Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Identification of Soft Failure Mechanisms Triggered by ESD Stress on a Powered USB 3.0 Interface
Koch, Sebastian; Orr, Benjamin J.; Gossner, H.; Gieser, Horst A.; Maurer, Linus
Journal Article
2019Reliability of power converters in wind turbines: Exploratory analysis of failure and operating data from a worldwide turbine fleet
Fischer, Katharina; Pelka, Karoline; Bartschat, Arne; Tegtmeier, Bernd; Coronado, Diego; Broer, Christian; Wenske, Jan
Journal Article
2018Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling
Kraatz, Matthias; Sander, Christoph; Clausner, André; Hauschildt, M.; Standke, Yvonne; Gall, Martin; Zschech, Ehrenfried
Conference Paper
2018Cathodoluminescence spectroscopy for failure analysis and process development of GaN-based microelectronic devices
Monachon, C.; Zielinski, M.S.; Berney, J.; Poppitz, David; Graff, Andreas; Breuer, Steffen; Kirste, Lutz
Conference Paper
2018Environmental testing, corrosion, failure analysis. Power electronics in harsh environments
Bayer, Christoph Friedrich; Kokot, Alexandra; Filippi, Thomas; Hutzler, Aaron; Fuchs, Carmen; Wüstefeld, Sophie; Kellner, Simon; Diepgen, Antonia; Zimmernmann, Victoria
Presentation
2017Configuration options for corporate incubators - development of a description model using the morphological analysis method
Schuh, Günther; Lau, Felix; Zimmermann, Richard; Vogt, Florian
Conference Paper
2016Demo: "Funkdebugger" - a failure analysis framework for industrial wireless communication systems
Wetzker, Ulf
Conference Paper
2016On the strength and failure of an electrolyte supported solid oxide fuel cell
Fleischhauer, Felix
: Danzer, Robert (Betreuer); Michaelis, Alexander (Gutachter)
Dissertation
2016Towards proper tool support for component-oriented and model-based development of safety critical systems
Velasco, David S.
Report
2015Failure mode and effect analysis - observations of the past, present and upcoming trends
Mannuß, Oliver; Mandel, Jörg; Schloske, Alexander
Conference Paper
2015With electroluminescence microcopy towards more reliable AlGaN/GaN transistors
Baeumler, M.; Dammann, M.; Wespel, M.; George, R.; Konstanzer, H.; Maroldt, S.; Polyakov, V.M.; Müller, S.; Bronner, W.; Brueckner, P.; Benkhelifa, F.; Waltereit, P.; Quay, R.; Mikulla, M.; Wagner, J.; Ambacher, O.; Graff, A.; Altmann, F.; Simon-Najasek, M.; Lorenzini, M.; Fagerlind, M.; Wel, P. van der; Roedle, T.
Conference Paper
2013Integriertes Modell zur Entwicklung von funktional sicheren Produkten in der Automobilbranche
Maier, Christoph
: Westkämper, Engelbert (Hauptberichter)
Dissertation
2012Laser beam structured sheets - a new potential for sheet metal forming
Neugebauer, Reimund; Ahnert, Maik
Conference Paper
2010A Bayesian reliability model for failure count data
Kempf, Michael
Conference Paper
2009Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system
Klengel, R.; Bennemann, S.; Petzold, M.
Conference Paper
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Conference Paper
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper
2003New directions in measurement for software quality control
Krause, P.; Freimut, B.; Suryn, W.
Conference Paper
2002Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J.
Conference Paper
2002Schwachstellenanalysen in Lackierbetrieben
Hoffmann, U.
Conference Paper
2001Failure analysis with the aid of bayesian networks
Kempf, M.
Conference Paper
2001Produktentwicklungsmethoden gezielt und richtig einsetzen
Schloske, A.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1997Shear test for adhesion measurement of small structures
Schammler, G.; Buschick, K.; Hahn, R.; Reichl, H.
Conference Paper
1997Trends- und Entwicklungsperspektiven der FMEA
Henke, J.
Conference Paper
1995Failure mechanisms in AlGaAs/GaAs HEMTs
Christianson, K.A.; Moglestue, C.; Anderson, W.T.
Journal Article
1994Application of solid mechanics in the fields of microelectronics and micro system technology
Michel, B.; Sommer, J.-P.
Conference Paper
1994Thermally induced failure in GaAs transistors exposed to alpha particle irradiation
Moglestue, C.; Buot, F.; Anderson, W.T.
Conference Paper
1987An age-wear dependent model of failure
Giglmayr, J.
Journal Article