Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Journal Article
2017Development of a reproducible laser structuring process of stacked thin films on ultra-barrier films for organic solar devices
Friedrich-Schilling, Niels; Fledderus, Henri; Peuckert, Frank; Kuntze, Thomas; Gburek, Benedikt; Salem, Ahmed; Akkerman, Hylke; Anderson, Merve
Conference Paper
2017Different encapsulation strategies for implanted electronics
Winkler, Sebastian; Edelmann, Jan; Ruff, Roman; Welsch, Christine
Conference Paper
2017Overview on an implantable multi sensor system for cardiovascular monitoring
Görtz, Michael; Grabmaier, Anton; Wiemer, Maik; Storsberg, Joachim; Duschl, Claus; Vom Bögel, Gerd
Journal Article, Conference Paper
2016ALD as effictive barrier for organic electronic devices
Boeffel, Christine
Presentation
2016Encapsulation of organic electronics
Fahlteich, John; Glawe, Andrea; Vacca, Paolo
Book Article
2016Investigation of UV-Induced Degradation of Different Types of WPVS Reference Solar Cells
Kröger, I.; Hohl-Ebinger, J.; Brachmann, S.; Winter, S.
Conference Paper
2016Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Baer, Eberhard; Schletz, Andreas
Conference Paper
2016Solution processing of organic light emitting diodes
Boeffel, Christine; Kröpke, Stefan; Lange, Alexander; Wedel, Armin; Kim, Yohan
Presentation
2015Design of porous alginate hydrogels by sacrificial CaCO3 templates: Pore formation mechanism
Sergeeva, Alena S.; Feoktistova, Natalia; Prokopovic, Vladimir Z.; Gorin, Dmitry A.; Volodkin, Dimitry V.
Journal Article
2014Aging-effects of polymeric encapsulation on the mechanical characteristics of solar panels and embedded components
Fromm, A.; Trondl, A.; Strecker, H.; Krappitz, M.; Thissen, D.; Kübler, R.
Conference Paper
2014The influence of the additive composition on degradation induced changes in poly(ethylene-co-vinyl acetate) during photochemical aging
Beinert, A.; Peike, C.; Dürr, I.; Kempe, M.D.; Reiter, G.; Weiß, K.-A.
Conference Paper
2014Nondestructive determination of climate-specific degradation patterns for photovoltaic-module encapsulation
Peike, C.; Hoffmann, S.; Heck, M.; Kaltenbach, T.; Weiß, K.-A.; Köhl, M.
Journal Article
2013Identification and tackling of a parasitic surface compound in SiC and Si-rich carbide films
Canino, M.; Summonte, C.; Allegrezza, M.; Shukla, R.; Jain, I.P.; Bellettato, M.; Desalvo, A.; Mancarella, F.; Sanmartin, M.; Terrasi, A.; Löper, P.; Schnabel, M.; Janz, S.
Journal Article
2013Ongoing development and first long-term trials of a cardiac output monitoring system in the pulmonary artery (COMPASS)
Pfennig, M.; Cleven, Nina J.; Biela, S.; Urbaszek, Albrecht; Ooyen, A. van; Görtz, Michael; Mokwa, Wilfried; Schmitz-Rode, Thomas
Journal Article, Conference Paper
2013Present Status of Roll-to-Roll OLED Fabrication and Encapsulation
Mogck, Stefan; Wanski, Tomasz; Lehmann, Claudia; May, Christian
Journal Article
2013State of the art telemetric implantable sensors and their encapsulation
Kraft, Michael; Görtz, Michael; Müntjes, Jutta A.; Mokwa, Wilfried; Cleven, Nina J.; Schmitz-Rode, Thomas
Conference Paper
2013Thermal influence on the photochemical degradation behavior of ethylene-based PV encapsulants
Peike, C.; Apin, K.; Hummel, M.; Weiß, K.-A.; Köhl, M.
Conference Paper
2013Verkapselungstechniken für implantierbare integrierte MEMS Drucksensoren
Görtz, Michael; Betz, Wolfgang; Mokwa, Wilfried; Vogt, Holger; Kraft, Michael
Conference Paper
2012Microelectromechanical implants: Encapsulation concepts and test procedures
Betz, Wolfgang; Trieu, Hoc-Khiem; Vogt, Holger
Abstract
2011Characterization of reactively sputtered permeation barrier materials on polymer substrates
Fahlteich, J.; Schönberger, W.; Fahland, M.; Schiller, N.
Journal Article, Conference Paper
2009Assembly of pressure sensor chips as an example for integrated MEMS for high temperature applications
Klieber, R.; Goehlich, A.; Trieu, H.-K.; Kappert, H.; Grabmaier, A.
Conference Paper
2009Permeation barrier properties of thin oxide films on flexible polymer substrates
Fahlteich, J.; Fahland, M.; Schönberger, W.; Schiller, N.
Conference Paper, Journal Article
2008Assembly of ASICs for high temperature applications - material characterization and reliability testing
Klieber, R.; Trieu, H.-K.
Conference Paper
2008The quest for transparent barriers on flexible substrates
Fahlteich, J.; Fahland, M.; Schönberger, W.; Schiller, N.
Conference Paper
2006Assembly and hermetic encapsulation of wafer level secondary batteries
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2006Principles of UML-based component modeling
Atkinson, C.; Bunse, C.; Kamsties, E.; Zettel, J.
Book Article
2005Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E.
Journal Article
2005Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, Torsten; Kallmayer, C.
Conference Paper
2005Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Film coatings as an encapsulation process for polymer electronics
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Explanation of object orienting for computer languages
Jähnichen, S.; Herrmann, S.
Journal Article
2002Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Laser joining of glass with silicon
Witte, R.; Herfurth, H.; Heinemann, S.
Conference Paper
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H.
Conference Paper
1998Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1998Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.
Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H.
Conference Paper
1997Data encapsulation and data abstraction with petri nets: A graphical visualization of modules
Fricke, O.
Conference Paper
1997Data encapsulation and date abstraction with petri nets : A graphical visualization of modules
Fricke, O.
Conference Paper
1997FE-Simulation for polymeric packaging materials
Dudek, R.; Scherzer, M.; Schubert, A.; Michel, B.
Conference Paper
1996Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H.
Journal Article
1995Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H.
Conference Paper
1995Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H.
Journal Article

 

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