Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system
Adamietz, Raphael; Desmulliez, Marc P.Y.; Pavuluri, Sumanth Kumar; Tilford, Tim; Bailey, Chris; Schreier-Alt, Thomas; Warmuth, Jens
Journal Article
2012Encapsulation of microelectronic components using open-ended microwave oven
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Journal Article
2012A microwave curing system for microelectronics assembly
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010Advances in the design and test of a novel open ended microwave oven
Pavuluri, Sumanth Kumar; Tilford, Tim; Goussetis, George; Desmulliez, Marc P.Y.; Ferenets, Marju; Adamietz, R.; Eicher, F.; Bailey, Chris
Conference Paper
2010Experimental investigation of open-ended microwave oven assisted encapsulation process
Pavuluri, Sumanth Kumar; Ferenets, Marju; Goussetis, George; Desmulliez, Marc P.Y.; Tilford, Tim; Adamietz, Raphael; Müller, Guido; Eicher, Frank; Bailey, Chris
Conference Paper
2010Modular microwave-based system for packaging applications
Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank
Conference Paper
2010Numerical analysis of microwave underfill cure in ball-grid packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010Numerical analysis of microwave-assisted encapsulation processes for ball grid array packages
Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, Raphael; Müller, Guido; Othman, Nabih; Eicher, Frank; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris
Conference Paper
2010On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications
Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y.
Conference Paper
2009A 300 GHz mHEMT amplifier module
Tessmann, A.; Leuther, A.; Hurm, V.; Massler, H.; Zink, M.; Kuri, M.; Riessle, M.; Lösch, R.; Schlechtweg, M.; Ambacher, O.
Conference Paper
2008A 3-D millimeterwave luggage scanner
Hägelen, M.; Stanko, S.; Essen, H.; Briese, G.; Schlechtweg, M.; Tessmann, A.
Conference Paper
2008A high performance 200-GHz broadband experimental radar
Essen, H.; Stanko, S.; Sommer, R.; Wahlen, A.; Brauns, R.; Wilcke, J.; Johannes, W.; Tessmann, A.; Schlechtweg, M.
Conference Paper
2007220 GHz low-noise amplifier MMICs and modules based on a high performance 50 nm metamorphic HEMT technology
Tessmann, A.; Leuther, A.; Massler, H.; Riessle, M.; Kuri, M.; Zink, M.; Reinert, W.
Journal Article
2006220 GHz low-noise amplifier modules for radiometric imaging applications
Tessmann, A.; Leuther, A.; Kuri, M.; Massler, H.; Riessle, M.; Essen, H.; Stanko, S.; Sommer, R.; Zink, M.; Stibal, R.; Reinert, W.; Schlechtweg, M.
Conference Paper
2005An AlGaN/GaN push-pull HEMT amplifier with 400 MHz bandwidth and 100 W peak output power
Kappeler, O.; Quay, R.; Raay, F. van; Kiefer, R.; Reiner, R.; Walcher, H.; Müller, S.; Mikulla, M.; Schlechtweg, M.; Weimann, G.
Conference Paper
2005GaN/AlGaN HEMTs for highly linear communication applications in L-frequency band
Quay, R.; Würfl, J.; Wiegner, D.; Fischer, G.; Schubert, C.; Magerl, G.
Conference Paper
1998Microwave properties of coplanar transmission lines and filters on diamond from 1-120 GHz
Steinhagen, F.; Haydl, W.H.; Krems, T.; Marsetz, W.; Locher, R.; Wild, C.; Koidl, P.; Hülsmann, A.; Kerssenbrock, T.v.; Heide, P.
Conference Paper
1996Aufbau- und Verbindungstechnik von mikrooptischen Komponenten
Guyenot, V.; Eberhardt, R.; Tittelbach, G.
Conference Paper
1995Aufbau- und Verbindungstechnik mikrooptischer Systeme
Guyenot, V.; Eberhardt, R.; Tittelbach, G.
Conference Paper
1993Klebverbindungen in der optischen Meßtechnik
Schäfer, H.
Journal Article
1992Klebsysteme für die integrierte Optik optimieren
Schäfer, H.
Journal Article
1992Optimieren von Klebsystemen für die integrierte Optik
Schäfer, H.
Conference Paper