Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2002Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J.
Conference Paper
2002Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Simultaneous flip chip underfill and encapsulation
Becker, K.F.; Braun, T.; Adams, T.
Journal Article