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2021 | Electrochemical CO2 Reduction: Tailoring Catalyst Layers in Gas Diffusion Electrodes junge Puring, Kai; Siegmund, Daniel; Timm, Jana; Möllenbruck, Florian; Schemme, Steffen; Marschall, Roland; Apfel, Ulf-Peter | Journal Article |
2021 | Integration of pure copper to optimize heat dissipation in injection mould inserts using laser metal deposition Polenz, Stefan; Kolbe, Christian; Bittner, Florian; Lopez, Elena; Brückner, Frank; Leyens, Christoph | Journal Article |
2021 | Tailored absorptivity: Increasing the laser weldability of copper through surface structuring Baumann, Robert; Hipp, Dominik; Lasagni, Andrés-Fabián; Mahrle, Achim | Journal Article |
2021 | Tailored wetting of copper using precise nanosecond direct laser interference patterning Baumann, Robert; Milles, Stephan; Leupolt, Beate; Kleber, Susann; Dahms, Johannes; Lasagni, Andrés-Fabián | Journal Article |
2020 | Electrical Modelling and Investigation of Laser Beam Welded Joints for Lithium-Ion Batteries Hollatz, Sören; Kremer, Sebastian; Ünlübayir, Cem; Sauer, Dirk Uwe; Olowinsky, Alexander; Gillner, Arnold | Journal Article |
2020 | Laser metal deposition of copper on diverse metals using green laser sources Siva Prasad, Himani; Brückner, Frank; Volpp, Jörg; Kaplan, Alexander Friedrich Hermann | Journal Article |
2019 | Copper availability from the recycling of electric vehicles in Europe, North America and China: A model based estimation until 2050 Soulier, Marcel; Goldmann, Daniel | Conference Paper |
2019 | The effect of thickness on the properties of laser-deposited NiBSi-WC coating on a Cu-Cr-Zr substrate Korobov, Yuriy Stanislavovich; Khudorozhkova, Yuliya Viktorovna; Hillig, Holger; Vopneruk, Aleksandr Aleksandrovich; Kotelnikov, Aleksandr B.; Burov, Sergey Vladimirovich; Balu, Prabu; Makarov, Aleksey Viktorovich; Chernov, Alexey | Journal Article |
2019 | Influence of the surface properties of the connector material on the reliable and reproducible contacting of battery cells with a laser beam welding process Helm, Johanna; Dietz von Bayer, Ingo; Olowinsky, Alexander; Gillner, Arnold | Journal Article |
2019 | Printing and Laser Sintering of Ag and Cu Paste - Prospects and Challenges in Additive Manufacturing Fichtner, Juliane; Dobeleit, Philipp; Jaretzki, Martin; Ascheri, Mary Esther; Stoll, Tobias | Poster |
2019 | Solids under extreme shear: Friction-mediated subsurface structural transformations Greiner, C.; Gagel, J.; Gumbsch, P. | Journal Article |
2018 | Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U. | Conference Paper |
2018 | Antimicrobial effects and dissolution properties of silver copper mixed layers Gotzmann, G.; Jorsch, C.; Wetzel, C.; Funk, H.W.R. | Journal Article |
2018 | The Chinese copper cycle: Tracing copper through the economy with dynamic substance flow and input-output analysis Soulier, Marcel; Pfaff, Matthias; Goldmann, Daniel; Walz, Rainer; Geng, Yong; Zhang, Ling; Tercero Espinoza, Luis A. | Journal Article |
2018 | Comparative analysis of the transcriptome responses of zebrafish embryos after exposure to low concentrations of cadmium, cobalt and copper Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina | Journal Article |
2018 | Dynamic analysis of European copper flows Soulier, Marcel; Glöser-Chahoud, Simon; Goldmann, Daniel; Tercero Espinoza, Luis A. | Journal Article |
2018 | Magnetic pulse welding of dissimilar material sheet metal joints Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Presentation |
2018 | Microstructure evolution and deformation mechanisms during high rate and cryogenic sliding of copper Chen, X.; Schneider, R.; Gumbsch, P.; Greiner, C. | Journal Article |
2018 | The origin of surface microstructure evolution in sliding friction Greiner, C.; Liu, Z.; Schneider, R.; Pastewka, L.; Gumbsch, P. | Journal Article |
