Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2020Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V
Saponara, S.; Ciarpi, G.; Erlbacher, Tobias; Rattmann, Gudrun
Journal Article
2017Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Conference Paper
2008Electromagnetic modeling and optimization of packaged photodetector modules for 100 Gbit/s applications
Jiang, C.; Krozer, V.; Johansen, T.K.; Bach, H-G.; Mekonnen, G-G.; Zhang, R.; Pech, D.
Conference Paper
2007The Effect of Visco-elasticity on the Result Accuracy of FEM Panel Warpage Simulations Supporting Industrial Microelectronics Packaging
Rzepka, S.; Müller, A.
Conference Paper