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| 2020 | Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics
Palavesam, Nagarajan; Hell, Waltraud; Drost, Andreas; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz | Journal Article |
| 2014 | Zuverlässigkeitsuntersuchungen an einer hochtemperaturtauglichen SOI-CMOS-Technologie
Dreiner, Stefan; Grella, Katharina; Heiermann, Wolfgang; Kelberer, Andreas; Kappert, Holger; Vogt, Holger; Paschen, Uwe | Journal Article |
| 2013 | Flip-Chip Technologie für Anwendungstemperaturen > 250 °C
Heiermann, Wolfgang; Geruschke, Thomas; Ruß, Marco; Vogt, Holger | Conference Paper |
| 2009 | Flip chips on PCB - from single chip encapsulation to systems in package
Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H. | Journal Article |
| 2006 | Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H. | Conference Paper |
| 2005 | Gold-gold flip chip bonding processes for RF, optoelectronic, high temperature and power devices
Klein, M.; Oppermann, H.; Reichl, H. | Conference Paper |
| 2002 | Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H. | Conference Paper |
| 2000 | High-Resolution Radioscopy and Tomography for Light Materials and Devices
Helfen, L.; Baumbach, T.; Banhart, J.; Stanzick, H.; Cloetens, P.; Ludwig, W.; Baruchel, J. | Conference Paper |