling and optoelectronic integrated circuit packaging based on flip chip bonding techniques
Weber, R.; Fidorra, F.; Hamacher, M.; Heidrich, H.; Jacumeit, G. | Conference Paper |
| 1993 | Neue Verpackungen - neue Lebensmittelqualität?
Rüter, M. | Journal Article |
| 1993 | Transportation stress and packaging. Recent developments in Germany and Europe with special respect to standardization
Ziegahn, K.-F.; Braunmiller, U. | Conference Paper |
| 1993 | Die Verpackungsverordnung. Umsetzung in die Praxis
: Runge, M.; Schricker, G. | Scientific Anthology |
| 1992 | Aseptik-Technologie zur Herstellung verbrauchergerechter Produkte (Neue Verpackung)
Rehmann, D. | Journal Article |
| 1992 | Barriereeigenschaften von aluminiumbedampften Kunststoffolien. Tl.1. Aufgedampfte Aluminiummenge, Oberflächenwiderstand, optische Dichte und Gasdurchlässigkeit
Utz, H. | Journal Article |
| 1992 | Dünne anorganische Schichten für Barrierepackstoffe
Langowski, H.-C.; Utz, H. | Journal Article |
| 1992 | Einfluß von Restlösemitteln aus Verpackungen auf die sensorischen Eigenschaften von Lebensmitteln
Rüter, M. | Journal Article |
| 1992 | Entwicklung neuartiger Umhüllmassen für die Mikroelektronik
Gesang, T.; Hennemann, O.-D. | Journal Article |
| 1992 | Entwicklung neuartiger Umhüllmassen für die Mikroelektronik
Gesang, T.; Hennemann, O.-D. | Journal Article |
| 1992 | Entwicklung von Verpackungen mit ökologisch erweitertem Anforderungsprofil
Holley, W. | Journal Article |
| 1992 | Entwicklung von Verpackungen mit ökologisch erweitertem Anforderungsprofil
Holley, W. | Journal Article |
| 1992 | Ökobilanzen erstellen und anwenden. Entwicklung eines Untersuchungsmodells für die Umweltverträglichkeit von Verpackungen
Möller, F.-J. | Dissertation |
| 1992 | Responsibility for the life-cycles of technical products and their relationship to the environment.
Schmitt, D.; Ziegahn, K.-F. | Journal Article |
| 1992 | Werden Lebensmittel bereits optimal verpackt
Heiss, R. | Journal Article |
| 1991 | Environment and packaging
Möller, F.-J. | Conference Paper |
| 1991 | Recycling von Verpackungen
Braunmiller, U.; Geißler, A.; Ziegahn, K.-F. | Journal Article |
| 1990 | Methode zur zerstörungsfreien Messung der Gasdurchlässigkeit von Verpackungen
Leibl, S.; Ewender, J.; Piringer, O.G. | Journal Article |
| 1990 | Novel stress free assembly technique for micromechanical services.
Offereins, H.L.; Sandmaier, H. | Conference Paper |
| 1990 | Temperaturverteilung auf der Oberfläche von Wärmekontakt-Schweißwerkzeugen in Verpackungsmaschinen
Hohmann, H.J. | Journal Article |
| 1989 | Beitrag der Forschung zur Objektivierung der Verpackungsdiskussion. Neue Strategien, Technologien und Materialien
Bauer, W. | Journal Article |
| 1989 | Beurteilung der Umweltverträglichkeit von Verpackungen. Probleme und Lösungsansätze
Möller, F.-J. | Conference Paper |
| 1989 | Dokumentation und Information im Bereich Verpackung. Der Referatedienst Verpackung: Packaging Science and Technology Abstracts PSTA
Haas, K. | Journal Article |
| 1989 | Forschen für die Verpackung von morgen
Bauer, W. | Journal Article |
| 1989 | Umweltverträglichkeit - neues Kriterium im Verpackungswesen
Bauer, W.; Möller, F.-J. | Journal Article |
| 1989 | Verpackungsmaterialien und Good Manufacturing Practice
Franz, R. | Journal Article |
| 1989 | Weltkonferenz für Verpackungstechnik
Behlau, L. | Journal Article |
| 1988 | Überlegungen zur Umweltverträglichkeit von Verpackungen
Schricker, G.; Möller, F.-J. | Journal Article |
| 1988 | Verpackung und Hygiene. Tl.I
Hennlich, W. | Journal Article |
| 1988 | Verpackung und Hygiene. Tl.II
Hennlich, W. | Journal Article |
| 1988 | Die Verpackung zwischen Ökonomie und Ökologie
Schricker, G. | Journal Article |
| 1987 | Packstoffe - Substitutionslawine durch Umweltdiskussion
Möller, F.-J.; Schricker, G. | Journal Article |