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| 2012 | Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Journal Article |
| 2011 | Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2011 | Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator
Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris | Conference Paper |
| 2010 | Advances in the design and test of a novel open ended microwave oven
Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris | Conference Paper |
| 2010 | Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Conference Paper |
| 2010 | Modular microwave-based system for packaging applications
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank | Conference Paper |
| 2010 | Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
| 2010 | On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y. | Conference Paper |
| 2007 | Stress monitoring in epoxy resins and embedded components during packaging and curing processes
Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F. | Conference Paper |
| 2002 | Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T. | Conference Paper |
| 2002 | Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article |
| 2001 | E-Packaging
Lange, V. | Conference Paper |
| 2000 | E-Commerce. Potentiale für Verpackungen in der Logistik?
Lange, V. | Conference Paper |
| 1995 | Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik
Michel, B. | Conference Paper |
| 1995 | Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse
Sommer, J.-P.; Dudek, R.; Michel, B. | Conference Paper |
| 1995 | Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis
| Conference Proceedings |
| 1994 | Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V. | Journal Article |
| 1994 | Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method
Dudek, R.; Michel, B. | Conference Paper |