Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
1997An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1995Reflow properties of electrodeposited PbSn 95/5 solder bumps for FC-assembly
Jung, E.; Zakel, E.; Beutler, U.; Klöser, J.; Reichl, H.
Conference Paper