Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Reliability of microbolometer thermal imager sensors using chip-scale packaging
Elßner, Michael; Vogt, Holger
Journal Article, Conference Paper
2003Kalibrierung von integrierten Drucksensoren im Waferverbund
Köster, O.; Slotkowski, J.; Brögger, D.
Journal Article
2003On wafer calibration for pressure sensors
Köster, O.
Conference Paper
2002Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B.
Journal Article
2000New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth
Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Eckhardt, T.; Mekonnen, G.G.; Jacumeit, G.
Journal Article
1999A new fiber-chip coupling concept for reusable multipurpose packaging suitable for up to 45 GHz bandwidth
Fischer, U.H.P.; Eckhardt, T.; Jacumeit, G.; Kilk, A.; Mekonnen, G.G.; Pech, D.; Ziegler, R.
Conference Paper
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Jung, E.; Klöser, J.; Heinricht, K.; Lauter, L.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Opto-electronic packaging for broadband high speed (40 Gb/s) optical demultiplexer chip
Rosin, T.; Bornholdt, C.; Hoffmann, D.; Burghardt, R.
Conference Paper