Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2000A selective CMP process for stacked low-k CVD oxide films
Hartmannsgruber, E.; Zwicker, G.; Beekmann, K.
Conference Paper
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Conference Paper
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A.
Conference Paper
1998Low dielectric constant materials for interlayer dielectric
Treichel, H.; Ruhl, G.; Ansmann, P.; Wurl, R.; Müller, C.
Journal Article
1998Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A.
Conference Paper
1997Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1997Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P.
Conference Paper
1996In situ observation of the self-alignment during FC-bonding under vacuum with and without H2
Kuhmann, J.F.; Pech, D.
Journal Article
199550 GHz operation of waveguide integrated photodiode at 1.55 mu m
Umbach, A.; Trommer, D.; Siefke, A.; Unterborsch, G.
Conference Paper
1995Conductivity and reproducibility of e-beam induced deposited tungsten lines
Kohlmann van Platen, K.T.; Schmidt, L.; Brünger, W.H.
Conference Paper