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| 2019 | Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V
Saponara, S.; Ciarpi, G.; Erlbacher, Tobias; Rattmann, Gudrun | Journal Article |
| 2018 | Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried | Conference Paper |
| 2016 | Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried | Conference Paper |
| 2016 | Novel approaches to determine thermomechanical materials data in advanced interconnect stacks
Zschech, Ehrenfried; Gall, Martin; Clausner, André; Sander, Christoph; Sukharev, Valeriy | Conference Paper |
| 2009 | Fracture toughness assessment of patterned Cu-interconnect stacks by dual-cantilever-beam (DCB) technique
Chumakov, Dmytro; Lindert, Frank; Lehr, Matthias U.; Grillberger, Michael; Zschech, Ehrenfried | Journal Article |
| 2004 | Modeling of chemical-mechanical polishing on patterned wafers as part of integrated topography process simulation
Nguyen, P.-H.; Bär, E.; Lorenz, J.; Ryssel, H. | Conference Paper, Journal Article |
| 1999 | Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H. | Conference Paper |
| 1998 | Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A. | Conference Paper |
| 1998 | Interchip via technology-three dimensional metallization for vertically integrated circuits
Bertagnolli, E.; Bollmann, D.; Braun, R.; Buchner, R.; Engelhardt, M.; Grassl, T.; Hieber, K.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Pamler, W.; Popp, R.; Ramm, P.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Sänger, A. | Conference Paper |
| 1998 | Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H. | Journal Article |
| 1998 | Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A. | Conference Paper |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Journal Article, Conference Paper |
| 1997 | Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H. | Journal Article, Conference Paper |
| 1997 | Dielectric materials and insulators for microelectronics
Treichel, H.; Ruhl, G.; Wurl, R.; Ansmann, P.; Müller, O. | Conference Paper |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H. | Conference Paper |
| 1997 | Three dimensional metallization for vertically integrated circuits
Ramm, P.; Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schertel, A.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Sänger, A. | Conference Paper |
| 1997 | Three dimensional metallization for vertically integrated circuits
Bollmann, D.; Braun, R.; Buchner, R.; Cao-Minh, U.; Engelhardt, M.; Errmann, G.; Grassl, T.; Hieber, K.; Hübner, H.; Kawala, G.; Kleiner, M.; Klumpp, A.; Kuhn, S.; Landesberger, C.; Lezec, H.; Muth, W.; Pamler, W.; Popp, R.; Renner, E.; Ruhl, G.; Scheler, U.; Schmidt, C.; Schwarzl, S.; Weber, J.; Weber, W.; Ramm, P.; Sänger, A. | Conference Paper |
| 1997 | Titanium monophosphide (TiP) layers as potential diffusion barriers
Leutenecker, R.; Fröschle, B.; Ramm, P. | Conference Paper |
| 1996 | Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1995 | Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H. | Journal Article |