Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2020Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, K.; MacKowiak, P.; Kröhnert, K.; Oppermann, H.; Jürgensen, N.; Wietstruck, M.; Göritz, A.; Tolunay Wipf, S.; Kaynak, M.; Lang, K.-D.
Conference Paper
2020Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling
Schwietering, J.; Herbst, C.; Kirsch, O.; Arndt-Staufenbiel, N.; Wachholz, P.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Journal Article
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Conference Paper
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2020Uv sensor based on fiber bragg grating covered with graphene oxide embedded in composite materials
Lesiak, P.; Bednarska, K.; Małkowski, K.; Kozłowski, L.; Wróblewska, A.; Sobotka, P.; Dydek, K.; Boczkowska, A.; Osuch, T.; Anuszkiewicz, A.; Lewoczko-Adamczyk, W.; Schröder, H.; Woliński, T.R.
Journal Article
Fulltext
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Conference Paper
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Conference Paper
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Conference Paper
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2018Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M
Conference Paper
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Conference Paper
2018Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D.
Conference Paper
2018Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S.
Journal Article
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module: Design, technology, performance and reliability within a system approach
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Conference Paper
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Journal Article
Fulltext
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Conference Paper
2017Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Conference Paper
2017Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Conference Paper
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Book Article
2017Quantum cascade detector at 4.3µm wavelength in pixel array configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Conference Paper
2017Shrinkage Measurements of UV‐Curable Adhesives: An elegant method based on a laser distance sensor for in‐situ measurements of the polymerization shrinkage
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Journal Article
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Tackling low temperature bonding in fine pitch applications
Oppermann, H.; Lang, K.-D.
Conference Paper
2017Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen
Brink, Morten; Oppermann, H.; Lang, K.-D.
Conference Paper
20164.3 μm quantum cascade detector in pixel configuration
Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.
Journal Article
Fulltext
2016µAFS High Resolution ADB/AFS Solution
Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.
Report
2016Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm
Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.
Conference Paper
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Conference Paper
2016Enhancement of carbon nanotube FET performance via direct synthesis of poly (sodium 4-styrenesulfonate) in the transistor channel
Toader, M.; Schubel, R.; Hartmann, M.; Scharfenberg, L.; Jordan, R.; Mertig, M.; Schulz, S.E.; Gessner, T.; Hermann, S.
Journal Article
2016Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, Kevin; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2016Intra-stack sealing of tier interconnects using the interconnect alloy
Kleff, Jessica; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.
Conference Paper
2016Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.
Journal Article
2016Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.
Conference Paper
2016Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling
Manier, Charles-Alix; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.
Conference Paper
2016Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.
Conference Paper
2016SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.
Conference Paper
2016Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2015Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production
Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.
Conference Paper
2015Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers
Brusberg, L.; Whalley, S.; Herbst, C.; Schröder, H.
Journal Article
Fulltext
2015Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.
Conference Paper
2015Glass-based Manufacturing and Prototyping Platform PhotPack: New concepts for integrating various optical components in actively aligned glass assemblies
Böttger, G.; Seifert, S.; Schröder, H.
Journal Article
2015High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects
Brusberg, L.; Schröder, H.; Herbst, C.; Frey, C.; Fiebig, C.; Zakharian, A.; Kuchinsky, S.; Liu, X.; Fortusini, D.; Evans, A.
Conference Paper
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2015Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.
Journal Article
2015Silicon photonics packaging on board-level
Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.
Conference Paper
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Conference Paper
2015Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D.
Conference Paper
2015Thin glass based electro-optical circuit board (EOCB): Waveguide process, PCB technology, and coupling interfaces
Schröder, H.; Brusberg, L.
Conference Paper
2015Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.
Conference Paper
2015Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.
Book Article
2014Array fiber welding on micro optical glass substrates for chip-to-fiber coupling
Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D.
Conference Paper
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, Kai; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014CO2-laser drilling of TGVs for glass interposer applications
Brusberg, L.; Queisser, M.; Neitz, M.; Schröder, H.; Lang, K.-D.
