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| 2012 | Evaluation of soldering processes for high efficiency solar cells
Gierth, Paul; Rebenklau, Lars; Michaelis, Alexander | Conference Paper |
| 2011 | Assembly of a photonic wavelength-division multiplexing device using laser-based soldering
Burkhardt, T.; Hornaff, M.; Kamm, A.; Rütz, M.; Possner, T.; Beckert, E.; Eberhardt, R.; Tünnermann, A. | Conference Paper |
| 2010 | Submicron accuracy optimization for laser beam soldering processes
Beckert, E.; Burkhardt, T.; Hornaff, M.; Kamm, A.; Scheiding, I.; Stiehl, C.; Eberhardt, R.; Tünnermann, A. | Conference Paper |
| 2007 | Explorative study into the sustainable use and substitution of soldering metals in electronics
Deubzer, O. | Dissertation |
| 2007 | Neues Konvektions-Reflowlötverfahren für bleifreie hochtemperaturgeeignete Lötverbindungen
Pape, U. | Presentation |
| 2006 | Entwicklung von Weichlotpasten für das Löten mit der Mikrowelle
Nowottnick, M.; Pape, U. | Conference Paper |
| 2006 | Micro-optics soldering on multifunctional system platforms
Beckert, E.; Banse, H.; Eberhardt, R.; Tünnermann, A. | Conference Paper |
| 2005 | Niedrigtemperaturmontage hochintegrierter elektronischer Baugruppen durch selektive Mikrowellenerwärmung
Pape, U.; Nowottnick, M.; Diehm, R. | Poster |
| 2003 | Integration of optics electronics and mechanics on miniaturized platforms
Beckert, E.; Damm, C.; Eberhardt, R.; Schreiber, P. | Conference Paper |
| 1998 | Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M. | Conference Paper |
| 1998 | Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A. | Conference Paper |
| 1998 | Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A. | Conference Paper |
| 1998 | Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 1998 | Reliability investigations of flip chip interconnects in FCOB and FCOG applications by FEA
Schubert, A.; Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 1998 | Thermo-mechanical reliability of flip chip structures used in DCA and CSP
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Conference Paper |
| 1997 | Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H. | Conference Paper |
| 1997 | An efficient approach to predict solder fatigue life and its application to SM- and area array components
Dudek, R.; Nylen, M.; Schubert, A.; Michel, B.; Reichl, H. | Conference Paper |
| 1997 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H. | Journal Article |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.; Jiang, H. | Conference Paper |
| 1997 | Materials mechanics and mechanical reliability of flip chip assemblies on organics substrates
Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H. | Journal Article |
| 1997 | Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H. | Conference Paper |
| 1997 | Precision Tin/Lead Alloy Plating for Flip-chip Mounting Technology
Richter, H.; Rueß, K.; Gemmler, A.; Leonhard, W. | Journal Article |
| 1996 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H. | Journal Article |
| 1996 | Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A. | Conference Paper |
| 1996 | Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H. | Conference Paper |
| 1996 | Self-aligned, fluxless flip-chip bonding technology for photonic devices
Kuhmann, J.F.; Hensel, H.-J.; Pech, D.; Harde, P.; Bach, H.-G. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H. | Conference Paper |
| 1995 | Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J. | Conference Paper |
| 1995 | Low cost flip chip bonding on FR-4 boards
Klöser, J.; Zakel, E.; Reichl, H. | Journal Article |
| 1989 | Consideration on the productivity and flexibility in automatic soldering using industrial robots
Warnecke, H.-J.; Spingler, J. | Conference Paper |