Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2012Die-attach technologies for ultraviolet LED multi-chip module based on ceramic substrate
Burkhardt, Thomas; Hornaff, Marcel; Acker, Anne; Peschel, Thomas; Beckert, Erik; Suphan, Karl-Heinz; Mesel, Karsten; Jirak, Stephan; Eberhardt, Ramona; Tünnermann, Andreas
Journal Article
2012Ultraviolet LED multi-chip module based on ceramic substrate
Burkhardt, Thomas; Hornaff, Marcel; Acker, Anne; Peschel, Thomas; Becker, Erik; Suphan, Karl-Heinz; Mensel, Karsten; Jirak, Stephan; Eberhardt, Ramona; Tünnermann, Andreas
Conference Paper
2009Robust LTCC/PZT sensor-actuator-module for aluminium die casting
Flössel, M.; Scheithauer, U.; Gebhardt, S.; Schönecker, A.; Michaelis, A.
Conference Paper
2006LTCC-based micro-scale PEM fuel cell
Partsch, U.; Goldberg, A.; Stelter, M.
Conference Paper
1998The development of a modular 32 Bit microcontroller MCM in top bottom BGA (TB-BGA) technique
Leutenbauer, R.; Amiri Jam, K.; Reichl, H.
Conference Paper
1997Flip chip technology for multi chip modules
Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H.
Conference Paper