Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Post-CMOS 3D-integration of a nanopellistor
Münchenberger, Finja M.; Dreiner, Stefan; Kappert, Holger; Vogt, Holger
Conference Paper
2019Wafer-Level-3D-Integrationsverfahren für hochsensitive optische Sensoren
Kalwa, Lukas; Gläsener, Stefan; Ruskowski, Jennifer; Figge, Martin; Kappert, Holger; Vogt, Holger
Conference Paper
2018Simulation results of prospective next generation 3D thermopile sensor and array circuitry options
Verheyen, Erik; Erbslöh, Andreas; Viga, Reinhard; Vogt, Holger
Journal Article
2016ALD-based 3D-capacitors for harsh environments
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger
Conference Paper
2015High-temperature trench capacitors, using thin-film ALD dielectrics
Dietz, Dorothee; Celik, Yusuf; Goehlich, Andreas; Vogt, Holger; Kappert, Holger
Journal Article, Conference Paper
2012Low firing functional materials for application in power electronics
Barth, S.; Kastner, F.; Rößler, M.; Wentorp, R.; Töpfer, J.; Bartnitzek, T.
Conference Paper
2012LTCC-based sensors for mechanical quantities
Partsch, U.; Lenz, C.; Ziesche, S.; Lohrberg, C.; Neubert, H.; Maeder, T.
Journal Article
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modular modeling of RF behavior of interconnect structures in 3D integration
Stolle, J.; Reitz, S.; Schneider, P.; Wilde, A.
Conference Paper
2008Modeling approaches and design methods for 3D system design
Schneider, P.; Elst, G.
Book Article
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.
Journal Article
2002Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H.
Conference Paper
2001Interchip Via Technology for Vertical System Integration
Ramm, P.; Bonfert, D.; Gieser, H.; Haufe, J.; Iberl, F.; Klumpp, A.; Kux, A.; Wieland, R.
Conference Paper
1991Avoidance of substrate damage upon laser recrystallization of a SOI layer
Wel, W. van der; Seitz, S.; Weber, J.; Buchner, R.; Haberger, K.; Seegebrecht, P.
Journal Article
19903D CMOS devices in recrystallized silicon
Seitz, S.; Weber, J.; Seegebrecht, P.; Wel, W. van der; Buchner, R.; Haberger, K.
Journal Article
19893D - CMOS devices in recrystallized silicon
Buchner, R.; Haberger, K.; Seitz, D.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989An advanced fabrication process for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Avoidance of substrate damage upon laser recrystallization of an SOI layer
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Laser recrystallization for three-dimensional integration
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Laser recrystallization of polysilicon for improved device quality
Buchner, R.; Haberger, K.; Hu, B.
Book Article
1989Process technology for 3D-CMOS devices
Buchner, R.; Haberger, K.; Seitz, S.; Weber, J.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Substrate damage free laser recrystallization of polysilicon
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Conference Paper
1989Substrate-damage-free laser recrystallization of polycrystalline silicon
Buchner, R.; Haberger, K.; Wel, W. van der; Seegebrecht, P.
Journal Article
1988Effects of different recrystallization processes on the electrical characteristics of underlying MOS devices
Buchner, R.; Panish, P.; Haberger, K.; Seegebrecht, P.
Conference Paper
1988Fast CO2 laser recrystallization for 3D integration
Haberger, K.; Panish, P.; Buchner, R.; Steinberger, H.
Conference Paper
1988Laser recrystallization of polysilicon for improved device quality
Buchner, R.; Haberger, K.; Hu, B.
Conference Paper
1988STACHMOS - a basic 3-dimensional CMOS process
Haberger, K.; Panish, P.; Buchner, R.; Seegebrecht, P.
Conference Paper
1987High troughput CO2 laser recrystallization for 3D integrated devices
Haberger, K.; Panish, P.; Buchner, R.; Steinberger, H.
Conference Paper