Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2015Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
Kelberer, Andreas; Dreiner, Stefan; Grella, Katharina; Dittrich, Dirk; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper, Journal Article
2014CMOS readout circuit integrated with ionizing radiation detectors
Szymanski, Andrzej; Obrebski, Dariusz; Marczewski, Jacek; Tomaszewski, Daniel; Grodner, Miroslaw; Pieczynski, Janusz
Journal Article
2014High temperature 0.35 micron Silicon-on-Insulator CMOS technology
Kappert, Holger; Dreiner, Stefan; Kordas, Norbert; Schmidt, Alexander; Paschen, Uwe; Kokozinski, Rainer
Conference Paper
2014Zuverlässigkeitsuntersuchungen an einer hochtemperaturtauglichen SOI-CMOS-Technologie
Dreiner, Stefan; Grella, Katharina; Heiermann, Wolfgang; Kelberer, Andreas; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2013Analog performance of PD-SOI MOSFETs at high temperatures using reverse body bias
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2013Development of ionizing radiation detectors integrated with readout electronics
Obrebski, Dariusz; Szymanski, Andrzej; Tomaszewski, Daniel; Grodner, Miroslaw; Marczewski, Jacek; Pieczynski, Janusz
Conference Paper
2013High temperature characterization up to 450°C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Journal Article
2013PD-SOI MOSFET performance optimization for high temperatures up to 400°C using reverse body biasing
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2012A cyclic RSD analog-digital-converter for application specific high temperature integrated circuits up to 250°C
Schmidt, Alexander; Kappert, Holger; Heiermann, Wolfgang; Kokozinski, Rainer
Conference Paper
2012High temperature characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
Grella, Katharina; Dreiner, Stefan; Schmidt, Alexander; Heiermann, Wolfgang; Kappert, Holger; Vogt, Holger; Paschen, Uwe
Conference Paper
2012Precision analog circuit design in SOI CMOS for a wide temperature range up to 350°C
Schmidt, Alexander; Kappert, Holger; Kokozinski, Rainer
Conference Paper
2011High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology
Grella, K.; Vogt, H.; Paschen, U.
Conference Paper
2011A robust SOI gain-boosted operational amplifier targeting high temperature precision applications up to 300°C
Schmidt, A.; Marzouk, A.M.; Kappert, H.; Kokozinski, R.
Conference Paper
2009Charge-injection photogate pixel fabricated in CMOS silicon-on-insulator technology
Durini, D.; Brockherde, W.; Hosticka, B.J.
Conference Paper, Journal Article
2009Comparison between 65nm bulk and PD-SOI MOSFETs. Si/BOX interface effect on point defects and doping profiles
Bazizi, E.M.; Pakfar, A.; Fazzini, P.F.; Cristiano, F.; Tavernier, C.; Claverie, A.; Burenkov, A.; Pichler, P.
Conference Paper
2009PD-SOI MOSFETs: Interface effect on point defects and doping profiles
Bazizi, E.M.; Pakfar, A.; Fazzini, P.F.; Cristiano, F.; Tavernier, C.; Claverie, A.; Burenkov, A.; Pichler, P.
Conference Paper
2008Advanced annealing strategies for the 32 nm node
Kampen, C.; Martinez-Limia, A.; Pichler, P.; Burenkov, A.; Lorenz, J.; Ryssel, H.
Conference Paper
2008On the stability of fully depleted SOI MOSFETs under lithography process variations
Kampen, C.; Fühner, T.; Burenkov, A.; Erdmann, A.; Lorenz, J.; Ryssel, H.
Conference Paper
2007Physically based simulation of fully depleted SOI MOS transistors at nanometer gate lengths
Burenkov, A.; Kampen, C.; Lorenz, J.; Ryssel, H.
Abstract
2006CMOS integrated pixel array for low-level radiation detection using "time compression" parametric amplification
Durini, D.; Kemna, A.; Brockherde, W.; Hosticka, B.J.
Conference Paper, Journal Article
1997Smart power with 1200V DMOS
Vogt, F.P.; Vogt, H.; Radecker, M.; Fiedler, H.-L.
Conference Paper
1996An intelligent vertical trench DMOS on SIMOX-substrate
Vogt, F.P.; Vogt, H.; Brücker, J.; Zimmermann, C.; Richter, F.
Conference Paper
1995Nitrogen implanted etch-stop layers in silicon
Paneva, R.; Temmel, G.; Ryssel, H.; Burte, E.P.
Conference Paper
1995Vertikaler IGBT für intelligente Leistungsschalter in SIMOX-Technologie
Mütterlein, B.
Dissertation
1994Advanced SOI MOSFET for low voltage, low power and fast application
Stephan, Rolf; Raab, Michael; Kück, Heinz; Vogt, Holger
Conference Paper
1993Fabrication of sensors and microsystems on SIMOX substrates
Gottfried-Gottfried, R.; Köhler, R.; Kück, H.; Mokwa, W.; Vogt, H.
Conference Paper
1993Novel approach to defect etching in thin film silicon-on-insulator
Gassel, H.; Peter-Weidemann, J.; Vogt, H.
Journal Article
1992An intelligent 500 V power vertical DMOS on SIMOX substrate. Part 1
Mütterlein, B.; Vogt, F.P.; Vogt, H.
