Fraunhofer-Publica: author's publication list

Year	Title/Author	Document Type
2020	Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin	Patent Fulltext
2020	Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.	Journal Article Fulltext
2020	Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.	Journal Article Fulltext
2020	Sensor platform based on packaged whispering-gallery-resonators Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.	Conference Paper
2019	Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2019	Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.	Journal Article Fulltext
2019	Fiber-coupled photonic interconnects based on stacked glass block connectors Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.	Conference Paper
2019	Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2019	Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2019	Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin	Book Article
2019	Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.	Conference Paper
2019	Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2019	A numerical study on mitigation of flying dies in compression molding of microelectronic packages Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2019	Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.	Conference Paper
2019	Where is the Sweet Spot for Panel Level Packaging? Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.	Conference Paper
2018	3D wire - a novel approach for 3D chips interconnection for harsh environment applications Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2018	Alterungsphänomene beim Al-Drahtbonden mit semiautokatalytisch abgeschiedenem Gold auf chemisch Ni-Schichten Fischer, Felix; Schmidt, R.; Schneider-Ramelow, M.; Schmitz, S.; Ngo, H.-D.; Sitte, N.	Conference Paper
2018	Die attach for high power VCSEL array systems Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.	Conference Paper
2018	Can Bond Wires really be used as Antennas? Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2018	Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.	Journal Article
2018	Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy Schröder, H.; Neitz, M.; Schneider-Ramelow, M.	Conference Paper
2018	Design and application of a high-g piezoresistive acceleration sensor for high-impact application Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong	Journal Article Fulltext
2018	Determination of Stress-Strain Properties Combining Small-Depth Nanoindentation and Numerical Simulation Kuttler, S.; Walter, H.; Grams, A.; Schneider-Ramelow, M.; Huber, S.	Conference Paper
2018	Electrical micro-heating structures on glass created by laser ablation Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin	Conference Paper
2018	Frequency-modulated laser ranging sensor with closed-loop control Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.	Conference Paper
2018	High temperature encapsulation for smart power devices Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2018	Impact of multilayer stack-ups on bond wire antennas at millimetre-wave frequencies Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D.	Conference Paper
2018	A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens	Journal Article Fulltext
2018	Panel Level Packaging: A View Along the Process Chain Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2018	Piezoresistive pressure sensors for applications in harsh environments - a roadmap Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Book Article
2018	Recent developments in panel level packaging Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.	Conference Paper
2018	Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Journal Article
2018	Simulation and Electrical Characterization of a Novel 2D-Printed Incontinence Sensor with Conductive Polymer PEDOT:PSS for Medical Applications Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong	Conference Paper
2018	Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.	Conference Paper
2018	Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2018	Using fluidic simulation for parameter optimization in compression molding of microelectronic packages Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2017	Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter Geißler, Ute; Schneider-Ramelow, M.	Journal Article
2017	Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter	Conference Paper
2017	Experimental verification and analysis of analytical model of the shape of bond wire antennas Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.	Journal Article
2017	The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter	Conference Paper
2016	Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.	Conference Paper
2016	Aluminum-Scandium: A Material for Semiconductor Packaging Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter	Journal Article
