Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. | | |
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| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1997 | Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Conference Paper |
| 1996 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H. | Journal Article |
| 1996 | Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H. | Journal Article |