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| 2008 | Packaging aspects of photodetector modules for 100 Gbit/s Ethernet applications
Jiang, C.; Mekonnen, G.G.; Krozer, V.; Johansen, T.K.; Bach, H.-G. | Conference Paper |
| 1998 | The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H. | Conference Paper |
| 1998 | Low thermal resistivity adhesive bonding of ceramic substrates to high performance coolers for the fabrication of power MCMs
Hahn, R.; Hoehne, J.; Schmidt, M.; Reichl, H. | Journal Article |
| 1998 | Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H. | Journal Article |
| 1998 | A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P. | Conference Paper |
| 1998 | Thin-film processing on a thick-film multilayer
Klink, G.; Drost, A.; Schmaus, C.; Bechtold, F.; Feil, M. | Journal Article |
| 1997 | Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | Flip chip technology for multi chip modules
Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H. | Conference Paper |
| 1997 | High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H. | Conference Paper |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Shear test for adhesion measurement of small structures
Schammler, G.; Buschick, K.; Hahn, R.; Reichl, H. | Conference Paper |
| 1997 | A versatile pick and place tool for ultraprecise placement - demonstrated by the application in an advanced MCM-D technology
Gulde, P.; Bornhold, O.; Neumann, G. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1994 | Thinfilm multichip modules - Process development using photosensitive benzocyclobutane
Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A. | Conference Paper |
| 1993 | Multi fiber/chip coupling and optoelectronic integrated circuit packaging based on flip chip bonding techniques
Weber, R.; Fidorra, F.; Hamacher, M.; Heidrich, H.; Jacumeit, G. | Conference Paper |