Conference Paper
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2014Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer
Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D.
Conference Paper
2014Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test
Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.
Conference Paper
2014Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection
Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D.
Conference Paper
2014Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application
Brusberg, L.; Neitz, M.; Schröder, H.; Fricke-Begemann, T.; Ihlemann, J.
Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Journal Article
Fulltext
2014High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Journal Article
2014Highly sensitive integrated optical biosensors
Zamora, V.; Lützow, P.; Weiland, M.; Pergande, D.; Schröder, H.
Conference Paper
2014Human papillomavirus DNA and host gene mRNA biomarker detection in a "micro total analysis aystem" (microTAS) device to aid diagnosis of cervical intraepithelial neoplasia
Keegan, H.; Pilkington, L.; Jordan, R.; Mozes, J.; Varga, N.; Benczik, M.; Riegger, L.; Koltay, P.; Sauer, U.; Preininger, C.; Koger, B.; Brandenburg, A.; Müller, W.; Faltin, B.; Roth, G.; Martin, C.; Jeney, C.; O'Leary, J.J.
Abstract
2014Human Papillomavirus DNA and Host Gene mRNA Biomarker Detection in a "Micro Total Analysis System" (microTAS) Device to Aid Diagnosis of Cervical Intraepithelial Neoplasia
Keegan, H.; Pilkington, L.; Jordan, R.; Mozes, J.; Varga, N.; Benczik, M.; Riegger, L.; Koltay, P.; Sauer, U.; Preininger, C.; Koger, B.; Brandenburg, A.; Muller, W.; Faltin, B.; Roth, C.; Martin, C.; Jeney, C.; O'Leary, J.J.
Abstract
2014A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS)
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology
Brusberg, L.; Herbst, C.; Neitz, M.; Schröder, H.; Lang, K.-D.
Conference Paper
2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article
2014Phase change based thermal buffering of transient loads for power converter
Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.
Conference Paper
2014Strategies for glass based photonic system integration
Schröder, H.; Brusberg, L.; Böttger, G.
Conference Paper
2014Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.
Conference Paper
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Journal Article
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
2013Active or passive fiber-chip-alignment: Approaches to efficient solutions
Böttger, G.; Schröder, H.; Jordan, R.
Conference Paper
2013Embedded planar glass waveguide optical interconnect for data centre applications
Pitwon, R.; Schröder, H.; Brusberg, L.; Graham-Jones, J.; Wang, K.
Conference Paper
2013The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures
Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.
Conference Paper
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D.
Conference Paper
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Optical system components for navigation grade fiber optic gyroscopes
Heimann, M.; Liesegang, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.
Conference Paper
2013Panel level packaging for LED lighting
Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D.
Conference Paper
2013Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Conference Paper
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Conference Paper
2012Advances in CO2-laser drilling of glass substrates
Brusberg, L.; Queisser, M.; Gentsch, C.; Schröder, H.; Lang, K.D.
Conference Paper
Fulltext
2012Assembly and interconnect formation in MEMS/MOEMS application
Oppermann, H.
Conference Paper
2012Au/Sn Solder
Oppermann, H.; Hutter, M.
Book Article
2012Die bonding in embedded substrates
Oppermann, H.; Rothermund, M.; Jurgensen, N.; Yen, U.; Essig, K.
Conference Paper
2012Challenges in LED packaging and green lighting
Jordan, R.; Hutter, M.; Oppermann, H.
Conference Paper
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2012Mass flows of selected target materials in LED products
Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.
Conference Paper
2012Nanoporous gold bumps for low temperature bonding
Oppermann, H.; Dietrich, L.
Journal Article
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Girolamo, B. di; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.
Journal Article
Fulltext
2012Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications
Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.
Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.
Conference Paper
2011Actuated micro-optical submount using a dielectric elastomer actuator
Jordan, G.; McCarthy, D.N.; Schlepple, N.; Krißler, J.; Schröder, H.; Kofod, G.