Conference Paper
1992An intelligent 500 V power vertical DMOS on SIMOX substrate. Part 2
Mütterlein, B.; Vogt, F.P.; Vogt, H.
Conference Paper
1992Matrix method for latch-up free demonstration in a triple-well bulk-silicon technology
Muth, W.
Journal Article
1992Novel approach to defect etching in thin film SOI. Part 1
Gassel, H.; Peter-Weidemann, J.; Vogt, H.
Conference Paper
1992Novel approach to defect etching in thin film SOI. Part 2
Gassel, H.; Peter-Weidemann, J.; Vogt, H.
Conference Paper
1992SIMOX, a silicon-technology for high temperature
Burbach, G.
Conference Paper
1991Avoidance of substrate damage upon laser recrystallization of a SOI layer
Wel, W. van der; Seitz, S.; Weber, J.; Buchner, R.; Haberger, K.; Seegebrecht, P.
Journal Article
1991High-quality SOI-substrates for CMOS transistors
Belz, J.; Burbach, G.; Vogt, H.; Zimmer, G.
Conference Paper
1991Intelligens teljes tmenykapcsol'k inverteres alkalmaz sa
Gabriel, R.; Stein, E.
Journal Article
1991Low loss singlemode optical waveguides with large cross-section in silicon-on-insulator
Schmidtchen, J.; Splett, A.; Schüppert, B.; Petermann, K.; Burbach, G.
Journal Article
1991Silicon-on-Insulator development in Europe
Belz, J.; Burbach, G.; Vogt, H.; Zimmer, G.
Journal Article
1991SIMOX-devices for analog circuits
Badenes, G.; Burbach, G.; Gassel, H.; Vogt, H.
Conference Paper
1991Suppression of grain boundary formation during laser recrystallization of thin Si-films using micro absorbers
Hu, B.; Wel, W. van der; Buchner, R.; Haberger, K.; Seidl, A.
Conference Paper
1991Temperaturfeste Bauelemente auf Siliziumbasis
Burbach, G.
Journal Article
19903D CMOS devices in recrystallized silicon
Seitz, S.; Weber, J.; Seegebrecht, P.; Wel, W. van der; Buchner, R.; Haberger, K.
Journal Article
1990Investigation of laser recrystallization of thin Si films using numerical simulation
Hu, B.; Wel, W. van der; Buchner, R.; Haberger, K.; Seidl, A.
Journal Article
1990Investigation of laser recrystallization of thin Si-films using numeric simulation
Hu, B.; Buchner, R.; Bollmann, D.; Wei, W. van de; Haberger, K.; Seidl, A.
Conference Paper
1990Leistungsschalter für 500 V mit dielektrisch isolierter CMOS-Signalelektronik
Boguszewicz, R.; Burbach, G.; Fiedler, H.-L.; Mütterlein, B.; Vogt, F.P.; Vogt, H.
Journal Article
1990Smart power switches for inverter applications
Gabriel, R.; Stein, E.
Conference Paper
1990Smart-Power-Schalter mit integrierter, dielektrisch isolierter CMOS-Ansteuerung
Belz, J.; Boguszewicz, R.; Burbach, G.; Fiedler, H.-L.; Karl, R.; Mütterlein, B.; Stein, E.; Vogt, F.P.; Vogt, H.
Conference Paper
1990Temperature behaviour of CMOS devices built on SIMOX substrates
Zimmermann, W.; Belz, J.; Burbach, G.; Vogt, H.
Conference Paper
19893D - CMOS devices in recrystallized silicon
Buchner, R.; Haberger, K.; Seitz, D.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989An advanced fabrication process for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Avoidance of substrate damage upon laser recrystallization of an SOI layer
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989A flexible target chamber for a Varian 350 DF implanter
Kluge, A.; Ryssel, H.; Schork, R.
Journal Article, Conference Paper
1989Laser recrystallization for three-dimensional integration
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Laser recrystallization of polysilicon for improved device quality
Buchner, R.; Haberger, K.; Hu, B.
Book Article
1989MESFETs in thin silicon on SIMOX
Vogt, Holger; Burbach, Gert; Belz, Joachim; Zimmer, Günter
Journal Article
1989Process technology for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Selective crystallization of silicon layers without seeding and capping layer
Stumpff, C.; Sigmund, H.
Journal Article
1989Substrate damage free laser recrystallization of polysilicon
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Substrate-damage-free laser recrystallization of polycrystalline silicon
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Journal Article
1988CW argon-laser induced zone-melting recrystallization of thin silicon on oxide.
Ryssel, H.; Götzlich, J.; Steinberger, H.; Qiuxia, X
Journal Article
1988Effects of different recrystallization processes on the electrical characteristics of underlying MOS devices
Buchner, R.; Panish, P.; Haberger, K.; Seegebrecht, P.
Conference Paper
1988Fast CO2 laser recrystallization for 3D integration
Haberger, K.; Panish, P.; Buchner, R.; Steinberger, H.
Conference Paper
1988Laser recrystallization of polysilicon for improved device quality
Buchner, R.; Haberger, K.; Hu, B.
Conference Paper
1987High troughput CO2 laser recrystallization for 3D integrated devices
Haberger, K.; Panish, P.; Buchner, R.; Steinberger, H.
Conference Paper