Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Copper availability from the recycling of electric vehicles in Europe, North America and China: A model based estimation until 2050
Soulier, Marcel; Goldmann, Daniel
Conference Paper
2019Influence of the surface properties of the connector material on the reliable and reproducible contacting of battery cells with a laser beam welding process
Helm, Johanna; Dietz von Bayer, Ingo; Olowinsky, Alexander; Gillner, Arnold
Journal Article
2019Solids under extreme shear: Friction-mediated subsurface structural transformations
Greiner, C.; Gagel, J.; Gumbsch, P.
Journal Article
2018Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching
Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U.
Conference Paper
2018Antimicrobial effects and dissolution properties of silver copper mixed layers
Gotzmann, G.; Jorsch, C.; Wetzel, C.; Funk, H.W.R.
Journal Article
2018The Chinese copper cycle: Tracing copper through the economy with dynamic substance flow and input-output analysis
Soulier, Marcel; Pfaff, Matthias; Goldmann, Daniel; Walz, Rainer; Geng, Yong; Zhang, Ling; Tercero Espinoza, Luis A.
Journal Article
2018Comparative analysis of the transcriptome responses of zebrafish embryos after exposure to low concentrations of cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Journal Article
2018Dynamic analysis of European copper flows
Soulier, Marcel; Glöser-Chahoud, Simon; Goldmann, Daniel; Tercero Espinoza, Luis A.
Journal Article
2018Magnetic pulse welding of dissimilar material sheet metal joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Presentation
2018Microstructure evolution and deformation mechanisms during high rate and cryogenic sliding of copper
Chen, X.; Schneider, R.; Gumbsch, P.; Greiner, C.
Journal Article
2018The origin of surface microstructure evolution in sliding friction
Greiner, C.; Liu, Z.; Schneider, R.; Pastewka, L.; Gumbsch, P.
Journal Article
2018Stages in the tribologically-induced oxidation of high-purity copper
Liu, Z.; Patzig, C.; Selle, S.; Höche, T.; Gumbsch, P.; Greiner, C.
Journal Article
2017Concentration dependent transcriptome responses of zebrafish embryos after exposure to cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Journal Article
2017Enhanced manufacturing possibilities using multi-materials in laser metal deposition
Brückner, Frank; Riede, Mirko; Müller, Michael M.; Marquardt, Franz; Willner, Robin; Seidel, André; Lopez, Elena; Leyens, Christoph; Beyer, Eckhard
Conference Paper
2017JOIN'EM - Industrial technologies for advanced joining and assembly processes for multi-materials
Psyk, Verena
Presentation
2017Manufacturing of hybrid aluminum copper joints by electromagnetic pulse welding - identification of quantitative process windows
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Conference Paper
2017Materials response to glancing incidence femtosecond laser ablation
Echlin, M.P.; Titus, M.S.; Straw, M.; Gumbsch, P.; Pollock, T.M.
Journal Article
2017Measurement and GIS-based spatial modelling of copper corrosion in different environments in Europe
Slamova, K.; Koehl, M.
Journal Article
2017Siloxane-treated and copper-plasma-coated wood
Gascón-Garrido, P.; Thévenon, M. F.; Mainusch, N.; Militz, H.; Viöl, W.; Mai, C.
Journal Article
2017Synergistic Toxicity of Copper and Gold Compounds in Cupriavidus metallidurans
Wiesemann, N.; Bütof, L.; Herzberg, M.; Hause, G.; Berthold, L.; Etschmann, B.; Brugger, J.; Martinez-Criado, G.; Dobritzsch, D.; Baginsky, S.; Reith, F.; Nies, D.H.
Journal Article
2016Entwicklung und Anpassung einer Free-Flow-Elektrophorese zur selektiven quantitativen Trennung von Metallionen
Kotzur, Maximilian; König, Lea; Egner, Siegfried
Journal Article
2016An examination of copper contained in international trade flows
Tercero Espinoza, Luis A.; Soulier, Marcel
Journal Article
2016JOIN'EM - Dissimilar materials joining using magnetic pulse welding
Assuncao, Enrico; Coutinho, Luisa; Faes, Koen; Psyk, Verena
Presentation
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Process analysis for magnetic pulse welding of aluminium-copper joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Presentation
2016Visualizing global trade flows of copper. An examination of copper contained in international trade flows in 2014
Tercero Espinoza, Luis A.; Soulier, Marcel; Haag, Stefan
Report
2015Characterization of copper diffusion in silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.
Journal Article, Conference Paper
2015Consideration of the bioavailability of metal/metalloid species in freshwaters: Experiences regarding the implementation of biotic ligand model-based approaches in risk assessment frameworks
Rüdel, Heinz; Díaz Muñiz, Cristina; Garelick, Hemda; Kandile, Nadia G.; Miller, Bradley W.; Pantoja Munoz, Leonardo; Peijnenburg, Willie J.G.M.; Purchase, Diane; Shevah, Yehuda; Sprang, Patrick van; Vijver, Martina; Vink, Jos P.M.
