| | |
|---|
| 2019 | Adhesion Improvement for Solder Interconnection of Wet Chemically Coated Aluminum Surfaces
Rose, Angela de; Kamp, M.; Mikolasch, G.; Kraft, A.; Nowottnick, M. | Conference Paper |
| 2019 | Electrode Design for Wire Interconnected Back Contact Solar Cells
Spribille, A.; Huyeng, J.D.; Schweigstill, T.; Franzetti, I.; Rendler, L.C.; Clement, F. | Conference Paper |
| 2019 | Interconnection of Silicon Heterojunction Solar Cells by Infrared Soldering - Solder Joint Analysis and Temperature Study
Rose, Angela de; Geipel, T.; Eberlein, D.; Kraft, A.; Nowottnick, M. | Conference Paper |
| 2019 | Lead-free Solders for Ribbon Interconnection of Crystalline Silicon PERC Solar Cells with Infrared Soldering
Geipel, Torsten; Eberlein, Dirk; Kraft, Achim | Conference Paper |
| 2019 | Lead-free Solders for Ribbon Interconnection of Crystalline Silicon PERC Solar Cells with Infrared Soldering
Geipel, T.; Eberlein, D.; Kraft, A. | Conference Paper |
| 2018 | Development and analysis of high temperature stable interconnections on thick films using micro resistance welding for sensors and MEMS
Gierth, Paul; Rebenklau, Lars | Conference Paper |
| 2018 | Influence of Interconnection Concepts for IBC Solar Cell Performance by Simulation
Huyeng, J.D.; Spribille, A.; Rendler, L.C.; Ebert, C.; Eitner, U.; Keding, R. | Conference Paper |
| 2018 | Knotting nets. Molecular junctions of interconnecting endocrine axes identified by application of the adverse outcome pathway (AOP) concept
Brüggemann, Maria; Licht, Oliver; Fetter, Éva; Teigeler, Matthias; Schäfers, Christoph; Eilebrecht, Elke | Journal Article |
| 2018 | Mechanical and electrical properties of wave-shaped wires for low-stress interconnection of solar cells
Rendler, L.; Walter, J.; Goldenberg, S.; Beinert, A.J.; Wiese, S.; Eitner, U. | Journal Article |
| 2018 | Solder joint analysis on coated aluminum for silicon solar cell interconnection
Rose, Angela de; Kraft, A.; Eitner, U.; Nowottnick, M. | Conference Paper |
| 2018 | Wave-Shaped Wires Soldered on the Finger Grid of Solar Cells: Solder Joint Stability under Thermal Cycling
Rendler, L.; Haryantho, A.P.; Walter, J.; Huyeng, J.; Kraft, A.; Wiese, S.; Eitner, U. | Conference Paper |
| 2017 | Cell-to-Module (CTM) analysis for photovoltaic modules with shingled solar cells
Mittag, M.; Zech, T.; Wiese, M.; Bläsi, D.; Ebert, M.; Wirth, H. | Conference Paper |
| 2017 | Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics
Geipel, T.; Moeller, M.; Walter, J.; Kraft, A.; Eitner, U. | Journal Article |
| 2017 | Low-temperature soldering for the interconnection of silicon heterojunction solar cells
Rose, Angela de; Erath, D.; Geipel, T.; Kraft, A.; Eitner, U. | Conference Paper |
| 2017 | Multi-segment photovoltaic laser power converters and their electrical losses
Kimovec, R.; Helmers, H.; Bett, A.W.; Topic, M. | Conference Paper |
| 2017 | Qualification of conductive adhesives for photovoltaic application - Accelerated ageing tests
Bauermann, L.P.; Fokuhl, E.; Stecklum, S.; Philipp, D.; Geipel, T.; Kraft, A.; Eitner, U.; Fischer, T.; Breitenbücher, D. | Journal Article, Conference Paper |
| 2017 | Solder interconnection of aluminum foil rear side metallization for passivated emitter and rear solar cells
Rose, Angela de; Kraft, A.; Gledhill, S.; Ali, M.T.; Kroyer, T.; Pscherer, C.; Graf, M.; Nekarda, J.; Eitner, U. | Conference Paper |
| 2017 | Ultra-soft wires for direct soldering on finger grids of solar cells
Rendler, L.C.; Walter, J.; Kraft, A.; Ebert, C.; Wiese, S.; Eitner, U. | Journal Article, Conference Paper |
| 2016 | A comprehensive study of intermetallic compounds in solar cell interconnections and their growth kinetics
Geipel, T.; Moeller, M.; Kraft, A.; Eitner, U. | Journal Article, Conference Paper |
| 2016 | The impact of ribbon properties on measured peel forces
Eitner, U.; Rendler, L.C. | Journal Article, Conference Paper |
| 2016 | Low-temperature interconnection of PVD-aluminium metallization
Geipel, T.; Kumm, J.; Moeller, M.; Kroely, L.; Kraft, A.; Eitner, U.; Wolf, A.; Zhang, Z.; Wolfahrt, P. | Journal Article, Conference Paper |
| 2016 | Mechanical stress in solar cells with multi busbar interconnection - parameter study by FEM simulation
Rendler, L.C.; Kraft, A.; Ebert, C.; Eitner, U.; Wiese, S. | Conference Paper |
| 2015 | Development of integrated interconnected crystalline silicon thin film solar cells
Pavlovic, R.; Lindekugel, S.; Janz, S.; Reber, S. | Journal Article |
| 2014 | A Low Concentration Receiver Concept for Cost Effective Crystalline Back Contact Cells
Ebert, M.; Dörsam, T.; Fellmeth, T.; Hädrich, I.; Eitner, U.; Biro, D.; Wiesenfarth, M.; Noriega, P.; Caparros, S.; Castano, F. | Conference Paper |
| 2013 | Adhesion of Al-Metallization in Ultra-Sonic Soldering on the Al-Rear Side of Solar Cells
Schmitt, P.; Eberlein, D.; Tranitz, M.; Eitner, U.; Wirth, H.; Ebert, C. | Conference Paper, Journal Article |
| 2013 | Electrically Conductive Adhesives-An Emerging Interconnection Technology for High-Efficiency Solar Modules
Geipel, T.; Eitner, U. | Journal Article |
| 2012 | Low temperature interconnection techniques for high efficiency heterojunction solar cells
Rebenklau, L.; Gierth, P.; Partsch, U.; Mehlich, H.; Hausmann, J.; Grimm, M.; Stein, W.; Bell, H.; Clement, C.; Vogg, F. | Conference Paper |
| 2009 | Packaging, interconnection, assembly - packaging innovations for novel products
Jung, E.; Pötter, H.; John, L.-G. | Journal Article |
| 2005 | Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, Torsten; Kallmayer, C. | Conference Paper |
| 2001 | Interconnection Techniques for Ultra Thin ICs and MEMS Elements
Feil, M.; Adler, C.; Klink, G.; König, M. | Conference Paper |
| 1999 | Environmental screening of packaging and interconnection technologies
Nissen, F.; Griese, H.; Middendorf, A.; Müller, J.; Potter, H.; Reichl, H. | Conference Paper |
| 1998 | Thermomechanical behavior of metal contacts and interconnects for information technology
Kaulfersch, E.; Schubert, A.; Michel, B. | Conference Paper |
| 1997 | Kernel/2r. A reference model conformant factory support environment
Deiters, W.; Holtkamp, B.; Weber, H.; Weißenberg, N.; Adomeit, R.; Gera, M.; Jägers, R. | Book Article |
| 1996 | Millimeter-wave performance of chip interconnections using wire bonding and flip chip
Krems, T.; Haydl, W.; Massler, H.; Rüdiger, J. | Conference Paper |
| 1995 | Mechanical bumping for flipchip application
Jung, E.; Nave, J.; Aschenbrenner, R.; Reichl, H.; Zakel, E. | Conference Paper |