Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Brazes for extremely high temperatures
Martin, Hans-Peter; Roszeitis, Sven; Matthey, Björn; Herrmann, Marion; Graffé, Marius; Lippmann, Wolfgang; Schmidt, Marcus Peter; Burkhardt, Ulrich; Michaelis, Alexander
Conference Paper
2019Energy coupling of laser radiation on AISI 304 stainless steel: Effect of high temperatures and surface oxidation
Hipp, Dominik; Mahrle, Achim; Beyer, Eckhard
Journal Article
2019Feasibility of 4H-SiC p-i-n diode for sensitive temperature measurements between 20.5 K and 802 K
Matthus, C.D.; Benedetto, L. di; Kocher, M.; Bauer, A.J.; Licciardo, G.D.; Rubino, A.; Erlbacher, T.
Journal Article
2019Improving 5V Digital 4H-SiC CMOS ICs for Operating at 400°C Using PMOS Channel Implantation
Albrecht, M.; Erlbacher, T.; Bauer, A.J.; Frey, L.
Conference Paper
2018Improving the high temperature abrasion resistance of thermally sprayed Cr3C2-NiCr coatings by WC addition
Janka, Leo; Berger, Lutz-Michael; Norpoth, Jonas; Trache, Richard; Thiele, Sven; Tomastik, Christian; Matikainen, Ville; Vuoristo, Petri
Journal Article
2018Inter-fuel substitution in European industry: A random utility approach on industrial heat demand
Rehfeldt, Matthias; Fleiter, Tobias; Worrell, Ernst
Journal Article
2018Technology development and tool concepts for high-temperature forming of titanium
Landgrebe, Dirk; Demmler, Matthias; Albert, Andre`; Schieck, Frank; Weber, Martin
Conference Paper
2017High temperature EEPROM using a differential approach for high reliability
Kappert, Holger; Braun, Sebastian; Alfring, Michael; Kordas, Norbert; Kelberer, Andreas; Dreiner, Stefan; Kokozinski, Rainer
Journal Article, Conference Paper
2017Ta-Ni- and Ti-Al-braze-alloys for high temperature stable ceramic - ceramic junctions
Roszeitis, Sven
Presentation
2017Thermal stability and failure mechanism of schottky gate AlGaN/GaN HEMTs
Mocanu, Manuela; Unger, Christian; Pfost, Martin; Waltereit, Patrick; Reiner, Richard
Journal Article
2016Experimental analysis of the gate-leakage-induced failure mechanism in GaN HEMTs
Unger, C.; Mocanu, M.; Pfost, M.; Waltereit, P.; Reiner, R.
Conference Paper
2016Experimental investigations of TiAl-brazes for ceramic joining
Martin, Hans-Peter; Triebert, Anke
Conference Paper
2016Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2016High temperature GaN gate driver in SOI CMOS technology
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Dreiner, Stefan; Kokozinski, Rainer
Journal Article, Conference Paper
2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
Gabler, Felix; Roscher, Frank; Döring, Ralf; Otto, Alexander; Ziesche, Steffen; Ihle, Martin; Celik, Yusuf; Dietz, Dorothee; Goehlich, Andreas; Kappert, Holger; Vogt, Holger; Naumann, Falk; Geßner, Thomas
Conference Paper
2016Performance evaluation of a proof-of-concept 70 W internal reforming methanol fuel cell system
Avgouropoulos, G.; Schlicker, Sebastian; Schelhaas, Karl-Peter; Papavasiliou, J.; Papadimitriou, K.D.; Theodorakopoulou, E.; Gourdoupi, N.; MacHocki, A.; Ioannides, T.; Kallitsis, J.K.; Kolb, Gunther; Neophytides, S.
