| | |
|---|
| 2019 | Copper availability from the recycling of electric vehicles in Europe, North America and China: A model based estimation until 2050
Soulier, Marcel; Goldmann, Daniel | Conference Paper |
| 2019 | Influence of the surface properties of the connector material on the reliable and reproducible contacting of battery cells with a laser beam welding process
Helm, Johanna; Dietz von Bayer, Ingo; Olowinsky, Alexander; Gillner, Arnold | Journal Article |
| 2019 | Solids under extreme shear: Friction-mediated subsurface structural transformations
Greiner, C.; Gagel, J.; Gumbsch, P. | Journal Article |
| 2018 | Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching
Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U. | Conference Paper |
| 2018 | Antimicrobial effects and dissolution properties of silver copper mixed layers
Gotzmann, G.; Jorsch, C.; Wetzel, C.; Funk, H.W.R. | Journal Article |
| 2018 | The Chinese copper cycle: Tracing copper through the economy with dynamic substance flow and input-output analysis
Soulier, Marcel; Pfaff, Matthias; Goldmann, Daniel; Walz, Rainer; Geng, Yong; Zhang, Ling; Tercero Espinoza, Luis A. | Journal Article |
| 2018 | Comparative analysis of the transcriptome responses of zebrafish embryos after exposure to low concentrations of cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina | Journal Article |
| 2018 | Dynamic analysis of European copper flows
Soulier, Marcel; Glöser-Chahoud, Simon; Goldmann, Daniel; Tercero Espinoza, Luis A. | Journal Article |
| 2018 | Magnetic pulse welding of dissimilar material sheet metal joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Presentation |
| 2018 | Microstructure evolution and deformation mechanisms during high rate and cryogenic sliding of copper
Chen, X.; Schneider, R.; Gumbsch, P.; Greiner, C. | Journal Article |
| 2018 | The origin of surface microstructure evolution in sliding friction
Greiner, C.; Liu, Z.; Schneider, R.; Pastewka, L.; Gumbsch, P. | Journal Article |
| 2018 | Stages in the tribologically-induced oxidation of high-purity copper
Liu, Z.; Patzig, C.; Selle, S.; Höche, T.; Gumbsch, P.; Greiner, C. | Journal Article |
| 2017 | Concentration dependent transcriptome responses of zebrafish embryos after exposure to cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina | Journal Article |
| 2017 | Enhanced manufacturing possibilities using multi-materials in laser metal deposition
Brückner, Frank; Riede, Mirko; Müller, Michael M.; Marquardt, Franz; Willner, Robin; Seidel, André; Lopez, Elena; Leyens, Christoph; Beyer, Eckhard | Conference Paper |
| 2017 | JOIN'EM - Industrial technologies for advanced joining and assembly processes for multi-materials
Psyk, Verena | Presentation |
| 2017 | Manufacturing of hybrid aluminum copper joints by electromagnetic pulse welding - identification of quantitative process windows
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Conference Paper |
| 2017 | Materials response to glancing incidence femtosecond laser ablation
Echlin, M.P.; Titus, M.S.; Straw, M.; Gumbsch, P.; Pollock, T.M. | Journal Article |
| 2017 | Measurement and GIS-based spatial modelling of copper corrosion in different environments in Europe
Slamova, K.; Koehl, M. | Journal Article |
| 2017 | Siloxane-treated and copper-plasma-coated wood
Gascón-Garrido, P.; Thévenon, M. F.; Mainusch, N.; Militz, H.; Viöl, W.; Mai, C. | Journal Article |
| 2017 | Synergistic Toxicity of Copper and Gold Compounds in Cupriavidus metallidurans
Wiesemann, N.; Bütof, L.; Herzberg, M.; Hause, G.; Berthold, L.; Etschmann, B.; Brugger, J.; Martinez-Criado, G.; Dobritzsch, D.; Baginsky, S.; Reith, F.; Nies, D.H. | Journal Article |
| 2016 | Entwicklung und Anpassung einer Free-Flow-Elektrophorese zur selektiven quantitativen Trennung von Metallionen
Kotzur, Maximilian; König, Lea; Egner, Siegfried | Journal Article |
| 2016 | An examination of copper contained in international trade flows
Tercero Espinoza, Luis A.; Soulier, Marcel | Journal Article |
| 2016 | JOIN'EM - Dissimilar materials joining using magnetic pulse welding
Assuncao, Enrico; Coutinho, Luisa; Faes, Koen; Psyk, Verena | Presentation |
| 2016 | A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S. | Journal Article |
| 2016 | Process analysis for magnetic pulse welding of aluminium-copper joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Presentation |
| 2016 | Visualizing global trade flows of copper. An examination of copper contained in international trade flows in 2014
Tercero Espinoza, Luis A.; Soulier, Marcel; Haag, Stefan | Report |
| 2015 | Characterization of copper diffusion in silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M. | Journal Article, Conference Paper |
| 2015 | Consideration of the bioavailability of metal/metalloid species in freshwaters: Experiences regarding the implementation of biotic ligand model-based approaches in risk assessment frameworks
