Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Copper availability from the recycling of electric vehicles in Europe, North America and China: A model based estimation until 2050
Soulier, Marcel; Goldmann, Daniel
Conference Paper
2019Influence of the surface properties of the connector material on the reliable and reproducible contacting of battery cells with a laser beam welding process
Helm, Johanna; Dietz von Bayer, Ingo; Olowinsky, Alexander; Gillner, Arnold
Journal Article
2019Solids under extreme shear: Friction-mediated subsurface structural transformations
Greiner, C.; Gagel, J.; Gumbsch, P.
Journal Article
2018Analysis of Grain-Size Distribution and Yield Strength of Interconnector Ribbons and Wires at Different Streching Conditions Using Color Etching
Walter, J.; Stegmaier, J.; Kraft, A.; Eitner, U.
Conference Paper
2018Antimicrobial effects and dissolution properties of silver copper mixed layers
Gotzmann, G.; Jorsch, C.; Wetzel, C.; Funk, H.W.R.
Journal Article
2018The Chinese copper cycle: Tracing copper through the economy with dynamic substance flow and input-output analysis
Soulier, Marcel; Pfaff, Matthias; Goldmann, Daniel; Walz, Rainer; Geng, Yong; Zhang, Ling; Tercero Espinoza, Luis A.
Journal Article
2018Comparative analysis of the transcriptome responses of zebrafish embryos after exposure to low concentrations of cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Journal Article
2018Dynamic analysis of European copper flows
Soulier, Marcel; Glöser-Chahoud, Simon; Goldmann, Daniel; Tercero Espinoza, Luis A.
Journal Article
2018Magnetic pulse welding of dissimilar material sheet metal joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Presentation
2018Microstructure evolution and deformation mechanisms during high rate and cryogenic sliding of copper
Chen, X.; Schneider, R.; Gumbsch, P.; Greiner, C.
Journal Article
2018The origin of surface microstructure evolution in sliding friction
Greiner, C.; Liu, Z.; Schneider, R.; Pastewka, L.; Gumbsch, P.
Journal Article
2018Stages in the tribologically-induced oxidation of high-purity copper
Liu, Z.; Patzig, C.; Selle, S.; Höche, T.; Gumbsch, P.; Greiner, C.
Journal Article
2017Concentration dependent transcriptome responses of zebrafish embryos after exposure to cadmium, cobalt and copper
Sonnack, Laura; Klawonn, Thorsten; Kriehuber, Ralf; Hollert, Henner; Schäfers, Christoph; Fenske, Martina
Journal Article
2017Enhanced manufacturing possibilities using multi-materials in laser metal deposition
Brückner, Frank; Riede, Mirko; Müller, Michael M.; Marquardt, Franz; Willner, Robin; Seidel, André; Lopez, Elena; Leyens, Christoph; Beyer, Eckhard
Conference Paper
2017JOIN'EM - Industrial technologies for advanced joining and assembly processes for multi-materials
Psyk, Verena
Presentation
2017Manufacturing of hybrid aluminum copper joints by electromagnetic pulse welding - identification of quantitative process windows
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Conference Paper
2017Materials response to glancing incidence femtosecond laser ablation
Echlin, M.P.; Titus, M.S.; Straw, M.; Gumbsch, P.; Pollock, T.M.
Journal Article
2017Measurement and GIS-based spatial modelling of copper corrosion in different environments in Europe
Slamova, K.; Koehl, M.
Journal Article
2017Siloxane-treated and copper-plasma-coated wood
Gascón-Garrido, P.; Thévenon, M.F.; Mainusch, N.; Militz, H.; Viöl, W.; Mai, C.
Journal Article
2017Synergistic Toxicity of Copper and Gold Compounds in Cupriavidus metallidurans
Wiesemann, N.; Bütof, L.; Herzberg, M.; Hause, G.; Berthold, L.; Etschmann, B.; Brugger, J.; Martinez-Criado, G.; Dobritzsch, D.; Baginsky, S.; Reith, F.; Nies, D.H.
Journal Article
2016Entwicklung und Anpassung einer Free-Flow-Elektrophorese zur selektiven quantitativen Trennung von Metallionen
Kotzur, Maximilian; König, Lea; Egner, Siegfried
Journal Article
2016An examination of copper contained in international trade flows
Tercero Espinoza, Luis A.; Soulier, Marcel
Journal Article
2016JOIN'EM - Dissimilar materials joining using magnetic pulse welding
Assuncao, Enrico; Coutinho, Luisa; Faes, Koen; Psyk, Verena
Presentation
2016A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
Kraatz, Matthias; Gall, Martin; Zschech, Ehrenfried; Schmeißer, Dieter; Ho, Paul S.
Journal Article
2016Process analysis for magnetic pulse welding of aluminium-copper joints
Psyk, Verena; Scheffler, Christian; Linnemann, Maik; Landgrebe, Dirk
Presentation
2016Visualizing global trade flows of copper. An examination of copper contained in international trade flows in 2014
Tercero Espinoza, Luis A.; Soulier, Marcel; Haag, Stefan
Report
2015Characterization of copper diffusion in silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.