Journal Article
2016Potential of 4H-SiC CMOS for high temperature applications using advanced lateral p-MOSFETs
Albrecht, Matthäus; Erlbacher, Tobias; Bauer, Anton J.; Frey, Lothar
Conference Paper
2016Quantification of identical and unique segments in ethylene-propylene copolymers using two dimensional liquid chromatography with infra-red detection
Bhati, Sampat Singh; Macko, Tibor; Brüll, Robert
Journal Article
2016Sliding and abrasive wear behaviour of HVOF- and HVAF-sprayed Cr3C2-NiCr hardmetal coatings
Bolelli, Giovanni; Berger, Lutz-Michael; Börner, Tim; Koivuluoto, Heli; Matikainen, V.; Lusvarghi, Luca; Lyphout, Christophe; Markocsan, Nicolaie; Nylén, Per E.; Sassatelli, Paolo; Trache, Richard; Vuoristo, Petri
Journal Article
2016Using Ion/Ioff to predict switch-based circuit accuracy in an extended temperature range up to 300°C
Tallhage, Jonas; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2015Aging behavior of reactive air brazed seals for SOFC
Pönicke, Andreas; Schilm, Jochen; Kusnezoff, Mihails; Michaelis, Alexander
Journal Article, Conference Paper
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper, Journal Article
2015High temperature SOI CMOS technology and circuit realization for applications up to 300°C
Kappert, Holger; Kordas, Norbert; Dreiner, Stefan; Paschen, Uwe; Kokozinski, Rainer
Conference Paper
2015High-temperature solar organic rankine cycle - annual simulation of various system designs
Hunstock, Björn; Strauch, Sabine; Althaus, Wilhelm; Bülten, Björn; Grob, Johannes; Paucker, Ralf
Conference Paper
2015High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Journal Article, Conference Paper
2015High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Conference Paper
2014Analog circuit design in PD-SOI CMOS technology for high temperatures up to 400 °C using reverse body biasing (RBB)
Schmidt, Alexander
: Kokozinski, Rainer (Gutachter); Fiedler, Horst-Lothar (Gutachter)
Dissertation
2014Comparative study of the dry sliding wear behaviour of HVOF-sprayed WC-(W,Cr)2C-Ni and WC-CoCr hardmetal coatings
Bolelli, G.; Berger, L.-M.; Bonetti, M.; Lusvarghi, L.
Journal Article
2014Evaluation of TFR-characteristics in a wide temperature range
Partsch, Uwe; Lenz, Christian; Wenzel, Marco; Eberstein, Markus
Conference Paper
2014High temperature 0.35 micron Silicon-on-Insulator CMOS technology
Kappert, Holger; Dreiner, Stefan; Kordas, Norbert; Schmidt, Alexander; Paschen, Uwe; Kokozinski, Rainer
Conference Paper
2013Analog performance of PD-SOI MOSFETs at high temperatures using reverse body bias
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013Enhanced high temperature performance of PD-SOI MOSFETs in analog circuits using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Journal Article
2013High temperature analog circuit design in PD-SOI CMOS technology using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013High temperature characterization up to 450°C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2013One-step method for separation and identification of n-alkanes/oligomers in HDPE using high-temperature high-performance liquid chromatography
Mekap, D.; Macko, Tibor; Brüll, Robert; Cong, R.; Groot, A.W. de; Parrott, A.; Yau, W.
Journal Article
2013PD-SOI MOSFET performance optimization for high temperatures up to 400°C using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2012Bulk material heat storage system for high temperatures
Daschner, R.; Ebner, L.; Binder, S.
Conference Paper
2012A cyclic RSD analog-digital-converter for application specific high temperature integrated circuits up to 250°C
Schmidt, Alexander; Kappert, Holger; Heiermann, Wolfgang; Kokozinski, Rainer
Conference Paper
2012Direct integration of carbon nanotubes on CMOS with high-temperature tungsten metallization
Jupe, Andreas; Hoeren, André; Goehlich, Andreas; Meißner, Frank; Endler, Ingolf; Vogt, Holger
Conference Paper
2012High temperature characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2012Precision analog circuit design in SOI CMOS for a wide temperature range up to 350°C
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2011High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology
Grella, K.; Vogt, H.; Paschen, U.