Rüdel, Heinz; Díaz Muñiz, Cristina; Garelick, Hemda; Kandile, Nadia G.; Miller, Bradley W.; Pantoja Munoz, Leonardo; Peijnenburg, Willie J.G.M.; Purchase, Diane; Shevah, Yehuda; Sprang, Patrick van; Vijver, Martina; Vink, Jos P.M. | Journal Article |
| 2015 | Long term stability of copper front side contacts for crystalline silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.; Glunz, S. | Journal Article |
| 2015 | Plasma deposited silicon oxide films for controlled permeation of copper as antimicrobial agent
Lehmann, Antje; Rupf, Stefan; Schubert, Andreas; Zylla, Isabella-Maria; Seifert, Hans Jürgen; Schindler, Axel; Arnold, Thomas | Journal Article |
| 2015 | Quantification of Front Side Metallization Area on Silicon Wafer Solar Cells for Background Plating Detection
Heinrich, M.; Lieder, M.; Hoex, B.; Aberle, A.G.; Glatthaar, M. | Conference Paper, Journal Article |
| 2015 | Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K. | Conference Paper |
| 2015 | Small-scale multiaxial setup for damage detection into the very high cycle fatigue regime
Straub, T.; Berwind, M.F.; Kennerknecht, T.; Lapusta, Y.; Eberl, C. | Journal Article |
| 2014 | Antimicrobial bioactive polymer coatings
Förch, Renate; Duque, Luis; Lotz, Alexander | Book Article |
| 2014 | Challenges in joining aluminium with copper for applications in electro mobility
Kaspar, Jörg; Zimmermann, Martina; Ostwaldt, Andrea; Göbel, Gunther; Standfuß, Jens; Brenner, Berndt | Conference Paper |
| 2014 | Long term stability analysis of copper front side metallization for silicon solar cells
Kraft, A.; Wolf, C.; Lorenz, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W. | Journal Article, Conference Paper |
| 2014 | Origins of folding instabilities on polycrystalline metal surfaces
Beckmann, N.; Romero, P.A.; Linsler, D.; Dienwiebel, M.; Stolz, U.; Moseler, M.; Gumbsch, P. | Journal Article |
| 2014 | Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading
Yoo, B.-G.; Boles, S. T.; Liu, Y.; Zhang, X.; Schwaiger, R.; Eberl, C.; Kraft, O. | Journal Article |
| 2013 | The effects of organic pollutants on metals in museums
Lafuente, D.; Cano, E.; Crespo, A.; Künne, J.; Schieweck, A. | Conference Paper |
| 2013 | Inert drying system for copper paste application in PV
Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe | Journal Article, Conference Paper |
| 2013 | Light-induced degradation in copper-contaminated gallium-doped silicon
Lindroos, J.; Yli-Koski, M.; Haarahiltunen, A.; Schubert, M.C.; Savin, H. | Journal Article |
| 2013 | Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells
Mondon, A.; Jawaid, M.N.; Bartsch, J.; Glatthaar, M.; Glunz, S.W. | Journal Article |
| 2012 | Electrodeposition of copper on aligned multi-walled carbon nanotubes
Schneider, M.; Weiser, M.; Dörfler, S.; Althues, H.; Kaskel, S.; Michaelis, A. | Journal Article |
| 2012 | Microstructural analysis and process chain simulation of copper-ribbons for solar cell interconnections
Butz, A.; Helm, D.; Meier, R. | Conference Paper |
| 2010 | Calculation of emissions into rivers in Germany using the MONERIS model
Fuchs, S.; Scherer, U.; Wander, R.; Behrendt, H.; Venohr, M.; Opitz, D.; Hillenbrand, T.; Marscheider-Weidemann, F.; Götz, T. | Report |
| 2010 | Opening of via-holes in flexible electronics by a UV-laser
Bollmann, Dieter | Poster |
| 2009 | The behavior of silicon nitride tools in hot rolling copper wire
Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R. | Conference Paper |
| 2009 | Kombinierte Verwertung von Altbeizsäuren und Composite-Verpackungen zur Gewinnung von Kupferzementat
Egenolf, B.; Erich, E.; Grüning, F.; Mrotzek, A.; Deerberg, G. | Conference Paper, Journal Article |
| 2009 | Novel construction of a deformable mirror for laser beam shaping
Bruchmann, C.; Eberhardt, R.; Beckert, E.; Peschel, T.; Gramens, S.; Gebhardt, S.E.; Tünnermann, A. | Conference Paper |
| 2009 | Structure and failure of Fcc/Bcc heterophase boundaries in metals
Hashibon, A.; Elsässer, C.; Gumbsch, P. | Conference Paper |
| 2008 | Micro-bending tests: A comparison between three-dimensional discrete dislocation dynamics simulations and experiments
Motz, C.; Weygand, D.; Senger, J.; Gumbsch, P. | Journal Article |
| 2008 | Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E. | Conference Paper |
| 2008 | Vesicular localization of the rat ATP-binding cassette half-transporter rAbcb6
Abdul, J.Y.; Ritz, V.; Jakimenko, A.; Schmitz-Salue, C.; Siebert, H.; Awuah, D.; Kotthaus, A.; Kietzmann, T.; Ziemann, C.; Hirsch-Ernst, K. | Journal Article |
| 2007 | Ab initio study of electronic densities of states at copper-alumina interfaces
Hashibon, A.; Elsässer, C.; Rühle, M. | Journal Article |
| 2007 | Damage mechanisms of silicon nitride rolls in hot rolling of copper wire
Khader, I.; Gumbsch, P.; Kailer, A. | Conference Paper |
| 2005 | Einträge von Kupfer, Zink und Blei in Gewässer und Böden
Hillenbrand, T.; Toussaint, D.; Böhm, E.; Fuchs, S.; Scherer, U.; Rudolphi, A.; Hoffmann, M.; Kreißig, J.; Kotz, C. | Report |