Journal Article
2011Chip-to-chip communication by optical routing inside a thin glass substrate
Brusberg, L.; Schlepple, N.; Schröder, H.
Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.
Journal Article
2011Electromigration in electroplated gold micro contacts
Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Conference Paper
2011Evaluation of graded index glass waveguides for board-level WDM optical chip-to-chip communications
Schrage, J.; Stuebbe, O.; Brusberg, L.; Soenmez, Y.; Schroeder, H.; Schuhmann, R.
Conference Paper
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Conference Paper
2011Glass panel processing for electrical and optical packaging
Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N.; Hofmann, J.; Marx, S.
Conference Paper
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.
Conference Paper
2011Integrated optical waveguides for VLSI applications
Schröder, H.; Griese, E.
Book Article
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
2011Nanostructured polymer brushes and protein density gradients on diamond by carbon templating
Hutter, N.A.; Steenackers, M.; Reitinger, A.; Williams, O.A.; Garrido, J.A.; Jordan, R.
Journal Article
2011Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
Oppermann, H.; Hutter, M.; Ehrhardt, C.
Patent
Fulltext
2011Recyclable PUFs: Logically reconfigurable PUFs
Katzenbeisser, S.; Koçabas, Ü.; Leest, V. van der; Sadeghi, A.-R.; Schrijen, G.-J.; Schröder, H.; Wachsmann, C.
Conference Paper
2011Recyclable PUFs: Logically reconfigurable PUFs
Katzenbeisser, S.; Koçabas, Ü.; Leest, V. van der; Sadeghi, A.-R.; Schrijen, G.-J.; Schröder, H.; Wachsmann, C.
Journal Article
2011Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.
Journal Article
2011Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level
Brusberg, L.; Lang, G.; Schröder, H.
Conference Paper
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.
Conference Paper
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level
Schröder, H.
Conference Paper
2010Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.
Patent
Fulltext
2010Generic packaging concepts in the frame of network of excellence ePIXnet
Tekin, T.; Zimmermann, L.; Schröder, H.; Dumon, P.; Bogaerts, W.; Galan, J.V.; Sanchis, P.; Whelan-Curtin, W.; Beggs, D.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B.
Conference Paper
2010Integration of a multifunctional and multispectral optical sensor for automotive applications using surface mountable planar optical interconnect
Klein, A.; Gerritzen, A.; Schröder, H.; Oppermann, H.; Capello, D.; Pallaro, N.
Conference Paper
2010Microstructured poly(2-oxazoline) bottle-brush brushes on nanocrystalline diamond
Hutter, N.A.; Reitinger, A.; Zhang, N.; Steenackers, M.; Williams, O.A.; Garrido, J.A.; Jordan, R.
Journal Article
2010Nano-porous gold interconnect
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.; Reichl, H.
Conference Paper
2010Nanoporous interconnects
Oppermann, H.; Dietrich, L.; Klein, M.; Wunderle, B.
Conference Paper
2010New options for chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level
Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N.
Conference Paper
2010Power efficient data communication modules for optical networks
Schröder, H.; Brusberg, L.; Stobbe, L.; Tekin, T.
Conference Paper
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.
Conference Paper
2009AuSn solder in photonics assembly
Oppermann, H.
Conference Paper
2009Automated assembly of fast-axis collimation (FAC) lenses for diode laser bar modules
Miesner, J.; Timmermann, A.; Meinschien, J.; Neumann, B.; Wright, S.; Tekin, T.; Schröder, H.; Westphalen, T.; Frischkorn, F.
Conference Paper
2009Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.
Patent
Fulltext
2009CMOS compatible silicon etched V-grooves integrated with a SOI fiber coupling technique for enhancing fiber-to-chip alignment
Galan, J.V.; Sanchis, P.; Marti, J.; Marx, S.; Schröder, H.; Mukhopadhyay, B.; Tekin, T.; Selvaraja, S.; Bogaerts, W.; Dumon, P.; Zimmermann, L.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Faseroptischer Sensor und Verfahren zur Herstellung
Schröder, H.; Schmälzlin, E.; Löhmannsröben, H.-G.
