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| 2019 | Additive Multimaterial-Fertigung durch Kombination aus Laserstrahlschmelzen und Pastenextrusion
Jaretzki, Martin; Fichtner, Juliane; Töpfer, Friedrich | Presentation |
| 2019 | Improving Wall Slip Behavior of Silver Pastes on Screen Emulsions for Fine Line Screen Printing
Tepner, S.; Wengenmeyr, N.; Ney, L.; Linse, M.; Pospischil, M.; Clement, F. | Journal Article |
| 2017 | Entwicklung eines Systems zur kontaminationsfreien Multimaterialfertigung im Laser-Strahlschmelzen
Kordaß, Richard; Jaretzki, Martin; Dani, Ines | Conference Paper |
| 2017 | Paste development for electrochemical screen printing to structure metal layers of back contact solar cells
Gensowski, K.; Kamp, M.; Efinger, R.; Klawitter, M.; Pospischil, M.; Eckert, J.; Bartsch, J. | Conference Paper |
| 2017 | Pastenunterstützte Hybridverfahren. Ein Ansatz zur additiven Multimaterialverarbeitung
Dani, Ines; Kordaß, Richard; Jaretzki, Martin | Conference Paper |
| 2016 | High performance silver polymer pastes for SHJ cells
Körner, Stefan; Waltinger, Andreas; Partsch, Uwe; Eberstein, Markus | Presentation |
| 2016 | Influence of surface near doping concentration on contact formation of silver thick film contacts
Rothhardt, P.; Meier, S.; Hoenig, R.; Wolf, A.; Biro, D. | Journal Article |
| 2016 | Schaffung von Grundlagen zur additiven Multimaterialfertigung durch Erweiterung des pulverbettbasierten Laser-Strahlschmelzprozesses mit einem Pastendispenser
Jaretzki, Martin
: Kordaß, Richard | Thesis |
| 2015 | Analysis and performance of dispensed and screen printed front side contacts at cell and module level
Rodriguez, C.; Pospischil, M.; Padilla, A.; Kuchler, M.; Klawitter, M.; Geipel, T.; Padilla, M.; Fellmeth, T.; Brand, A.; Efinger, R.; Linse, M.; Gentischer, H.; König, M.; Hörteis, M.; Wende, L.; Doll, O.; Clement, F.; Biro, D. | Conference Paper |
| 2015 | Combined Microstructural and Electrical Characterization of Metallization Layers in Industrial Solar Cells
Kumar, P.; Willsch, B.; Dürrschnabel, M.; Aabdin, Z.; Hönig, R.; Peranio, N.; Clement, F.; Biro, D.; Eibl, O. | Conference Paper, Journal Article |
| 2015 | Dispensing Technology on the Route to an Industrial Metallization Process
Pospischil, M.; Kuchler, M.; Klawitter, M.; Rodriguez, C.; Padilla, M.; Efinger, R.; Linse, M.; Padilla, A.; Gentischer, H.; König, M.; Hörteis, M.; Wende, L.; Doll, O.; Zengerle, R.; Clement, F.; Biro, D. | Conference Paper, Journal Article |
| 2015 | Progress on industrial solar cell front side metallization by parallel dispensing technology
Pospischil, M.; Kuchler, M.; Klawitter, M.; Efinger, R.; Rodriguez, C.; Padilla, A.; Gentischer, H.; König, M.; Hörteis, M.; Wende, L.; Mette, A.; Clement, F.; Preu, R.; Biro, D. | Conference Paper |
| 2014 | Microscopic origin of the aluminium assisted spiking effects in n-type silicon solar cells
Heinz, F.D.; Breitwieser, M.; Gundel, P.; König, M.; Hörteis, M.; Warta, W.; Schubert, M.C. | Journal Article, Conference Paper |
| 2014 | Optimizing Fine Line Dispensed Contact Grids
Pospischil, M.; Fellmeth, T.; Brand, A.; Nold, S.; Kuchler, M.; Klawitter, M.; Gentischer, H.; Clement, F.; Biro, D.; König, M.; Hörteis, M.; Wende, L.; Doll, O.; Zengerle, R. | Journal Article, Conference Paper |
| 2014 | Recombination characteristics of p+ regions alloyed from screen-printed aluminum pastes containing boron additives
Rauer, M.; Steinkemper, H.; Schmiga, C.; Glatthaar, M.; Glunz, S.W. | Conference Paper |
| 2013 | Influence of the chemicals used in Nickel and Copper plating solutions on the adhesion of screen-printed silver contacts
Kraft, A.; Ni, L.; Kalio, A.; Moldovan, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W. | Journal Article, Conference Paper |
| 2013 | Investigation of aluminum-boron doping profiles formed by coalloying of screen-printed pastes
Rauer, M.; Schmiga, C.; Tuschinsky, A.; Glatthaar, M.; Glunz S. | Journal Article, Conference Paper |
| 2013 | Study of contact formation of printed contacts through different passivation layers on lowly doped emitters
Kalio, A.; Richter, A.; Glatthaar, M.; Wilde, J. | Journal Article, Conference Paper |
| 2012 | Kinetic aspects of the contact formation by glass containing silver pastes
Eberstein, M.; Schilm, J.; Reinhardt, K.; Partsch, U. | Conference Paper |
| 2008 | Aluminide protective coatings on steels by sintering of powder filled pastes
Veltl, G.; Drescher, C.; Petzoldt, F.; Busse, M. | Conference Paper |
| 2006 | Fabrication and electrochemical characterisation of cathodes for solid oxide fuel cells
Mosch, S.; Trofimenko, N.; Kusnezoff, M.; Kellner, M.; Betz, T. | Conference Paper |
| 2003 | Improved ecology of paste systems for hybrids
Stolle, S.; Kretzschmar, C.; Otschik, P. | Conference Paper |
| 2003 | A method for measuring the abrasivity of tooth pastes
Jaeger, R.; Soltész, U.; Schäfer, R. | Conference Paper |
| 2003 | Water soluble paste systems
Stolle, S.; Kretzschmar, C.; Otschik, P. | Conference Paper |
| 2001 | Zuverlässigkeit und Integration von Leistungsmodulen für die Weitverkehrstechnik (HighModule)
: Otschik, P.; Kretzschmar, C.; Partsch, U. | Report |
| 1994 | Entwicklung einer Dünnschichtglaspaste für Aluminiumoxidkeramik
Otschik, P.; Kretschmar, C. | Book |
| 1994 | Schadensanalyse des Dielektrikums - DP5704
Otschik, P.; Kretschmar, C.; Obenaus, P. | Book |
| 1993 | Influence of the solid particle size on the properties of RuO2-based thick film resistors
Kretzschmar, C.; Otschik, P.; Eichler, K. | Conference Paper |
| 1993 | Interaction between electronic pastes and AlN-substrate.
Otschik, P.; Kretzschmar, C.; Jaenicke-Rößler, K. | Conference Paper |
| 1993 | Leitpastenentwicklung für Aluminiumnitrid-Keramik
Schoene, F.; Kretzschmar, C.; Otschik, P. | Conference Paper |
| 1993 | The reaction between ruthenium dioxide and aluminium nitride in resistor pastes.
Kretzschmar, C.; Otschik, P.; Jaenicke-Rößler, K.; Schlaefer, D. | Journal Article |