Journal Article, Conference Paper
2015Consideration of the bioavailability of metal/metalloid species in freshwaters: Experiences regarding the implementation of biotic ligand model-based approaches in risk assessment frameworks
Rüdel, Heinz; Díaz Muñiz, Cristina; Garelick, Hemda; Kandile, Nadia G.; Miller, Bradley W.; Pantoja Munoz, Leonardo; Peijnenburg, Willie J.G.M.; Purchase, Diane; Shevah, Yehuda; Sprang, Patrick van; Vijver, Martina; Vink, Jos P.M.
Journal Article
2015Long term stability of copper front side contacts for crystalline silicon solar cells
Kraft, A.; Wolf, C.; Bartsch, J.; Glatthaar, M.; Glunz, S.
Journal Article
2015Plasma deposited silicon oxide films for controlled permeation of copper as antimicrobial agent
Lehmann, Antje; Rupf, Stefan; Schubert, Andreas; Zylla, Isabella-Maria; Seifert, Hans Jürgen; Schindler, Axel; Arnold, Thomas
Journal Article
2015Quantification of Front Side Metallization Area on Silicon Wafer Solar Cells for Background Plating Detection
Heinrich, M.; Lieder, M.; Hoex, B.; Aberle, A.G.; Glatthaar, M.
Conference Paper, Journal Article
2015Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Conference Paper
2015Small-scale multiaxial setup for damage detection into the very high cycle fatigue regime
Straub, T.; Berwind, M.F.; Kennerknecht, T.; Lapusta, Y.; Eberl, C.
Journal Article
2014Antimicrobial bioactive polymer coatings
Förch, Renate; Duque, Luis; Lotz, Alexander
Book Article
2014Challenges in joining aluminium with copper for applications in electro mobility
Kaspar, Jörg; Zimmermann, Martina; Ostwaldt, Andrea; Göbel, Gunther; Standfuß, Jens; Brenner, Berndt
Conference Paper
2014Long term stability analysis of copper front side metallization for silicon solar cells
Kraft, A.; Wolf, C.; Lorenz, A.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Journal Article, Conference Paper
2014Origins of folding instabilities on polycrystalline metal surfaces
Beckmann, N.; Romero, P.A.; Linsler, D.; Dienwiebel, M.; Stolz, U.; Moseler, M.; Gumbsch, P.
Journal Article
2014Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading
Yoo, B.-G.; Boles, S.T.; Liu, Y.; Zhang, X.; Schwaiger, R.; Eberl, C.; Kraft, O.
Journal Article
2013The effects of organic pollutants on metals in museums
Lafuente, D.; Cano, E.; Crespo, A.; Künne, J.; Schieweck, A.
Conference Paper
2013Inert drying system for copper paste application in PV
Clement, Caroline; Bell, Hans; Vogg, Florian; Rebenklau, Lars; Gierth, Paul; Partsch, Uwe
Journal Article, Conference Paper
2013Light-induced degradation in copper-contaminated gallium-doped silicon
Lindroos, J.; Yli-Koski, M.; Haarahiltunen, A.; Schubert, M.C.; Savin, H.
Journal Article
2013Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells
Mondon, A.; Jawaid, M.N.; Bartsch, J.; Glatthaar, M.; Glunz, S.W.
Journal Article
2012Electrodeposition of copper on aligned multi-walled carbon nanotubes
Schneider, M.; Weiser, M.; Dörfler, S.; Althues, H.; Kaskel, S.; Michaelis, A.
Journal Article
2012Microstructural analysis and process chain simulation of copper-ribbons for solar cell interconnections
Butz, A.; Helm, D.; Meier, R.
Conference Paper
2010Calculation of emissions into rivers in Germany using the MONERIS model
Fuchs, S.; Scherer, U.; Wander, R.; Behrendt, H.; Venohr, M.; Opitz, D.; Hillenbrand, T.; Marscheider-Weidemann, F.; Götz, T.
Report
2010Opening of via-holes in flexible electronics by a UV-laser
Bollmann, Dieter
Poster
2009The behavior of silicon nitride tools in hot rolling copper wire
Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R.
Conference Paper
2009Kombinierte Verwertung von Altbeizsäuren und Composite-Verpackungen zur Gewinnung von Kupferzementat
Egenolf, B.; Erich, E.; Grüning, F.; Mrotzek, A.; Deerberg, G.
Conference Paper, Journal Article
2009Novel construction of a deformable mirror for laser beam shaping
Bruchmann, C.; Eberhardt, R.; Beckert, E.; Peschel, T.; Gramens, S.; Gebhardt, S.E.; Tünnermann, A.
Conference Paper
2009Structure and failure of Fcc/Bcc heterophase boundaries in metals
Hashibon, A.; Elsässer, C.; Gumbsch, P.
Conference Paper
2008Micro-bending tests: A comparison between three-dimensional discrete dislocation dynamics simulations and experiments
Motz, C.; Weygand, D.; Senger, J.; Gumbsch, P.