Journal Article
2015Long term stability of copper front side contacts for crystalline silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.; Glunz, S.
Journal Article
2015Plasma deposited silicon oxide films for controlled permeation of copper as antimicrobial agent
Lehmann, Antje; Rupf, Stefan; Schubert, Andreas; Zylla, Isabella-Maria; Seifert, Hans Jürgen; Schindler, Axel; Arnold, Thomas
Journal Article
2015Quantification of Front Side Metallization Area on Silicon Wafer Solar Cells for Background Plating Detection
Heinrich, M.; Lieder, M.; Hoex, B.; Aberle, A.G.; Glatthaar, M.
Conference Paper, Journal Article
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2015Small-scale multiaxial setup for damage detection into the very high cycle fatigue regime
Straub, T.; Berwind, M.F.; Kennerknecht, T.; Lapusta, Y.; Eberl, C.
Journal Article
2014Antimicrobial bioactive polymer coatings
Förch, Renate; Duque, Luis; Lotz, Alexander
Book Article
2014Challenges in joining aluminium with copper for applications in electro mobility
Kaspar, Jörg; Zimmermann, Martina; Ostwaldt, Andrea; Göbel, Gunther; Standfuß, Jens; Brenner, Berndt
Conference Paper
2014Long term stability analysis of copper front side metallization for silicon solar cells
Kraft, A.; Wolf, C.; Lorenz, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Journal Article, Conference Paper
2014Origins of folding instabilities on polycrystalline metal surfaces
Beckmann, N.; Romero, P.A.; Linsler, D.; Dienwiebel, M.; Stolz, U.; Moseler, M.; Gumbsch, P.
Journal Article
2014Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading
Yoo, B.-G.; Boles, S. T.; Liu, Y.; Zhang, X.; Schwaiger, R.; Eberl, C.; Kraft, O.
Journal Article
2013The effects of organic pollutants on metals in museums
Lafuente, D.; Cano, E.; Crespo, A.; Künne, J.; Schieweck, A.
Conference Paper
2013Inert drying system for copper paste application in PV
Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe
Journal Article, Conference Paper
2013Light-induced degradation in copper-contaminated gallium-doped silicon
Lindroos, J.; Yli-Koski, M.; Haarahiltunen, A.; Schubert, M.C.; Savin, H.
Journal Article
2013Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells
Mondon, A.; Jawaid, M.N.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Journal Article
2012Electrodeposition of copper on aligned multi-walled carbon nanotubes
Schneider, M.; Weiser, M.; Dörfler, S.; Althues, H.; Kaskel, S.; Michaelis, A.
Journal Article
2012Microstructural analysis and process chain simulation of copper-ribbons for solar cell interconnections
Butz, A.; Helm, D.; Meier, R.
Conference Paper
2010Calculation of emissions into rivers in Germany using the MONERIS model
Fuchs, S.; Scherer, U.; Wander, R.; Behrendt, H.; Venohr, M.; Opitz, D.; Hillenbrand, T.; Marscheider-Weidemann, F.; Götz, T.
Report
2010Opening of via-holes in flexible electronics by a UV-laser
Bollmann, Dieter
Poster
2009The behavior of silicon nitride tools in hot rolling copper wire
Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R.
Conference Paper
2009Kombinierte Verwertung von Altbeizsäuren und Composite-Verpackungen zur Gewinnung von Kupferzementat
Egenolf, B.; Erich, E.; Grüning, F.; Mrotzek, A.; Deerberg, G.
Conference Paper, Journal Article
2009Novel construction of a deformable mirror for laser beam shaping
Bruchmann, C.; Eberhardt, R.; Beckert, E.; Peschel, T.; Gramens, S.; Gebhardt, S.E.; Tünnermann, A.
Conference Paper
2009Structure and failure of Fcc/Bcc heterophase boundaries in metals
Hashibon, A.; Elsässer, C.; Gumbsch, P.
Conference Paper
2008Micro-bending tests: A comparison between three-dimensional discrete dislocation dynamics simulations and experiments
Motz, C.; Weygand, D.; Senger, J.; Gumbsch, P.
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2008Vesicular localization of the rat ATP-binding cassette half-transporter rAbcb6
Abdul, J.Y.; Ritz, V.; Jakimenko, A.; Schmitz-Salue, C.; Siebert, H.; Awuah, D.; Kotthaus, A.; Kietzmann, T.; Ziemann, C.; Hirsch-Ernst, K.
Journal Article
2007Ab initio study of electronic densities of states at copper-alumina interfaces
Hashibon, A.; Elsässer, C.; Rühle, M.
Journal Article
2007Damage mechanisms of silicon nitride rolls in hot rolling of copper wire
Khader, I.; Gumbsch, P.; Kailer, A.
Conference Paper
2005Einträge von Kupfer, Zink und Blei in Gewässer und Böden
Hillenbrand, T.; Toussaint, D.; Böhm, E.; Fuchs, S.; Scherer, U.; Rudolphi, A.; Hoffmann, M.; Kreißig, J.; Kotz, C.
Report