Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2019Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
Franzon, Paul D.; Marinissen, Erik Jan; Bakir, Muhannad S.; Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book
2019Integrated Passive Devices and Switching Circuit Design for a 3D DC/DC Converter up to 60 V
Saponara, S.; Ciarpi, G.; Erlbacher, Tobias; Rattmann, Gudrun
Journal Article
2019Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Garrou, Philip; Koyanagi, Mitsumasa; Ramm, Peter
Book Article
20183D integration processes for advanced sensor systems and high-performance RF components
Weber, Josef; Fernandez-Bolanos, Montserrat; Ionescu, Adrian; Ramm, Peter
Conference Paper
2018Advanced sensor systems by low-temperature heterogeneous 3D integration processes
Fernandez-Bolanos, Montserrat; Muller, Andrei; Weber, Josef; Ramm, Peter
Conference Paper
2018Heterogeneous integration of vertical GaN power transistor on Si capacitor for DC-DC converters
Yu, Zechun; Zeltner, Stefan; Boettcher, Norman; Rattmann, Gudrun; Leib, Jürgen; Bayer, Christoph Friedrich; Schletz, Andreas; Erlbacher, Tobias; Frey, Lothar
Presentation
2017The Advancement of Device Packaging - A Resume on IMAPS DPC 2017
Ramm, Peter; Poupon, Gilles; Couderc, Pascal; Leitgeb, Markus; Taklo, Maaike M.V.
Journal Article
2017Low-temperature 3D integration processes for advanced sensor systems
Ramm, P.; Fernandez-Bolanos, M.; Weber, J.
Presentation
2016Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Wilke, Martin
: Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B.
Dissertation
2014Advanced 3D packaging of chips and materials integrity: Stress-induced effects and mechanical properties of new ultra low-k dielectrics for on-chip interconnect stacks
Sander, Christoph; Gall, Martin; Yeap, Kong Boon; Zschech, Ehrenfried
Conference Paper
2014Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration
Sander, Christoph; Standke, Yvonne; Niese, Sven; Rosenkranz, Rüdiger; Clausner, André; Gall, Martin; Zschech, Ehrenfried
Journal Article, Conference Paper
2014Fraunhofer cluster 3D integration
Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Fraunhofer cluster 3D integration - key to a holistic technology and service approach
Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried
Conference Paper
2014Interposer based wide IO processor integration
Heinig, Andy; Fischbach, Robert; Dittrich, Michael
Conference Paper
2013Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integration
Huang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul; Altmann, Frank
Journal Article
2012Enabling system level simulation of 3D integrated systems
Bayer, Christian; Reitz, Sven; Stolle, Jörn; Wilde, Andreas; Schneider, Peter
Conference Paper
2012Low temperature fusion wafer bonding quality investigation for failure mode analysis
Dragoi, V.; Czurratis, P.; Brand, S.; Beyersdorfer, J.; Patzig, C.; Krugers, J.; Schrank, F.; Siegert, J.; Petzold, M.
Conference Paper, Journal Article
2012Thermal management in the design space exploration of 3D stacks and corresponding package
Heinig, Andy; Knöchel, Uwe; Schneider, Peter; Wilde, Andreas
Conference Paper
2010Design methods for 3D IC integration
Schneider, P.; Reitz, S.; Stolle, J.; Martin, R.; Heinig, A.; Wilde, A.
Conference Paper