Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2002Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Schünemann, M.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper