Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2016Extending the limits of screen-printed metallization of phosphorus- and boron-doped surfaces
Werner, S.; Lohmüller, E.; Wolf, A.; Clement, F.
Journal Article, Conference Paper
2015Impact of boron doping profiles on the specific contact resistance of screen printed Ag-Al contacts on silicon
Lohmüller, E.; Werner, S.; Hoenig, R.; Greulich, J.; Clement, F.
Journal Article, Conference Paper
2015Pseudo FF and Voc analysis of Cz-Si based low concentrator solar cells
Fellmeth, T.; Clement, F.; Biro, D.
Journal Article, Conference Paper
2012Evaluation of soldering processes for high efficiency solar cells
Gierth, Paul; Rebenklau, Lars; Michaelis, Alexander
Conference Paper
2011On the influence of RTA and MSA peak temperature variations on Schottky contact resistances of 6-T SRAM cells
Kampen, C.; Burenkov, A.; Pichler, P.; Lorenz, J.
Journal Article, Conference Paper
2010Influence of annealing parameters on surface roughness, mobility, and contact resistance of aluminum implanted 4H SiC
Schmitt, H.; Häublein, V.; Bauer, A.J.; Frey, L.
Poster
2010On the influence of flash peak temperature variations on Schottky contact resistances of 6-T SRAM cells
Kampen, C.; Burenkov, A.; Lorenz, J.
Conference Paper
2003Effective thermophysical properties of thermal inferface materials. Part I definitions and models
Savija, I.; Culham, J.R.; Yovanovich, M.M.
Conference Paper
2003Effective thermophysical properties of thermal interface materials: Part II experiments and data
Savija, I.; Culham, J.R.; Yovanovich, M.M.
Conference Paper
2002Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J.
Conference Paper
1998Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H.
Conference Paper
1998Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article, Conference Paper
1997Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Journal Article
1997Micromechanical relay with electrostatic actuation
Schiele, I.; Hillerich, B.; Kozlowski, F.; Evers, C.
Conference Paper
1996Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Conference Paper
1996Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H.
Conference Paper
1993A controllable mechanism of forming extremely low-resistance nonalloyed ohmic contacts to group III-V compound semiconductors
Stareev, G.; Kunzel, H.; Dortmann, G.
Journal Article
1993Formation of extremely low resistance Ti/Pt/Au ohmic contacts to p-GaAs
Stareev, G.
Journal Article
1993Tunneling behavior of extremely low resistance nonalloyed Ti/Pt/Au contacts to n(p)-InGaAs and n-InAs/InGaAs
Stareev, G.; Kunzel, H.
Journal Article
1991A reliable fabrication technique for very low resistance ohmic contacts to p-InGaAs using low energy Ar+ ion beam sputtering
Stareev, G.; Umbach, A.; Fidorra, F.; Roehle, H.
Conference Paper
1991Vergleichende Untersuchung verschiedener Kontaktmetallurgien bei Mikroschweissverbindungen
Haag, J.F.
Conference Paper