Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2017Large-scale anodic bonding mediated by a liquid tin solder
Ramirez, E.C.; Klemenčič, R.; Klučka, M; Lang, B; Beisel, S.; Altorfer, H.; Koebel, M.M.; Malfait, W.J.
Journal Article
2016Optimized solder alloy for glass-to-metal joints by simultaneous soldering and anodic bonding
Malfait, W.J.; Klemencic, R.; Lang, B.; Rist, T.; Klucka, M.; Zajacz, Z.; Koebel, M.M.
Journal Article
2013Reliable wafer-level-bonding method for MEMS packaging using LTCC interposers
Ihle, Martin; Ziesche, Steffen; Roscher, Frank; Capraro, Beate; Partsch, Uwe
Conference Paper
2006A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers
Knechtel, R.; Knaup, M.; Bagdahn, J.
Conference Paper, Journal Article
2005NON-destructive strength testing of anodic bonded glass-silicon wafer compounds
Knechtel, R.; Knaup, M.; Bagdahn, J.; Wiemer, M.
Conference Paper
2004A glass/silicon technology for low-power robust gas sensors
Plaza, J.A.; López-Bosque, M.J.; Gracia, I.; Cane, C.; Wöllenstein, J.; Kühner, G.; Plescher, G.; Böttner, H.
Journal Article
2003A failure criterion for interface notches in silicon/glass anodic bonds
Knaup, M.; Busch, M.; Bagdahn, J.; Maschke, H.-G.
Conference Paper
2000Investigation of bonding behaviour of different borosilicate glasses
Wiemer, M; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.
Conference Paper
1998Simultaneous fabrication of dielectric and electrical joints by wafer bonding
Drost, A.; Klink, G.; Scherbaum, S.; Feil, M.
Conference Paper
1990Silicon membrane mask blanks for X-ray and ion projection lithography
Löchel, B.; Chlebek, J.; Huber, H.-L.; Macioßek, A.; Grimm, J.
Journal Article, Conference Paper