2016	Fully automated hybrid diode laser assembly using high precision active alignment Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2016	Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2016	High viscosity paste dosing for microelectronic applications Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2016	In-situ measuring module for transfer molding process monitoring Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2016	The reliability of wire bonding using Ag and Al Schneider-Ramelow, Martin; Ehrhardt, Christian	Journal Article
2016	Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2016	Visuelle und mechanische Prüfung von Drahtbondverbindungen Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.	Journal Article
2015	Advanced approach of calculating wire bond pull test correction factors Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.	Book Article
2015	Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2015	Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2015	Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2015	Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2015	Heterogeneous integration of a miniaturized W-band radar module Becker, Karl-Friedrich; Georgi, L.; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S.; Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2015	Large Area LED Package Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.	Conference Paper
2015	Microelectronic Packaging in the 21st Century: Honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday Aschenbrenner, Rolf; Schneider-Ramelow, Martin	Book
2015	Numerical modelling in design for reliability of power modules Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.	Journal Article Fulltext
2014	The influence of liners with Ti, Ta or Ru finish on thin Cu films Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2014	Investigating wire bonding pull testing and its calculation basics Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.	Conference Paper
2014	Korrosion in ENIG-Schichtsystemen Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M.	Conference Paper
2014	Precision jetting of solder paste - a versatile tool for small volume production Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2013	Development and status of Cu ball/wedge bonding in 2012 Schneider-Ramelow, Martin; Geißler, U.; Schmitz, S.; Grübl, W.; Schuch, B.	Journal Article
2013	European R&D trends in wire bonding technologies Schneider-Ramelow, M.; Göhre, J.-M.; Geißler, U.; Schmitz, S.; Lang, K.-D.	Conference Paper
2013	Modular microsystems with embedded components Böhme, Christian; Ostmann, A.; Schneider-Ramelow, M.	Conference Paper
2013	A new aluminium alloy for heavy wire bonding in power: First tests of bonding behaviour and reliability Geißler, Ute; Göhre, J.-M.; Thomas, S.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2013	Precision jetting of glob top materials - A methodology for process optimization Becker, K.-F.; Koch, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2013	Smart power module molding advances: Evaluating high temperature suitability of molding compounds Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2013	Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2013	Ursachen und Vermeidung des Black-Pad-Defekts beim Löten von SMDs Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M.	Journal Article
2012	Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess Geißler, Ute; Milke, Eugen; Prenosil, Peter; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2012	Aufbau- und Verbindungstechniken in der Leistungselektronik Schneider-Ramelow, Martin; Becker, Karl-Friedrich; Ehrhardt, Christian; Göhre, Jens-Martin; Hoene, Eckart; Hutter, Matthias; Lang, Klaus-Dieter; Oppermann, Hermann	Conference Paper
2012	Development of a multi-terminal crimp package for smart textile integration Simon, Erik; Kallmeyer, Christine; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2012	Einfluss der Drahtbondgeometrie auf die plastischen Dehnungen in Heel-Bereich von AlSi1-Standard-Drahtbondverbindungen Kripfgans, Johannes; Schneider-Ramelow, M.; Schmitz, S.; Müller, W.H.	Journal Article
2012	FE-thermo mechanische Analyse zur Beschreibung der Ausbildung der intermetallischen Phase beim Drahtbonden Sbeiti, Mohamad; Müller, Wolfgang H.; Geißler, Ute; Schneider-Ramelow, Martin; Schmitz, Stefan	Journal Article
2012	Heterogenous integration - packaging on and in organic substrates Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2012	Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.	Journal Article
2012	Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.	Conference Paper
2012	Influence of bonding parameters on the reliability of heavy wire bonds on power semiconductors Göhre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2012	Neue Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess Geißler, Ute; Schneider-Ramelow, M.; Milke, E.	Book Article
