Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2021High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications
Murugesan, K.S.; Chernobryvko, M.; Zinal, S.; Rossi, M.; Ndip, I.; Boettcher, M.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S.B.; Trewhella, J.
Conference Paper
2021Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
Dilek, S.; Ndip, I.; Rossi, M.; Tschoban, C.; Kuttler, S.; Wittler, O.; Lang, K.-D.; Goetze, C.; Berger, D.; Wieland, M.; Schneider-Ramelow, M.
Conference Paper
2021RF Modeling and Measurement of a Novel Aperture-Coupled Hybrid Glass-Silicon 5G Antenna Array
Le, T.H.; Rossi, M.; Ndip, I.; Kaiser, M.; Manier, C.-A.; Gernhardt, R.; Oppermann, H.; Lang, K.-D.; Reichl, H.
Conference Paper
2020Dual-Band 5G Antenna Array in Fan-Out Wafer-Level Packaging (FOWLP) Technology
Le, T.H.; Kanitkar, A.; Rossi, M.; Ndip, I.; Braun, T.; Mueller, F.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S.B.; Trewhella, J.
Conference Paper
2020Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications
Kanitkar, A.; Chernobryvko, M.; Rossi, M.; Ndip, I.; Braun, T.; Müller, F.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S. bin; Trewhella, J.
Conference Paper
2020A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2020Performance simulation of a 5G hybrid beamforming millimeter-wave system
Kühne, T.; Song, X.; Caire, G.; Rasilainen, K.; Le, T.H.; Rossi, M.; Ndip, I.; Fager, C.
Conference Paper
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Journal Article
2019Compact wideband wilkinson power divider in thin-film glass technology for 5G applications
Murugesan, K.S.; Voigt, T.; Tschoban, C.; Rossi, M.; Ndip, I.; Lang, K.-D.; Nädele, D.; Student, R.; Dengler, D.
Conference Paper
2019Development of a glass technology based 79 GHz MIMO radar front-end module for autonomous driving
Tschoban, C.; Rossi, M.; Reyes, J.; Ndip, I.; Lang, K.-D.
Conference Paper
2019Entwicklung eines MIMO-Radarfrontends auf Glasinterposer Basis fürs autonome Fahren
Tschoban, C.; Fritsche, C.; Böttcher, M.; Steller, W.; Ndip, I.; Pötter, H.
Conference Paper
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Conference Paper
2018Can Bond Wires really be used as Antennas?
Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Conference Paper
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Journal Article
2018Differential-Line Characterization Using Mixed-Port Scattering Parameters
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Effects of Glob Top on mmWave Bond Wire Antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Impact of multilayer stack-ups on bond wire antennas at millimetre-wave frequencies
Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D.
Conference Paper
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Journal Article
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Journal Article
Fulltext
2018Roles and Requirements of Electronic Packaging in 5G
Ndip, I.; Lang, K.-D.
Conference Paper
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Conference Paper
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Conference Paper
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Conference Paper
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Conference Paper
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Conference Paper
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Journal Article
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Conference Paper
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Journal Article
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H.
Conference Paper
2015Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X.
Journal Article
2014Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D.
Conference Paper
2014Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Journal Article
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2014Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.
Conference Paper
2014Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.
Conference Paper
2013Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2013Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2013Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Conference Paper
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
Fulltext
2013Introduction
Nowak, M.; Lee, C.; Ndip, I.; Goetz, M.
Conference Paper
2013Introduction
Ndip, I.; Yu, J.; Rouzaud, A.; Hoffmeyer, M.
Conference Paper
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2013Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
Lang, K.-D.; Ndip, I.; Guttowksi, S.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Journal Article
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Introduction: 2011 International Symposium on Microelectronics
Sigliano, R.; Chiang, K.-N.; Ndip, I.; Chan, B.
Conference Paper
2012Modeling and optimization of electronic packaging structures for signal and power integrity
Scogna, A.C.; Engin, A.E.; Ndip, I.
Conference Paper
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2012Optmized patch-like antennas for through the wall radar imaging and preliminary results with frequency modulated interrupted continuous wave
Fioranelli, F.; Salous, S.; Ndip, I.
Conference Paper
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Conference Paper
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Conference Paper
2011From the technical chairs
Sigliano, R.; Chan, B.; Ndip, I.; Chiang, K.-N.
Journal Article
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Conference Paper
2011Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M.
Conference Paper
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Journal Article
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Conference Paper
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Journal Article
2010Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Journal Article
Fulltext
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Conference Paper
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Design and integration of a planar EBG for UWB applications
Ndip, I.; Bierwirth, M.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes
Reichl, H.; Ndip, I.
Conference Paper
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and analysis of electromagnetic field distribution in vicinity of patch antennas at millimeter-wave frequencies
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and Measurement of Coplanar Transmission Lines with Significant Proximity and Surface Roughness Effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Conference Paper
2009Modeling and quantification of conventional and Coax-TSVs for RF applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H.
Conference Paper
2009A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Reduction of signal line to power plane coupling using controlled-return- current transmission lines
Engin, A.E.; Ndip, I.
Conference Paper
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Book Article
2009Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2008Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Managing losses in through silicon vias with different return current path configurations
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H.
Patent
Fulltext
2007Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.
Patent
Fulltext
2006A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006RF/Microwave Modeling of SiP Modules - A novel approach
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2005Effects of discontinuities and technological fluctuations on the RF performance of BGA packages
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2005Efficient RF/microwave modeling of discontinuities in chip packages and boards
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2005Minimizing reflections and cross-talk in chip packages
Ndip, I.; John, W.; Reich, H.
Conference Paper
2005A novel approach for RF/microwave modeling and optimization of BGA packages
Ndip, I.; John, W.; Reichl, H.; Thiede, A.
Conference Paper
2004Methodology for Efficient Modeling of BGA Packages at RF/microwave Frequencies
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Conference Paper
2004RF/microwave modeling and comparison of buried, blind and through-hole vias
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2003A novel modelling methodology of bump arrays for RF and high-speed applications
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Conference Paper