2018 | Stages in the tribologically-induced oxidation of high-purity copper Liu, Z.; Patzig, C.; Selle, S.; Höche, T.; Gumbsch, P.; Greiner, C. | Journal Article |
2017 | Concentration dependent transcriptome responses of zebrafish embryos after exposure to cadmium, cobalt and copper Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina | Journal Article |
2017 | Enhanced manufacturing possibilities using multi-materials in laser metal deposition Brückner, Frank; Riede, Mirko; Müller, Michael M.; Marquardt, Franz; Willner, Robin; Seidel, André; Lopez, Elena; Leyens, Christoph; Beyer, Eckhard | Conference Paper |
2017 | JOIN'EM - Industrial technologies for advanced joining and assembly processes for multi-materials Psyk, Verena | Presentation |
2017 | Manufacturing of hybrid aluminum copper joints by electromagnetic pulse welding - identification of quantitative process windows Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Conference Paper |
2017 | Materials response to glancing incidence femtosecond laser ablation Echlin, M.P.; Titus, M.S.; Straw, M.; Gumbsch, P.; Pollock, T.M. | Journal Article |
2017 | Measurement and GIS-based spatial modelling of copper corrosion in different environments in Europe Slamova, K.; Koehl, M. | Journal Article |
2017 | Siloxane-treated and copper-plasma-coated wood Gascón-Garrido, P.; Thévenon, M.F.; Mainusch, N.; Militz, H.; Viöl, W.; Mai, C. | Journal Article |
2017 | Synergistic Toxicity of Copper and Gold Compounds in Cupriavidus metallidurans Wiesemann, N.; Bütof, L.; Herzberg, M.; Hause, G.; Berthold, L.; Etschmann, B.; Brugger, J.; Martinez-Criado, G.; Dobritzsch, D.; Baginsky, S.; Reith, F.; Nies, D.H. | Journal Article |
2016 | Entwicklung und Anpassung einer Free-Flow-Elektrophorese zur selektiven quantitativen Trennung von Metallionen Kotzur, Maximilian; König, Lea; Egner, Siegfried | Journal Article |
2016 | An examination of copper contained in international trade flows Tercero Espinoza, Luis A.; Soulier, Marcel | Journal Article |
2016 | JOIN'EM - Dissimilar materials joining using magnetic pulse welding Assuncao, Enrico; Coutinho, Luisa; Faes, Koen; Psyk, Verena | Presentation |
2016 | A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S. | Journal Article |
2016 | Process analysis for magnetic pulse welding of aluminium-copper joints Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk | Presentation |
2016 | Visualizing global trade flows of copper. An examination of copper contained in international trade flows in 2014 Tercero Espinoza, Luis A.; Soulier, Marcel; Haag, Stefan | Report |
2015 | Characterization of copper diffusion in silicon solar cells Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M. | Journal Article, Conference Paper |
2015 | Consideration of the bioavailability of metal/metalloid species in freshwaters: Experiences regarding the implementation of biotic ligand model-based approaches in risk assessment frameworks Rüdel, Heinz; Díaz Muñiz, Cristina; Garelick, Hemda; Kandile, Nadia G.; Miller, Bradley W.; Pantoja Munoz, Leonardo; Peijnenburg, Willie J.G.M.; Purchase, Diane; Shevah, Yehuda; Sprang, Patrick van; Vijver, Martina; Vink, Jos P.M. | Journal Article |
2015 | Long term stability of copper front side contacts for crystalline silicon solar cells Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.; Glunz, S. | Journal Article |
2015 | Plasma deposited silicon oxide films for controlled permeation of copper as antimicrobial agent Lehmann, Antje; Rupf, Stefan; Schubert, Andreas; Zylla, Isabella-Maria; Seifert, Hans Jürgen; Schindler, Axel; Arnold, Thomas | Journal Article |
