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| 2020 | FEM-study for solder model comparison on solder joints stress-strain effects
Schwerz, Robert; Metasch, René; Röllig, Mike; Meier, Karsten | Conference Paper |
| 2020 | Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras
Pandey, Amit; Kühn, Stephan; Erdogan, Hüseyin; Schneider, Klaus; Elger, Gordon | Conference Paper |
| 2019 | Modeling of spontaneous transformation of nitrides to Z phase accounting for stress relaxation by diffusion and interface activity
Svoboda, J.; Riedel, H. | Journal Article |
| 2019 | Numerical study on the influence of material models for tin-based solder alloys on reliability statements
Metasch, René; Schwerz, Robert; Meier, K.; Röllig, Mike | Conference Paper |
| 2019 | Residual lifetime estimation by scatter band analysis of an E911 pipe bend of an USC power plant
Mohrmann, R.; Oesterlin, H. | Conference Paper |
| 2018 | Comparison of long-term radii evolution of the S-phase in aluminum alloy 2618A during ageing and creep
Rockenhäuser, C.; Schriever, S.; Hartrott, P. von; Piesker, B.; Skrotzki, B. | Journal Article |
| 2017 | Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten | Conference Paper |
| 2016 | The creep behavior of long fiber reinforced thermoplastics examined by microstructural simulations
Fliegener, S.; Hohe, J.; Gumbsch, P. | Journal Article |
| 2016 | Precipitate growth in multi-component systems with stress relaxation by diffusion and creep
Svoboda, J.; Fischer, F.D.; Riedel, H.; Kozeschnik, E. | Journal Article |
| 2015 | Influence of solid solution hardening on creep properties of single-crystal nickel-based superalloys
Fleischmann, E.; Konrad, C.; Preussner, J.; Völkl, R.; Affeldt, E.; Glatzel, U. | Journal Article |
| 2014 | Design of a self-adjusting terminal connector based on shape memory alloys
Pagel, Kenny; Zimmermann, Philipp; Bucht, Andre; Drossel, Welf-Guntram | Conference Paper |
| 2014 | Steady-state creep of porous and an extended analysis on the creep of dense BSCFZ perovskite
Pećanac, Goran; Kiesel, Lutz; Malzbender, Jürgen | Journal Article |
| 2013 | Creep and fatigue behavior of a novel 2-component paste-like formulation of acrylic bone cements
Köster, U.; Jaeger, R.; Bardts, M.; Wahnes, C.; Büchner, H.; Kühn, K.-D.; Vogt, S. | Journal Article |
| 2012 | Material characterization to model linear viscoelastic behavior of thin organic polymer films in microelectronics
Unterhofer, K.; Preu, H.; Walter, J.; Lorenz, G.; Mack, W.; Petzold, M. | Conference Paper |
| 2009 | Effect of different particle size distributions on solid-state sintering
Wonisch, A.; Kraft, T.; Moseler, M.; Riedel, H. | Journal Article |
| 2009 | Physical aging and the creep behavior of acrylic bone cements
Kuzmychov, O.; Koplin, C.; Jaeger, R.; Büchner, H.; Gopp, U. | Journal Article |
| 2007 | The size effect on the creep properties of SnAgCu-solder alloys
Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M. | Conference Paper |
| 2006 | Nanoindentation creep and stress relaxation tests of polycarbonate
Schiffmann, K.I. | Journal Article |
| 2006 | Thermomechanical fatigue of open cell aluminium sponge
Guillén, T.; Ohrndorf, A.; Krupp, U.; Christ, H.-J.; Derimay, S.; Becker, W.; Hohe, J. | Conference Paper |
| 2001 | Creep-damaged pipe steels probed with positron spectroscopy
Somieski, B.; Krause-Rehberg, R. | Journal Article |
| 2000 | High-temperature properties of Si3N4/SiC microcomposites
Klemm, Hagen; Herrmann, Mathias; Schubert, Christian | Journal Article, Conference Paper |
| 1998 | High Temperature Properties of mixed alpha/beta-SIALON Materials
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C.; Frassek, L.; Wötting, G.; Gugel, E.; Nietfeld, G. | Journal Article |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 1998 | Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Conference Paper |