Journal Article
2008Process control and physical failure analysis for sub-100NM CU/Low-K structures
Zschech, Ehrenfried; Huebner, R.; Potapov, P.; Zienert, I.; Meyer, M.A.; Chumakov, D.; Geisler, H.; Hecker, M.; Engelmann, H.-J.; Langer, E.
Conference Paper
2008Vesicular localization of the rat ATP-binding cassette half-transporter rAbcb6
Abdul, J.Y.; Ritz, V.; Jakimenko, A.; Schmitz-Salue, C.; Siebert, H.; Awuah, D.; Kotthaus, A.; Kietzmann, T.; Ziemann, C.; Hirsch-Ernst, K.
Journal Article
2007Ab initio study of electronic densities of states at copper-alumina interfaces
Hashibon, A.; Elsässer, C.; Rühle, M.
Journal Article
2007Damage mechanisms of silicon nitride rolls in hot rolling of copper wire
Khader, I.; Gumbsch, P.; Kailer, A.
Conference Paper
2005Einträge von Kupfer, Zink und Blei in Gewässer und Böden
Hillenbrand, T.; Toussaint, D.; Böhm, E.; Fuchs, S.; Scherer, U.; Rudolphi, A.; Hoffmann, M.; Kreißig, J.; Kotz, C.
Report
2005Electromigration-induced copper interconnect degradation and failure: The role of microstructure
Zschech, Ehrenfried; Meyer, M.A.; Zienert, I.; Langer, E.; Geisler, H.; Preusse, A.; Huebler, P.
Conference Paper
2005Structure at abrupt copper-alumina interfaces: An ab-initio study
Hashibon, A.; Elsässer, C.; Rühle, M.
Journal Article
2003Failures in copper interconnects-localization, analysis and degradation mechanisms
Zschech, Ehrenfried; Langer, E.; Meyer, M.A.
Conference Paper
2002Emissions of heavy metals and lindane into river basins of Germany
Fuchs, S.; Scherer, U.; Hillenbrand, T.; Marscheider-Weidemann, F.; Behrendt, H.; Opitz, D.
Book
2000Breakdown of Elasticity in Copper and Aluminium Interconnects
Schreiber, J.; Melov, V.G.; Herms, M.
Conference Paper
2000Quantitative topographic assessment of Cu incorporation in GaAs
Baeumler, M.; Stibal, R.; Stolz, W.; Steinegger, T.; Jurisch, M.; Maier, M.; Jantz, W.
Journal Article
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Conference Paper
1999Investigation of Cu films by focused ion beam induced deposition using nuclear microprobe
Park, Y.K.; Takai, M.; Lehrer, C.; Frey, L.; Ryssel, H.
Journal Article
1997Effect of process parameters on the microstructure and properties of TiC dispersion strengthened copper alloys
Weißgärber, T.; Sauer, C.; Püsche, W.; Kieback, B.; Dehm, G.; Mayer, J.
Conference Paper
1997Infrared micromirror array with large pixel size and large deflection angle
Wagner, B.; Reimer, K.; Maciossek, A.; Hofmann, U.
Conference Paper
1993Influence of plasma activation on the deposition of Ti, TiN and Cu using metalorganic compounds
Weber, A.; Nikulski, R.; Bringmann, U.; Gernhuber, M.; Pöckelmann, R.; Klages, C.-P.
Conference Paper
1992Einfluß von Kaltverformung und Rekristallisationsglühung auf Reinkupfer.
Grussenmeyer, A.
Book
1992Investigation into the effects of planned restrictions with regard to the use, circulation and substitution of cadmium in products.
Bätcher, K.; Böhm, E.; Tötsch, W.
Book
1992Untersuchung über die Auswirkungen geplanter gesetzlicher Beschränkungen auf die Verwendung, Verbreitung und Substitution von Cadmium in Produkten. Umweltforschungsplan des Bundesministers für Umwelt, Naturschutz und Reaktorsicherheit. Produktbezogener Immissionsschutz. Forschungsbericht Nr. 104 08 320
Bätcher, K.; Böhm, E.
: Tötsch, W.
Book
1992Verbundprojekt - Kombination von PVD und Galvanik - Teilvorhaben. Metallisierung faserverstärkter Kunststoffe mittels kombinierter galvanischer/physikalischer Beschichtungsverfahren
Fessmann, J.; Mertz, K.
Conference Paper
1990Removal and drilling of metals by eximer laser radiation.
Schulze, W.; Kreutz, E.W.; Poprawe, R.
Conference Paper
1989Einfluß unterschiedlicher Schweißbedingungen auf die Qualität der Schweißnähte von Weißblechdosen
Hollaender, J.
Journal Article
1989Mechanisms in neo-vascularization of avascular ocular tissue by a monocytic angio-morphogen
Renner, H.; Logemann, E.; Wissler, J.H.
Book Article
1988Accomodation of polarization and shaping in laser beam welding
Schulz, W.; Wolf, N.; Welsing, O.; Behler, K.; Beyer, E.
Conference Paper