Patent
Fulltext
2009Freshscan - microsystems based spectroscopic measurements for logistic chain monitoring in the meat industry
Thomasius, R.; Jordan, G.; Kim, J.-U.; Schröder, H.; Reichl, H.
Conference Paper
2009FreshScan - Portables optisches Messsystem zur Überwachung des Frischegrades von Fleisch
Thomasius, R.; Kim, J.-U.; Nestler, V.; Reichl, H.; Jordan, G.; Schröder, H.; Lang, K.-D.; Maiwald, M.; Sumpf, B.; Schmidt, H.; Kronfeldt, H.-D.; Hengl, C.; Wulf, J.
Conference Paper
2009Green light source by single-pass second harmonic generation with laser and crystal in a tilted butt joint setup
Wiedmann, J.; Scholz, F.; Tekin, T.; Marx, S.; Lang, G.; Schröder, H.; Brox, O.; Erbert, G.
Conference Paper
2009Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F.
Journal Article
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article
2009Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H.
Conference Paper
2009Mikrooptisches Koppelelement mit integrierten optischen Wellenleitern
Tekin, T.; Schroeder, H.; Arndt-Staufenbiehl, N.; Brusberg, L.
Patent
Fulltext
2009Non-invasive mobile monitoring of meat quality
Jordan, G.; Thomasius, R.; Schröder, H.; Wulf, J.S.; Schlüter, O.; Sumpf, B.; Maiwald, M.; Schmidt, H.; Kronfeldt, H.-D.; Scheuer, R.; Schwägele, F.; Lang, K.-D.
Journal Article
2009Out-of-plane coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.; Tekin, T.
Conference Paper
2009Photonic system-in-package technologies using thin glass substrates
Brusberg, L.; Schröder, H.; Töpper, M.; Reichl, H.
Conference Paper
2009Stability of AuSn eutectic solder cap on Au socket during reflow
Yu, D.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2009Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H.
Conference Paper
2009VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components
Pruijmboom, A.; Booij, S.; Schemmann, M.; Werner, K.; Hoeven, P.; Limpt, H. van; Intemann, S.; Jordan, R.; Fritzsch, T.; Oppermann, H.; Barge, M.
Conference Paper
2008Compact green laser source using butt-coupling between multi-section DFB-laser and SHG waveguide crystal
Wiedmann, J.; Brox, O.; Tekin, T.; Scholz, F.; Büttner, T.; Marx, S.; Lang, G.; Schröder, H.; Klehr, A.; Erbert, G.
Journal Article
2008A compact integrated green-light source by second harmonic generation of a GaAs distributed feedback laser diode
Tekin, T.; Schröder, H.; Wunderle, B.; Erbert, G.; Klehr, A.; Brox, O.; Wiedmann, J.; Scholz, F.
Conference Paper
2008Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips
Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.
Conference Paper
2008Effizienter Wellenlaengenkonverter und Leuchtvorrichtung mit einem effizienten Wellenlaengenkonverter
Jordan, R.; Oppermann, H.
Patent
Fulltext
2008Electrical-optical circuit boards optical waveguides and coupling elements based on the thin glass layer concept
Schröder, H.; Arndt-Staufenbiehl, N.
Journal Article
2008Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides
Beier, A.; Schröder, H.; Arndt-Staufenbiel, N.; Ebling, F.; Franke, M.; Griese, E.; Intemann, S.; Kostelnik, J.; Kühler, T.; Mödinger, R.; Roda, I.; Schlosser, I.
Conference Paper
2008ePIXpack - advanced smart packaging solutions for silicon photonics
Zimmermann, L.; Schröder, H.; Dumon, P.; Bogaerts, W.; Tekin, T.
Conference Paper
Fulltext
2008Fibre-array optical interconnection for silicon photonics
Tekin, T.; Schröder, H.; Zimmermann, L.; Dumon, P.; Bogaerts, W.
