Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2008Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications
Jiang, C.; Krozer, V.; Johansen, T.K.; Bach, H-G.; Mekonnen, G-G.; Zhang, R.; Pech, D.
Conference Paper
1997Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H.
Conference Paper
1996Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H.
Conference Paper
1996Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H.
Conference Paper