Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008Packaging aspects of photodetector modules for 100 Gbit/s Ethernet applications
Jiang, C.; Mekonnen, G.G.; Krozer, V.; Johansen, T.K.; Bach, H.-G.
Conference Paper
1998The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H.
Conference Paper
1998Low thermal resistivity adhesive bonding of ceramic substrates to high performance coolers for the fabrication of power MCMs
Hahn, R.; Hoehne, J.; Schmidt, M.; Reichl, H.
Journal Article
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1998A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.
Conference Paper
1998Thin-film processing on a thick-film multilayer
Klink, G.; Drost, A.; Schmaus, C.; Bechtold, F.; Feil, M.
Journal Article