Conference Paper
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper
2008g-Pack - a generic testbed package for silicon photonics devices
Zimmermann, L.; Schröder, H.; Tekin, T.; Bogaerts, W.; Dumon, P.
Conference Paper
Fulltext
2008"glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.
Conference Paper
2008"glassPack": A novel photonic packaging and integration technology using thin glass foils
Brusberg, L.; Schröder, H.; Arndt-Staufenbiel, N.; Wiemer, M.
Conference Paper
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Conference Paper
2008Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow
Yu, D.Q.; Oppermann, H.; Kleff, J.; Hutter, M.
Journal Article
2008Lead free solder joints: reliability and metallurgical reactions
Hutter, M.; Schmidt, R.; Pape, U.; Oppermann, H.; Reichl, H.
Conference Paper
2008Optical coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiehl, N.; Brusberg, L.; Tekin, T.
Conference Paper
2008Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides
Schröder, H.; Arndt-Staufenbiel, N.; Beier, A.; Ebling, F.; Franke, M.; Griese, E.; Intemann, S.; Kostelnik, J.; Kühler, T.; Mödinger, R.; Roda, I.; Schlosser, I.
Conference Paper
2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.
Patent
Fulltext
2007Converter film technology for homogeneous white light
Jordan, R.C.; Bauer, J.; Oppermann, H.
Conference Paper
2007ECD wafer bumping and packaging for pixel detector applications
Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Integrated polymer multimode waveguides for microfluidic sensing applications
Otto, T.; Nestler, J.; Baum, M.; Schroeder, H.; Ebling, F.; Bruch, R.; Gessner, T.
Conference Paper
2007Investigations on possibilities of inline inspection of high aspect ratio microstructures
Engelke, R.; Ahrens, G.; Arndt-Staufenbiehl, N.; Kopetz, S.; Wiesauer, K.; Löchel, B.; Schröder, H.; Kastner, J.; Neyer, A.; Stifter, D.; Grützner, G.
Conference Paper
2007Lotmetallisierung
Hutter, M.; Oppermann, H.; Rafael, J.; Thomas, T.
Patent
Fulltext
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper
2007Reliability Investigation of Large GaAs Pixel Detectors Flip Chip Bonded on Si Readout Chips
Klein, M.; Oppermann, H.; Hutter, M.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R; Reichl, H.
Conference Paper
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.
Journal Article
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.
Conference Paper
2007Verfahren zum Herstellen einer Mikrostruktur oder Nanostruktur und mit Mikrostruktur oder Nanostruktur versehenes Substrat
Oppermann, H.; Wolf, J.; Jordan, R.; Schmidt, R.; Engelmann, G.
Patent
Fulltext
2007Verfahren zum Herstellen einer nanoporoesen Schicht
Oppermann, H.; Dietrich, L.; Engelmann, G.; Wolf, J.
Patent
Fulltext
2007Verfahren zum Verbinden einer Edelmetalloberflaeche mit einem Polymer
Oppermann, H.
Patent
Fulltext
2007Verfahren zum Verbinden zweier Fuegeflaechen
Oppermann, H.
Patent
Fulltext
2007Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
Oppermann, H.
Patent
Fulltext
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Biocompatible hybrid system integration of silicon based neural interface devices
Tathireddy, P.; Chakravarthy, S.; Hsu, J.; Klein, M.; Oppermann, H.; Rieth, L.; Harrison, R.; Normann, R.A.; Solzbacher, F.
Conference Paper
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2006Goldhaltiges Lotdepot, Verfahren zu dessen Herstellung, Lötverfahren und Verwendung
Oppermann, H.
Patent
Fulltext
2006Multiple flip-chip assembly for hybrid compact optoelectroi modules using electroplated AuSn solder Bumps
Chu, K.-M.; Lee, J.-S.; Oppermann, H.; Engelmamr, G.; Wolf, J.; Reichl, H.; Jeon, D.Y.
Conference Paper
2006Optimized heat transfer and homogeneous color converting for ultra high brightness LED package
Jordan, R.; Bauer, J.; Oppermann, H.
Conference Paper
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Polymer optical interconnects - a scalable large-area panel processing approach
Uhlig, S.; Fröhlich, L.; Chen, M.; Arndt-Staufenbiel, N.; Lang, G.; Schröder, H.; Houbertz, R.; Popall, M.; Robertsson, M.
Journal Article
2006Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
Hutter, M.; Oppermann, H.; Engelmann, G.; Dietrich, L.; Reichl, H.
Conference Paper
2006Preventing of dewetting effects for inorganic-organic hybrid polymers applied in sequentially buildup (SBU) technology without surface pretreatments
Uhlig, S.; Domann, G.; Houbertz, R.; Fröhlich, L.; Schröder, H.; Krissler, J.; Lang, G.; Robertsson, M.
Journal Article
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2006Substratbauteil mit eingebettetem Lichtwellenleiter und Strahlumlenkung und Verfahren zu dessen Herstellung
Bauer, J.; Beier, A.; Beil, P.; Demmer, P.; Ebling, F.; Franke, M.; Guenther, P.; Happel, T.; Kostelnik, J.; Moedinger, R.; Park, H.; Schroeder, H.
Patent
Fulltext
2006Temperaturstabile Wellenleiter und optische Kopplung für elektro-optische Leiterplatten
Schröder, H.; Bauer, J.; Ebling, F.; Pfeiffer, K.
Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.
Conference Paper
2006Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards
Schröder, H.; Bauer, J.; Ebling, F.; Franke, M.; Beier, A.; Demmer, P.; Süllau, W.; Kostelnik, J.; Mödinger, R.; Pfeiffer, K.; Ostrzinski, U.; Griese, E.
Conference Paper
2005Au/Sn-Flip-Chip-Bonding für 77 GHz-Radar-Frontend-Anwendungen
Klein, M.; Hutter, M.; Oppermann, H.
Journal Article
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Gold-gold flip chip bonding processes for RF, optoelectronic, high temperature and power devices
Klein, M.; Oppermann, H.; Reichl, H.
Conference Paper
2005Investigation of Different Flip Chip Assembly Processes Using Au/Sn Microbumps
Hutter, M.; Thomas, T.; Jordan, R.; Engelmann, G.; Oppermann, H.; Reichl, H.; Wang, Y.; Howlader, M.; Higurashi, E.; Suga, T.
Conference Paper
2005Mehrlagige Trittschall-Daemmschicht
Schroeder, H.
Patent
Fulltext
2005Micro-optical bench technology using ultra-precision milling
Schröder, H.; Oberschmidt, D.
Conference Paper
2005New Generation Interconnection Technology: Printed Circuit Boards with Integrated Optical Layers
Demmer, P.; Schröder, H.; Bauer, J.; Ebling, F.; Beil, P.; Albrecht, H.; Franke, M.; Beier, A.; Kostelnik, J.; Mödinger, R.; Pfeiffer, K.; Griese, E.
Conference Paper
2005New-generation interconnect
Albrecht, H.; Beier, A.; Demmer, P.; Franke, M.; Mödinger, R.; Pfeiffer, K.; Beil, P.; Kostelnik, J.; Bauer, J.; Ebling, F.; Schröder, H.; Griese, E.
Conference Paper
2005Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Passive Alignment Flip Chip Assembly Using Surface Tension of Liquid Solder and Micromechanical Stops
Oppermann, H.; Hutter, M.; Engelmann, G.; Reichl, H.
Conference Paper
2005Polymerwellenleiter fuer opto-elektrische Schaltungstraeger
Pfeiffer, K.; Ostrzinski, U.; Schroeder, H.; Bauer, J.; Gruetzner, G.
Patent
Fulltext
2005The role of Au/Sn solder in packaging
Oppermann, H.