2012	Qualitätsprüfung von Drahtbondverbindungen - Stand der Technik 2012 Schmitz, S.; Schneider-Ramelow, M.	Journal Article
2012	Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces Sbeiti, Mohamad; Müller, W.H.; Schneider-Ramelow, M.; Geißler, U.; Schmitz, S.	Conference Paper
2012	Reliability of power semiconductor modules combining active and passive temperature cycling Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2012	Technologies and Trends to Improve Power Electronic Packaging Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter	Conference Paper
2012	Transfer molding technology for smart power electronics modules - materials and processes Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.	Conference Paper
2012	Transfer molding technology for smart power electronics modules: Materials and processes Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.	Journal Article
2011	Cu-Ball/Wedge Bonden: Entwicklung und Status 2011. Tl.2 Schneider-Ramelow, Martin; Geißler, Ute, Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard	Journal Article
2011	Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Tl.1 Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard	Journal Article
2011	Cu-Ball/Wedge-bonden: Entwicklung und Status 2011. Tl.3 Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard	Journal Article
2011	Entwicklungsrichtungen für das Leistungshalbleiter Packaging Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias	Journal Article
2011	Fortschritte beim Aufbau von Leistungshalbleitern Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann	Journal Article
2011	Immersion silver as universal surface finish for COB technology Göhre, J.; Schneider-Ramelow, M.; Becker, K.-F.; Hutter, M.	Conference Paper
2011	Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °c Schmitz, S.; Schneider-Ramelow, M.; Schröder, S.	Journal Article
2011	Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test Goehre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.	Conference Paper
2011	Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.	Journal Article
2011	Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.	Conference Paper
2011	Potential of large area mold embedded packages with pcb based redistribution Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter	Conference Paper
2011	Temperatur und Interdiffusion beim US-Wedge/Wedge-Bondverschweißen von Al-Drähten auf Ni/Flash-Au Geißler, U.; Funck, J.; Schneider-Ramelow, M.	Journal Article
2010	Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.	Conference Paper
2010	Analytic model verification of the interfacial friction power in Al us w/w bonding on Au pads Gaul, H.; Schneider-Ramelow, M.; Reichl, H.	Journal Article
2010	Degradation of Heavy Wire Bond Interfaces Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.	Journal Article
2010	Ein Finish für alles: Immersion-Silber eignet sich zum Golddrahtbonden und bietet sich als multifunktionales Leiterplattenfinish an Schneider-Ramelow, M.; Göhre, J.-M.	Journal Article
2010	Immersion Ag als Au-drahtbondbares und COB-geeignetes Universal-Finish für die multi-funktionale Leiterplatte Schneider-Ramelow, M.; Göhre, J.-M.; Becker, K.-F.; Hutter, M.	Journal Article
2010	Interduffision and Kirkendall Voiding in the Contact System Au Ball Bond on Al Chip Metallization Schneider-Ramelow, M.; Schmitz, S.; Schuch, B.; Grübl, W.	Book Article
2010	Modeling and analysis of coplanar bonding wires for high-speed applications Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.	Conference Paper
2010	Thermomechanical description of interface formation in aluminum ultrasound (US)-wedge/wedge-wirebond contacts Müller, W.H.; Sbeiti, M.; Schneider-Ramelow, M.; Geissler, U.	Conference Paper
2010	The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor Gaul, H.; Shah, A.; Mayer, M.; Zhou, Y.; Schneider-Ramelow, M.; Reichl, H.	Journal Article
2010	Wire Bonding as Dynamic Process of Hardening and Softening Geißler, U.; Schneider-Ramelow, M.	Book Article
2009	Analyse des Rissverlaufs in Dickdrahtbondverbindungen auf Leistungshalbleitern beim Active Power Cycling Göhre, J.; Geißler, U.; Schneider-Ramelow, M.	Journal Article
2009	Analysis of the friction processes in ultrasonic wedge/wedge-bonding Gaul, H.; Schneider-Ramelow, M.; Reichl, H.	Journal Article
2009	Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding Geißler, U.; Schneider-Ramelow, M.; Reichl, H.	Journal Article
2009	Kirkendall voiding in Au ball bond interconnects on Al chip metallization in the temperature range from 100 - 200°C after optimized intermetallic coverage Schneider-Ramelow, M.; Schmitz, S.; Schuch, B.; Grübl, W.	Conference Paper
2009	Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.	Journal Article
2009	Ultrasonic friction power during Al wire wedge-wedge bonding Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.	Journal Article
