Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis
Schmidt, C.; Altmann, F.; Breitenstein, O.
Journal Article
2012Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M.
Conference Paper
2008Low noise amplifiers for D-band
Kantanen, M.; Kärkkäinen, M.; Varonen, M.; Laaninen, M.; Karttaavi, T.; Weber, R.; Leuther, A.; Seelmann-Eggebert, M.; Närhi, T.; Lahtinen, J.; Halonen, K.
Journal Article
2006LTCC-based micro-scale PEM fuel cell
Partsch, U.; Goldberg, A.; Stelter, M.
Conference Paper
200240 Gbit/s photoreceiver with DC-coupled output and operation without bias-T
Mekonnen, G.G.; Bach, H.-G.; Schlaak, W.; Steingruber, K.; Seeger, A.; Passenberg, W.; Ebert, W.; Jacumeit, G.; Eckhardt, T.; Ziegler, R.; Beling, A.
Conference Paper
200040 GHz InP-based photoreceiver OEICs: Application for 40 Gb/s TDM systems and beyond
Bach, H.G.; Schlaak, W.; Mekonnen, G.G.; Umbach, A.; Schramm, C.; Unterborsch, G.; Passenberg, W.
Conference Paper
2000InP photoreceiver OEICs for high-speed optical transmission systems
Mekonnen, G.G.; Schlaak, W.; Bach, H.-G.; Engel, T.; Schramm, C.; Umbach, A.
Conference Paper
2000InP-based pin TWA photoreceivers with low group delay scatter over 40 GHz bandwidth
Bach, H.-G.; Schlaak, W.; Mekonnen, G.G.; Seeger, A.; Steingrüber, R.; Schramm, C.; Jacumeit, G.; Ziegler, R.; Umbach, A.; Unterborsch, G.; Passenberg, W.; Ebert, W.; Eckardt, T.
Conference Paper
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Conference Paper
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H.
Conference Paper
1998Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H.
Conference Paper
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1998Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1998Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A.
Conference Paper
1998Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1998Thermo-mechanical analysis of microelectronics components and chipcards
Michel, B.; Vogel, D.
Conference Paper
1998Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H.
Conference Paper
1997FE-Simulation for polymeric packaging materials
Dudek, R.; Scherzer, M.; Schubert, A.; Michel, B.
Conference Paper
1997Flip chip technology for multi chip modules
Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H.
Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H.
Journal Article
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1996Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Conference Paper
1996Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H.
Conference Paper
1996The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A.
Conference Paper
1996Ultrafast monolithically integrated InP-based photoreceiver: OEIC-design, fabrication, and system application
Bach, H.-G.; Umbach, A.; Waasen, S. van; Bertenburg, R.M.; Unterborsch, G.
Journal Article
1995Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J.
Conference Paper
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article