Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper
20183D Multilayered Ceramics - harsh environment interposer technologies expand into 3rd dimension
Ziesche, Steffen; Lenz, Christian; Müller-Köhn, Axel; Scheithauer, Uwe; Partsch, Uwe
Conference Paper
2018Compact LTCC Packaging and Printing Technologies for Sub-THz Modules
Ihle, Martin; Ziesche, Steffen; Zech, Christian; Baumann, Benjamin
Conference Paper