Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2004A flip-chip packaged coplanar 94 GHz amplifier module with efficient suppression of parasitic substrate effects
Tessmann, A.; Riessle, M.; Kudszus, S.; Massler, H.
Journal Article
2003Flip-chip integration of power HEMTs: A step towards a GaN MMIC technology
Seemann, K.; Ramberger, S.; Tessmann, A.; Quay, R.; Schneider, J.; Riessle, M.; Walcher, H.; Kuri, M.; Kiefer, R.; Schlechtweg, M.
Conference Paper
2002A 94 GHz single-chip FMCW radar module for commercial sensor applications
Tessmann, A.; Kudszus, S.; Feltgen, T.; Riessle, M.; Sklarczyk, C.; Haydl, W.
Conference Paper
2002Compact single-chip W-band FMCW radar modules for commercial high-resolution sensor applications
Tessmann, A.; Kudszus, S.; Feltgen, T.; Riessle, M.; Sklarczyk, C.; Haydl, W.H.
Journal Article
2001Design of coplanar power amplifiers for millimeter-wave system applications including thermal aspects
Bessemoulin, A.; Marsetz, W.; Baeyens, Y.; Osorio, R.; Massler, H.; Hülsmann, A.; Schlechtweg, M.
Journal Article
2001Suppression of parasitic substrate modes in Flip-Chip packaged coplanar W-Band amplifier MMICs
Tessmann, A.; Haydl, W.H.; Kerssenbrock, T.V.; Heide, P.; Kudszus, S.
Conference Paper