| 1997 | An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Conference Paper |
| 1997 | Laser induced creep and fracture in ceramics
Pompe, W.; Bahr, H.-A.; Pflugbeil, I.; Kirchhoff, G.; Langmeier, P.; Weiss, H.-J. | Journal Article |
| 1996 | Characterization of creep and fatigue damage using laser generated ultrasound
Kalyanasundaram, P.; Paul, M.; Raj, B.; Arnold, W. | Conference Paper |
| 1996 | The influence of molybdenum silicide additions on high-temperature oxidation resistance of silicon nitride materials
Klemm, H.; Tangermann, K.; Schubert, C.; Hermel, W. | Journal Article |
| 1996 | Problems and prospects of Si3N4 materials for applications at temperatures above 1400 deg C
Klemm, H.; Herrmann, M.; Schubert, C.; Hermel, W. | Journal Article |
| 1995 | Einfluß von last- und verformungsggesteuerten mehrachsigen Beanspruchungen auf die Anrißlebensdauer
Sonsino, C.M. | Journal Article |
| 1994 | Finite element analysis of indentation experiments using visco-plastic material models
Olaf, J.M.; Sester, M.; Hönig, A.; L'Huillier, P. | Conference Paper |
| 1994 | Fracture toughness and time-dependent strength behavior of low-doped silicon nitrides for applications at 1400 degree
Klemm, H.; Pezzotti, G. | Journal Article |
| 1994 | Hochtemperaturcharakterisierung von Siliziumnitridwerkstoffen durch dynamische Ermüdung
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C. | Journal Article |
| 1994 | Silicon nitride materials featured by superior creep and fracture resistance at 1400 degree
Klemm, H.; Herrmann, M.; Reich, T.; Schubert, C. | Conference Paper |
| 1993 | Densification, microstructure and properties of SiCN-nanocomposites
Herrmann, M.; Millers, T.; Rendtel, A.; Reich, T.; Boden, G.; Schubert, C. | Conference Paper |
| 1993 | Fracture mechanisms.
Riedel, H. | Book Article |
| 1993 | Indication of creep embrittlement in low carbon steel components using NDT-methods
Jansky, J.; Dobmann, G. | Conference Paper |
| 1993 | Mechanical behaviour of pressureless sinterd SiC at high temperatures.
Wolf, C.; Huebner, H.; Adler, J. | Conference Paper |
| 1993 | Nondestructive evaluation of creep-induced material degradation in low alloy ferritic steels
Willems, H.; Koble, T.D.; Kröning, M. | Conference Paper |
| 1993 | Thermal damage by erosion and cracking under pulsed irradiation.
Schultrich, B.; Weiss, H.-J.; Bahr, H.-A. | Conference Paper |
| 1993 | Zerstörungsfreie Früherkennung von Kriechschäden
Willems, H.; Dobmann, G.; Koble, T. | Conference Paper |
| 1992 | Bestimmung des Einflusses von Kriechschädigungen auf die Rayleighwellengeschwindigkeit an der Legierung Alloy 800 H mittels Akustischer Rastermikroskopie
Wertsman, N.; Arnold, W.; Pangraz, S.; Willems, H. | Conference Paper |
| 1992 | Creep crack growth in a 1 percent CrMoV steel and a 32 percent Ni 20 percent Cr alloy
Webster, G.A.; Djavanroodi, F.; Hollstein, T. | Journal Article |
| 1992 | Früherkennung von Kriechschäden - Zum Stand fortschrittlicher Zerstörungsfreier Prüfverfahren
Dobmann, G.; Koble, T.D.; Kröning, M.; Willems, H. | Conference Paper |
| 1991 | Early detection of creep damage by ultrasonic and electromagnetic techniques
Dobmann, G.; Herbert, W. | Conference Paper |
| 1990 | A life prediction method for constrained grain boundary cavitation
Riedel, H. | Conference Paper |
| 1990 | Lifetime prediction in high temperature component.
Bressers, J.; Danzer, R.; Gerold, V.; Guttmann, V.; Henderson, J.; Schneider, K.; Hollstein, T. | Book Article |
| 1990 | Numerical treatment of creep crack growth
Hollstein, T.; Kienzler, R. | Book |
| 1989 | Improved properties of the magnesium based alloy MSR.
Bühler, K. | Journal Article |
| 1987 | Früherkennung von Kriechschädigung mittels Ultraschall-Verfahren
Willems, H. | Conference Paper |
| 1987 | The influence of high-temperature creep on the ultrasonic velocity in alloy 800H
Willems, H. | Conference Paper |