2008	Design and assembly of power semiconductors with double-sided water cooling Schneider-Ramelow, M.; Baumann, T.; Hoene, E.	Conference Paper
2008	Immersion Ag as an alternative in 'Green' COB technology Schneider-Ramelow, M.; Müller, J.; Göhre, J.-M.; Reichl, H.	Conference Paper
2008	Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination Lang, K.-D.; Goehre, J.; Schneider-Ramelow, M.	Conference Paper
2008	Lieferempfehlung für Leiterplatten für die COB-Montage Schneider-Ramelow, M.; Rudolf, F.	Journal Article
2008	Mechanische Prüfverfahren für Draht- und Bändchenbondver-bindungen extrem kleiner Geometrien. Schneider-Ramelow, M.; Rudolf, F	Book Article
2008	Systematical pull and shear test investigations on very small bond loops (wire <= 25 µm) and innovative alloys Schneider-Ramelow, M.; Göhre, J.	Conference Paper
2008	Systematische Pull- und Schertestuntersuchungen an Drahtbondbrücken mit kleinsten Geometrien (<= 25 µm) und innovativer Legierungszusammensetzung Schneider-Ramelow, M.; Rudolf, F.	Conference Paper
2007	Ausfallmechanismen bei Drahtbondverbindungen Schneider-Ramelow, M.	Book Article
2007	High temperature and element alloying influences on Kirkendall voiding in Au ball bond interconnects on Al chip metallization Schneider-Ramelow, M.; Schuch, B.; Lang, K.-D.; Reichl, H.	Conference Paper
2007	Hochgeschwindigkeitsaufnahmen der Wedgebewegung beim US-Bonden/Wedge-Bonden Schneider-Ramelow, M.; Gaul, H.; Schmitz, S.; Reichl, H.	Journal Article
2007	Hochgeschwindigkeitsaufnahmen der Werkzeug- und Drahtschwingung beim US-Wedge/Wedge-Bonden Gaul, H.; Schneider-Ramelow, M.; Reichl, H.	Journal Article
2007	Innovative 3D-Montagetechnologie für Speicherchips mittels AlSi1-Drahtbonden Schneider-Ramelow, M.; Milstrey, M.; Mattheier, L.	Journal Article
2007	Interface reactions during Au-ball/wedge and AlSi1- Wedge/wedge bonding at room temperature Schneider-Ramelow, M.; Lang, K.-D.; Geißler, U.; Scheel, W.; Reichl, H.	Conference Paper
2007	Micro-Nanostructural Investigations of AlSi1 Bondcontacts Geißler, U.; Schneider-Ramelow, M.; Reichl, H.	Conference Paper
2007	Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.	Conference Paper
2006	Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichel, H.	Journal Article
2006	Methoden zur Zuverlässigkeitsqualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik: Herausforderungen und Möglichkeiten Wilde, J.; Schneider-Ramelow, M.; Petzold, M.; Scheel, W.	Book
2006	Physics-of-failure-Modelle für Ausfallmechanismen Schneider-Ramelow, M.; Wilde, J.; Janz, D	Book Article
2006	Predicting the shear strength of a wire bond using laser vibration measurements Gaul, H.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.	Conference Paper
2006	Raumtemperatur-Bondbarkeit und Zuverlässigkeitsbetrachtungen beim Au-TS-Ball/Wedge-Bonden Schneider-Ramelow, M.; Schmitz, S.	Conference Paper
2005	Grenzflächenuntersuchungen beim US-Wedge/Wedge-Bonden von Al-Drähten verschiedener Drahtstärken Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.	Journal Article
2005	Investigations on TS bondability of different Au wires down to room temperature Schneider-Ramelow, M.; Petzold, M.; Knoll, H.; Wohnig, M.	Conference Paper
2004	Bond reliability of new quality Au and Cu wires at high temperature load > 175 ºC Schneider-Ramelow, M.; Lang, K.-D.; Ferber, A.; Meier, P.	Journal Article
2004	Grenzflächenuntersuchungen beim Ultraschall-Wedge-Wedge-Bonden von 25 µm AlSi1-Draht Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.; Reichl, H.	Journal Article
2004	Mechanische Prüfverfahren für Mikroverbindungen elektronischer Schaltungen mit extrem verkleinerten Geometrien Schneider-Ramelow, M.; Rudolf, F.	Journal Article
2004	Metallkundliche Phänomene und Grenzflächenreaktionen beim US-Bonden von 25µm-AlSi1-Draht Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.	Conference Paper
2004	Modern wire bonding technologies - ready for the challenges of future microelectronic packaging Lang, K.-D.; Harman, G.G.; Schneider-Ramelow, M.	Book Article
2004	Ver- oder Entfestigung von Aluminiumdrähten beim Ultraschall-Wedge-Wedge-Bonden Schneider-Ramelow, M.; Ferber, A.; Lang, K.-D.	Journal Article
2003	Aufbau eines Multi-Sensor-Datenloggers zur biomaritimen Erforschung tief tauchender Meerestiere Schneider-Ramelow, M.; Lang, K.-D.; Bielau, M.; Driesen, H.-H.	Journal Article
2000	MST-BioMar-COB-Technik in hermetisch gekapselten Mikrosystemen Funke, E.; Lang, K.-D.; Rudolf, F.; Schneider-Ramelow, M.	Journal Article
2000	Wire-Bonding bleibt auf Draht - Herausforderungen und Entwicklungen in der Halbleiter Verbindungstechnik Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M.	Journal Article
2000	Wire-Bonding bleibt auf Draht. Herausforderungen und Entwicklungen in der Halbleiter-Verbindungstechnik Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M.	Journal Article