2015 | Quantification of Front Side Metallization Area on Silicon Wafer Solar Cells for Background Plating Detection Heinrich, M.; Lieder, M.; Hoex, B.; Aberle, A.G.; Glatthaar, M. | Conference Paper, Journal Article |
2015 | Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications Meier, Karsten; Röllig, Mike; Bock, K. | Conference Paper |
2015 | Small-scale multiaxial setup for damage detection into the very high cycle fatigue regime Straub, T.; Berwind, M.F.; Kennerknecht, T.; Lapusta, Y.; Eberl, C. | Journal Article |
2014 | Antimicrobial bioactive polymer coatings Förch, Renate; Duque, Luis; Lotz, Alexander | Book Article |
2014 | Challenges in joining aluminium with copper for applications in electro mobility Kaspar, Jörg; Zimmermann, Martina; Ostwaldt, Andrea; Göbel, Gunther; Standfuß, Jens; Brenner, Berndt | Conference Paper |
2014 | Long term stability analysis of copper front side metallization for silicon solar cells Kraft, A.; Wolf, C.; Lorenz, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W. | Journal Article, Conference Paper |
2014 | Origins of folding instabilities on polycrystalline metal surfaces Beckmann, N.; Romero, P.A.; Linsler, D.; Dienwiebel, M.; Stolz, U.; Moseler, M.; Gumbsch, P. | Journal Article |
2014 | Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading Yoo, B.-G.; Boles, S.T.; Liu, Y.; Zhang, X.; Schwaiger, R.; Eberl, C.; Kraft, O. | Journal Article |
2013 | The effects of organic pollutants on metals in museums Lafuente, D.; Cano, E.; Crespo, A.; Künne, J.; Schieweck, A. | Conference Paper |
2013 | Inert drying system for copper paste application in PV Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe | Journal Article, Conference Paper |
2013 | Light-induced degradation in copper-contaminated gallium-doped silicon Lindroos, J.; Yli-Koski, M.; Haarahiltunen, A.; Schubert, M.C.; Savin, H. | Journal Article |
2013 | Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells Mondon, A.; Jawaid, M.N.; Bartsch, J.; Glatthaar, M.; Glunz, S.W. | Journal Article |
2012 | Electrodeposition of copper on aligned multi-walled carbon nanotubes Schneider, M.; Weiser, M.; Dörfler, S.; Althues, H.; Kaskel, S.; Michaelis, A. | Journal Article |
2012 | Microstructural analysis and process chain simulation of copper-ribbons for solar cell interconnections Butz, A.; Helm, D.; Meier, R. | Conference Paper |
2010 | Calculation of emissions into rivers in Germany using the MONERIS model Fuchs, S.; Scherer, U.; Wander, R.; Behrendt, H.; Venohr, M.; Opitz, D.; Hillenbrand, T.; Marscheider-Weidemann, F.; Götz, T. | Report |
2010 | Opening of via-holes in flexible electronics by a UV-laser Bollmann, Dieter | Poster |
2009 | The behavior of silicon nitride tools in hot rolling copper wire Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R. | Conference Paper |
2009 | Kombinierte Verwertung von Altbeizsäuren und Composite-Verpackungen zur Gewinnung von Kupferzementat Egenolf, B.; Erich, E.; Grüning, F.; Mrotzek, A.; Deerberg, G. | Conference Paper, Journal Article |
2009 | Novel construction of a deformable mirror for laser beam shaping Bruchmann, C.; Eberhardt, R.; Beckert, E.; Peschel, T.; Gramens, S.; Gebhardt, S.E.; Tünnermann, A. | Conference Paper |
2009 | Structure and failure of Fcc/Bcc heterophase boundaries in metals Hashibon, A.; Elsässer, C.; Gumbsch, P. | Conference Paper |
2008 | Micro-bending tests: A comparison between three-dimensional discrete dislocation dynamics simulations and experiments Motz, C.; Weygand, D.; Senger, J.; Gumbsch, P. | Journal Article |
2008 | Process control and physical failure analysis for sub-100NM CU/Low-K structures Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E. | Conference Paper |
2008 | Vesicular localization of the rat ATP-binding cassette half-transporter rAbcb6 Abdul, J.Y.; Ritz, V.; Jakimenko, A.; Schmitz-Salue, C.; Siebert, H.; Awuah, D.; Kotthaus, A.; Kietzmann, T.; Ziemann, C.; Hirsch-Ernst, K. | Journal Article |