Conference Paper
2005Technologien und Packaging für optische Wellenleiter in elektrisch-optischen Leiterplatten
Schröder, H.; Bauer, J.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2004Alternative determination of dynamic stiffness of thick insulating layers
Leistner, P.; Schröder, H.; Richter, B.
Conference Paper
2004Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
Hutter, M.; Hohnke, F.; Oppermann, H.; Klein, M.; Engelmann, G.
Conference Paper
2004Evaluation of walking noise on floors
Schröder, H.; Richter, B.
Conference Paper
2004Flanking sound reduction of suspended ceilings
Richter, B.; Leistner, P.; Schröder, H.
Conference Paper
2004Flip chip assembly and reliability using gold/tin solder bumps
Oppermann, H.; Hutter, M.; Klein, M.; Reichl, H.
Conference Paper
2004Flip Chip Assembly Using AuSn Solder Bumps for GaAs Applications
Oppermann, H.; Hutter, M.; Jordan, R.; Klein, M.; Engelmann, G.; Wolf, J.; Reichl, H.
Conference Paper
2004High precision passive alignment flip chip assembly using self alignment and micromechanical stops
Hutter, M.; Oppermann, H.; Engelmann, G.; Reichl, H.
Conference Paper
2004Investigation of Cu stud bumping for single chip flip-chip assembly
Klein, M.; Busse, E.; Kaschlun, K.; Oppermann, H.
Conference Paper
2004Investigation of solder bumps, flip chip assembly, reliability and passive alignment using Au/Sn
Hutter, M.; Klein, M.; Engelmann, G.; Oppermann, H.
Book Article
2004Längs oder durch ist nicht egal
Schröder, H.
Journal Article
2004Large-area processing of inorganic-organic hybrid polymers (ORMOCER®s) for optical backplane application
Uhlig, S.; Robertsson, M.; Schröder, H.; Lang, G.; Arndt-Staufenbiel, A.; Popall, M.; Fröhlich, L.; Houbertz, R.
Conference Paper
2004Messungen der dynamischen Steifigkeit und Vorzüge mehrlagiger Trittschalldämmung
Schröder, H.
Journal Article
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2004New optical pin for 90 degree waveguide coupling in electrical-optical circuit boards (EOCB)
Schröder, H.; Bauer, J.; Ebling, F.; Franke, M.; Happel, T.; Kostelnik, J.
Conference Paper
2004Specific glass fiber technologies: Lensing and laser fusion
Arndt-Staufenbiel, N.; Lang, G.; Krissler, J.; Schröder, H.; Scheel, W.
Conference Paper
2004Verfahren zum Erzeugen einer Lotverbindung durch kapillaren Lotfluss
Oppermann, H.; Hutter, M.
Patent
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2003Bauakustik-Datenbank
Schröder, H.
Conference Paper
2003Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Reichl, H.; Aschenbrenner, R.; Ansorge, F.; Becker, K.; Ehrlich, R.; Oppermann, H.; Azdasht, G.
Patent
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2003Gehgeräusche bei Massiv- und Holzbalkendecken
Leistner, P.; Schröder, H.; Richter, B.
Journal Article
2003Hot embossing for MEMS using silicon tools
Küchler, M.; Otto, T.; Gessner, T.; Ebling, F.; Schröder, H.
Journal Article
2003Kontakthoecker mit profilierter Oberflaechenstruktur sowie Verfahren zur Herstellung
Oppermann, H.; Ostmann, A.; Nieland, C.
Patent
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2003Polymer BioMEMs with integrated optical and fluidic functionality
Windhorn, K.; Meixner, L.; Drost, S.; Schröder, H.; Kilgus, E.; Scheel, W.; Ebling, F.; Otto, T.; Küchler, M.; Nestler, J.; Geßner, T.
Conference Paper
2003Reduction of indirect sound transmission by additional layers
Schröder, H.
Conference Paper
2003Substratstapel
Oppermann, H.
Patent
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2003Verfahren und Vorrichtung zur Strukturierung, insbesondere Mikrostrukturierung, von Polymerfolien
Ebling, F.; Schroeder, H.; Lang, G.