Conference Paper
2011Next generation 8xx nm laser bars and single emitters
Strauss, U.; Müller, M.; Swietlik, T.; Fehse, R.; Lauer, C.; Grönninger, G.; König, H.; Keidler, M.; Fillardet, T.; Kohl, A.; Stoiber, M.; Scholl, I.; Biesenbach, J.; Baeumler, M.; Konstanzer, H.
Conference Paper
2011A robust SOI gain-boosted operational amplifier targeting high temperature precision applications up to 300°C
Schmidt, A.; Marzouk, A.M.; Kappert, H.; Kokozinski, R.
Conference Paper
2010Evaluation of materials for high temperature IC packaging
Klieber, R.; Lerch, R.G.
Conference Paper
2010High-temperature modeling of AlGaN/GaN HEMTs
Vitanov, S.; Palankovski, V.; Maroldt, S.; Quay, R.
Journal Article, Conference Paper
2010Micromachined mid-infrared emitter for fast transient temperature operation for optical gas sensing systems
Hildenbrand, J.; Korvink, J.; Wollenstein, J.; Peter, C.; Kurzinger, A.; Naumann, F.; Ebert, M.; Lamprecht, F.
Journal Article
2009Assembly of pressure sensor chips as an example for integrated MEMS for high temperature applications
Klieber, R.; Goehlich, A.; Trieu, H.-K.; Kappert, H.; Grabmaier, A.
Conference Paper
2009Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D.; Berthold, S.; Dötsch, C.; Lopez, J.U.; Erkan, T.; Span, R.
Conference Paper
2009Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D.
Presentation
2009Dynamic simulation of possible heat management solutions for adiabatic compressed air energy storage
Wolf, D.; Berthold, S.; Dötsch, C.; Lopez, J.U.; Erkan, T.; Span, R.
Abstract
2009Evaluating plant configurations for adiabatic compressed air energy storage by dynamic simulation
Wolf, D.
Presentation
2009Evaluating plant configurations for adiabatic compressed air energy storage by dynamic simulation
Wolf, D.; Dötsch, C.; Span, R.
Abstract
2009Fast transient temperature operating micromachined emitter for mid-infrared for optical gas sensing systems
Hildenbrand, J.; Peter, C.; Lamprecht, F.; Kürzinger, A.; Naumann, F.; Ebert, M.; Wehrspohn, R.; Wöllenstein, J.
Conference Paper
2008Untersuchung von Nachschaltprozessen an Verbrennungsmotoren
Grob, J.; Paucker, R.; Eckert, F.; Mieck, S.; Althaus, W.; Eckert, F.
Conference Paper
2007Neues Konvektions-Reflowlötverfahren für bleifreie hochtemperaturgeeignete Lötverbindungen
Pape, U.
Presentation
2007Process design and modelling of ethanol reforming HT-PEM fuel cell system
Padgilwar, G.S.
: Schulzke, T. (Prüfer); Fahlenkamp, H. (Prüfer); Jörissen, J. (Prüfer)
Master Thesis
2007Reliability testing of wire-bond at high temperature storage
Schelle, B.; Arik, B.; Klieber, R.; Trieu, H.-K.
Abstract
2006Entwicklung von Weichlotpasten für das Löten mit der Mikrowelle
Nowottnick, M.; Pape, U.
Conference Paper
2006Fatigue life simulation for optimized exhaust manifold geometry
Mohrmann, R.; Seifert, T.; Willeke, W.; Hartmann, D.
Conference Paper
2006Solarunterstützte Kraft-Wärme-Kälte-Kopplung - Hybridsysteme im Trend
Lokurlu, A.; Buck, R.; Henning, H.-M.; Dötsch, C.
Conference Paper
2006Solarunterstützte Kraft-Wärme-Kälte-Kopplung - Hybridsysteme im Trend
Lokurlu, A.; Buck, R.; Henning, H.-M.; Dötsch, C.
Journal Article
2006Zuverlässigkeit stoffschlüssiger Fügeverbindungen für Hochtemperatur-Elektronikbaugruppen
Nowottnick, M.
Habilitation
2005Bewertung der Ergebnisse und Simulation der Zuverlässigkeit
Nowottnick, M.; Pape, U.; Neher, W.
Book Article
2005Comparison of material behavior and economic effects of cold and high temperature forming technologies applied to high-strength steels
Neugebauer, Reimund; Göschel, A.; Sterzing, A.; Kurka, P.; Seifert, M.
Conference Paper
2005High temperature (T >= 400 K) operation of strain-compensated quantum cascade lasers with thin InAs insertion layers and AlAs blocking barriers
Yang, Q.K.; Mann, C.; Fuchs, F.; Köhler, K.; Bronner, W.
Conference Paper, Journal Article
2003A compact IGBT driver for high temperature applications
Zeltner, S.; Billmann, M.; März, M.; Schimanek, E.
Conference Paper
2003HTPAL. Ein programmierbarer Logikbaustein für den Einsatz in Hochtemperaturanwendungen
Gorontzi, K.
Dissertation
2003Structure and properties of high-temperature annealed CVD diamond
Ralchenko, V.; Nistor, L.; Pleuler, E.; Khomich, A.; Vlasov, I.; Khmelnitskii, R.
Conference Paper, Journal Article
2002Ganzheitliche Systemanalyse der energetischen Nutzung biogener Vergasungsgase in Brennstoffzellen
Schleitzer, D.-K.
Dissertation
2000A 1-Kbit EEPROM in SIMOX technology for high-temperature applications up to 250 deg C
Gogl, D.; Fiedler, H.-L.; Spitz, M.; Parmentier, B.
Journal Article
1997Laser based strain measurement above 1500 deg C
Aswendt, P.
Conference Paper
1997Laser induced creep and fracture in ceramics
Pompe, W.; Bahr, H.-A.; Pflugbeil, I.; Kirchhoff, G.; Langmeier, P.; Weiss, H.-J.
Journal Article
1997Using speckle interferometry under extreme conditions
Aswendt, P.
Conference Paper
1994Fracture toughness and time-dependent strength behavior of low-doped silicon nitrides for applications at 1400 degree
Klemm, H.; Pezzotti, G.
Journal Article
1994Hochtemperaturcharakterisierung von Siliziumnitridwerkstoffen durch dynamische Ermüdung
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C.
Journal Article
1994Silicon nitride materials featured by superior creep and fracture resistance at 1400 degree
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C.
Conference Paper
1993Kinetics of growing oxide layers studied by means of X-ray diffraction.
Kolarik, V.; Engel, W.; Eisenreich, N.
Conference Paper
1993Optisches Prozessieren
Eyer, A.; Räuber, A.
Conference Paper
1992Fatigue and short crack propagation behaviour of cast nickel base alloys in 713 C and MAR-M-247 LC at high temperatures
Bergmann, J.; Brandt, U.; Sonsino, C.M.
Conference Paper
1991High pressure high temperature solvolysis of polymer binders in propellants and explosives
Bohn, M.A.
Conference Paper
1991Rückgewinnung von Treibmittelkomponenten durch Hochdruck-Hochtemperatur-Solvolyse
Bohn, M.A.; Neumann, H.
Conference Paper
1991Schwingfestigkeit der keramikverstärkten Kolbengußlegierung GP-AlSi 12 CuMgNi bei erhöhten Temperaturen
Backer, E.; Sonsino, C.M.
Journal Article
1990Creep crack growth under small-scale creep conditions.
Riedel, H.
Conference Paper