Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2012Damage and breakage of silicon wafers during impact loading on the wafer edge
Kaule, F.; Koepge, R.; Schönfelder, S.
Conference Paper
2007Testing of packages with LSA materials in very severe mechanical impact conditions with measurement of airborne release
Lange, F.; Martens, R.; Nolte, O.; Lödding, H.; Koch, W.; Hörmann, E.
Journal Article
2006Drop simulation and stress analysis of MEMS devices
Hauck, T.; Li, G.; McNeill, A.; Knoll, H.; Ebert, M.; Bagdahn, J.
Conference Paper
1991Qualification of electronic hardware for the automobile environment
Heyden, S.; Reichert, T.; Ziegahn, K.-F.; Braunmiller, U.
Conference Paper
1991Qualification of electronic hardware for the automobile environment
Heyden, S.; Reichert, T.; Ziegahn, K.-F.; Braunmiller, U.
Conference Paper