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| 2010 | Rostaschen aus Ersatzbrennstoff-Kraftwerken
Marzi, T.; Bertling, R.; Auel, W.; Kühl, M. | Book Article |
| 2009 | Ageing management - a new challenge for integration of non-destructive testing
Dobmann, G. | Conference Paper |
| 2009 | Reliability and effective signal-to-noise ratio of RuO(sub 2)-based thick film strain gauges
Dietrich, S.; Kretzschmar, C.; Partsch, U.; Rebenklau, L. | Conference Paper |
| 2008 | Materials characterization a challenge in NDT for quality management
Dobmann, G.; Altpeter, I.; Wolter, B. | Conference Paper |
| 2007 | Age-dependent impairment of endothelial progenitor cells is corrected by growth-hormone-mediated increase of insulin-like growth-factor-1
Thum, T.; Hoeber, S.; Klink, I.; Stichtenoth, D.O.; Tsikas, D.; Anker, S.D.; Poole-Wilson, P.A.; Borlak, J.; Ertl, G.; Bauersachs, J. | Abstract, Conference Paper |
| 2005 | Rapid aging of bottom ashes from municipal solid waste incineration - A large-scale test
Marzi, T.; Palitzsch, S.; Keldenich, K.; Kümmel, R.; Pellens, J.; Bleeker, P. | Conference Paper |
| 2004 | Künstliche Alterung von Rostaschen aus der thermischen Abfallbehandlung
Marzi, T.; Palitzsch, S.; Kümmel, R.; Bleeker, P.; Pellens, J. | Journal Article |
| 2003 | Ageing and work in Europe
: Buck, H.; Dworschak, B. | Book |
| 2003 | Einfluss der Alterung auf die wasserwirtschaftliche Qualität von Rostaschen der thermischen Abfallbehandlung
Palitzsch, I.S. | Dissertation |
| 2000 | Critical issues on the assessment of laser induced damage thresholds of fluoride multilayer coatings at 193 nm
Thielsch, R.; Heber, J.; Kaiser, N.; Martin, S.; Welsch, E. | Conference Paper |
| 1998 | Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H. | Conference Paper |
| 1997 | Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1992 | Entwicklung neuartiger Umhüllmassen für die Mikroelektronik
Gesang, T.; Hennemann, O.-D. | Journal Article |
| 1992 | Entwicklung neuartiger Umhüllmassen für die Mikroelektronik
Gesang, T.; Hennemann, O.-D. | Journal Article |