Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Wet chemical single-side emitter etch back for MWT solar cells with AL-BSF and challenges for via paste selection
Spribille, A.; Lohmüller, E.; Thaidigsmann, B.; Hamid, R.; Nussbaumer, H.; Clement, F.; Preu, R.
Conference Paper
2001Innovative direct metallisation of polymer foils for the purposes of additive technology
Schmidt, R.; Hannemann, M.; Scheel, W.; Studzinski, D.; Elkin, B.; Oehr, C.; Lux, T.
Journal Article
1996Self-aligned, fluxless flip-chip bonding technology for photonic devices
Kuhmann, J.F.; Hensel, H.-J.; Pech, D.; Harde, P.; Bach, H.-G.
Conference Paper
1995Barriereeigenschaften aluminiumbedampfter Kunststoffolien
Utz, H.
Dissertation
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article
1995Metallized viscoelastic control layers for light-valve projection displays
Brinker, W.; Wirges, W.; Przyrembel, G.; Gerhard-Multhaupt, R.; Klemberg-Sapieha, J.; Martinu, L.; Poitras, D.; Wertheimer, M.R.
Journal Article
1993A controllable mechanism of forming extremely low-resistance nonalloyed ohmic contacts to group III-V compound semiconductors
Stareev, G.; Kunzel, H.; Dortmann, G.
Journal Article
1993Formation of extremely low resistance Ti/Pt/Au ohmic contacts to p-GaAs
Stareev, G.
Journal Article
1993Shallow junction formation by dopant outdiffusion from CoSi2 and its application in sub 0.5 mu m MOS processes
Niazmand, M.; Friedrich, D.; Windbracke, W.
Conference Paper
1991Impact of metallization techniques on 20 % efficient silicon solar cells
Kopp, J.; Warta, W.; Aberle, A.G.; Glunz, S.; Knobloch, J.
Conference Paper
1990TE/TM mode splitters on InGaAsP/InP
Albrecht, P.; Hamacher, M.; Heidrich, H.; Hoffmann, D.; Nolting, H.; Weinert, C.M.
Journal Article
1988Aluminium - ein vielseitiger Packstoff
Schricker, G.
Journal Article
1987Simultaneous fabrication of very low resistance ohmic contacts to n-InP and p-InGaAs
Kaumanns, R.; Grote, N.; Bach, H.-G.; Fidorra, F.
Conference Paper