Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2013Influence of pressure-assisted polymerization on the microstructure and strength of polymer-infiltrated ceramics
Steier, V.F.; Koplin, C.; Kailer, A.
Journal Article
2012Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
Schmidt, C.; Altmann, F.; Breitenstein, O.
Journal Article
2000Low energy proton testing of space electronics at "JULIC"
Henschel, H.; Köhn, O.; Lennartz, W.; Metzger, S.; Boge, H.G.; Bräutigam, W.; Brings, R.; Gad, N.; Probst, H.J.
Conference Paper
1999Application and cost analysis of scatterometry for integrated metrology
Benesch, N.; Schneider, C.; Pfitzner, L.; Ryssel, H.
Conference Paper
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998CMOS sensor systems
Hosticka, B.J.
Conference Paper
1998Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H.
Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1994On-wafer large signal power, S-parameter and waveform measurement system
Demmler, M.; Tasker, P.J.; Schlechtweg, M.
Conference Paper