2007 | Ab initio study of electronic densities of states at copper-alumina interfaces Hashibon, A.; Elsässer, C.; Rühle, M. | Journal Article |
2007 | Damage mechanisms of silicon nitride rolls in hot rolling of copper wire Khader, I.; Gumbsch, P.; Kailer, A. | Conference Paper |
2005 | Einträge von Kupfer, Zink und Blei in Gewässer und Böden Hillenbrand, T.; Toussaint, D.; Böhm, E.; Fuchs, S.; Scherer, U.; Rudolphi, A.; Hoffmann, M.; Kreißig, J.; Kotz, C. | Report |
2005 | Electromigration-induced copper interconnect degradation and failure: The role of microstructure Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P. | Conference Paper |
2005 | Structure at abrupt copper-alumina interfaces: An ab-initio study Hashibon, A.; Elsässer, C.; Rühle, M. | Journal Article |
2003 | Failures in copper interconnects-localization, analysis and degradation mechanisms Zschech, Ehrenfried; Langer, E.; Meyer, M.A. | Conference Paper |
2002 | Emissions of heavy metals and lindane into river basins of Germany Fuchs, S.; Scherer, U.; Hillenbrand, T.; Marscheider-Weidemann, F.; Behrendt, H.; Opitz, D. | Book |
2000 | Breakdown of Elasticity in Copper and Aluminium Interconnects Schreiber, J.; Melov, V.G.; Herms, M. | Conference Paper |
2000 | Quantitative topographic assessment of Cu incorporation in GaAs Baeumler, M.; Stibal, R.; Stolz, W.; Steinegger, T.; Jurisch, M.; Maier, M.; Jantz, W. | Journal Article |
1999 | Electroless plating on semiconductor wafers Aschenbrenner, R.; Ostmann, A.; Reischl, H. | Conference Paper |
1999 | Investigation of Cu films by focused ion beam induced deposition using nuclear microprobe Park, Y.K.; Takai, M.; Lehrer, C.; Frey, L.; Ryssel, H. | Journal Article |
1997 | Effect of process parameters on the microstructure and properties of TiC dispersion strengthened copper alloys Weißgärber, T.; Sauer, C.; Püsche, W.; Kieback, B.; Dehm, G.; Mayer, J. | Conference Paper |
1997 | Infrared micromirror array with large pixel size and large deflection angle Wagner, B.; Reimer, K.; Maciossek, A.; Hofmann, U. | Conference Paper |
1993 | Influence of plasma activation on the deposition of Ti, TiN and Cu using metalorganic compounds Weber, A.; Nikulski, R.; Bringmann, U.; Gernhuber, M.; Pöckelmann, R.; Klages, C.-P. | Conference Paper |
1992 | Einfluß von Kaltverformung und Rekristallisationsglühung auf Reinkupfer. Grussenmeyer, A. | Book |
1992 | Investigation into the effects of planned restrictions with regard to the use, circulation and substitution of cadmium in products. Bätcher, K.; Böhm, E.; Tötsch, W. | Book |
1992 | Untersuchung über die Auswirkungen geplanter gesetzlicher Beschränkungen auf die Verwendung, Verbreitung und Substitution von Cadmium in Produkten. Umweltforschungsplan des Bundesministers für Umwelt, Naturschutz und Reaktorsicherheit. Produktbezogener Immissionsschutz. Forschungsbericht Nr. 104 08 320 Bätcher, K.; Böhm, E. : Tötsch, W. | Book |
1992 | Verbundprojekt - Kombination von PVD und Galvanik - Teilvorhaben. Metallisierung faserverstärkter Kunststoffe mittels kombinierter galvanischer/physikalischer Beschichtungsverfahren Fessmann, J.; Mertz, K. | Conference Paper |
1990 | Removal and drilling of metals by eximer laser radiation. Schulze, W.; Kreutz, E.W.; Poprawe, R. | Conference Paper |
1989 | Einfluß unterschiedlicher Schweißbedingungen auf die Qualität der Schweißnähte von Weißblechdosen Hollaender, J. | Journal Article |
1989 | Mechanisms in neo-vascularization of avascular ocular tissue by a monocytic angio-morphogen Renner, H.; Logemann, E.; Wissler, J.H. | Book Article |
1988 | Accomodation of polarization and shaping in laser beam welding Schulz, W.; Wolf, N.; Welsing, O.; Behler, K.; Beyer, E. | Conference Paper |