Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
202013-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard
Chaudhary, Muhammad Waqas; Heinig, Andy; Choubey, Bhaskar
Conference Paper
2020Application of composite coatings as protection/contacting layers for metallic high-chromium-content SOFC interconnect material
Sauchuk, Viktar; Trofimenko, Nikolai; Megel, Stefan; Rothe, Stefan; Schilm, Jochen; Andritschky, Martin; Hiller, Michael; Goebel, Claudia; Froitzheim, Jan; Kusnezoff, Mihails
Conference Paper
2017Interconnect Corrosion in Steam Containing Fuel Gas
Folgner, Christoph; Sauchuk, Viktar; Megel, Stefan; Kusnezoff, Mihails; Michaelis, Alexander
Conference Paper
2007Contactless EMG sensors embroidered into textile
Linz, Torsten; Gourmelon, L.; Langereis, G.
Conference Paper
2003Three-dimensional simulation of superconformal copper deposition based on the curvature-enhanced accelerator coverage mechanism
Bär, E.; Lorenz, J.; Ryssel, H.
Conference Paper
2002Simulation of the influence of via sidewall tapering on step coverage of sputter-deposited barrier layers
Bär, E.; Lorenz, J.; Ryssel, H.
Journal Article