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2020 | Complementary EIS/FTIR study of the degradation of adhesives in electronic packaging Schneider, Michael; Gierth, Uta; Simunkova, Lenka; Gierth, Paul; Rebenklau, Lars | Journal Article |
2020 | Reliability analysis of foil substrate based integration of silicon chips Palavesam, Nagarajan | Dissertation |
2019 | High-Temperature packaging for sensors Rebenklau, Lars; Gierth, Paul; Barth, Henry | Conference Paper |
2012 | Encapsulation of microelectronic components using open-ended microwave oven Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Journal Article |
2011 | Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
2011 | Post cure behaviour of encapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Goussetis, George; Arrighi, Valeria; Johnston, K.; Adamietz, Raphael; Tilford, Tim; Bailey, Chris | Conference Paper |
2010 | Advances in the design and test of a novel open ended microwave oven Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris | Conference Paper |
2010 | Experimental investigation of open-ended microwave oven assisted encapsulation process Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris | Conference Paper |
2010 | Modular microwave-based system for packaging applications Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank | Conference Paper |
2010 | Numerical analysis of microwave underfill cure in ball-grid packages Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
2010 | Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
2010 | On the integration of microwave curing systems into microelectronics assembly processes Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris | Conference Paper |
2010 | On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y. | Conference Paper |
2007 | Stress monitoring in epoxy resins and embedded components during packaging and curing processes Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F. | Conference Paper |
2002 | Micro Materials Center Berlin: Reliability research for MEMS Michel, B.; Winkler, T. | Conference Paper |
2002 | Micro- and nanomaterials characterization by image correlation methods Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article |
2001 | E-Packaging Lange, V. | Conference Paper |
2000 | E-Commerce. Potentiale für Verpackungen in der Logistik? Lange, V. | Conference Paper |
1995 | Eigenspannungen in Werkstoffverbunden der Mikrosystemtechnik Michel, B. | Conference Paper |
1995 | Numerische Beanspruchungsanalyse an mikrotechnischen Baugruppen mit Kunststoffgehäuse Sommer, J.-P.; Dudek, R.; Michel, B. | Conference Paper |
1995 | Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis | Conference Proceedings |
1994 | Experimental and numerical investigations of thermo-mechanically stressed micro-components Michel, B.; Schubert, A.; Dudek, R.; Grosser, V. | Journal Article |
1994 | Thermal reliability assessment in SM- and COB-technology by combined experimental and finite element method Dudek, R.; Michel, B. | Conference Paper |