Patent
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2003Verfahren zum stoffschluessigen Verbinden mikrotechnischer Bauteile
Lang, G.; Arndt-Staufenbiel, N.; Schroeder, H.
Patent
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2003Verfahren zur Erzeugung von erhabenen Strukturen, insbesondere Kontakthoeckern
Oppermann, H.; Ostmann, A.
Patent
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2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Modular systems for sensor integration
Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Journal Article
2002Untersuchung von Gehgeräuschen
Richter, B.; Schröder, H.
Journal Article
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2002Verbesserung der Längs-Schalldämmung durch Vorsatzschalen
Schröder, H.
Journal Article
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2001(9-Oxo-9H-Fluoren-2-yl)-Phenyl-Iodonium Hexafluoroantimonate(V) - a photoinitiator for the cationic polymerisation of epoxides
Hartwig, A.; Harder, A.; Lühring, A.; Schröder, H.
Journal Article
2001Aktuelle Schalldämmwerte von Gipskartonständerwänden - welche Werte gelten nun für die Praxis?
Schröder, H.
Conference Paper
2001Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Elger, G.; Voigt, J.; Oppermann, H.
Conference Paper
2001Convex corner undercutting of (100) silicon in anisotropic KOH etching: The new step-flow model of 3-D structuring and first simulation results
Schröder, H.; Obermeier, E.; Horn, A.; Wachutka, G.K.M.
Journal Article
2001Kleben mit flüssigkristallinen Epoxidharzen
Hartwig, A.; Harder, A.; Schnurpfeil, G.; Schröder, H.; Wöhrle, D.
Journal Article
2001MOEMS - Technologie, Packaging und optische Verbindungstechnik
Schröder, H.; Scheel, W.
Journal Article
2001MOEMS - Technology, packaging and optical interconnection
Schröder, H.; Scheel, W.
Conference Paper
2001Polymer optical interconnects for PCB
Schröder, H.; Bauer, J.; Ebling, F.; Scheel, W.
Conference Paper
2001Synthesis and photoinitiated polymerization of nematic liquid-crystalline diepoxides
Schnurpfeil, G.; Harder, A.; Schröder, H.; Wöhrle, D.; Hartwig, A.; Hennemann, O.-D.
Journal Article
2000Avanzadas Tecnologias "Flip Chip"
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Spectroscopic measurement of mounting-induced strain in optoelectronic devices
Bärwolff, A.; Tomm, J.W.; Müller, R.; Weiss, S.; Hutter, M.; Oppermann, H.; Reichl, H.
Journal Article
2000Synthesis and photoinduced polymerization of liquid crystalline diepoxides for bonding in the microsystem technique
Wöhrle, D.; Hartwig, A.; Schnurpfeil, G.; Harder, A.; Schröder, H.
Journal Article
1999Advanced flip chip technologies
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Gehaeuse zur Aufnahme von Bauelementen und Verfahren zu dessen Herstellung
Azdasht, G.; Leutenbauer, R.; Oppermann, H.
Patent
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1999Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Oppermann, H.; Azdasht, G.
Patent
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1999Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Single chip bumping and reliability for flip chip processes
Klein, M.; Oppermann, H.; Kalicki, R.; Aschenbrenner, R.; Reichl, H.
Journal Article
1998Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Verfahren zur Verbindung eines Bauelements mit einem Substrat und eine damit hergestellte elektrische Schaltung
Oppermann, H.; Azdasht, G.
Patent
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1997New trends in semiconductor packaging
Oppermann, H.; Zakel, E.; Reichl, H.
Conference Paper
1995Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper
1995Hybrid Visualization Component for Planning Cellular Radio Networks
Haase, H.; Lutze, K.; Oppermann, E.; Schröder, H.
Journal Article
1994Damage structures due to thermal fatigue - development of a stochastic simulation model
Winkler, T.; Kullig, E.; Oppermann, H.; Foit, A.; Michel, B.
Conference Paper