Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2020Simulation challenges of warpage for wafer- and panel level packaging
Dijk, M. van; Kuttler, S.; Rost, F.; Jeaschke, J.; Walter, H.; Wittler, O.; Braun, T.; Schneider-Ramelow, M.
Conference Paper
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Journal Article
Fulltext
2019Panel Level Packaging - From Idea to Industrialization -
Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2019Panel Level Packaging for Component Integration of an Energy Harvesting System
Braun, T.; Kahle, R.; Voges, S.; Hölck, O.; Bauer, J.; Becker, K.-F.; Aschenbrenner, R.; Dreissigacker, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2019Process flow and cost modelling for fan-out panel level packaging
Billaud, M.; Zedel, H.; Stobbe, L.; Braun, T.; Nissen, N.; Lang, K.-D.
Conference Paper
2019Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging
Dreissigacker, M.; Roshanghias, A.; Becker, K.-F.; Braun, T.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.
Conference Paper
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Conference Paper
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2013Panel level packaging for LED lighting
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D.
Conference Paper
2011Through mold vias for stacking of mold embedded packages
Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper