Michel, B. :
Micromaterials and nanomaterials
Berlin: ddp Goldenbogen
urn:ISSN:1619-2486
Fraunhofer IZM


Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter:
3D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin. (International Conference on Structural Nano Composites (NANOSTRUC) <2018, Berlin>)
Njuguna, J.: NANOSTRUC 2018, International Conference on Structural Nano Composites. Abstract Book: 23rd - 24th May 2018, Berlin, Germany. Berlin, 2018, pp. 59-61
Fraunhofer IZM


Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter:
3D wire - a novel approach for 3D chips interconnection for harsh environment applications. (Smart Systems Integration Conference (SSI) <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 100-105
Fraunhofer IZM


Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.:
5G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments: The 5G-PHOS Approach. (International Symposium on Broadband Multimedia Systems and Broadcasting (BMSB) <13, 2018, Valencia>)
Institute of Electrical and Electronics Engineers -IEEE-: Leading the way to future multimedia and broadcasting: 13th IEEE International Symposium on Broadband Multimedia Systems and Broadcasting, BMSB 2018: 6-8 June 2018, Valencia (Spain) . Piscataway, NJ: IEEE, 2018, pp. 92-93
info:doi/10.1109/BMSB.2018.8436713
Fraunhofer IZM


Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub:
Adaptive camouflage panel in the visible spectral range. (Conference "Target and Background Signatures" <4, 2018, Berlin>)
Stein, K.U.: Target and Background Signatures IV: 10-13 September 2018, Berlin, Germany. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10794), Paper 107940W, 9 pp.
info:doi/10.1117/12.2326591
Fraunhofer IOSB
Fraunhofer IAF
Fraunhofer IZM


Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong:
Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Knaut, Matthias: Kreativität + X = Innovation. Berlin: BWV, 2018. (Schriften der Hochschule für Technik und Wirtschaft Berlin 8), pp. 214-221
Fraunhofer IZM


Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.:
Advanced through silicon vias for hybrid pixel detector modules
Nuclear instruments and methods in physics research, Section A. Accelerators, spectrometers, detectors and associated equipment, (2018), Online First, 2 pp.
info:doi/10.1016/j.nima.2018.08.067
Fraunhofer IZM


Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.:
Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 464-467
Fraunhofer IZM


Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan:
Antennenmessplatz
2018
Fraunhofer IZM


Ndip, Ivan:
Antennenvorrichtung mit Bonddrähten
2018
Fraunhofer IZM


Ndip, Ivan:
Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
2018
Fraunhofer IZM


Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.:
Die attach for high power VCSEL array systems. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 412-415
Fraunhofer IZM


Ndip, Ivan:
Bändchenbondantennen
2018
Fraunhofer IZM


Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.:
Catastrophic Optical Damage of GaN-Based Diode Lasers: Sequence of Events, Damage Pattern, and Comparison with GaAs-Based Devices
Journal of Electronic Materials, Vol.47 (2018), No.9, pp.4959-4963
info:doi/10.1007/s11664-018-6144-6
Fraunhofer IZM


Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.:
Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration. (International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>)
Japanese journal of applied physics, Vol.57 (2018), No.2S1, Art. 02BC05, 7 pp.
info:doi/10.7567/JJAP.57.02BC05
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.:
Closed-form multipole debye model for time-domain modeling of lossy dielectrics
IEEE transactions on electromagnetic compatibility, (2018), Online First, 3 pp.
info:doi/10.1109/TEMC.2018.2838522
Fraunhofer IZM


Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.:
Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS). (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 201-206
Fraunhofer IZM


Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.:
A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies . (International Microwave and Radar Conference (MIKON) <22, 2018, Poznán>)
Institute of Electrical and Electronics Engineers -IEEE-: 22nd International Microwave and Radar Conference, MIKON 2018: May 14-17, 2018, Poznán, Poland. Piscataway, NJ: IEEE, 2018, pp. 222-225
info:doi/10.23919/MIKON.2018.8405183
Fraunhofer IZM


Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.:
Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers . (High Power Diode Lasers and Systems Conference (HPD) <9, 2017, Coventry>)
Institute of Electrical and Electronics Engineers -IEEE-: High Power Diode Lasers and Systems Conference, HDP 2017. Proceedings: Co-located with Photonex 2017, Ricoh Arena, Coventry, United Kingdom, 11th and 12th October 2017. Piscataway, NJ: IEEE, 2018, pp. 55-56
info:doi/10.1109/HPD.2017.8261097
Fraunhofer IZM


Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.:
Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Microelectronics reliability, Vol.88-90 (2018), pp.534-539
info:doi/10.1016/j.microrel.2018.07.124
Fraunhofer IZM


Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.:
Corrosion behaviour of sintered silver under maritime environmental conditions
Microelectronics reliability, Vol.88-90 (2018), pp.715-720
info:doi/10.1016/j.microrel.2018.07.123
Fraunhofer IZM


Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.:
Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength . (Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>)
Karikalan, S.: 68th Electronic Components and Technology Conference, ECTC 2018. Proceedings: 29 May-1 June 2018, San Diego, California. Piscataway, NJ: IEEE, 2018, pp. 808-813
info:doi/10.1109/ECTC.2018.00125
Fraunhofer IZM


Schröder, H.; Neitz, M.; Schneider-Ramelow, M.:
Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy. (Conference "Optical Interconnects" <18, 2018, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVIII: 27 January - 1 February 2018, San Francisco, California, United States. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10538), Paper 105380D, 13 pp.
info:doi/10.1117/12.2297363
Fraunhofer IZM


Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong:
Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Micromachines, Vol.9 (2018), No.6, Art. 266, 8 pp.
info:doi/10.3390/mi9060266
Fraunhofer IZM


Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.:
Determination of relevant material behavior for use in stretchable electronics . (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <19, 2018, Toulouse>)
Driel, W.D. van (Ed.): 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018: 15-18 April 2018, Toulouse, France. Piscataway, NJ: IEEE, 2018, pp. 269-273
info:doi/10.1109/EuroSimE.2018.8369902
Fraunhofer IZM


Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.:
Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
IEEE transactions on components, packaging and manufacturing technology, Vol.8 (2018), No.7, pp.1231-1240
info:doi/10.1109/TCPMT.2018.2842824
Fraunhofer IZM


Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.:
Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept. (Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>)
Karikalan, S.: 68th Electronic Components and Technology Conference, ECTC 2018. Proceedings: 29 May-1 June 2018, San Diego, California. Piscataway, NJ: IEEE, 2018, pp. 916-925
info:doi/10.1109/ECTC.2018.00141
Fraunhofer IZM


Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.:
Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 55-62
Fraunhofer IZM


Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.:
Double-wired bond wire antennas . (International Microwave and Radar Conference (MIKON) <22, 2018, Poznán>)
Institute of Electrical and Electronics Engineers -IEEE-: 22nd International Microwave and Radar Conference, MIKON 2018: May 14-17, 2018, Poznán, Poland. Piscataway, NJ: IEEE, 2018, pp. 216-217
info:doi/10.23919/MIKON.2018.8405181
Fraunhofer IZM


Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.:
Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels . (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <17, 2018, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: Seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Proceedings: May 29-June 1, 2018, San Diego, CA, USA. Piscataway, NJ: IEEE, 2018, pp. 331-339
info:doi/10.1109/ITHERM.2018.8419609
Fraunhofer IZM


Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.:
Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options. (Life Cycle Engineering Conference (LCE) <25, 2018, Copenhagen>)
Procedia CIRP, Vol.69 (2018), pp.716-721
info:doi/10.1016/j.procir.2017.11.051
Fraunhofer IZM


Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin:
Electrical micro-heating structures on glass created by laser ablation. (Conference "Laser Applications in Microelectronic and Optoelectronic Manufacturing" (LAMOM) <23, 2018, San Francisco/Calif.>)
Neuenschwander, B.: Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIII: SPIE LASE, 27 January - 1 February 2018. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10519), Paper 105190G, 7 pp.
info:doi/10.1117/12.2290049
Fraunhofer IZM


Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia:
Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS: Presentation held at IFAAP 2018 - Session 31am-A05-Energy Harvesters, ISAF-FMA-AMF-AMEC-PFM (IFAAP) Joint Conference in Hiroshima, May 27th - June 1st, 2018. (International Symposium on Applications of Ferroelectrics (ISAF) <2018, Hiroshima>)
2018
urn:nbn:de:0011-n-5099776
Volltext
Fraunhofer EAS
Fraunhofer ISIT
Fraunhofer IZM


Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.:
The Evolution of Panel Level Packaging . (Electron Devices Technology and Manufacturing Conference (EDTM) <2, 2018, Kobe>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Proceedings of Technical Papers: Kobe, Japan, March 13-16, 2018. Piscataway, NJ: IEEE, 2018, pp. 223-226
info:doi/10.1109/EDTM.2018.8421523
Fraunhofer IZM


Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.:
Fan-out wafer level packaging for 5G and mm-Wave applications. (International Conference on Electronics Packaging (ICEP) <2018, Kuwana/Japan>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging and IMAPS All Asia Conference, ICEP-IAAC 2018: Hotel Hanamizuki, Kuwana, Mie, Japan, April 17 (Tue)-21 (Sat), 2018. Piscataway, NJ: IEEE, 2018, pp. 247-251
info:doi/10.23919/ICEP.2018.8374297
Fraunhofer IZM


O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian:
First responders occupancy, activity and vital signs monitoring - SAFESENS
International journal on advances in networks and services, Vol.11 (2018), No.1&2, pp.22-32
Fraunhofer IZM


Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain:
Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Optical Materials Express, Vol.8 (2018), No.2, pp.469-484
info:doi/10.1364/OME.8.000469
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
Berlin: Fraunhofer IZM, 2018
urn:nbn:de:0011-n-5073850
Volltext
Fraunhofer IZM


Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.:
Frequency-modulated laser ranging sensor with closed-loop control . (Conference "Photonic Instrumentation Engineering" <5, 2018, San Francisco/Calif.>)
Soskind, Y.G.: Photonic Instrumentation Engineering V: 30 January - 1 February 2018, San Francisco, California, United States. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10539), Paper 1053909, 6 pp.
info:doi/10.1117/12.2289585
Fraunhofer IZM


Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.:
Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster. (Electronics Packaging Technology Conference (EPTC) <19, 2017, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 19th Electronics Packaging Technology Conference, EPTC 2017: 6-9 December 2017, Singapore. Piscataway, NJ: IEEE, 2018, pp. 57-64
info:doi/10.1109/EPTC.2017.8277579
Fraunhofer IZM


Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas:
Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 480-483
Fraunhofer EAS
Fraunhofer IWU
Fraunhofer ENAS
Fraunhofer IPMS
Fraunhofer IKTS
Fraunhofer IZM


Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.:
In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration . (European Microelectronics Packaging Conference (EMPC) <21, 2017, Warsaw>)
Dziedzic, A.: 21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings: Warsaw, 10-13 September 2017. Piscataway, NJ: IEEE, 2018, pp. 181-186
info:doi/10.23919/EMPC.2017.8346862
Fraunhofer IZM


Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.:
Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Reactive & functional polymers, Vol.129 (2018), pp.2-22
info:doi/10.1016/j.reactfunctpolym.2017.10.004
Fraunhofer IZM
Fraunhofer IAP


Kripfgans, J.; Weber, C.; Hutter, M.:
Investigation of high pressure Ag sintered joints manufactured with different tools. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 428-431
Fraunhofer IZM


Ndip, Ivan:
Kombinationsantenne
2018
Fraunhofer IZM


Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.:
Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration . (Conference "Frontiers in Biological Detection - From Nanosensors to Systems" <10, 2018, San Francisco/Calif.>)
Danielli, A.: Frontiers in Biological Detection: From Nanosensors to Systems X: 28-29 January 2018, San Francisco, California, United States. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10510), Paper 105100P, 6 pp.
info:doi/10.1117/12.2290496
Fraunhofer IZM


Azhdast, M. H.; Eichler, H. J.; Lang, K.-D.; Glaw, V.; Kossatz, M.:
Laser-induced forward transfer of aluminium particles in different gaseous environment. (Conference "Compact EUV & X-ray Light Sources" (EUVXRAY) <2018, Strasbourg>)
Optical Society of America -OSA-, Washington/D.C.: Compact EUV & X-ray Light Sources: Part of High-Brightness Sources and Light-Driven Interactions; 26–28 March 2018, Strasbourg France. Washington, DC: OSA, 2018, Poster JT5A.21
info:doi/10.1364/EUVXRAY.2018.JT5A.21
Fraunhofer IZM


Bell, A.J.; Deubzer, O.:
Lead-free piezoelectrics - The environmental and regulatory issues
MRS Bulletin, Vol.43 (2018), No.8, pp.581-587
info:doi/10.1557/mrs.2018.154
Fraunhofer IZM


Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.:
Lifetime modelling and geometry optimization of meander tracks in stretchable electronics . (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <19, 2018, Toulouse>)
Driel, W.D. van (Ed.): 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018: 15-18 April 2018, Toulouse, France. Piscataway, NJ: IEEE, 2018, pp. 177-181
info:doi/10.1109/EuroSimE.2018.8369887
Fraunhofer IZM


Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.:
Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
ChemSusChem. Chemistry & sustainability, energy & materials, Vol.11 (2018), No.1, pp.229-236
info:doi/10.1002/cssc.201701696
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.:
Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
IEEE transactions on electromagnetic compatibility, (2018), Online First, 8 pp.
info:doi/10.1109/TEMC.2018.2855040
Fraunhofer IZM


Ndip, I.; Le, T.H.; Lang, K.-D.:
Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas . (International Microwave and Radar Conference (MIKON) <22, 2018, Poznán>)
Institute of Electrical and Electronics Engineers -IEEE-: 22nd International Microwave and Radar Conference, MIKON 2018: May 14-17, 2018, Poznán, Poland. Piscataway, NJ: IEEE, 2018, pp. 5-6
info:doi/10.23919/MIKON.2018.8405267
Fraunhofer IZM


Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.:
Narrow linewidth micro-integrated high power diode laser module for deployment in space . (International Conference on Space Optical Systems and Applications (ICSOS) <2017, Okinawa/Japan))
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Conference on Space Optical Systems and Applications, ICSOS 2017: 14-16 Nov. 2017. Piscataway, NJ: IEEE, 2018, pp. 150-153
info:doi/10.1109/ICSOS.2017.8357226
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.:
Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
IEEE transactions on components, packaging and manufacturing technology, Vol.8 (2018), No.1, pp.50-56
info:doi/10.1109/TCPMT.2017.2764801
Fraunhofer IZM


Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.:
A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation . (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <17, 2018, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: Seventeenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018. Proceedings: May 29-June 1, 2018, San Diego, CA, USA. Piscataway, NJ: IEEE, 2018, pp. 1071-1080
info:doi/10.1109/ITHERM.2018.8419568
Fraunhofer IZM
Fraunhofer ENAS


Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens:
A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials. (Eurosensors Conference <32, 2018, Graz>)
Proceedings. MDPI AG, Vol.2 (2018), No.13, Art. 716, 4 pp.
info:doi/10.3390/proceedings2130716
Fraunhofer IZM


Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.:
On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
IEEE Transactions on Antennas and Propagation, Vol.66 (2018), No.11, pp.5672-5686
info:doi/10.1109/TAP.2018.2864319
Fraunhofer IZM


Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.:
Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate. (International Conference on Photonics, Optics and Laser Technology (PHOTOPTICS) <6, 2018, Funchal>)
Raposo, M.: PHOTOPTICS 2018, 6th International Conference on Photonics, Optics and Laser Technology. Proceedings: Funchal, Madeira, Portugal, January 25-27, 2018 . Setúbal: SciTePress, 2018, pp. 228-231
info:doi/10.5220/0006627702280231
Fraunhofer IZM


Folk, E.; Ndip, I.:
Packaging for high frequency and reliability
Advancing microelectronics, Vol.45 (2018), No.2, pp.4
Fraunhofer IZM


Wolf, M.J.; Steller, W.; Lang, K.-D.:
Packaging meets heterogeneous integration driving direction for advanced system in packages . (Pan Pacific Microelectronics Symposium <2018, Waimea/Hawaii>)
Institute of Electrical and Electronics Engineers -IEEE-: Pan Pacific Microelectronics Symposium, Pan Pacific 2018: 5-8 Feb. 2018, Waimea, HI, USA . Piscataway, NJ: IEEE, 2018, pp. 53-57
info:doi/10.23919/PanPacific.2018.8318987
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.:
Panel Level Packaging: A View Along the Process Chain . (Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>)
Karikalan, S.: 68th Electronic Components and Technology Conference, ECTC 2018. Proceedings: 29 May-1 June 2018, San Diego, California. Piscataway, NJ: IEEE, 2018, pp. 70-78
info:doi/10.1109/ECTC.2018.00019
Fraunhofer IZM


Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.:
Parameter driven monitoring for a flip-chip LED module under power cycling condition
Microelectronics reliability, Vol.82 (2018), pp.84-89
info:doi/10.1016/j.microrel.2018.01.005
Fraunhofer IZM


Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramleow, Martin; Lang, Klaus-Dieter:
Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Mukhopadhyay, S.C.: Modern Sensing Technologies. Cham: Springer International Publishing, 2018. (Smart Sensors, Measurement and Instrumentation 29), pp. 231-251
info:doi/10.1007/978-3-319-99540-3_12
Fraunhofer IZM


Azhdast, M. H.; Eichler, H. J.; Lang, K.-D.; Glaw, V.; Kossatz, M.:
Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process. (Conference on Lasers and Electro-Optics - Applications and Technology (CLEO A&T) <2018, San Jose/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: CLEO: Applications and Technology: Part of CLEO: 2018; 13-18 May 2018, San Jose, California, United States. Washington, DC: OSA, 2018, Art. ATu4M.3
info:doi/10.1364/CLEO_AT.2018.ATu4M.3
Fraunhofer IZM


Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter:
Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors. (International Symposium on Microelectronics <51, 2018, Pasadena/Calif.>)
IMAPS Proceedings of the International Symposium on Microelectronics. Online journal, (2018), No.1, Fall, pp.672-679
info:doi/10.4071/2380-4505-2018.1.000672
Fraunhofer IMS
Fraunhofer IZM


Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter:
Silicon micro piezoresistive pressure sensors
Yurish, S.: Physical Sensors, Sensor Networks and Remote Sensing. Barcelona: IFSA Publishing, 2018. (Advances in Sensors. Reviews 5), pp. 161-184
Fraunhofer IZM


Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.:
Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor. (Electronics Packaging Technology Conference (EPTC) <19, 2017, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 19th Electronics Packaging Technology Conference, EPTC 2017: 6-9 December 2017, Singapore. Piscataway, NJ: IEEE, 2018, pp. 209-214
info:doi/10.1109/EPTC.2017.8277550
Fraunhofer IZM


Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.:
A technology toolbox concept to improve reliability evaluation. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 328-334
Fraunhofer IZM


Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.:
Thermal transient measurement and modelling of a power cycled flip-chip LED module
Microelectronics reliability, Vol.81 (2018), pp.373-380
info:doi/10.1016/j.microrel.2017.10.032
Fraunhofer IZM


Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.:
Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data . (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <19, 2018, Toulouse>)
Driel, W.D. van (Ed.): 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018: 15-18 April 2018, Toulouse, France. Piscataway, NJ: IEEE, 2018, pp. 256-268
info:doi/10.1109/EuroSimE.2018.8369901
Fraunhofer ENAS
Fraunhofer IZM


Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.:
Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems . (Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>)
Karikalan, S.: 68th Electronic Components and Technology Conference, ECTC 2018. Proceedings: 29 May-1 June 2018, San Diego, California. Piscataway, NJ: IEEE, 2018, pp. 1136-1139
info:doi/10.1109/ECTC.2018.00174
Fraunhofer IZM


Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.:
Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration . (International Electron Devices Meeting (IEDM) <63, 2017, San Francisco/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: International Electron Devices Meeting, IEDM 2017. Technical digest: 2-6 December 2017, San Francisco, CA, USA. Piscataway, NJ: IEEE, 2018, pp. 75-78
info:doi/10.1109/IEDM.2017.8268322
Fraunhofer IZM


Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.:
Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept. (Electronic Components and Technology Conference (ECTC) <68, 2018, San Diego/Calif.>)
Karikalan, S.: 68th Electronic Components and Technology Conference, ECTC 2018. Proceedings: 29 May-1 June 2018, San Diego, California. Piscataway, NJ: IEEE, 2018, pp. 675-681
info:doi/10.1109/ECTC.2018.00107
Fraunhofer IZM


Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel:
Universal test system for system embedded optical interconnect. (Conference "Optical Interconnects" <18, 2018, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVIII: 27 January - 1 February 2018, San Francisco, California, United States. Bellingham, WA: SPIE, 2018. (Proceedings of SPIE 10538), Paper 1053804, 10 pp.
info:doi/10.1117/12.2289590
Fraunhofer IZM


Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.:
Using fluidic simulation for parameter optimization in compression molding of microelectronic packages. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2018, Dresden>)
Otto, T.: Smart Systems Integration 2018. International Conference and Exhibition on Integration Issues of Miniaturized Systems: Dresden, Germany, 11 - 12 April 2018. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2018, pp. 396-399
Fraunhofer IZM


Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter:
Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2018, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings: Nuremberg, 05 - 07 June 2018, CD-ROM. Berlin: VDE-Verlag, 2018, pp. 951-958
Fraunhofer IZM


Kaynak, M.; Wietstruck, M.; Göritz, A.; Wipf, S.T.; Inac, M.; Cetindogan, B.; Wipf, C.; Kaynak, C.B.; Wöhrmann, M.; Voges, S.; Braun, T.:
0.13-μm SiGe BiCMOS technology with More-than-Moore modules. (Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) <2017, Miami/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Bipolar/BiCMOS Circuits and Technology Meeting, BCTM 2017: 19-21 Oct. 2017, Miami, Florida. Piscataway, NJ: IEEE, 2017, pp. 62-65
info:doi/10.1109/BCTM.2017.8112912
Fraunhofer IZM


Meyer, J.; Panchenko, I.; Wambera, L.; Bickel, S.; Wahrmund, W.; Wolf, M.J.:
Accelerated SLID bonding for fine-pitch interconnects with porous microstructure. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 405-410
info:doi/10.1109/ECTC.2017.231
Fraunhofer IZM


Lohse, S.; Wolff, M.; Wollanke, A.; Quednau, S.:
Advanced packaging for future demands. (Nordic Conference on Microelectronics Packaging (NordPac) <2017, Göteborg>)
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter: IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017: June 18-20, 2017, Göteborg, Sweden. Piscataway, NJ: IEEE, 2017, pp. 7-11
info:doi/10.1109/NORDPAC.2017.7993154
Fraunhofer IZM


Wagner, E.; Böhme, C.; Benecke, S.; Nissen, N.N.; Lang, K.-D.:
Advanced packaging for wireless sensor nodes in cyber-physical systems - impacts of multifunctionality and miniaturization on the environment. (International Conference on Prognostics and Health Management (ICPHM) <2017, Dallas/Tex.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Conference on Prognostics and Health Management, ICPHM 2017: June 19-21, 2017 in Dallas, TX, USA. Piscataway, NJ: IEEE, 2017, pp. 173-178
info:doi/10.1109/ICPHM.2017.7998324
Fraunhofer IZM


Geißler, Ute; Schneider-Ramelow, M.:
Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Produktion von Leiterplatten und Systemen : PLUS, Vol.19 (2017), No.1, pp.92-94
Fraunhofer IZM


Ndip, Ivan; Curran, Brian:
Antennenanordnung mit Richtstruktur
2017
Fraunhofer IZM


Jerchel, K.; Grams, A.; Nissen, N.F.; Suga, T.; Lang, K.-D.:
Canary devices for through-silicon vias a condition monitoring approach. (International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging, ICEP 2017: Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017. Piscataway, NJ: IEEE, 2017, pp. 282-287
info:doi/10.23919/ICEP.2017.7939376
Fraunhofer IZM


Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.:
Comparison of nano particle implantation with picosecond lasers by concerning different wavelengths from aluminum and copper on silicon wafer substrate. (Conference on Lasers and Electro-Optics - Applications and Technology (CLEO A&T) <2017, San Jose/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: CLEO: Applications and Technology: Part of CLEO: 2017; 14-19 May 2017, San Jose, California, United States. Washington, DC: OSA, 2017, Paper ATu4C.2
info:doi/10.1364/CLEO_AT.2017.ATu4C.2
Fraunhofer IZM


Curran, B.; Ndip, I.; Lang, K.-D.:
A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs. (Workshop on Signal and Power Integrity (SPI) <21, 2017, Baveno>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 21st Workshop on Signal and Power Integrity, SPI 2017. Proceedings: 7-10 May, 2017, Lake Maggiore (Baveno), Italy. Piscataway, NJ: IEEE, 2017, pp. 141-143
info:doi/10.1109/SaPIW.2017.7944034
Fraunhofer IZM


Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.:
Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Applied Sciences, Vol.7 (2017), No.9, Art. 940, 16 pp.
info:doi/10.3390/app7090940
Fraunhofer IZM


Klein, K.; Hoene, E.; Lang, K.-D.:
Comprehensive AC performance analysis of ceramic capacitors for DC link usage. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2017, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2017, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings: Nuremberg, 16 - 18 May 2017. Berlin: VDE Verlag, 2017, pp. 1240-1246
info:doi/10.1109/SBMicro.2017.7990844
Fraunhofer IZM


Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.:
Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <18, 2017, Dresden>)
Institute of Electrical and Electronics Engineers -IEEE-: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 3-5 April 2017, Dresden. Piscataway, NJ: IEEE, 2017, pp. 225-230
info:doi/10.1109/EuroSimE.2017.7926250
Fraunhofer ENAS
Fraunhofer IZM


Lykova, M.; Panchenko, I.; Geidel, M.; Reif, J.; Wolf, J.M.; Lang, K.-D.:
Cu passivation with self-assembled monolayers for direct metal bonding in 3D integration. (International Spring Seminar on Electronics Technology (ISSE) <40, 2017, Sofia>)
Institute of Electrical and Electronics Engineers -IEEE-: 40th International Spring Seminar on Electronics Technology, ISSE 2017: 10-14 May 2017, Sofia, Bulgaria. Piscataway, NJ: IEEE, 2017, pp. 198-203
info:doi/10.1109/ISSE.2017.8000916
Fraunhofer IZM


Bickel, S.; Panchenko, I.; Wahrmund, W.; Neumann, V.; Meyer, J.; Wolf, M.J.:
Cu-In-microbumps for low-temperature bonding of fine-pitch-interconnects. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 2092-2096
info:doi/10.1109/ECTC.2017.206
Fraunhofer IZM


Azhdast, M.H.; Kossatz, M.; Eichler, H.J.; Lang, K.-D.; Glaw, V.:
Deposition of Al and Cu nanoparticles on silicon wafer using a picosecond Nd: YAG Laser. An experiment-based parameter optimization guide. (Conference on Lasers and Electro-Optics - Applications and Technology (CLEO A&T) <2017, San Jose/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: CLEO: Applications and Technology: Part of CLEO: 2017; 14-19 May 2017, San Jose, California, United States. Washington, DC: OSA, 2017, Paper JTu5A.12, 2 pp.
info:doi/10.1364/CLEO_AT.2017.JTu5A.12
Fraunhofer IZM


Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.:
Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 538-544
info:doi/10.1109/ECTC.2017.254
Fraunhofer IZM


Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.:
Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 1592-1599
info:doi/10.1109/ECTC.2017.130
Fraunhofer IZM


Bittrich, E.; Windrich, F.; Martens, D.; Bittrich, L.; Häussler, L.; Eichhorn, K.-J.:
Determination of the glass transition temperature in thin polymeric films used for microelectronic packaging by temperature-dependent spectroscopic ellipsometry
Polymer testing, Vol.64 (2017), pp.48-54
info:doi/10.1016/j.polymertesting.2017.09.030
Fraunhofer IZM


Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.:
Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
IEEE Transactions on Nuclear Science, Vol.64 (2017), No.8, pp.2433-2440
info:doi/10.1109/TNS.2017.2721643
Fraunhofer IZM


Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.:
Development of a multi-project fan-out wafer level packaging platform. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 1-7
info:doi/10.1109/ECTC.2017.230
Fraunhofer IZM


Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.:
Development of micro batteries based on micro fluidic MEMS packaging. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2017, Bordeaux>)
Charlot, B.: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Collection of papers: Bordeaux, France, May 29th-June 1st, 2017. Piscataway, NJ: IEEE, 2017, pp. 203-207
info:doi/10.1109/DTIP.2017.7984497
Fraunhofer IZM


Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Effect of 3D stack-up integration on through silicon via characteristics. (Workshop on Signal and Power Integrity (SPI) <21, 2017, Baveno>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 21st Workshop on Signal and Power Integrity, SPI 2017. Proceedings: 7-10 May, 2017, Lake Maggiore (Baveno), Italy. Piscataway, NJ: IEEE, 2017, pp. 106-109
info:doi/10.1109/SaPIW.2017.7944025
Fraunhofer IZM


Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.:
Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance. (Nordic Conference on Microelectronics Packaging (NordPac) <2017, Göteborg>)
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter: IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017: June 18-20, 2017, Göteborg, Sweden. Piscataway, NJ: IEEE, 2017, pp. 31-34
info:doi/10.1109/NORDPAC.2017.7993158
Fraunhofer IZM


Brusberg, L.; Immonen, M.; Lamprecht, T.:
Electro-optical circuit boards with single- or multi-mode optical interconnects
Tekin, T.: Optical Interconnects for Data Centers. Amsterdam: Elsevier, 2017. (Woodhead publishing series in eletronic and optical materials 90), pp. 287-307
info:doi/10.1016/B978-0-08-100512-5.00012-7
Fraunhofer IZM


Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter:
Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact. (European Microelectronics Packaging Conference (EMPC) <21, 2017, Warsaw>)
Dziedzic, A.: 21st European Microelectronics Packaging Conference, EMPC 2017. Proceedings: Warsaw, 10-13 September 2017. Piscataway, NJ: IEEE, 2017, pp. 275-282
info:doi/10.23919/EMPC.2017.8346879
Fraunhofer IZM


Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.:
Experimental verification and analysis of analytical model of the shape of bond wire antennas
Electronics Letters, Vol.53 (2017), No.14, pp.906-907
info:doi/10.1049/el.2016.3673
Fraunhofer IZM


Singh, R.; Boettcher, M.; Panchenko, I.; Fiedler, C.; Schwarz, A.; Wolf, J.:
Fabrication and characterization of precise integrated titanium nitride thin film resistors for 2.5D interposer. (International Spring Seminar on Electronics Technology (ISSE) <40, 2017, Sofia>)
Institute of Electrical and Electronics Engineers -IEEE-: 40th International Spring Seminar on Electronics Technology, ISSE 2017: 10-14 May 2017, Sofia, Bulgaria. Piscataway, NJ: IEEE, 2017, pp. 183-188
info:doi/10.1109/ISSE.2017.8000913
Fraunhofer IZM


Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.:
Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 917-924
info:doi/10.1109/ECTC.2017.278
Fraunhofer IZM


Zamora, V.; Hofmanna, J.; Marx, S.; Herter, J.; Nguyen, D.; Arndt-Staufenbiel, N.; Schöder, H.:
Fiber bundle probes for interconnecting miniaturized medical imaging devices. (Conference "Optical Interconnects" <17, 2017, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVII: 30 January-1 February 2017, San Francisco, California, United States. Bellingham, WA: SPIE, 2017. (Proceedings of SPIE 10109), Paper 101090R, 7 pp.
info:doi/10.1117/12.2251904
Fraunhofer IZM


Aschenbrenner, Rolf:
Forschung für die Elektroniksysteme von morgen: Vortrag gehalten auf dem 20. Elektroniktechnologie Kolleg; Colonia de Sant Jordi, Mallorca, Spanien; 29.03.-03.04.2017. (Elektroniktechnologie Kolleg <20, 2017, Colonia de Sant Jordi/Mallorca>)
2017
urn:nbn:de:0011-n-5036414
Volltext
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2016/2017
Berlin: Fraunhofer IZM, 2017
urn:nbn:de:0011-n-4591712
Volltext
Fraunhofer IZM


Sarajlic, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M.O.; Askar, M.; Graafsma, H.:
Germanium "hexa" detector. Production and testing. (International Workshop on Radiation Imaging Detectors (IWORID) <18, 2016, Barcelona>)
Journal of Instrumentation, Vol.12 (2017), Art. C01068, 11 pp.
info:doi/10.1088/1748-0221/12/01/C01068
Fraunhofer IZM


Tschoban, Christian; Günther, Julia; Schrank, Kai; Mathar, Fabian; Morgenschweis, Bernd:
Golfball, System und Verfahren zur Ortung eines Golfballs
2017
Fraunhofer IZM


Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Heinrich, W.:
Impact of parasitic coupling on multiline TRL calibration. (European Microwave Conference (EuMC) <47, 2017, Nuremberg>)
Institute of Electrical and Electronics Engineers -IEEE-: 47th European Microwave Conference, EuMC 2017: European Microwave Week 2017, 10-12 October 2017, Nuremberg, Germany. Piscataway, NJ: IEEE, 2017, pp. 835-838
info:doi/10.23919/EuMC.2017.8230974
Fraunhofer IZM


Carazzetti, P.; Balon, F.; Hoffmann, M.; Weichart, J.; Erhart, A.; Strolz, E.; Viehweger, K.:
Impact of process control on UBM/RDL contact resistance for next-generation fan-out devices. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 909-916
info:doi/10.1109/ECTC.2017.280
Fraunhofer IZM


Wambera, L.; Panchenko, I.; Steller, W.; Müller, M.; Wolf, M.J.:
Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps. (International Spring Seminar on Electronics Technology (ISSE) <40, 2017, Sofia>)
Institute of Electrical and Electronics Engineers -IEEE-: 40th International Spring Seminar on Electronics Technology, ISSE 2017: 10-14 May 2017, Sofia, Bulgaria. Piscataway, NJ: IEEE, 2017, pp. 161-166
info:doi/10.1109/ISSE.2017.8000909
Fraunhofer IZM


Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.:
Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 872-877
info:doi/10.1109/ECTC.2017.272
Fraunhofer IZM


Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.:
Insertion loss study for panel-level single-mode glass waveguides. (Conference "Optical Interconnects" <17, 2017, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVII: 30 January-1 February 2017, San Francisco, California, United States. Bellingham, WA: SPIE, 2017. (Proceedings of SPIE 10109), Paper 101090J, 8 pp.
info:doi/10.1117/12.2252802
Fraunhofer IZM


Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.:
Insights into the reversibility of aluminum graphite batteries
Journal of materials chemistry. A, Materials for energy and sustainability, Vol.5 (2017), No.20, pp.9682-9690
info:doi/10.1039/c7ta01018d
Fraunhofer IZM


Sandetskaya, Natalia; Moos, Doreen; Pötter, Harald; Seifert, Stefan; Jenerowicz, Marcin; Becker, Holger; Zilch, Christian; Kuhlmeier, Dirk:
An integrated versatile lab-on-a-chip platform for the isolation and nucleic acid-based detection of pathogens
Future Science OA, Vol.3 (2017), No.2, Art. FSO177, 13 pp.
info:doi/10.4155/fsoa-2016-0088
Fraunhofer IZI
Fraunhofer IZM


Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.:
Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board . (International Communications Satellite Systems Conference (ICSSC) <35, 2017, Trieste>)
American Institute of Aeronautics and Astronautics -AIAA-, Washington/D.C.: 35th AIAA International Communications Satellite Systems Conference, ICSSC 2017: Trieste, Italy, 16-19 October 2017. Red Hook, NY: Curran, 2017
info:doi/10.2514/6.2017-5434
Fraunhofer IZM


Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.:
International and industrial standardization of optical circuit board technologies
Tekin, T.: Optical Interconnects for Data Centers. Amsterdam: Elsevier, 2017. (Woodhead publishing series in eletronic and optical materials 90), pp. 309-342
info:doi/10.1016/B978-0-08-100512-5.00013-9
Fraunhofer IZM


Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias:
Interposer-based smartcard system with active wireless communication. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2017, Cork>)
Otto, T.: Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems, 8 - 9 March 2017, Cork, Ireland. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2017, pp. 90-97
urn:nbn:de:0011-n-4387299
Volltext
Fraunhofer EAS
Fraunhofer IZM


Sandjaja, M.; Lestari, M.L.A.D.:
Investigation of Effect of Adding Hydrophobically Modified Water Soluble Polymers on the Structure and Viscosity of Anionic Vesicle Dispersion
Indonesian Journal of Chemistry, Vol.17 (2017), No.1, pp.86-94
info:doi/10.22146/ijc.23619
Fraunhofer IZM


Zoschke, Kai; Töpper, Michael:
Klebeverfahren zum Verbinden zweier Wafer
2017
Fraunhofer IZM


Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.:
Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Microelectronics reliability, Vol.76-77 (2017), pp.450-454
info:doi/10.1016/j.microrel.2017.07.033
Fraunhofer IZM


Zoschke, Kai; Lang, K.-D.:
Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding. (Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2017, Leuven>)
Knechtel, Roy (Ed.): WaferBond 2017, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts: 27th - 29th Novmber 2017, Leuven, Belgium. Leuven: IMEC, 2017, pp. 53-54
Fraunhofer IZM


Sedlmair, J.; Mehlmann, B.; Olowinsky, A.:
Laserbonding instead of ultrasonic wire bonding - an alternative joining technology for power applications. (International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging, ICEP 2017: Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017. Piscataway, NJ: IEEE, 2017, pp. 94-96
info:doi/10.23919/ICEP.2017.7939332
Fraunhofer IZM


Panchenko, I.; Bickel, S.; Meyer, J.; Müller, M.; Wolf, J.M.:
Low temperature Cu/In bonding for 3D integration. (International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>)
Institute of Electrical and Electronics Engineers -IEEE-: 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings: May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan. Piscataway, NJ: IEEE, 2017, pp. 17
info:doi/10.23919/LTB-3D.2017.7947413
Fraunhofer IZM


Aschenbrenner, Rolf; Kallmayer, Christine:
Materials and Concepts for Textile Sensor Systems: Presentation held at 9th International Conference on Materials for Advanced Technologies (ICMAT 2017); Singapur; 18.-23.06.2017. (International Conference on Materials for Advanced Technologies (ICMAT) <9, 2017, Singapore>)
2017
urn:nbn:de:0011-n-5036436
Volltext
Fraunhofer IZM


Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.:
Micro patterned test cell arrays for high-throughput battery materials research. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2017, Bordeaux>)
Charlot, B.: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Collection of papers: Bordeaux, France, May 29th-June 1st, 2017. Piscataway, NJ: IEEE, 2017, pp. 143-148
info:doi/10.1109/DTIP.2017.7984484
Fraunhofer IZM


Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia:
Miniaturization of power converters by piezoelectric transformers - chances and challenges: Presentation held at International Symposium on Piezocomposite Applications, ISPA 2017, September 13 - 15, 2017, Fraunhofer IKTS Dresden. (International Symposium on Piezocomposite Applications (ISPA) <2017, Dresden>)
2017
urn:nbn:de:0011-n-4699650
Volltext
Fraunhofer EAS
Fraunhofer ISIT
Fraunhofer IZM


Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.:
Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <23, 2017, Amsterdam>)
Volz, S.: THERMINIC 2017, 23rd International Workshop Thermal Investigations of ICs and Systems: September 27-29, 2017, Amsterdam, the Netherlands; Proceedings. Piscataway, NJ: IEEE, 2017, pp. 36-41
info:doi/10.1109/THERMINIC.2017.8233806
Fraunhofer ENAS
Fraunhofer IZM


Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas:
Modular power electronics, realized by PCB embedding technology: Presentation held at Productronica 2017, 14.11. bis 17.11.2017, München. (Messe "Productronica" <2017, München>)
2017
urn:nbn:de:0011-n-5067142
Volltext
Fraunhofer IZM


Stube, B.; Schröder, B.; Mullins, T.; Bartels, T.; Lang, K.-D.:
Novel EDA Tools for system planning and 3D layout design of smart items. (Nordic Conference on Microelectronics Packaging (NordPac) <2017, Göteborg>)
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter: IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017: June 18-20, 2017, Göteborg, Sweden. Piscataway, NJ: IEEE, 2017, pp. 1-6
info:doi/10.1109/NORDPAC.2017.7993133
Fraunhofer IZM


Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.:
A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer. (International Conference and Exhibition on Integration Issues of Miniaturized Systems <2017, Cork>)
Otto, T.: Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems, 8 - 9 March 2017, Cork, Ireland. Auerbach /Vogtl.: Verlag Wissenschaftliche Scripten, 2017, pp. 98-105
Fraunhofer IZM


Aschenbrenner, Rolf:
Panel Level Embedding for Power and Sensor Applications: Presentation held at IMAPS MicroTech 2017, 16.03.2017. (MicroTech Annual Conference <2017, Didcot>)
2017
urn:nbn:de:0011-n-5036446
Volltext
Fraunhofer IZM


Aschenbrenner, Rolf:
Panel Level Packaging for Power Applications: Presentation held at "From Nano to Micro Power Electronics and Packaging" Workshop (IMAPS) 2017; Tours, Frankreich; 11-12.10.2017. ("From Nano to Micro Power Electronics and Packaging" Workshop <2017, Tours>)
2017
urn:nbn:de:0011-n-5036468
Volltext
Fraunhofer IZM


Aschenbrenner, Rolf; Ostmann, Andreas:
Panel processing for high volume/high mix manufacturing. (International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging, ICEP 2017: Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017. Piscataway, NJ: IEEE, 2017, pp. 316-317
urn:nbn:de:0011-n-4558158
info:doi/10.23919/ICEP.2017.7939384
Volltext
Fraunhofer IZM


Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.:
Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
ACS applied materials & interfaces, Vol.9 (2017), No.44, pp.38381-38389
info:doi/10.1021/acsami.7b09378
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.:
Power plane filter using higher order virtual ground fence
IEEE transactions on components, packaging and manufacturing technology, Vol.7 (2017), No.4, pp.519-525
info:doi/10.1109/TCPMT.2016.2637300
Fraunhofer IZM


Moralis-Pegios, M.; Terzenidis, N.; Vagionas, C.; Pitris, S.; Chatzianagnostou, E.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rochracher, K.; Dorrestein, S.; Bogdan, M.; Tekin, T.; Syrivelis, D.; Tassiulas, L.; Miliou, A.; Pleros, N.; Vyrsokinos, K.:
A programmable Si-photonic node for SDN-enabled bloom filter forwarding in disaggregated data centers. (Conference "Optical Interconnects" <17, 2017, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVII: 30 January-1 February 2017, San Francisco, California, United States. Bellingham, WA: SPIE, 2017. (Proceedings of SPIE 10109), Paper 101090X, 7 pp.
info:doi/10.1117/12.2252043
Fraunhofer IZM


Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.:
Progress on TSV technology for Medipix3RX chip
Journal of Instrumentation, Vol.12 (2017), Art. C12042, 7 pp.
info:doi/10.1088/1748-0221/12/12/C12042
Fraunhofer IZM


Huisman, Jaco; Leroy, Pascal; Tertre, François; Ljunggren Söderman, Maria; Chancerel, Perrine; Cassard, D.; Løvik, Amund N.; Wäger, P.; Kushnir, D.; Rotter, Vera Susanne; Mählitz, Paul; Herreras, L.; Emmerich, Johanna; Hallberg, A.; Habib, H.; Wagner, M.; Downes, Sarah:
Prospecting Secondary Raw Materials in the Urban Mine and mining wastes (ProSUM): Final Report - ProSUM Project
Brussels, 2017
ISBN 978-92-808-9060-0
ISBN 978-92-808-9061-7
Fraunhofer IZM


Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.:
Quantum cascade detector at 4.3µm wavelength in pixel array configuration. (Conference "Quantum Sensing and Nano Electronics and Photonics" <14, 2017, San Francisco/Calif.>)
Razeghi, M. (Ed.): Quantum Sensing and Nano Electronics and Photonics XIV: San Francisco, California, United States, January 28, 2017. Bellingham, WA: SPIE, 2017. (Proceedings of SPIE 10111), Paper 101112C
info:doi/10.1117/12.2252275
Fraunhofer IZM


Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Defregger, S.; Kraker, E.:
Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation
Microelectronics reliability, Vol.76-77 (2017), pp.601-605
info:doi/10.1016/j.microrel.2017.07.052
Fraunhofer IZM


Iannacci, J.; Tschoban, C.:
RF-MEMS for future mobile applications: experimental verification of a reconfigurable 8-bit power attenuator up to 110 GHz
Journal of micromechanics and microengineering, Vol.27 (2017), Art. 044003, 11 pp.
info:doi/10.1088/1361-6439/aa5f2c
Fraunhofer IZM


Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter:
The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications. (International Conference on Sensing Technology (ICST) <11, 2017, Sydney>)
Institute of Electrical and Electronics Engineers -IEEE-: Eleventh International Conference on Sensing Technology, ICST 2017: December 4-6, 2017, Sydney, Australia. Piscataway, NJ: IEEE, 2017, pp. 190-195
info:doi/10.1109/ICSensT.2017.8304457
Fraunhofer IZM


Cittanti, D.; Iannuzzo, F.; Hoene, E.; Klein, K.:
Role of parasitic capacitances in power MOSFET turn-on switching speed limits: A SiC case study. (Energy Conversion Congress and Exposition (ECCE) <9, 2017, Cincinnati/Ohio>)
Institute of Electrical and Electronics Engineers -IEEE-: ECCE 2017, IEEE Energy Conversion Congress & Exposition: Cincinnati, Ohio, October 1-5, 2017. Piscataway, NJ: IEEE, 2017, pp. 1387-1394
info:doi/10.1109/ECCE.2017.8095952
Fraunhofer IZM


O’Flynn, Brendan; Walsh, Michael; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Oudenhoven, Jos; Nackaerts, Axel; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian:
SAFESENS - Smart Sensors for Fire Safety: First responders occupancy, activity and vital signs monitoring. (International Conference on Sensor Technologies and Applications (SENSORCOMM) <11, 2017, Rome>)
Vieira, M.: SENSORCOMM 2017, Eleventh International Conference on Sensor Technologies and Applications: September 10-14, 2017, Rome, Italy. IARIA, 2017, pp. 51-57
Fraunhofer IZM


Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.:
Shrinkage Measurements of UV‐Curable Adhesives: An elegant method based on a laser distance sensor for in‐situ measurements of the polymerization shrinkage
Optik & Photonik, Vol.12 (2017), No.4, pp.41-43
info:doi/10.1002/opph.201700026
Fraunhofer IZM


Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.:
Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen. (MikroSystemTechnik Kongress <2017, München>)
Verband Deutscher Elektrotechniker e.V. -VDE-, Berlin: MikroSystemTechnik Kongress 2017. Proceedings: MEMS, Mikroelektronik, Systeme, 23.-25. Oktober 2017 in München. Berlin: VDE Verlag, 2017, pp. 429-432
Fraunhofer IZM


Sammler, Fiona; Nissen, Nils F.:
Solutions for Sustainability-Driven Development of Manufacturing Technologies. Pt.II. Foreword
Stark, Rainer et al.: Sustainable Manufacturing. Challenges, Solutions and Implementation Perspective. Cham: Springer International Publishing, 2017. (Sustainable Production, Life Cycle Engineering and Management), pp. 45-46
Fraunhofer IZM


Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.:
Stress-compensating MEMS sensor assembly. (Electronic Components and Technology Conference (ECTC) <67, 2017, Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: ECTC 2017, the 67th Electronic Components and Technology Conference: 30 May-2 June 2017, Lake Buena Vista, Florida. Proceedings . Piscataway, NJ: IEEE, 2017, pp. 932-936
info:doi/10.1109/ECTC.2017.241
Fraunhofer IZM


Mitterhuber, L.; Defregger, S.; Magnien, J.; Rose, J.; Schrank, F.; Hörth, S.; Goullon, L.; Hutter, M.; Kraker, E.:
Study on the temperature-dependent thermal resistance matrix of a multi-chip LED-matrix. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <23, 2017, Amsterdam>)
Volz, S.: THERMINIC 2017, 23rd International Workshop Thermal Investigations of ICs and Systems: September 27-29, 2017, Amsterdam, the Netherlands; Proceedings. Piscataway, NJ: IEEE, 2017, pp. 153-157
info:doi/10.1109/THERMINIC.2017.8233842
Fraunhofer IZM


Uhlmann, Eckart; Lang, Klaus-Dieter; Prasol, Lukas; Thom, Simon; Peukert, Bernd; Benecke, Stephan; Wagner, Eudard; Sammler, Fiona; Richarz, Sebastian; Nissen, Nils F.:
Sustainable Solutions for Machine Tools
Stark, Rainer et al.: Sustainable Manufacturing. Challenges, Solutions and Implementation Perspective. Cham: Springer International Publishing, 2017. (Sustainable Production, Life Cycle Engineering and Management), pp. 47-69
info:doi/10.1007/978-3-319-48514-0_4
Fraunhofer IZM


Oppermann, H.; Lang, K.-D.:
Tackling low temperature bonding in fine pitch applications. (International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <5, 2017, Tokyo>)
Institute of Electrical and Electronics Engineers -IEEE-: 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Proceedings: May 16-18, 2017, Ito International Research Center, The University of Tokyo, Tokyo, Japan. Piscataway, NJ: IEEE, 2017, pp. 41
info:doi/10.23919/LTB-3D.2017.7947437
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.:
Trends in fan-out wafer and panel level packaging. (International Conference on Electronics Packaging (ICEP) <2017, Tendo/Japan>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging, ICEP 2017: Takinoyu Hotel, Tendo, Yamagata, Japan, April 19 (Wed.)-22 (Sat.), 2017. Piscataway, NJ: IEEE, 2017, pp. 325-327
info:doi/10.23919/ICEP.2017.7939387
Fraunhofer IZM


Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.:
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
Microelectronics reliability, Vol.79 (2017), pp.462-472
info:doi/10.1016/j.microrel.2017.04.024
Fraunhofer IZM


Brink, Morten; Oppermann, H.; Lang, K.-D.:
Verbindungstechnologien zur Herstellung hochpixelierter LED-Lichtquellen. (MikroSystemTechnik Kongress <2017, München>)
Verband Deutscher Elektrotechniker e.V. -VDE-, Berlin: MikroSystemTechnik Kongress 2017. Proceedings: MEMS, Mikroelektronik, Systeme, 23.-25. Oktober 2017 in München. Berlin: VDE Verlag, 2017, pp. 444-447
Fraunhofer IZM


Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga:
Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
2017
Fraunhofer IZM


Jaeger-Erben, Melanie; Proske, Marina:
What's hot what's not: The social construction of product obsolescence and its relevance for strategies to increase functionality. (Product Lifetime and the Environment Conference (PLATE) <2, 2017, Delft>)
Bakker, C.: PLATE 2017, Product Lifetimes and the Environment. Conference Proceedings: 8-10 November 2017, Delft. Amsterdam: IOS Press, 2017, pp. 181-185
info:doi/10.3233/978-1-61499-820-4-181
Fraunhofer IZM


Harrer, A.; Schwarz, B.; Schuler, S.; Reininger, P.; Wirthmüller, A.; Detz, H.; MacFarland, D.; Zederbauer, T.; Andrews, A.M.; Rothermund, M.; Oppermann, H.; Schrenk, W.; Strasser, G.:
4.3 μm quantum cascade detector in pixel configuration
Optics Express, Vol.24 (2016), No.15, pp.17041-17049
info:doi/10.1364/OE.24.017041
Fraunhofer IZM


Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.:
Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden. (Tagung "Elektronische Baugruppen und Leiterplatten" (EBL) <8, 2016, Fellbach>)
Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-: Elektronische Baugruppen und Leiterplatten, EBL 2016: Multifunktionale Baugruppen - Leistungsdichte am Limit?; 8. DVS/GMM-Tagung vom 16.-17. Februar 2016 in Fellbach. Berlin: VDE-Verlag, 2016. (GMM-Fachbericht 84), pp. 146-150
Fraunhofer IZM


Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.:
Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology. (International Scientific Conference "Management of Technology - Step to Sustainable Production" (MOTSP) <8, 2016, Porec/Croatia>)
Cosic, P.: MOTSP 2016, 8th International Scientific Conference Management of Technology - Step to Sustainable Production. Conference Proceedings: 1-3 June 2016, Poreč, Istria, Croatia; USB. Zagreb: Croatian Association for PLM, 2016, 9 pp.
Fraunhofer IZM


Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.:
Adhesion mechanism between laser sputtered aluminum nano particles on Si-wafer by Nd:YAG laser. (Conference on Lasers and Electro-Optics - Applications and Technology (CLEO A&T) <2016, San Jose/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: CLEO: Applications and Technology: Part of CLEO: 2016. 5-10 June 2016, San Jose, California, United States . Washington, DC: OSA, 2016. (OSA Technical digest series), Paper ATh1K.7
info:doi/10.1364/CLEO_AT.2016.ATh1K.7
Fraunhofer IZM


Franz, M.; Schubert, I.; Junghans, R.; Martinka, R.; Rudolph, C.; Wachsmuth, H.; Trojan, D.; VanDevender, B.; Wrschka, P.; Gottfried, K.:
Advanced carriers on legacy CMP tools - an intelligent solution for flexible production environments and R&D labs. (Symposium Chemical Mechanical Polishing <2016, San Diego/Calif.>)
Rhoades, R.: Chemical Mechanical Polishing 14: 229th ECS Meeting, May 29, 2016 - June 2, 2016, San Diego, California. Pennington, NJ: ECS, 2016. (ECS transactions 72. 2016, Nr.18), pp. 17-24
info:doi/10.1149/07218.0017ecst
Fraunhofer ENAS
Fraunhofer IZM


Grötsch, S.G.; Brink, M.; Fiederling, R.; Liebetrau, T.; Möllers, I.; Moisel, J.; Oppermann, H.; Pfeuffer, A.:
µAFS High Resolution ADB/AFS Solution. (Society of Automotive Engineers (SAE World Congress) <2016, Detroit/Mich.>)
Warrendale, Pa.: SAE, 2016
(SAE Technical Paper 2016-01-1410)
info:doi/10.4271/2016-01-1410
Fraunhofer IZM


Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.:
Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <17, 2016, Montpellier>)
Institute of Electrical and Electronics Engineers -IEEE-: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016: Montpellier, 18-20 April 2016. Piscataway, NJ: IEEE, 2016, 5 pp.
info:doi/10.1109/EuroSimE.2016.7463346
Fraunhofer IZM


Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.:
All-optical SR flip-flop based on SOA-MZI switches monolithically integrated on a generic InP platform. (Conference "Smart Photonic and Optoelectronic Integrated Circuits" <18, 2016, San Francisco/Calif.>)
He, Sailing (Ed.): Smart photonic and optoelectronic integrated circuits XVIII: 16 - 18 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9751), Paper 97510H
info:doi/10.1117/12.2211152
Fraunhofer IZM


Geißler, Ute; Stockmeyer, J.; Mukhopadhyay, B.:
Aluminium-Scandium als Bond-Pad-Chip-Metallisierung für den Kupferdraht-Bond-Prozess
Produktion von Leiterplatten und Systemen : PLUS, Vol.18 (2016), No.11, pp.2225-2231
Fraunhofer IZM


Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter:
Aluminum-Scandium: A Material for Semiconductor Packaging
Journal of Electronic Materials, Vol.45 (2016), No.10, pp.5456-5467
info:doi/ 10.1007/s11664-016-4756-2
Fraunhofer IZM


Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.:
Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm. (Conference "Optical Interconnects" <16, 2016, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVI. Proceedings: 15-17 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9753), Art.97530T
info:doi/10.1117/12.2213333
Fraunhofer IZM


Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei:
BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications. (International Symposium on Microelectronics <48, 2015, Orlando/Fla.>)
Ray, U.: Advanced packaging & the internet of things. The future of our industry. 48th International Symposium on Microelectronics, IMAPS 2015: Orlando, Florida, USA, 26-29 October 2015. Red Hook, NY: Curran, 2016, pp. 79-85
info:doi/10.4071/isom-2015-TP33
Fraunhofer IZM


Lohse, S.; Wollanke, A.:
Bonding technologies for 3D packaging with high I/O count - An evaluation report. (Smart Systems Integration Conference (SSI) <2016, Munich>)
Geßner, T.: Smart Systems Integration 2016. Proceedings: International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick. Auerbach: Verlag Wissenschaftliche Scripten, 2016, pp. 90-96
Fraunhofer IZM


Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.:
Broadband dielectric material characterization of epoxy molding compound. (Smart Systems Integration Conference (SSI) <2016, Munich>)
Geßner, T.: Smart Systems Integration 2016. Proceedings: International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick. Auerbach: Verlag Wissenschaftliche Scripten, 2016, pp. 36-43
Fraunhofer IZM


Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong:
Characterization of anodic bondable LTCC for wafer-level packaging. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 501-505
info:doi/10.1109/EPTC.2016.7861529
Fraunhofer IKTS
Fraunhofer IZM


Aschenbrenner, Rolf:
Chip embedding - The key for efficient power electronics solutions: Presentation held at MRS Spring Meeting 2016; Phoenix, AZ, USA; 28.03.-01.04.2016. (Materials Research Society (Spring Meeting) <2016, Phoenix/Ariz.>)
2016
urn:nbn:de:0011-n-5036381
Volltext
Fraunhofer IZM


Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter:
Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 1335-1341
info:doi/10.1109/ECTC.2016.394
Fraunhofer IZM


Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.:
Compact power electronic modules realized by PCB embedding technology. (IEEE CPMT Symposium Japan (ICSJ) <2016, Kyoto>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE CPMT Symposium Japan, ICSJ 2016: Kyoto, Japan, 7-9 November 2016. Piscataway, NJ: IEEE, 2016, pp. 259-262
info:doi/10.1109/ICSJ.2016.7801277
Fraunhofer IZM


Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter:
Comparison of different technologies for the die attach of power semiconductor devices conduting active power cycling. (International Conference on Integrated Power Electronics Systems (CIPS) <9, 2016, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2016, 9th International Conference on Integrated Power Electronics Systems. Proceedings. CD-ROM: March, 8 - 10, 2016, Nuremberg/Germany. Berlin: VDE-Verlag, 2016. (ETG Fachbericht 148), 7 pp.
Fraunhofer IZM


Rao, S.; Casalino, M.; Coppola, G.; Kisacik, R.; Tekin, T.; Corte, F.G.D.:
Design of amorphous silicon photonic crystal-based M-Z modulator operating at 1.55 μm. (International Conference on Photonics, Optics and Laser Technology (PHOTOPTICS) <4, 2016, Rome>)
Ribeiro, P.A.: PHOTOPTICS 2016. Proceedings of the 4th International Conference on Photonics, Optics and Laser Technology: Rome, Italy, February 27-29, 2016. Setubal: SciTePress, 2016, pp. 164-170
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.:
Determination of dielectric thickness, constant, and loss tangent from cavity resonators. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 521-523
info:doi/10.1109/EPTC.2016.7861533
Fraunhofer IZM


Winzer, Janis; Wagner, Eduard; Nissen, Nils F.; Lang, Klaus-Dieter:
Developing an indicator setup to measure life-cycle conditions of electronic products. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, 8 pp.
info:doi/10.1109/EGG.2016.7829824
Fraunhofer IZM


Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.:
Development and fabrication of a very high-g sensor for very high impact applications. (Micromechanics and Microsystems Europe Workshop (MME) <27, 2016, Cork>)
Institute of Physics -IOP-, London: 27th Micromechanics and Microsystems Europe Workshop, MME 2016: 28-30 August 2016, Cork, Ireland. Bristol: IOP Publishing, 2016. (Journal of physics. Conference series 757), Art. 012016, 8 pp.
info:doi/10.1088/1742-6596/757/1/012016
Fraunhofer IZM


Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong:
Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Sensors & Transducers Journal, Vol.207 (2016), No.12, pp.30-35
Fraunhofer IZM


Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.:
Development of a sensor concept to in situ measure process data in a transfer mold process. (Smart Systems Integration Conference (SSI) <2016, Munich>)
Geßner, T.: Smart Systems Integration 2016. Proceedings: International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick. Auerbach: Verlag Wissenschaftliche Scripten, 2016, pp. 405-408
Fraunhofer IZM


Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.:
Development of edgeless TSV X-ray detectors. (International Workshop on Radiation Imaging Detectors (IWORID) <17, 2015, Hamburg>)
Journal of Instrumentation, Vol.11 (2016), Art. C02043, 10 pp.
info:doi/10.1088/1748-0221/11/02/C02043
Fraunhofer IZM


Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.:
Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses. (European Microwave Integrated Circuits Conference (EuMIC) <11, 2016, London>)
European Microwave Association: 11th European Microwave Integrated Circuits Conference, EuMIC 2016. Proceedings: European Microwave Week (EuMW) 2016, 3-4 Oct 2016, London, UK. London: Horizon House, 2016, pp. 528-531
info:doi/10.1109/EuMIC.2016.7777608
Fraunhofer IZM


Mueller, M.; Türke, A.; Panchenko, I.:
DSC investigation of the undercooling of SnAgCu solder alloys. (International Spring Seminar on Electronics Technology (ISSE) <39, 2016, Pilsen>)
Institute of Electrical and Electronics Engineers -IEEE-: 39th International Spring Seminar on Electronics Technology, ISSE 2016: Printed electronics and smart textiles, 18-22 May 2016, Pilsen, Czech Republic. Piscataway, NJ: IEEE, 2016, pp. 53-57
info:doi/10.1109/ISSE.2016.7563160
Fraunhofer IZM


Clemm, C.; Sinai, C.; Ferkinghoff, C.; Dethlefs, N.; Nissen, N.F.; Lang, K.D.:
Durability and cycle frequency of smartphone and tablet lithium-ion batteries in the field. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 290-296
info:doi/10.1109/EGG.2016.7829849
Fraunhofer IZM


Hoffmann, S.; Hoene, E.; Zeiter, O.; Kuczmik, A.; Lang, K.-D.:
Effective method for filter design and semiconductor and inductors loss calculation. (European Conference on Power Electronics and Applications (EPE) <18, 2016, Karlsruhe>)
Institute of Electrical and Electronics Engineers -IEEE-: EPE 2016, ECCE Europe, 18th European Conference on Power Electronics and Applications: Karlsruhe, Germany, 5 -9 September, 2016, USB-Stick. Piscataway, NJ: IEEE, 2016, pp. 2318-2327
info:doi/10.1109/EPE.2016.7695505
Fraunhofer IZM


Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Efficient total crosstalk analysis of large via arrays in silicon interposers
IEEE transactions on components, packaging and manufacturing technology, Vol.6 (2016), No.12, pp.1889-1898
info:doi/10.1109/TCPMT.2016.2620059
Fraunhofer IZM


Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.:
Electro-optical circuit board with single-mode glass waveguide optical interconnects. (Conference "Optical Interconnects" <16, 2016, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVI. Proceedings: 15-17 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9753), Paper 97530J
info:doi/10.1117/12.2208103
Fraunhofer IZM


Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.:
Electrochemical sensors based on printed circuit board technologies. (Eurosensors Conference <30, 2016, Budapest>)
Procedia Engineering, Vol.168 (2016), pp.452-455
info:doi/10.1016/j.proeng.2016.11.543
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.:
Embedded die packages and modules for power electronics applications. (International Conference and Exhibition on Device Packaging (DPC) <12, 2016, Fountain Hill/Ariz.>)
International Microelectronics and Packaging Society -IMAPS-: 12th International Conference and Exhibition on Device Packaging 2016: Fountain Hill, Arizona, USA, 14-17 March 2016. Red Hook, NY: Curran, 2016, pp. 96-102
Fraunhofer IZM


Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.:
Embedding of wearable electronics into smart sensor insole. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 597-601
info:doi/10.1109/EPTC.2016.7861550
Fraunhofer IZM


Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.:
Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2016. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 10 - 12 May 2016. Berlin: VDE-Verlag, 2016, pp. 1040-1045
Fraunhofer IZM


Hintemann, R.; Beucker, S.; Clausen, J.; Stobbe, L.; Proske, M.; Nissen, N.F.:
Energy efficiency of data centers - a system-oriented analysis of current development trends. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 113-117
info:doi/10.1109/EGG.2016.7829805
Fraunhofer IZM


Stobbe, L.; Proske, M.; Beucker, S.; Hintemann, R.; Lang, K.D.:
Energy efficiency of ICT: Further improvement through customized products. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 98-104
info:doi/10.1109/EGG.2016.7829822
Fraunhofer IZM


Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.:
Energy-autarkic smart sensor insole for telemedical patient monitoring. (Smart Systems Integration Conference (SSI) <2016, Munich>)
Geßner, T.: Smart Systems Integration 2016. Proceedings: International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick. Auerbach: Verlag Wissenschaftliche Scripten, 2016, pp. 262-268
Fraunhofer IZM


Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.:
Ensuring system reliability of a piezoelectric energy harvester. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 540-545
info:doi/10.1109/ESTC.2016.7764702
Fraunhofer IZM


Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter:
Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Produktion von Leiterplatten und Systemen : PLUS, (2016), No.2, pp.331-335
Fraunhofer IZM


Dietrich, Manfred; Gulbins, Matthias; Haase, Joachim; Markwirth, Thomas; Warmuth, Jens Michael:
Entwurfsmethoden für verbesserte robuste Batteriemanagementsysteme. Teilvorhaben: Teil des Gesamtvorhabens: Integrierte Komponenten und integrierter Entwurf energie-effizienter Batteriemanagementsysteme. Schlussbericht
Dresden: Fraunhofer IIS / EAS, 2016
urn:nbn:de:0011-n-4132539
Volltext
Fraunhofer EAS
Fraunhofer IZM


Wagner, E.; Benecke, S.; Winzer, J.; Nissen, N.F.; Lang, K.-D.:
Evaluation of indicators supporting the sustainable design of electronic systems. (Global Conference on Sustainable Manufacturing (GCSM) <13, 2015, Ho Chi Minh City, Vietnam>)
Procedia CIRP, Vol.40 (2016), pp.469-474
info:doi/10.1016/j.procir.2016.01.100
Fraunhofer IZM


Lotter, Carsten; Heiland, Josef J.; Stein, Volkmar; Klimkait, Michael; Queisser, Marco; Belder, Detlev:
Evaluation of pressure stable chip-to-tube fittings enabling high-speed chip-HPLC with mass spectrometric detection
Analytical chemistry, Vol.88 (2016), No.15, pp.7481-7486
info:doi/10.1021/acs.analchem.6b01907
Fraunhofer ICT-IMM
Fraunhofer IZM


Zoschke, K.; Lang, K.-D.:
Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 223-228
info:doi/10.1109/EPTC.2016.7861476
Fraunhofer IZM


Hartmann, S.; Sturm, H.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.:
Experimental and computational studies on the role of surface functional groups in the mechanical behavior of interfaces between single-walled carbon nanotubes and metals
Journal of Materials Science : JMS, Vol.51 (2016), No.3, pp.1217-1233
info:doi/10.1007/s10853-015-9142-6
Fraunhofer IZM
Fraunhofer ENAS


Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.:
Experts view on the sustainability of the fairphone 2. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 15-21
info:doi/10.1109/EGG.2016.7829811
Fraunhofer IZM


Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura :
Feasibility study for setting-up reference values to support the calculation of recyclability / recoverability rates of electr(on)ic products
Luxembourg: Publications Office of the European Union, 2016
(JRC Technical Reports EUR 27922 EN)
ISBN 978-92-79-58390-2
ISBN 978-92-79-58391-9
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.:
Foldable fan-out wafer level packaging. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 19-24
info:doi/10.1109/ECTC.2016.90
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2015/2016
Berlin: Fraunhofer IZM, 2016
urn:nbn:de:0011-n-4066927
Volltext
Fraunhofer IZM


Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.:
Fully automated hybrid diode laser assembly using high precision active alignment. (Conference "Components and Packaging for Laser Systems" <2, 2016, San Francisco/Calif.>)
Glebov, A.L.: Components and Packaging for Laser Systems II. Proceedings: 16-17 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9730), Paper 97300E
info:doi/10.1117/12.2214718
Fraunhofer IZM


Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.:
Glass based interposers for RF applications up to 100GHz. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 498-504
info:doi/10.1109/ESTC.2016.7764695
Fraunhofer IZM


Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.:
Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 82-87
info:doi/10.1109/ECTC.2016.178
Fraunhofer IZM


Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.:
Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Microelectronic engineering, Vol.156 (2016), pp.41-45
info:doi/10.1016/j.mee.2015.12.017
Fraunhofer IZM


Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.:
High frequency characterization of silicon substrate and through silicon vias. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 1544-1550
info:doi/10.1109/ECTC.2016.240
Fraunhofer IZM


Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.:
High viscosity paste dosing for microelectronic applications. (International Symposium on Microelectronics <49, 2016, Pasadena/Calif.>)
IMAPS Proceedings of the International Symposium on Microelectronics. Online journal, (2016), No.1, Fall, pp.345-350
info:doi/10.4071/isom-2016-WP45
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.:
Higher-order virtual ground fence design for filtering power plane noise. (Workshop on Signal and Power Integrity (SPI) <20, 2016, Turin>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 20th Workshop on Signal and Power Integrity, SPI 2016. Proceedings: 8-11 May, 2016, Starhotel Majestic, Turin, Italy. Piscataway, NJ: IEEE, 2016, pp. 53-55
info:doi/10.1109/SaPIW.2016.7496286
Fraunhofer IZM


Gundel, P.; Persons, R.; Bawohl, M.; Challingsworth, M.; Czwickla, C.; Garcia, V.; Modes, C.; Nikolaidis, I.; Reitz, J.; Shahbazi, C.; Nowak, T.:
Highly reliable and cost effective thick film substrates for power LEDs. (Annual Applied Power Electronics Conference and Exposition (APEC) <31, 2016, Long Beach/Calif.>)
APEC 2016, thirty first Annual IEEE Applied Power Electronics Conference and Exposition: March 20-24, 2016, Long Beach Convention Center - Long Beach, California. Piscataway, NJ: IEEE, 2016, pp. 3069-3074
info:doi/10.1109/APEC.2016.7468301
Fraunhofer IZM


Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen:
HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature. (International Conference and Exhibition on High Temperature Electronics (HiTEC) <2016, Albuquerque/NM>)
International Conference and Exhibition on High Temperature Electronics, HiTEC 2016: Albuquerque, New Mexico, USA, 10-12 May 2016. Red Hook, NY: Curran, 2016, pp. 1-10
info:doi/10.4071/2016-HITEC-1a
Fraunhofer IMS
Fraunhofer IMWS
Fraunhofer IZM
Fraunhofer ENAS
Fraunhofer IKTS


Gwinnutt, J.; Cumming, S.; Prigneaux, J.; Stevenson, A.; Dils, C.; Granberg, H.; Slater, A.; Knorr, K.; Jolly, M.; Möbitz, C.; Lütke, C.; Hofmann, M.; Käppel, D.:
How will high-performance nonwovens transform your business?
Technical textiles international, Vol.25 (2016), No.5, pp.33-37
Fraunhofer IZM


Hartmann, S.; Bonitz, J.; Heggen, M.; Hermann, S.; Hölck, O.; Schulz, S.E.; Gessner, T.; Wunderle, B.:
An in situ tensile test device for thermo-mechanical characterisation of interfaces between carbon nanotubes and metals. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <17, 2016, Montpellier>)
Institute of Electrical and Electronics Engineers -IEEE-: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016: Montpellier, 18-20 April 2016. Piscataway, NJ: IEEE, 2016, 9 pp.
info:doi/10.1109/EuroSimE.2016.7463360
Fraunhofer IZM
Fraunhofer ENAS


Windrich, F.; Kappert, E.J.; Malanin, M.; Eichhorn, K.-J.; Häußler, L.; Benes, N.E.; Voit, B.:
In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications
European polymer journal : EPJ, Vol.84 (2016), pp.279-291
info:doi/10.1016/j.eurpolymj.2016.09.020
Fraunhofer IZM


Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.:
In-situ measuring module for transfer molding process monitoring. (International Symposium on Microelectronics <49, 2016, Pasadena/Calif.>)
IMAPS Proceedings of the International Symposium on Microelectronics. Online journal, (2016), No.1, Fall, pp.475-477
info:doi/10.4071/isom-2016-THA43
Fraunhofer IZM


Wunderle, B.; May, D.; Abo Ras, M.; Sheva, S.; Schulz, M.; Wöhrmann, M.; Bauer, J.; Keller, J.:
In-situ monitoring of interface delamination by local thermal transducers exemplified for a flip-chip package. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <22, 2016, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: THERMINIC 2016, 22nd International Workshop Thermal Investigations of ICs and Systems: September 21-23, 2016, Budapest, Hungary; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 230-235
info:doi/10.1109/THERMINIC.2016.7749057
Fraunhofer IZM


Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.:
Inline monitoring of epoxy molding compound in transfer molding process for smart power modules. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 714-721
info:doi/10.1109/ECTC.2016.99
Fraunhofer IZM


Aschenbrenner, Rolf:
Integration Technologies for Smart Textiles: Presentation held at MRS Spring Meeting 2016; Phoenix, AZ, USA; 28.03.-01.04.2016. (Materials Research Society (Spring Meeting) <2016, Phoenix/Ariz.>)
2016
urn:nbn:de:0011-n-5036422
Volltext
Fraunhofer IZM


Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.:
Interposer - an enabling technology for fan-out hybrid pixel modules. (International Workshop on Radiation Imaging Detectors (IWORID) <18, 2016, Barcelona>)
18th iWoRiD, International Workshop on Radiation Imaging Detectors 2016. Book Abstracts: 3-7 July 2016, Barcelona, Spain. Barcelona, 2016, pp. 12
Fraunhofer IZM


Kleff, J.; Schlottig, G.; Mrossko, R.; Steller, W.; Oppermann, H.; Keller, J.; Brunschwiler, T.:
Intra-stack sealing of tier interconnects using the interconnect alloy. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 204-209
info:doi/10.1109/ESTC.2016.7764489
Fraunhofer IZM


Sandjaja, M.; Stolle, T.; Bund, A.; Lang, K.-D.:
Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias
IEEE transactions on electron devices, Vol.63 (2016), No.8, pp.3199-3204
info:doi/10.1109/TED.2016.2581312
Fraunhofer IZM


Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.:
Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 325-330
info:doi/10.1109/EPTC.2016.7861498
Fraunhofer IZM


Mitterhuber, L.; Defregger, S.; Hammer, R.; Magnien, J.; Schrank, F.; Hörth, S.; Hutter, M.; Kraker, E.:
Investigation of the temperature-dependent heat path of an LED module by thermal simulation and design of experiments. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <22, 2016, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: THERMINIC 2016, 22nd International Workshop Thermal Investigations of ICs and Systems: September 21-23, 2016, Budapest, Hungary; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 194-200
info:doi/10.1109/THERMINIC.2016.7749051
Fraunhofer IZM


Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.:
Large area processes for 3D shaped electronics. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 64-68
info:doi/10.1109/ESTC.2016.7764463
Fraunhofer IZM


Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.:
Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Journal of Lightwave Technology, Vol.34 (2016), No.10, pp.2540-2551
info:doi/10.1109/JLT.2016.2529651
Fraunhofer IZM


Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.:
Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding. (International Conference and Exhibition on Device Packaging (DPC) <12, 2016, Fountain Hill/Ariz.>)
International Microelectronics and Packaging Society -IMAPS-: 12th International Conference and Exhibition on Device Packaging 2016: Fountain Hill, Arizona, USA, 14-17 March 2016. Red Hook, NY: Curran, 2016, pp. 221-224
Fraunhofer IZM


Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.:
LiTaO3 capping technology for wafer level chip size packaging of SAW filters. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 889-896
info:doi/10.1109/ECTC.2016.291
Fraunhofer IZM


Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.:
Low Cost chemiresistor arrays for the detection of VOC's. (Smart Systems Integration Conference (SSI) <2016, Munich>)
Geßner, T.: Smart Systems Integration 2016. Proceedings: International Conference and Exhibition on Integration Issues of Miniaturized Systems; Munich, Germany, 9-10 March 2016, USB-Stick. Auerbach: Verlag Wissenschaftliche Scripten, 2016, pp. 246-250
Fraunhofer IZM


Capecchi, S.; Atanasova, T.; Willeke, R.; Parthenopoulos, M.; Pizzetti, C.; Daviot, J.:
Low undercut Ti Etch chemistry for Cu bump pillar under bump metallization Wet Etch process. (International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) <13, 2016, Knokke-Heist>)
Mertens, P.W.: Ultra clean processing of semiconductor surfaces XIII: Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium. Pfäffikon: Trans Tech Publications, 2016. (Diffusion and defect data. B, Solid state phenomena 255), pp. 291-296
info:doi/10.4028/www.scientific.net/SSP.255.291
Fraunhofer IZM


Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D.:
Modular products: Smartphone design from a circular economy perspective. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 7-14
info:doi/10.1109/EGG.2016.7829810
Fraunhofer IZM


Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.:
Multi-layer electro-optical circuit board fabrication on large panel. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 468-476
info:doi/10.1109/ECTC.2016.312
Fraunhofer IZM


Anzures, E.; Morganelli, P.; Barr, R.; Calvert, J.; Dhoble, A.; Fleming, D.; Kim, J.K.; Lei, H.; Grafe, J.; Haberland, J.:
Non-conductive film (NCF) underfill: Materials, performance, and evolution to next generation devices. (International Conference and Exhibition on Device Packaging (DPC) <12, 2016, Fountain Hill/Ariz.>)
International Microelectronics and Packaging Society -IMAPS-: 12th International Conference and Exhibition on Device Packaging 2016: Fountain Hill, Arizona, USA, 14-17 March 2016. Red Hook, NY: Curran, 2016, pp. 216-220
Fraunhofer IZM


Durek, J.; Fröhling, A.; Bolling, J.; Thomasius, R.; Durek, P.; Schlüter, O.K.:
Non-destructive mobile monitoring of microbial contaminations on meat surfaces using porphyrin fluorescence intensities
Meat science, Vol.115 (2016), pp.1-8
info:doi/10.1016/j.meatsci.2015.12.022
Fraunhofer IZM


Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.:
Non-overlapping power/ground planes for localized power distribution network design. (Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <15, 2016, Honolulu/Hawaii>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016: December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii. Piscataway, NJ: IEEE, 2016, pp. 7-9
info:doi/10.1109/EDAPS.2016.7893111
Fraunhofer IZM


Proske, M.; Winzer, J.; Marwede, M.; Nissen, N.F.; Lang, K.-D.:
Obsolescence of electronics - the example of smartphones. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 311-318
info:doi/10.1109/EGG.2016.7829852
Fraunhofer IZM


Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.:
On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
IEEE transactions on microwave theory and techniques, Vol.64 (2016), No.8, pp.2511-2518
info:doi/10.1109/TMTT.2016.2582693
Fraunhofer IZM


Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.:
On the upper bound of total uncorrelated crosstalk in large through silicon via arrays. (Workshop on Signal and Power Integrity (SPI) <20, 2016, Turin>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 20th Workshop on Signal and Power Integrity, SPI 2016. Proceedings: 8-11 May, 2016, Starhotel Majestic, Turin, Italy. Piscataway, NJ: IEEE, 2016, pp. 120-123
info:doi/10.1109/SaPIW.2016.7496309
Fraunhofer IZM


Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan:
On-chip automation of cell-free protein synthesis: New opportunities due to a novel reaction mode
LAB on a chip, Vol.16 (2016), No.2, pp.269-281
info:doi/10.1039/c5lc00700c
Fraunhofer IZI
Fraunhofer IZM


Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.:
Opportunities of fan-out wafer level packaging (FOWLP) for RF applications. (Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) <16, 2016, Austin/Tex.>)
Institute of Electrical and Electronics Engineers -IEEE-: SiRF 2016, IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: 24-27 January 2016, JW Mariott Austin, Austin, Texas, USA; RWW 2016, Austin, Texas; digest. Piscataway, NJ: IEEE, 2016, pp. 35-37
info:doi/10.1109/SIRF.2016.7445461
Fraunhofer IZM


Pitris, S.; Vagionas, C.; Kanellos, G.T.; Kisacik, R.; Tekin, T.; Broeke, R.; Pleros, N.:
Optical static RAM cell using a monolithically integrated InP Flip-Flop and wavelength-encoded signals. (Optical Fiber Communication Conference and Exposition (OFC) <2016, Anaheim/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: Optical Fiber Communications Conference and Exhibition, OFC 2016: 20-22 March 2016, Anaheim, California, United States. Washington, DC: OSA, 2016, Paper Tu2K.7
Fraunhofer IZM


Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.:
An Overview and Future Perspectives of Aluminum Batteries
Advanced Materials, Vol.28 (2016), No.35, pp.7564-7579
info:doi/10.1002/adma.201601357
Fraunhofer IZM


Manier, C.-A.; Oppermann, H.; Dietrich, L.; Ehrhardt, C.; Sarkany, Z.; Rencz, M.; Wunderle, B.; Maurer, W.; Mitova, R.; Lang, K.-D.:
Packaging and characterization of silicon and SiC-based power inverter module with double sided cooling. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2016. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 10 - 12 May 2016. Berlin: VDE-Verlag, 2016, pp. 1155-1162
Fraunhofer IZM


Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong:
Packaging solution for a novel silicon-based trace humidity sensor using coulometric method. (Electronics Packaging Technology Conference (EPTC) <18, 2016, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Proceedings: 30. November - 3 December 2016, Singapore. Piscataway, NJ: IEEE, 2016, pp. 354-359
info:doi/10.1109/EPTC.2016.7861504
Fraunhofer IZM


Aschenbrenner, Rolf:
Panel Level Embedding for Power and Sensor Applications: Presentation held at 37. International Electronics Manufacturing Technology Conference (IEMT) 2016; Penang, Malaysia; 20.-22.09.2016. (International Electronic Manufacturing Technology Symposium (IEMT) <37, 2016, Penang>)
2016
urn:nbn:de:0011-n-5036450
Volltext
Fraunhofer IZM


Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K.:
Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 319-325
info:doi/10.1109/EGG.2016.7829853
Fraunhofer IZM


Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.:
Planar polymer and glass graded index waveguides for data center applications. (Conference "Optical Interconnects" <16, 2016, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVI. Proceedings: 15-17 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9753), Paper 97530I
info:doi/10.1117/12.2212376
Fraunhofer IZM


Wilke, Martin; Dieckerhoff, S.; Lang, K.-D.; Bock, K.; Tillack, B. :
Plasmaätzen zur Herstellung von Siliziumdurchkontaktierungen mit kontrolliertem Seitenwinkel für die dreidimensionale Integration im Wafer Level Packaging
Stuttgart: Fraunhofer Verlag, 2016
Zugl.: Berlin, TU, Diss., 2016
ISBN 978-3-8396-1056-5
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.:
Potential and challenges of fan-out panel level packaging. (IEEE CPMT Symposium Japan (ICSJ) <2016, Kyoto>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE CPMT Symposium Japan, ICSJ 2016: Kyoto, Japan, 7-9 November 2016. Piscataway, NJ: IEEE, 2016, pp. 132-136
info:doi/10.1109/ICSJ.2016.7801251
Fraunhofer IZM


Bilevych, Y.; Brunner, S.E.; Chan, H.W.; Charbon, E.; Graaf, H. van der; Hagen, C.W.; Nutzel, G.; Pinto, S.D.; Prodanovic, V.; Rotmanc, D.; Santagata, F.; Sarro, L.; Schaart, D.R.; Sinsheimer, J.; Smedley, J.; Tao, S.X.; Theulings, A.M.M.G.:
Potential applications of electron emission membranes in medicine
Nuclear instruments and methods in physics research, Section A. Accelerators, spectrometers, detectors and associated equipment, Vol.809 (2016), pp.171-174
info:doi/10.1016/j.nima.2015.10.084
Fraunhofer IZM


Windrich, F.; Malanin, M.; Eichhorn, K.J.; Voit, B.:
Rapid scan in-situ FT-IR curing studies of low-temperature cure thin film polymer dielectrics in solid state. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 1698-1706
info:doi/10.1109/ECTC.2016.9
Fraunhofer IZM


Schneider-Ramelow, Martin; Ehrhardt, Christian:
The reliability of wire bonding using Ag and Al
Microelectronics reliability, Vol.63 (2016), pp.336-341
info:doi/10.1016/j.microrel.2016.05.009
Fraunhofer IZM


Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D.:
Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Microelectronics reliability, Vol.64 (2016), pp.140-144
info:doi/10.1016/j.microrel.2016.07.126
Fraunhofer IZM


Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D.:
A review of green electronics research trends. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 452-458
info:doi/10.1109/EGG.2016.7829858
Fraunhofer IZM


Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.:
RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz. (Sensors Conference <15, 2016, Orlano/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE SENSORS 2016: Orlando, Florida, USA, October 30-November 2, 2016; Proceedings papers. Piscataway, NJ: IEEE, 2016, pp. 448-450
info:doi/10.1109/ICSENS.2016.7808547
Fraunhofer IZM


Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.:
RF-MEMS Technology for 5G: Series and Shunt Attenuator Modules Demonstrated up to 110 GHz
IEEE Electron Device Letters, Vol.37 (2016), No.10, pp.1336-1339
info:doi/10.1109/LED.2016.2604426
Fraunhofer IZM


Iannacci, J.; Huhn, M.; Tschoban, C.; Pötter, H.:
RF-MEMS technology for future mobile and high-frequency applications: Reconfigurable 8-Bit power attenuator tested up to 110 GHz
IEEE Electron Device Letters, Vol.37 (2016), No.12, pp.1646-1649
info:doi/10.1109/LED.2016.2623328
Fraunhofer IZM


Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.:
A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
IEEE transactions on components, packaging and manufacturing technology, Vol.6 (2016), No.1, pp.117-125
info:doi/10.1109/TCPMT.2015.2497466
Fraunhofer IZM


Kanematsu, W.; Mandler, W., Jr.; Manier, C.-A.; Woydt, M.:
Rolling contact fatigue tests of ceramics by various methods: Comparison of suitability to the evaluation of silicon nitrides
Journal of testing and evaluation, Vol.44 (2016), No.3, pp.1271-1283
info:doi/10.1520/JTE20140258
Fraunhofer IZM


Krshiwoblozki, Malte von; Pawlikowski, Jakub:
Sensitive brace recognises the right angle
Medicine & technology, (2016), No.1, pp.56-57
Fraunhofer IZM


Watzke, Stefan:
Simulation based analysis of LED package reliability regarding encapsulant related failures
Stuttgart: Fraunhofer Verlag, 2016
Zugl.: Berlin, TU, Diss., 2015
ISBN 978-3-8396-0956-9
Fraunhofer IZM


Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter:
Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability. (International Conference on Integrated Power Electronics Systems (CIPS) <9, 2016, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2016, 9th International Conference on Integrated Power Electronics Systems. Proceedings. CD-ROM: March, 8 - 10, 2016, Nuremberg/Germany. Berlin: VDE-Verlag, 2016. (ETG Fachbericht 148), 4 pp.
Fraunhofer IZM


Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.:
SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs. (Conference "Optical Interconnects" <16, 2016, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XVI. Proceedings: 15-17 February 2016, San Francisco, California, United States. Bellingham, WA: SPIE, 2016. (Proceedings of SPIE 9753), Paper 975310, 10 pp.
info:doi/10.1117/12.2208878
Fraunhofer IZM


Vyrsokinos, K.; Moralis-Pegios, M.; Vagionas, C.; Brimont, A.; Zanzi, A.; Sanchis, P.; Marti, J.; Kraft, J.; Rohracher, K.; Dorrestein, S.; Bogdan, M.; Pleros, N.:
Single mode optical interconnects for future data centers. (International Conference on Transparent Optical Networks (ICTON) <18, 2016, Trento>)
Ferrari, M.: 18th International Conference on Transparent Optical Networks, ICTON 2016: Trento, Italy, July 10-14, 2016. Piscataway, NJ: IEEE, 2016, 4 pp.
info:doi/10.1109/ICTON.2016.7550291
Fraunhofer IZM


Hanss, A.; Hutter, M.; Trodler, J.; Elger, G.:
Solder process for fluxless solder paste applications. (Electronic Components and Technology Conference (ECTC) <66, 2016, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 66th Electronic Components and Technology Conference, ECTC 2016. Proceedings: 31 May-3 June 2016, Las Vegas, Nevada, USA. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2016, pp. 447-454
info:doi/10.1109/ECTC.2016.330
Fraunhofer IZM


Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D.:
Status of the RoHS directive and exemptions. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, pp. 433-438
info:doi/10.1109/EGG.2016.7829868
Fraunhofer IZM


Chancerel, Perrine; Maehlitz, Paul; Chanson, Claude; Binnemans, Peter; Huisman, Jaco; Guzman Brechu, Michelle; Rotter, Vera Susanne; Nissen, Nils F.; Lang, Klaus-Dieter:
Stocks and flows of critical materials in batteries: Data collection and data uses. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, 8 pp.
info:doi/10.1109/EGG.2016.7829827
Fraunhofer IZM


Stiebing, M.; Lörtscher, E.; Steller, W.; Vogel, D.; Wolf, M.J.; Brunschwiler, T.; Wunderle, B.:
Stress investigations in 3D-integrated silicon microstructures. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <17, 2016, Montpellier>)
Institute of Electrical and Electronics Engineers -IEEE-: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016: Montpellier, 18-20 April 2016. Piscataway, NJ: IEEE, 2016, pp. 478-483
info:doi/10.1109/EuroSimE.2016.7463368
Fraunhofer IZM
Fraunhofer ENAS


Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D.:
Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 217-222
info:doi/10.1109/ESTC.2016.7764491
Fraunhofer IZM


Stahr, H.; Unger, M.; Nicolics, J.; Morianz, M.; Gross, S.; Böttcher, L.:
Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 552-557
info:doi/10.1109/ESTC.2016.7764704
Fraunhofer IZM


Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.:
A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 333-339
info:doi/10.1109/ESTC.2016.7764514
Fraunhofer IZM


Hartmann, S.; Hermann, S.; Bonitz, J.; Heggen, M.; Hölck, O.; Shaporin, A.; Mehner, J.; Schulz, S.E.; Gessner, T.; Wunderle, B.:
Towards nanoreliability of sensors incorporating interfaces between single-walled carbon nanotubes and metals: Molecular dynamics simulations and in situ experiments using electron microscopy
Mechatronics, Vol.40 (2016), pp.270-280
info:doi/10.1016/j.mechatronics.2016.05.016
Fraunhofer IZM
Fraunhofer ENAS


Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert:
Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
2016
Fraunhofer IZM


Brusberg, Lars; Schröder, Henning:
Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
2016
Fraunhofer IZM


Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.:
Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components. (Electronics System-Integration Technology Conference (ESTC) <6, 2016, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: 6th Electronic System-Integration Technology Conference, ESTC 2016: Grenoble, 13-16 September 2016. Piscataway, NJ: IEEE, 2016, pp. 12-14
info:doi/10.1109/ESTC.2016.7764455
Fraunhofer IZM


Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.:
Visuelle und mechanische Prüfung von Drahtbondverbindungen
Produktion von Leiterplatten und Systemen : PLUS, Vol.18 (2016), pp.532-546
Fraunhofer IZM


Töpper, M.:
Wafer level chip scale packaging
Lu, D.: Materials for advanced packaging: Second Edition. Cham: Springer International Publishing, 2016, pp. 627-695
info:doi/10.1007/978-3-319-45098-8_15
Fraunhofer IZM


Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.:
Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2016, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: DTIP 2016, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS: Budapest, Hungary, May 30th - June, 2, 2016. Piscataway, NJ: IEEE, 2016, pp. 27-32
info:doi/10.1109/DTIP.2016.7514832
Fraunhofer IZM


Pitris, S.; Vagionas, C.; Tekin, T.; Broeke, R.; Kanellos, G.T.; Pleros, N.:
WDM-Enabled Optical RAM at 5 Gb/s Using a Monolithic InP Flip-Flop Chip
IEEE photonics journal, Vol.8 (2016), No.2, Art. 0600207, 8 pp.
info:doi/10.1109/JPHOT.2016.2526635
Fraunhofer IZM


Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina:
Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Berlin: Fraunhofer IZM, 2016
urn:nbn:de:0011-n-3996454
Volltext
Fraunhofer IZM


Chancerel, Perrine; Marwede, Max; Mathieux, Fabrice; Talens Peiró, Laura:
Would the setting-up of reference values to support the calculation of recyclability rates help improving the material efficiency of electronic products?. (International Congress Electronics Goes Green 2016+ (EGG) <2016, Berlin>)
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin: International Congress Electronics Goes Green 2016+, EGG 2016. Proceedings: Inventing shades of green; September 7-9, 2016, Berlin, Germany; Proceedings. Piscataway, NJ: IEEE, 2016, 6 pp.
info:doi/10.1109/EGG.2016.7829854
Fraunhofer IZM


Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.:
A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Micromachines, Vol.7 (2016), No.10, Art. 193, 9 pp.
info:doi/10.3390/mi7100193
Fraunhofer IZM


Yang, Yujia; Radecker, M.; Lang, K.-D.; Fischer, W.-J.:
An accurate back to front design methodology for PT based load resonant converters. (Applied Power Electronics Conference and Exposition (APEC) <30, 2015, Charlotte/NC>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Applied Power Electronics Conference and Exposition, APEC 2015. Vol.4: Charlotte, North Carolina, USA, 15 - 19 March 2015. Piscataway, NJ: IEEE, 2015, pp. 3291-3295
info:doi/10.1109/APEC.2015.7104824
Fraunhofer IZM


Brand, S.; Appenroth, T.; Naumann, F.; Steller, W.; Wolf, M.J.; Czurratis, P.; Altmann, F.; Petzold, M.:
Acoustic GHz-microscopy and its potential applications in 3D-integration technologies. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.1: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 46-53
info:doi/10.1109/ECTC.2015.7159570
Fraunhofer IWM-H
Fraunhofer IZM


Ehrhardt, Christian; Hutter, Matthias; Weber, Constanze; Lang, Klaus-Dieter:
Active power cycling results using copper tin TLPB joints as new die-attach technology. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2015. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings. Berlin: VDE Verlag, 2015, pp. 1268-1275
Fraunhofer IZM


Peukert, B.; Benecke, S.; Clavell, J.; Neugebauer, S.; Nissen, N.F.; Uhlmann, E.; Lang, K.-D.; Finkbeiner, M.:
Addressing sustainability and flexibility in manufacturing via smart modular machine tool frames to support sustainable value creation. (Conference on Life Cycle Engineering <22, 2015, Sydney>)
Procedia CIRP, Vol.29 (2015), pp.514-519
info:doi/10.1016/j.procir.2015.02.181
Fraunhofer IZM


Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.:
Advanced approach of calculating wire bond pull test correction factors
Aschenbrenner, Rolf et al.: Microelectronic Packaging in the 21st Century: Honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday. Stuttgart: Fraunhofer Verlag, 2015, pp. 277-283
Fraunhofer IZM


Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.:
Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Sensors. Online journal, Vol.15 (2015), No.8, pp.20305-20315
info:doi/10.3390/s150820305
Fraunhofer IZM


Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.:
Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices. (International Interconnect Technology Conference (IITC) <2015, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015: 18-21 May 2015, Grenoble. Piscataway, NJ: IEEE, 2015, pp. 233-236
info:doi/10.1109/IITC-MAM.2015.7325658
Fraunhofer IZM


Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.:
Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
IEEE transactions on electromagnetic compatibility, Vol.57 (2015), No.2, pp.241-249
info:doi/10.1109/TEMC.2014.2378284
Fraunhofer IZM


Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D.:
Hochstromkontakte für Smart-Power Mechanics
Produktion von Leiterplatten und Systemen : PLUS, (2015), No.5, pp.1021-1032
Fraunhofer IZM


Oppermann, Hermann:
Anordnung aus einem Substrat mit mindestens einem optischen Wellenleiter und einer optischen Koppelstelle und aus einem optoelektronischen Bauelement und Verfahren zur Herstellung einer solchen Anordnung
2015
Fraunhofer IZM


Zschech, Ehrenfried; Gluch, Jürgen; Niese, Sven; Lewandowska, Anna; Wolf, Jürgen M.; Röntzsch, Lars; Löffler, Markus:
Anwendungen der Röntgenmikroskopie in der Mikroelektronik und Energietechnik. (Metallographie-Tagung <49, 2015, Dresden>)
Schneider, Gerhard (Ed.) et al.: Fortschritte in der Metallographie: Vortragstexte der 49. Metallographie-Tagung, 16.-18. September 2015 in Dresden. Sankt Augustin: Inventum, 2015. (Sonderbände der praktischen Metallographie 47), pp. 3-11
Fraunhofer IKTS
Fraunhofer IZM
Fraunhofer IFAM


Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.:
Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.2: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 1343-1350
info:doi/10.1109/ECTC.2015.7159772
Fraunhofer IZM


Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.:
Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production. (Conference "Optical Interconnects" <15, 2015, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XV: 9-11 February 2015, San Francisco, California. Bellingham, WA: SPIE, 2015. (Proceedings of SPIE 9368), Paper 93680F, 6 pp.
info:doi/10.1117/12.2079617
Fraunhofer IZM


Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Wunderle, B.:
Challenges in the reliability of 3D integration using TSVs. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015: 19-22 April 2015, Budapest, Hungary. Piscataway, NJ: IEEE, 2015, pp. 334-341
info:doi/10.1109/EuroSimE.2015.7103129
Fraunhofer IZM
Fraunhofer ENAS


Rudolph, C.; Wachsmuth, H.; Boettcher, M.; Steller, W.; Wolf, M.J.:
Challenges of TSV backside process integration. (International Conference onPlanarization/CMP Technology (ICPT) <2015, Chandler/Ariz.>)
International Conference on Planarization/CMP Technology, ICPT 2015: Chandler, Arizona, USA 30 September – 2 October. Piscataway, NJ: IEEE, 2015, pp. 143-146
Fraunhofer IZM


Randoll, R.; Asef, M.; Wondrak, W.; Böttcher, L.; Schletz, A.:
Characteristics and aging of PCB embedded power electronics. (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <26, 2015, Toulouse>)
Microelectronics reliability, Vol.55 (2015), No.9-10, pp.1634-1639
info:doi/10.1016/j.microrel.2015.06.072
Fraunhofer IISB
Fraunhofer IZM


Zech, C.; Hülsmann, A.; Schlechtweg, M.; Reinold, Steffen; Giers, Christof; Kleiner, Bernhard; Georgi, L.; Kahle, R.; Becker, K.-F.; Ambacher, O.:
A compact W-band LFMCW radar module with high accuracy and integrated signal processing. (European Microwave Conference (EuMC) <45, 2015, Paris>)
45th European Microwave Conference, EuMC 2015. Proceedings: 7-10 September 2015, Paris, France. London: Horizon House, 2015, pp. 554-557
Fraunhofer IAF
Fraunhofer IPA 2015/853
Fraunhofer IZM


Tetzner, Kornelius:
Comparative study of organic, inorganic and hybrid gate-dielectrics for organic field-effect transistors using semiconducting liquid-crystal polymers
Stuttgart: Fraunhofer Verlag, 2015
Zugl.: Berlin, TU, Diss., 2014
ISBN 3-8396-0830-9
ISBN 978-3-8396-0830-2
Fraunhofer IZM


Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.:
Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 335-338
Fraunhofer IZM


Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.:
Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2015. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings. Berlin: VDE Verlag, 2015, pp. 1081-1085
Fraunhofer IZM


Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.:
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding. (European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <26, 2015, Toulouse>)
Microelectronics reliability, Vol.55 (2015), No.9-10, pp.1855-1860
info:doi/10.1016/j.microrel.2015.06.061
Fraunhofer IZM


Weber, Constanze; Hutter, Matthias; Schmitz, Stefan; Lang, Klaus-Dieter:
Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.3: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 1866-1873
info:doi/10.1109/ECTC.2015.7159854
Fraunhofer IZM


Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D.:
Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes. (International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS) <15, 2015, Boston/Mass.>)
Institute of Physics -IOP-, London: 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, PowerMEMS 2015: Boston, Massachusetts USA, December 1 - 4, 2015; Technical Digest. Bristol: IOP Publishing, 2015. (Journal of physics. Conference series 660), Art. 012064, 6 pp.
info:doi/10.1088/1742-6596/660/1/012064
Fraunhofer IZM


Schreier-Alt, T.; Reitlinger, C.; Kaul, F.; Metzger, T.; Revenberg, K.:
Design, setup and test of a heterogeneous module and characterization by stress measurement. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 458-462
Fraunhofer IZM


Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D.:
Development of a microcamera with embedded image processor using panel level packaging. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 271-274
Fraunhofer IZM


Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.:
Development of advanced power modules for electric vehicle applications. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 246-251
Fraunhofer IZM


Thomas, Tina; Voges, Steve; Fliess, M.; Becker, Karl-Friedrich; Reiners, Philipp; Koch, Mathias; Bauer, Jörg; Braun, Tanja; Lang, Klaus-Dieter:
Development of solder paste jetting processes for advanced packaging. (Smart Systems Integration Conference (SSI) <2015, Copenhagen>)
Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz: Smart Systems Integration 2015: 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015. Aachen: Apprimus-Verlag, 2015
Fraunhofer IZM


Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.:
Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding. (Smart Systems Integration Conference (SSI) <2015, Copenhagen>)
Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz: Smart Systems Integration 2015: 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015. Aachen: Apprimus-Verlag, 2015, pp. 32-39
Fraunhofer IZM


Brusberg, L.; Whalley, S.; Herbst, C.; Schröder, H.:
Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers
Optics Express, Vol.23 (2015), No.25, pp.32528-32540
info:doi/10.1364/OE.23.032528
Fraunhofer IZM


Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.:
Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method. (Workshop on Signal and Power Integrity (SPI) <19, 2015, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 19th Workshop on Signal and Power Integrity, SPI 2015: 10-13 May 2015, Berlin, Germany. Piscataway, NJ: IEEE, 2015, pp. 26-29
info:doi/10.1109/SaPIW.2015.7237387
Fraunhofer IZM


Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Efficient computation of localized fields for through silicon via modeling up to 500 GHz
IEEE transactions on components, packaging and manufacturing technology, Vol.5 (2015), No.12, pp.1793-1801
info:doi/10.1109/TCPMT.2015.2490601
Fraunhofer IZM


Hahn, R.; Möller, K.-C.:
Electrical buffer storage for energy harvesting
Spies, Peter: Handbook of energy harvesting power supplies and applications. Singapore: Pan Stanford Publishing, 2015, pp. 463-514
Fraunhofer IZM
Fraunhofer ICT


Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.:
Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel. (Conference "Optical Interconnects" <15, 2015, San Francisco/Calif.>)
Schröder, H.: Optical Interconnects XV: 9-11 February 2015, San Francisco, California. Bellingham, WA: SPIE, 2015. (Proceedings of SPIE 9368), Paper 93680U
info:doi/10.1117/12.2076254
Fraunhofer IZM


Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Günther, M.; Haag, M.:
Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015: 19-22 April 2015, Budapest, Hungary. Piscataway, NJ: IEEE, 2015, pp. 396-403
info:doi/10.1109/EuroSimE.2015.7103139
Fraunhofer ENAS
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.:
Embedded power modules - a new approach using Power Core and High Power PCB. (International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>)
International Microelectronics and Packaging Society: 11th International Conference and Exhibition on Device Packaging 2015: Fountain Hills, Arizona, USA, 16 - 19 March 2015. Red Hook, NY: Curran, 2015, pp. 369-373
Fraunhofer IZM


Feix, G.; Hoene, E.; Zeiter, O.; Pedersen, K.:
Embedded very fast switching module for SiC power MOSFETs. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2015. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings. Berlin: VDE Verlag, 2015, pp. 104-110
Fraunhofer IZM


Schlomann, Barbara; Eichhammer, Wolfgang; Stobbe, Lutz:
Energy saving potential of information and communication technology
International Journal of Decision Support Systems, Vol.1 (2015), No.2, pp.152-163
info:doi/10.1504/IJDSS.2015.067565
Fraunhofer ISI
Fraunhofer IZM


Stobbe, Lutz; Proske, Marina; Zedel, Hannes; Hintemann, Ralph; Clausen, Jens; Beucker, Severin:
Entwicklung des IKT-bedingten Strombedarfs in Deutschland: Abschlussbericht
Berlin: Fraunhofer IZM, 2015
Fraunhofer IZM


Chancerel, P.; Marwede, M.; Nissen, N.F.; Lang, K.D.:
Estimating the quantities of critical metals embedded in ICT and consumer equipment
Resources, conservation and recycling, Vol.98 (2015), pp.9-18
info:doi/10.1016/j.resconrec.2015.03.003
Fraunhofer IZM


Kaya, Burcu; Kaiser, Jan-Martin; Becker, Karl-Friedrich; Braun, Tanja; Lang, Klaus-Dieter:
Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, 6 pp.
Fraunhofer IZM


Weber, C.; Hutter, M.; Ehrhardt, C.; Lang, K.-D.:
Failure analysis of Ag sintered joints after power cycling under harsh temperature conditions from + 30 deg C up to + 180 deg C. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 191-197
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2014/2015
Berlin: Fraunhofer IZM, 2015
urn:nbn:de:0011-n-3496507
Volltext
Fraunhofer IZM


Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter:
From fan-out wafer to fan-out panel level packaging. (European Conference on Circuit Theory and Design (ECCTD) <2015, Trondheim>)
Institute of Electrical and Electronics Engineers -IEEE-: European Conference on Circuit Theory and Design, ECCTD 2015: 24-26 August 2015, Trondheim, Norway. Piscataway, NJ: IEEE, 2015, 4 pp.
info:doi/10.1109/ECCTD.2015.7300046
Fraunhofer IZM


Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.:
A geometry-independent lifetime modelling method for aluminum heavy wire bond joints. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015: 19-22 April 2015, Budapest, Hungary. Piscataway, NJ: IEEE, 2015, pp. 99-104
info:doi/10.1109/EuroSimE.2015.7103091
Fraunhofer IZM


Böttger, G.; Seifert, S.; Schröder, H.:
Glass-based Manufacturing and Prototyping Platform PhotPack: New concepts for integrating various optical components in actively aligned glass assemblies
Optik & Photonik, Vol.10 (2015), No.3, pp.42-47
info:doi/10.1002/opph.201500017
Fraunhofer IZM


Hutter, M.; Ehrhardt, C.:
Grenzen und Möglichkeiten der Weichlotverbindungen - Betrachtungen von Qualität und Zuverlässigkeit. (Tagung "Weichlöten" <4, 2015, Hanau>)
Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-: Weichlöten 2015. Trends und Entwicklungsschwerpunkte in der Leistungselektronik: Vorträge der gleichnamigen Tagung in Hanau am 24. und 25. März 2015. Düsseldorf: DVS Media, 2015. (DVS-Berichte 310), pp. 101-109
Fraunhofer IZM


Becker, Karl-Friedrich; Georgi, L,; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S., Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.:
Heterogeneous integration of a miniaturized W-band radar module. (International Symposium on Microelectronics <48, 2015, Orlando/Fla.>)
IMAPS Proceedings of the International Symposium on Microelectronics. Online journal, (2015), No.1, Fall, pp.766-770
info:doi/10.4071/isom-2015-THP11
Fraunhofer IZM


Doersam, T.; Schoerle, S.; Spieker, C.; Waldmann, T.; Hoene, E.; Lang, K.-D.:
High frequency impedance of Li-ion batteries. (International Symposium on Electromagnetic Compatibility (EMC) <2015, Dresden>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Vol.1: Joint conference with EMC Europe; Dresden, Germany, 16 - 22 August 2015. Piscataway, NJ: IEEE, 2015, pp. 714-719
info:doi/10.1109/ISEMC.2015.7256251
Fraunhofer IZM


Brusberg, L.; Schröder, H.; Herbst, C.; Frey, C.; Fiebig, C.; Zakharian, A.; Kuchinsky, S.; Liu, X.; Fortusini, D.; Evans, A.:
High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects. (European Conference and Exhibition on Optical Communication (ECOC) <41, 2015, Valencia>)
Institute of Electrical and Electronics Engineers -IEEE-: 41st European Conference on Optical Communication, ECOC 2015. Vol.2: Valencia, Spain, 27 September - 1 October 2015. Piscataway, NJ: IEEE, 2015, pp. 844-846
info:doi/10.1109/ECOC.2015.7341714
Fraunhofer IZM


Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D.:
HIPIMS in full face erosion circular cathode for semiconductor applications. (Electronics Packaging and Technology Conference (EPTC) <17, 2015, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015: 2-4 December 2015, Singapore. Piscataway, NJ: IEEE, 2015, pp. 11-15
info:doi/10.1109/EPTC.2015.7412263
Fraunhofer IZM


Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K.:
Hochauflösende Magnetfeld-Positionssensoren. (MikroSystemTechnik Kongress <6, 2015, Karlsruhe>)
Saile, Volker (Chairman): MEMS, Mikroelemente, Systeme. Proceedings CD-ROM: MikroSystemTechnik Kongress 2015, 26. - 28. Oktober 2015 in Karlsruhe. Berlin: VDE-Verlag, 2015, pp. 146-149
Fraunhofer ISIT
Fraunhofer IZM


Käppler, A.; Windrich, F.; Löder, M.G.J.; Malanin, M.; Fischer, D.; Labrenz, M.; Eichhorn, K.-J.; Voit, B.:
Identification of microplastics by FTIR and Raman microscopy: A novel silicon filter substrate opens the important spectral range below 1300 cm−1 for FTIR transmission measurements
Analytical and bioanalytical chemistry, Vol.407 (2015), No.22, pp.6791-6801
info:doi/10.1007/s00216-015-8850-8
Fraunhofer IZM


Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.:
Improving the lifetime of a 3D radio frequency transceiver by finite element simulations. (Smart Systems Integration Conference (SSI) <2015, Copenhagen>)
Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz: Smart Systems Integration 2015: 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015. Aachen: Apprimus-Verlag, 2015, pp. 469-472
Fraunhofer IZM


Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Influence of humidity on reliability of plastic packages. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, 6 pp.
Fraunhofer IZM


Michels, J.S.; Mödinger, R.; Meier, O.; Baar, C.; Ansorge, F.; Schiefelbein, F.-P.:
Intelligente Steckverbinder und Anschlusstechnologien für die Produktion der Zukunft. (MikroSystemTechnik Kongress <6, 2015, Karlsruhe>)
Saile, Volker (Chairman): MEMS, Mikroelemente, Systeme. Proceedings CD-ROM: MikroSystemTechnik Kongress 2015, 26. - 28. Oktober 2015 in Karlsruhe. Berlin: VDE-Verlag, 2015, pp. 94-95
Fraunhofer IZM


Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong:
Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments. (International Conference on Sensors and Measurement Technology (SENSOR) <17, 2015, Nuremberg>)
Lerch, Reinhard (Vorsitzender): AMA Conferences 2015. Proceedings: SENSOR 2015 and IRS 2 2015; Nuremberg Exhibition Centre, Germany, 19. - 21.5.2015. Nürnberg: AMA Service, 2015, pp. 570-574
info:doi/10.5162/sensor2015/D4.2
Fraunhofer IZM


Brink, M.; Grams, A.; Eichhammer, Y.; Broll, M.; Fritzsch, T.; Lang, K.-D.:
Investigation of room-temperature flip chip connections. (Smart Systems Integration Conference (SSI) <2015, Copenhagen>)
Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz: Smart Systems Integration 2015: 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015. Aachen: Apprimus-Verlag, 2015, pp. 170-177
Fraunhofer IZM


Dudek, R.; Doring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.:
Investigations on power cycling induced fatigue failure of IGBTs with silver sinterea interconnects. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 198-228
Fraunhofer ENAS
Fraunhofer IZM


Dudek, R.; Döring, R.; Rzepka, S.; Ehrhardt, C.; Hutter, M.; Rudzki, J.; Osterwald, F.; Eisele, R.; Stegmeier, S.; Weidner, K.; Rittner, M.:
Investigations on power cycling induced fatigue failure of IGBTs with silver sintered interconnects. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, 8 pp.
Fraunhofer ENAS
Fraunhofer IZM


Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Large area compression molding for Fan-out Panel Level Packing. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.2: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 1077-1083
info:doi/10.1109/ECTC.2015.7159728
Fraunhofer IZM


Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.:
Large Area LED Package. (Conference "Light-Emitting Diodes - Materials, Devices, and Applications for Solid State Lighting" <19, 2015, San Francisco/Calif.>)
Streubel, K.P.: Light-emitting diodes: Materials, devices, and applications for solid state lighting XIX: San Francisco, California, United States, February 07, 2015. Bellingham, WA: SPIE, 2015. (Proceedings of SPIE 9383), Paper 93831A
info:doi/10.1117/12.2079380
Fraunhofer IZM


Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O.:
Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2015. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings. Berlin: VDE Verlag, 2015, pp. 1327-1334
Fraunhofer IZM


Azhdast, M.H.; Lux, O.; Fritsche, H.; Eichler, H.J.; Azdasht, G.; Lüdeke, H.; Glaw, V.; Lang, K.-D.:
Laser melting of metal powders using Nd:yag and compact diode laser for micro particle deposition. (Conference "Advanced Solid State Lasers" (ASSL) <2015, Berlin>)
Optical Society of America -OSA-, Washington/D.C.: Advanced Solid State Lasers 2015: Berlin, Germany, October 4-9, 2015. Washington, DC: OSA, 2015, Paper AM5A.2
info:doi/10.1364/ASSL.2015.AM5A.2
Fraunhofer IZM


Le, L.; Yang, Y.; Radecker, M.:
Low profile LED off-line phase-cut dimming ballast with piezoelectric transformer. (IEEE Industry Applications Society (IAS Annual Meeting) <51, 2015, Addison/Tex.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Industry Application Society, 51st Annual Meeting 2015. Vol.2: Addison, Texas, USA, 18 - 22 October 2015. Piscataway, NJ: IEEE, 2015, pp. 963-966
info:doi/10.1109/IAS.2015.7356873
Fraunhofer IZM


Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.:
μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization. (Workshop on "Materials for Advanced Metallization" (MAM) <23, 2014, Chemnitz>)
Microelectronic engineering, Vol.137 (2015), pp.105-110
info:doi/10.1016/j.mee.2015.01.024
Fraunhofer IZM


Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.:
Material and process trends for moving from FOWLP to FOPLP. (Electronics Packaging and Technology Conference (EPTC) <17, 2015, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015: 2-4 December 2015, Singapore. Piscataway, NJ: IEEE, 2015, pp. 424-429
info:doi/10.1109/EPTC.2015.7412348
Fraunhofer IZM


Jung, Erik; Georgi, Leopold; Kubick, Stefan:
Messvorrichtung und Fluidikvorrichtung zum Messen einer Menge einer zu untersuchenden Substanz
2015
Fraunhofer IZM


Schischke, Karsten; Proske, Marina; Schulz, Gerd; Husemann, Jürgen; Trenner, Torger; Sonnenberg, Thea; Huck, Walter; Kelm, Klaus; Tempel, Norbert; Wunderlich, Peter; Dietrich, Marcus:
Methodology guidance - energy profiles and carbon footprint data for passive components and connectors: Version 1.2
Berlin: Fraunhofer IZM, 2015
urn:nbn:de:0011-n-3349766
Volltext
Fraunhofer IZM


Aschenbrenner, Rolf; Schneider-Ramelow, Martin :
Microelectronic Packaging in the 21st Century: Honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday
Stuttgart: Fraunhofer Verlag, 2015
ISBN 3-8396-0826-0
ISBN 978-3-8396-0826-5
Fraunhofer IZM


Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D.:
Microstructural evolution of ultrasonic-bonded aluminum wires
Microelectronics reliability, Vol.55 (2015), No.6, pp.961-968
info:doi/10.1016/j.microrel.2015.03.002
Fraunhofer IZM


Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D.:
Microstructural evulotion of ultrosonic-bonded aluminum wires
Microelectronics reliability, Vol.55 (2015), No.6, pp.961-968
info:doi/10.1016/j.microrel.2015.03.002
Fraunhofer IZM


Hahn, Robert:
Mikrobatterie und Verfahren zum Herstellen einer Mikrobatterie
2015
Fraunhofer IZM


Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D.:
Modeling method of stray magnetic couplings in an EMC filter for power electronic devices
IEEJ Journal of Industry Applications, Vol.4 (2015), No.6, pp.738-744
info:doi/10.1541/ieejjia.4.738
Fraunhofer IZM


Pitris, S.; Vagionas, C.; Kanellos, G.T.; Pleros, N.; Kisacik, R.; Tekin, T.; Broeke, R.:
Monolithically integrated all-optical SOA-based SR Flip-Flop on InP platform. (International Conference on Photonics in Switching (PS) <2015, Florence>)
International Conference on Photonics in Switching, PS 2015: Florence, Italy, 22-25 September 2015. Piscataway, NJ: IEEE, 2015, pp. 208-210
info:doi/10.1109/PS.2015.7329002
Fraunhofer IZM


Azhdast, M.H.; Azdasht, G.; Lüdeke, H.; Lang, K.-D.; Glaw, V.:
Nano particle production by laser ablation and metal sputtering on Si-wafer substrate. (Conference "Advanced Solid State Lasers" (ASSL) <2015, Berlin>)
Optical Society of America -OSA-, Washington/D.C.: Advanced Solid State Lasers 2015: Berlin, Germany, October 4-9, 2015. Washington, DC: OSA, 2015, Paper AM5A.3
info:doi/10.1364/ASSL.2015.AM5A.3
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.:
Next generation high power electronic modules based on embedded power semiconductors
Advancing microelectronics, Vol.42 (2015), No.1, pp.16-21
Fraunhofer IZM


Woehrmann, M.; Fischer, T.; Walter, H.; Toepper, M.; Lang, K.-D.:
Next generation thin film polymers for WLP applications and their mechanical characterization. (International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>)
International Microelectronics and Packaging Society: 11th International Conference and Exhibition on Device Packaging 2015: Fountain Hills, Arizona, USA, 16 - 19 March 2015. Red Hook, NY: Curran, 2015, pp. 333-337
Fraunhofer IZM


Wunderle, Bernhard; Schulz, M.; Braun, Tanja; May, D.; Bauer, Jörg; Hölck, Ole; Walter, Hans; Keller, J.:
A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.1: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 438-447
info:doi/10.1109/ECTC.2015.7159629
Fraunhofer ENAS
Fraunhofer IZM


Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.:
Numerical modelling in design for reliability of power modules
Bodo's power systems, (2015), No.08, pp.38-39
Fraunhofer IZM


Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H.:
Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz. (Workshop on Signal and Power Integrity (SPI) <19, 2015, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 19th Workshop on Signal and Power Integrity, SPI 2015: 10-13 May 2015, Berlin, Germany. Piscataway, NJ: IEEE, 2015, pp. 86-89
info:doi/10.1109/SaPIW.2015.7237402
Fraunhofer IZM


Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T.:
Photonic millimeter wave transmitter for a real-time coherent wireless link based on injection locking of integrated laser diodes
IEICE Transactions on Electronics, Vol.E98C (2015), No.12, pp.1105-1111
info:doi/10.1587/transele.E98.C.1105
Fraunhofer IZM


Hakansson, A.; Tekin, T.; Brusberg, L.; Pleros, N.; Vyrsokinos, C.; Apostolopoulos, D.; Pitwon, R.; Miller, A.; Wang, Kai; Tulli, D.; Dorrestein, S.; Smink, R.; Tuin, J.; Rijnbach, M. van; Duis, J.:
PhoxTroT - a European initiative toward low cost and low power photonic interconnects for data centres. (International Conference on Transparent Optical Networks (ICTON) <17, 2015, Budapest>)
Jaworski, M.: 17th International Conference on Transparent Optical Networks, ICTON 2015. Vol.1: Budapest, Hungary, 5 - 9 July 2015. Piscataway, NJ: IEEE, 2015, pp. 305-309
info:doi/10.1109/ICTON.2015.7193370
Fraunhofer IZM


Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong:
Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications. (Electronics Packaging and Technology Conference (EPTC) <17, 2015, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015: 2-4 December 2015, Singapore. Piscataway, NJ: IEEE, 2015, pp. 6-10
info:doi/10.1109/EPTC.2015.7412262
Fraunhofer IZM


Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.:
Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Journal of Lightwave Technology, Vol.33 (2015), No.4, pp.741-754
info:doi/10.1109/JLT.2014.2361438
Fraunhofer IZM


Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T.:
Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring. (Smart Systems Integration Conference (SSI) <2015, Copenhagen>)
Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz: Smart Systems Integration 2015: 9th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components, Copenhagen, Denmark, 11 - 12 March 2015. Aachen: Apprimus-Verlag, 2015, pp. 333-340
Fraunhofer IZM
Fraunhofer ENAS


Markey, L.; Zacharatos, F.; Weeber, J.-C.; Prinzen, A.; Waldow, M.; Nielsen, M.G.; Tekin, T.; Dereux, A.:
Recess photomask contact lithography and the fabrication of coupled silicon photonic and plasmonic waveguide switches
Microelectronic engineering, Vol.141 (2015), pp.129-134
info:doi/10.1016/j.mee.2015.02.009
Fraunhofer IZM


Hoffmann, S.; Hoene, E.; Zeiter, O.; Lang, K.-D.; Feix, G.:
Reducing inductor size in high frequency grid feeding inverters. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2015, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2015. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 19 – 21 May 2015; Proceedings. Berlin: VDE Verlag, 2015, pp. 196-203
Fraunhofer IZM


Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D.:
Sea water magnesium fuel cell power supply
Journal of power sources, Vol.288 (2015), pp.26-35
info:doi/10.1016/j.jpowsour.2015.04.119
Fraunhofer IZM


Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.:
Silicon photonics packaging on board-level. (International Photonics Conference (IPC) <28, 2015, Reston/Va.>)
Institute of Electrical and Electronics Engineers -IEEE-: 28th International Photonics Conference, IPC 2015: Reston, Virginia, USA, 4 - 8 October 2015. Piscataway, NJ: IEEE, 2015, pp. 474-475
info:doi/10.1109/IPCon.2015.7323521
Fraunhofer IZM


Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.:
Single-mode board-level interconnects for silicon photonics. (Optical Fiber Communication Conference (OFC) <2015, Los Angeles/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: Optical Fiber Communication Conference 2015. Proceedings: 22 - 26 March 2015, Los Angeles, California, United States. Washington, DC: OSA, 2015. (OSA Technical digest series), Paper W2A.56
info:doi/10.1364/OFC.2015.W2A.56
Fraunhofer IZM


Hahn, R.; Gabler, A.; Thoma, A.; Glaw, F.; Lang, K.D.:
Small fuel cell system with cartridges for controlled hydrogen generation
International journal of hydrogen energy, Vol.40 (2015), No.15, pp.5340-5345
info:doi/10.1016/j.ijhydene.2014.11.080
Fraunhofer IZM


Schreier-Alt, T.; Ansorge, F.; Baar, C.; Radtke, H.; Amende, T.:
Smart Power Mechanics – Elektrische Anschlusstechnologien für Morgen. (Fachtagung "Automotive meets Electronics" (AmE) <6, 2015, Dortmund>)
Wahl, M.: AmE 2015, Automotive meets Electronics. CD-ROM: Beiträge der 6. GMM-Fachtagung vom 24. bis 25. Februar 2015 in Dortmund. Berlin: VDE-Verlag, 2015. (GMM-Fachbericht 82), pp. 68-73
Fraunhofer IZM


Nakano, K.; Herppich, W.B.; Kardjilov, N.; Manke, I.; Hilger, A.; Dawson, M.; Masuda, K.; Hara, Y.; Matsushima, U.:
Structure investigation of soil aggregates treated with different organic matter using X-ray micro tomography
MP materials testing, Vol.57 (2015), No.3, pp.234-238
Fraunhofer IZM


Borchardt, L.; Michels, N.L.; Nowak, T.; Mitchell, S.; Perez-Ramírez, J.:
Structuring zeolite bodies for enhanced heat-transfer properties
Microporous and mesoporous materials, Vol.208 (2015), pp.196-202
info:doi/10.1016/j.micromeso.2015.01.028
Fraunhofer IZM


Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.:
A sub-4 µm via technology of thinfilm polymers using scanning laser ablation. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.1: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 388-395
info:doi/10.1109/ECTC.2015.7159622
Fraunhofer IZM


Jordan, Rafael:
System und Verfahren zur bedarfsgerechten Zuführung von Beleuchtungsenergie an Pflanzen
2015
Fraunhofer IZM


Zoschke, K.; Lang, K.-D.:
Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding. (International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>)
International Microelectronics and Packaging Society: 11th International Conference and Exhibition on Device Packaging 2015: Fountain Hills, Arizona, USA, 16 - 19 March 2015. Red Hook, NY: Curran, 2015, pp. 341-344
Fraunhofer IZM


Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D.:
Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces. (Electronic Components and Technology Conference (ECTC) <65, 2015, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Vol.2: San Diego, California, USA, 26 - 29 May 2015. Piscataway, NJ: IEEE, 2015, pp. 789-798
info:doi/10.1109/ECTC.2015.7159682
Fraunhofer IZM


Schröder, H.; Brusberg, L.:
Thin glass based electro-optical circuit board (EOCB): Waveguide process, PCB technology, and coupling interfaces. (IEEE CPMT Symposium Japan (ICSJ) <2015, Kyoto>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE CPMT Symposium Japan, ICSJ 2015: Kyoto, Japan, 9 - 11 November 2015. Piscataway, NJ: IEEE, 2015, pp. 109-117
info:doi/10.1109/ICSJ.2015.7357373
Fraunhofer IZM


Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.:
Thin wafer handling using mechanical- or laser-debondable temporary adhesives. (International Conference and Exhibition on Device Packaging (DPC) <11, 2015, Fountain Hills/Ariz.>)
International Microelectronics and Packaging Society: 11th International Conference and Exhibition on Device Packaging 2015: Fountain Hills, Arizona, USA, 16 - 19 March 2015. Red Hook, NY: Curran, 2015, pp. 305-307
Fraunhofer IZM


Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X.:
Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
IEEE Transactions on Antennas and Propagation, Vol.63 (2015), No.3, pp.1106-1117
info:doi/10.1109/TAP.2015.2389793
Fraunhofer IZM


Hartmann, S.; Shaporin, A.; Hermann, S.; Bonitz, J.; Heggen, M.; Meszmer, P.; Sturm, H.; Hölck, O.; Blaudeck, T.; Schulz, S.E.; Mehner, J.; Gessner, T.; Wunderle, B.:
Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <16, 2015, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015: 19-22 April 2015, Budapest, Hungary. Piscataway, NJ: IEEE, 2015, pp. 271-278
info:doi/10.1109/EuroSimE.2015.7103119
Fraunhofer IZM
Fraunhofer ENAS


Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Ras, M.A.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Mitova, R.:
Transient thermal management by using double-sided assembling, thermo-electric cooling and phase-change based thermal buffer structures: Design, technology and application. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <21, 2015, Paris>)
Components, Packaging and Manufacturing Technology Society -CPMT-: 21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015: Paris, France, 30 September – 2 October 2015 . Piscataway, NJ: IEEE, 2015, Session 5, Poster 07
info:doi/10.1109/THERMINIC.2015.7389638
Fraunhofer IZM


Seidel, K.; Böttcher, M.; Dobritz, S.; Czernohorsky, M.; Riedel, S.; Weinreich, W.:
Ultra-Thin high density capacitors for advanced packaging solutions. (European Microelectronics and Packaging Conference & Exhibition (EMPC) <20, 2015, Friedrichshafen>)
International Microelectronics and Packaging Society -IMAPS-: 20th European Microelectronics and Packaging Conference & Exhibition, EMPC 2015: Enabling technologies for a better life and future, Friedrichshafen, Germany, 14-16 September 2015. Piscataway, NJ: IEEE, 2015, pp. 24-28
Fraunhofer CNT
Fraunhofer IZM


Rao, S.; Kisacik, R.; Tekin, T.; Casalino, M.; Coppola, G.; Della Corte, F.G.:
Use of amorphous silicon for the design of a photonic crystal based MZ modulator at 1.55µm. (Italian Conference on Photonics Technologies <17, 2015, Turin>)
Institution of Engineering and Technology -IET-: Fotonica AEIT Italian Conference on Photonics Technologies 2015: 17th Edition, Turin, Italy, May 6-8, 2015. London: IET, 2015, 4 pp.
info:doi/10.1049/cp.2015.0149
Fraunhofer IZM


Ehrhardt, Christian; Hutter, M.; Weber, C.; Goullon, L.; Oppermann, H.:
Verbindungstechnologien für erhöhte Einsatztemperaturen mikroelektronischer Anwendungen
Aschenbrenner, Rolf et al.: Microelectronic Packaging in the 21st Century: Honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday. Stuttgart: Fraunhofer Verlag, 2015, pp. 194-199
Fraunhofer IZM


Krüger, Michael; Trampert, Stefan:
Verfahren und Messanordnung zum Überprüfen eines leitfähigen Körpers
2015
Fraunhofer IZM


Middendorf, Andreas; Nowak, Torsten; Janzen, Sergei:
Verfahren zum Bestimmen einer Bondverbindung in einer Bauteilanordnung und Prüfvorrichtung
2015
Fraunhofer IZM


Hisatake, S.; Carpintero, G.; Yoshimizu, Y.; Minamikata, Y.; Oogimoto, K.; Yasuda, Y.; Dijk, F. van; Tekin, T.; Nagatsuma, T.:
W-band coherent wireless link using injection-locked laser diodes
IEEE Photonics Technology Letters, Vol.27 (2015), No.14, pp.1565-1568
info:doi/10.1109/LPT.2015.2432045
Fraunhofer IZM


Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.:
Wafer level packaging for hermetical encapsulation of MEMS resonators. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS <17, 2015, Montpellier>)
Benoit, Charlot et al.: DTIP 2015, 17th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS: 27 - 30 April 2015, Montpellier, France. Piscataway, NJ: IEEE, 2015, pp. 314-319
info:doi/10.1109/DTIP.2015.7161027
Fraunhofer IZM


Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
24"×18" fan-out panel level packing. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 940-946
info:doi/10.1109/ECTC.2014.6897401
Fraunhofer IZM


Orozco, A.; Gagliolo, N.E.; Rowlett, C.; Wong, E.; Moghe, A.; Gaudestad, J.; Talanov, V.; Jeffers, A.; Torkashvan, K.; Wellstood, F.C.; Dobritz, S.; Boettcher, M.; Cawthorne, A.B.; Infante, F.:
3D IC/stacked device fault isolation using 3D magnetic field imaging. (International Symposium for Testing and Failure Analysis (ISTFA) <40, 2014, Houston/Tex.>)
Electronic Device Failure Analysis Society -EDFAS-, Materials Park/Ohio: 40th International Symposium for Testing and Failure Analysis 2014. Conference Proceedings: November 9 - 13, 2014, George R. Brown Convention Center, Houston, Texas, USA. Materials Park, Ohio: ASM International, 2014, pp. 33-37
Fraunhofer IZM


Wolf, M. Jürgen; Lang, Klaus-Dieter:
3D integration: Status and requirements. (Pan Pacific Microelectronics Symposium (PAN PAC) <2014, Kohala Coast/Hawaii>)
Surface Mount Technology Association -SMTA-: Pan Pacific Microelectronics Symposium, PAN PAC 2014: Held 11 - 13 February 2014, Kohala Coast, Hawaii, USA. Red Hook, NY: Curran, 2014, pp. 87-91
Fraunhofer IZM


Wolf, M. Jürgen; Schneider, Peter; Schulz, Stefan; Zschech, Ehrenfried:
3D technology as a holistic approach - quo vadis?: Presentation held at European 3D TSV Summit, Grenoble, France, 21.01.-22.01.2014. (European 3D TSV Summit <2014, Grenoble>)
2014
urn:nbn:de:0011-n-3036624
Volltext
Fraunhofer IZM
Fraunhofer EAS
Fraunhofer ENAS
Fraunhofer IKTS


Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A.:
A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance. (European Conference on Power Electronics and Applications (EPE) <16, 2014, Lappeenranta>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2014. Vol.3: Lappeenranta, Finland, 26 - 28 August 2014. Piscataway, NJ: IEEE, 2014, pp. 2432-2441
info:doi/10.1109/EPE.2014.6910953
Fraunhofer IZM


Tekin, T.; Pleros, N.:
Accelerating data centre performance. Interview
International innovation, (2014), No.124, pp.19
urn:nbn:de:0011-n-3071953
Volltext
Fraunhofer IZM


Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Adhesive-based self-alignment mechanisms for modular stacked microsystems. (Smart Systems Integration Conference (SSI) <2014, Vienna>)
Gessner, T.: Smart Systems Integration 2014: Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Aachen: Apprimus-Verlag, 2014, 8 pp.
Fraunhofer IZM


Jordan, R.C.; Weber, C.; Ehrhardt, C.; Wilke, M.:
Advanced packaging methods for high-power LED modules. (Conference "Light-Emitting Diodes - Materials, Devices, and Applications for Solid State Lighting" <18, 2014, San Francisco/Calif.>)
Streubel, K.P.: Light-emitting diodes: Materials, devices, and applications for solid state lighting XVIII: 4 - 6 February 2014, San Francisco, California, United States. Bellingham, WA: SPIE, 2014. (Proceedings of SPIE 9003), Paper 90030M
info:doi/10.1117/12.2040076
Fraunhofer IZM


Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D.:
Analysis and improvement of a spark plug for less radiated electromagnetic emissions. (International Symposium on Electromagnetic Compatibility (EMC Europe) <2014, Gothenburg>)
Institute of Electrical and Electronics Engineers -IEEE-: International Symposium on Electromagnetic Compatibility, EMC Europe 2014. Vol.1: Gothenburg, Sweden, 1 - 4 September 2014; Proceedings. Piscataway, NJ: IEEE, 2014, pp. 385-390
info:doi/10.1109/EMCEurope.2014.6930937
Fraunhofer IZM


Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D.:
Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH). (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 7-9 April 2014, Ghent , Belgium. Piscataway, NJ: IEEE, 2014, pp. 577-583
info:doi/10.1109/EuroSimE.2014.6813861
Fraunhofer IZM


Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Analysis of wave propagation along coaxial through silicon vias using a matrix method. (Workshop on Signal and Power Integrity (SPI) <18, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 18th Workshop on Signal and Power Integrity, SPI 2014: Ghent, Belgium, 11 - 14 May 2014. Los Alamitos, Calif.: IEEE Computer Society Conference Publishing Services (CPS), 2014, 4 pp.
info:doi/10.1109/SaPIW.2014.6844539
Fraunhofer IZM


Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.:
Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
IEEE transactions on components, packaging and manufacturing technology, Vol.4 (2014), No.3, pp.504-515
info:doi/10.1109/TCPMT.2013.2279688
Fraunhofer IZM


Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Dimitrova, Gergana; Genz, Paul; Lang, Klaus-Dieter:
Ansätze zur stofflichen Verwertung von Tablets aus Sicht des Produktdesigns
Thome-Kozmiensky, K.J.: Recycling und Rohstoffe. Bd.7. Nietwerder: TK Verlag, 2014, pp. 217-230
Fraunhofer IZM


Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D.:
Array fiber welding on micro optical glass substrates for chip-to-fiber coupling. (Conference "Optical Interconnects" <14, 2014, San Francisco/Calif.>)
Schröder, H.: Optical interconnects XIV: 3 - 5 February 2014, San Francisco, California, United States. Bellingham, WA: SPIE, 2014. (Proceedings of SPIE 8991), Paper 89910F, 9 pp.
info:doi/10.1117/12.2041934
Fraunhofer IZM


Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter:
Assessment of high temperature reliability of molded smart power modules. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 203-209
info:doi/10.1109/ESTC.2014.6962863
Fraunhofer IZM


Schörle, S.; Hoene, E.; Lang, K.-D.:
Automotive high voltage grid simulation. Modelling and simulation high voltage car grids from system prospective. (International Symposium on Electromagnetic Compatibility (EMC Europe) <2014, Gothenburg>)
Institute of Electrical and Electronics Engineers -IEEE-: International Symposium on Electromagnetic Compatibility, EMC Europe 2014. Vol.1: Gothenburg, Sweden, 1 - 4 September 2014; Proceedings. Piscataway, NJ: IEEE, 2014, pp. 426-431
info:doi/10.1109/EMCEurope.2014.6930944
Fraunhofer IZM


Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.:
Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1204-1211
info:doi/10.1109/ECTC.2014.6897444
Fraunhofer IZM


Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP). (International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) <9, 2014, Taipei>)
Institute of Electrical and Electronics Engineers -IEEE-: 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014. Proceedings: 22-24 October 2014, Taipei; Challenges of Change - Shaping the Future; held in conjunction with the 16th EMAP, International Conference on Electronics Materials and Packaging. Piscataway, NJ: IEEE, 2014, pp. 154-157
info:doi/10.1109/IMPACT.2014.7048374
Fraunhofer IZM


Grafe, Jürgen; Wahrmund, W.; Dobritz, S.; Wolf, M.J.; Lang, K.-D.:
Challenges in 3D die stacking. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 873-877
info:doi/10.1109/ECTC.2014.6897389
Fraunhofer IZM


Wöhrmann, M.; Fischer, T.; Walter, H.; Töpper, M.; Lang, K.-D.:
Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1421-1426
info:doi/10.1109/ECTC.2014.6897480
Fraunhofer IZM


Stantchev, V.; Colomo-Palacios, R.; Niedermayer, M.:
Cloud computing based systems for healthcare: Editorial
The Scientific World Journal, (2014), Art. 692619, 2 pp.
info:doi/10.1155/2014/692619
Fraunhofer IZM


Ebefors, T.; Fredlund, J.; Jung, E.; Braun, T.:
CMOS biosensor using TSV interposer technology
Advancing microelectronics, Vol.41 (2014), No.3, pp.14-21
Fraunhofer IZM


Brusberg, L.; Queisser, M.; Neitz, M.; Schröder, H.; Lang, K.-D.:
CO2-laser drilling of TGVs for glass interposer applications. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1759-1764
info:doi/10.1109/ECTC.2014.6897536
Fraunhofer IZM


Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter:
Combined Loads and Mechanisms: Presentation held at the ECPE Workshop: Intelligent Reliability Testing; Nürnberg, 02.12. - 03.12.14. (Workshop "Intelligent Reliability Testing" <2014, Nürnberg>)
2014
urn:nbn:de:0011-n-3199964
Volltext
Fraunhofer IZM


Niedermayer, M.:
Commercialization and application-driven economic viability of sensor technology
Hashmi, S.: Comprehensive materials processing. Vol.13: Sensor materials, technologies and applications. Amsterdam: Elsevier, 2014, pp. 149-177
info:doi/10.1016/B978-0-08-096532-1.01305-4
Fraunhofer IZM


Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.:
A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators. (European Frequency and Time Forum (EFTF) <28, 2014, Neuchâtel>)
Institute of Electrical and Electronics Engineers -IEEE-: European Frequency and Time Forum, EFTF 2014: Neuchâtel, Switzerland, 23 - 26 June 2014. Piscataway, NJ: IEEE, 2014, pp. 435-438
info:doi/10.1109/EFTF.2014.7331529
Fraunhofer IZM


Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf:
A critical review of corrosion phenomena in microelectronic systems. (PCIM Europe <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2014. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings. CD-ROM: Nuremberg, 20 – 22 May 2014. Berlin: VDE-Verlag, 2014, pp. 1078-1084
Fraunhofer IZM


Sirbu, B.; Tekin, T.; Pouhe, D.:
Design and simulation of an equiangular spiral antenna for extremely high-frequencies. (European Conference on Antennas and Propagation (EuCAP) <8, 2014, The Hague>)
European Association on Antennas and Propagation -EurAAP-: 8th European Conference on Antennas and Propagation, EuCAP 2014: 6-11 April 2014, The Hague. Piscataway, NJ: IEEE, 2014, pp. 3102-3106
info:doi/10.1109/EuCAP.2014.6902484
Fraunhofer IZM


Vogel, D.; Zschenderlein, U.; Auerswald, E.; Hölck, O.; Ramm, P.; Wunderle, B.; Pufall, R.:
Determination of residual stress with high spatial resolution at TSVs for 3D integration: Comparison between HR-XRD, Raman spectroscopy and fibDAC. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 7-9 April 2014, Ghent , Belgium. Piscataway, NJ: IEEE, 2014, pp. 618-625
info:doi/10.1109/EuroSimE.2014.6813868
Fraunhofer ENAS
Fraunhofer EMFT
Fraunhofer IZM


Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter:
Development of a high density glass interposer based on wafer level packaging technologies. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1498-1503
info:doi/10.1109/ECTC.2014.6897492
Fraunhofer IZM


Brusberg, L.; Manessis, D.; Neitz, M.; Schild, B.; Schröder, H.; Tekin, T.; Lang, K.-D.:
Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 340-344
info:doi/10.1109/ESTC.2014.6962733
Fraunhofer IZM


Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter:
Development of process and design criteria for stress management in through silicon vias. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 625-630
info:doi/10.1109/ECTC.2014.6897351
Fraunhofer IZM


Schischke, Karsten; Stobbe, Lutz; Dimitrova, Gergana; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.:
Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version July 2014
Berlin: Fraunhofer IZM, 2014
urn:nbn:de:0011-n-2986729
Volltext
Fraunhofer IZM


Wunderle, B.; Springborn, M.; May, D.; Manier, C.-A.; Abo Ras, M.; Mrossko, R.; Oppermann, H.; Xhonneux, T.; Caroff, T.; Maurer, W.; Mitova, R.:
Double-sided cooling and transient thermo-electrical management of silicon on DCB assemblies for power converter modules: Design, technology and test. (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <14, 2014, Lake Buena Vista/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2014. Vol.2: Lake Buena Vista, Orlando, Florida, USA, 27 - 30 May 2014. Piscataway, NJ: IEEE, 2014, pp. 851-861
info:doi/10.1109/ITHERM.2014.6892370
Fraunhofer ENAS
Fraunhofer IZM


Niedermayer, M.; Hoherz, C.; Reinhardt, D.; Scholtz, H.; Benecke, S.; Middendorf, A.:
Drahtlose Tiefendiagnose: Energieautarke Funksensorik für Condition-Monitoring-Anwendungen
wt Werkstattstechnik online, Vol.104 (2014), No.7-8, pp.502-504
Fraunhofer IZM


Krüger, Michael; Trampert, Stefan; Middendorf, Andreas; Schmitz, Stefan; Lang, Klaus-Dieter:
Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 114-118
urn:nbn:de:0011-n-3159321
info:doi/10.1109/ECTC.2014.6897275
Volltext
Fraunhofer IZM


Nissen, Nils F.; Stobbe, Lutz; Faninger, Thibault; Berwald, Anton; Lang, Klaus-Dieter:
Ecodesign Requirements for servers - from single product groups to extended system approach. (Conference "Going Green - CARE INNOVATION" <10, 2014, Vienna>)
Österreichische Gesellschaft für System- und Automatisierungstechnik -SAT-: Going Green - CARE INNOVATION 2014. Proceedings. CD-ROM: November 17-20, 2014, Vienna. Vienna, 2014
urn:nbn:de:0011-n-3159330
Volltext
Fraunhofer IZM


Brusberg, L.; Schröder, H.; Pitwon, R.; Whalley, S.; Miller, A.; Herbst, C.; Röder, J.; Weber, D.; Lang, K.-D.:
Electro-optical backplane demonstrator with gradient-index multimode glass waveguides for board-to-board interconnection. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1033-1041
info:doi/10.1109/ECTC.2014.6897415
Fraunhofer IZM


Junk, S.; Hoene, E.:
Electromagnetic robustness validation for gate drivers. (International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2014. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings. CD-ROM: Nuremberg, 20 – 22 May 2014. Berlin: VDE-Verlag, 2014, 7 pp.
Fraunhofer IZM


Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.:
Embedding of power semiconductors for innovative packages and modules. (Surface Mount Technology Association (SMTA International Conference) <2014, Rosemont/Ill.>)
Surface Mount Technology Association -SMTA-: SMTA International conference 2014: Rosemont, Illinois, USA, 28 September - 2 October 2014; Proceedings of the technical program; including the Evolving Technologies Summit, the Harsh Environments Symposium, and the Lead-Free Soldering Technology Symposium. Red Hook, NY: Curran, 2014, pp. 222-228
Fraunhofer IZM


Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter:
Establishing ecoreliability of electronic devices in manufacturing environments. (Global Conference on Sustainable Manufacturing (GCSM) <12, 2014, Johor Bahru/Malaysia>)
Procedia CIRP, Vol.26 (2014), pp.436–442
urn:nbn:de:0011-n-3200003
info:doi/10.1016/j.procir.2014.07.063
Volltext
Fraunhofer IZM


Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.:
Evaluation and signal conditioning of piezoresistive silicon pressure sensor. (International Conference on Sensors Instrument and Information Technology (ICSIIT) <2014, Guangzhou>)
Yarlagadd, P.: Advances in Measurements and Information Technologies: International Conference on Sensors Instrument and Information Technology, ICSIIT 2014, held in Guangzhou, on 18-19 January 2014. Dürnten: Trans Tech Publications, 2014. (Applied mechanics and materials 530-531), pp. 28-32
info:doi/10.4028/www.scientific.net/AMM.530-531.28
Fraunhofer IZM


Brusberg, L.; Neitz, M.; Schröder, H.; Fricke-Begemann, T.; Ihlemann, J.:
Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application. (Conference "Optical Interconnects" <14, 2014, San Francisco/Calif.>)
Schröder, H.: Optical interconnects XIV: 3 - 5 February 2014, San Francisco, California, United States. Bellingham, WA: SPIE, 2014. (Proceedings of SPIE 8991), Paper 89910H, 10 pp.
info:doi/10.1117/12.2040169
Fraunhofer IZM


Braun, Tanja; Becker, Karl-Friedrich; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Fan-out wafer level packaging for MEMS and sensor applications. (Fachtagung Sensoren und Messsysteme <17, 2014, Nürnberg>)
Informationstechnische Gesellschaft -ITG-: Sensoren und Messsysteme 2014. CD-ROM: Beiträge der 17. ITG/GMA-Fachtagung vom 3. bis 4. Juni 2014 in Nürnberg. Berlin: VDE Verlag, 2014. (ITG-Fachberichte 250), 5 pp.
Fraunhofer IZM


Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.:
Flip chip assembly of thinned chips for hybrid pixel detector applications. (International Workshop on Radiation Imaging Detectors (IWORID) <15, 2013, Paris>)
Journal of Instrumentation, Vol.9 (2014), No.5, Art. C05039, 10 pp.
info:doi/10.1088/1748-0221/9/05/C05039
Fraunhofer IZM


Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O.:
Fracture mechanics in new designed power module under thermo-mechanical loads. (International Symposium on Fatigue Design & Material Defects" (FDMD) <2, 2014, Paris>)
Buffière, J.Y.: Fatigue Design & Material Defects, FDMD II - JIP 2014: 14th International Spring Meeting - SF2M Commission Fatigue, Paris, June 11-13 2014. Les Ulis: EDP Sciences, 2014. (MATEC Web of Conferences 12.2014), Art. 04015, 3 pp.
info:doi/10.1051/matecconf/20141204015
Fraunhofer IZM


Wolf, M. Jürgen; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried:
Fraunhofer cluster 3D integration. (Pan Pacific Microelectronics Symposium (PAN PAC) <2014, Kohala Coast/Hawaii>)
Surface Mount Technology Association -SMTA-: Pan Pacific Microelectronics Symposium, PAN PAC 2014: Held 11 - 13 February 2014, Kohala Coast, Hawaii, USA. Red Hook, NY: Curran, 2014, pp. 297-301
Fraunhofer IZM
Fraunhofer ENAS
Fraunhofer EAS
Fraunhofer IKTS


Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried:
Fraunhofer cluster 3D integration - key to a holistic technology and service approach. (Smart Systems Integration Conference (SSI) <2014, Vienna>)
Gessner, T.: Smart Systems Integration 2014: Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Aachen: Apprimus-Verlag, 2014, pp. 599-602
Fraunhofer EAS IA 6.9 / 1467 <2014>
Fraunhofer IZM
Fraunhofer ENAS
Fraunhofer IKTS


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2013/2014
Berlin: Fraunhofer IZM, 2014
urn:nbn:de:0011-n-2891309
Volltext
Fraunhofer IZM


Nissen, Nils; Stobbe, Lutz; Lang, Klaus-Dieter:
German Technology Research Program „IT2Green“: Presentation held at the 5th Arab-German Energy Forum, November 13th-14th, 2014, Hotel Adlon Kempinski Berlin Berlin, Germany. (Arab-German Energy Forum <5, 2014, Berlin>)
2014
urn:nbn:de:0011-n-3200010
Volltext
Fraunhofer IZM


Pennicard, D.; Struth, B.; Hirsemann, H.; Sarajlic, M.; Smoljanin, S.; Zuvic, M.; Lampert, M.O.; Fritzsch, T.; Rothermund, M.; Graafsma, H.:
A germanium hybrid pixel detector with 55μm pixel size and 65,000 channels
Journal of Instrumentation, Vol.9 (2014), Art. P12003
info:doi/10.1088/1748-0221/9/12/P12003
Fraunhofer IZM


Hahn, Robert; Krebs, Martin; Schmalz, Michael:
Große H2-Zelle mit innenliegenden Kathoden in Form von Taschen
2014
Fraunhofer IZM


Middendorf, Andreas; Lang, Klaus-Dieter:
Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process Control. (International Symposium on Microelectronics <47, 2014, San Diego/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: 47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging: San Diego, 13.-16.10.2014. San Diego/Calif., 2014, pp. 361-366
Fraunhofer IZM


Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschläger, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, Th.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.:
High temperature electronics for LED-lighting architectures (European SEEL Project: Solution for energy efficient lighting)
Advancing microelectronics, Vol.41 (2014), No.5, pp.22-29
Fraunhofer IZM


Viehweger, Kay; Weichart, J.; Elghazzali, M.; Reynolds, G.J.; Wolf, M.J.; Lang, K.-D.; Koller, A.; Dill, A.:
Highly ionized sputter deposition into through silicon vias with aspect ratios up to 15:1. (Smart Systems Integration Conference (SSI) <2014, Vienna>)
Gessner, T.: Smart Systems Integration 2014: Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Aachen: Apprimus-Verlag, 2014, pp. 59-66
Fraunhofer IZM


Zamora, V.; Lützow, P.; Weiland, M.; Pergande, D.; Schröder, H.:
Highly sensitive integrated optical biosensors. (Conference "Frontiers in Biological Detection - From Nanosensors to Systems" <6, 2014, San Francisco/Calif.>)
Miller, B.L.: Frontiers in biological detection: from nanosensors to systems VI: 1 - 2 February 2014, San Francisco, California, United States. Bellingham, WA: SPIE, 2014. (Proceedings of SPIE 8933), Paper 893307, 7 pp.
info:doi/10.1117/12.2039676
Fraunhofer IZM
Fraunhofer HHI


Tekin, T.; Pleros, N.:
An holistic approach to optical interconnects in data centres
International innovation, (2014), No.124, pp.20-21
urn:nbn:de:0011-n-3071979
Volltext
Fraunhofer IZM


Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter:
Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System-Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 431-435
info:doi/10.1109/ESTC.2014.6962750
Fraunhofer IZM


Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter:
Improving the FE simulation of molded packages using warpage measurements. (European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <25, 2014, Berlin>)
Microelectronics reliability, Vol.54 (2014), No.9-10, pp.1862–1866
info:doi/10.1016/j.microrel.2014.07.156
Fraunhofer IZM


Schulz, M.; Sheva, S.; Walter, H.; Mroßko, R.; Yang, G.; Keller, J.; Wunderle, B.:
In situ monitoring of interface delamination by the 3ω-method. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <20, 2014, London>)
Institute of Electrical and Electronics Engineers -IEEE-: 20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014: September 24 - 26, 2014, Greenwich, London. Piscataway, NJ: IEEE, 2014, 8 pp.
info:doi/10.1109/THERMINIC.2014.6972529
Fraunhofer IZM


Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter:
Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <7, 2014, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2014: Von Hochstrom bis Hochintegration; Vorträge der 7. DVS/GMM-Tagung in Fellbach am 11. und 12. Februar 2014. Düsseldorf: DVS Media, 2014. (DVS-Berichte 301), pp. 202-209
Fraunhofer IZM


Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.:
The influence of liners with Ti, Ta or Ru finish on thin Cu films. (European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) <25, 2014, Berlin>)
Microelectronics reliability, Vol.54 (2014), No.9-10, pp.1877-1882
info:doi/10.1016/j.microrel.2014.07.121
Fraunhofer IZM


Lupberger, M.; Bilevych, J.; Desch, K.; Fischer, T.; Fritzsch, T.; Kaminski, J.; Kohl, K.; Rogowski, M.; Tomtschak, J.; Graaf, H. van der:
InGrid: Pixelated Micromegas detectors for a Pixel-TPC
International Union of Pure and Applied Physics -IUPAP-: 3rd Technology and Instrumentation in Particle Physics Conference, TIPP 2014. Proceedings. Online resource: 2-6 June 2014, Amsterdam, the Netherlands. Amsterdam, 2014. (Proceedings of Science 225), 9 pp.
Fraunhofer IZM


Neeb, C.; Boettcher, L.; Conrad, M.; Doncker, R.W. de:
Innovative and reliable power modules: A future trend and evolution of technologies
IEEE Industrial Electronics Magazine, Vol.8 (2014), No.3, pp.6-16
info:doi/10.1109/MIE.2014.2304313
Fraunhofer IZM


Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.:
Investigating wire bonding pull testing and its calculation basics. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 493-497
info:doi/10.1109/ESTC.2014.6962766
Fraunhofer IZM


Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelow, M.:
Korrosion in ENIG-Schichtsystemen. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <7, 2014, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2014: Von Hochstrom bis Hochintegration; Vorträge der 7. DVS/GMM-Tagung in Fellbach am 11. und 12. Februar 2014. Düsseldorf: DVS Media, 2014. (DVS-Berichte 301), pp. 210-241
Fraunhofer IZM


Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter:
Korrosionsphänomene im mikroelektronischen System
Produktion von Leiterplatten und Systemen : PLUS, Vol.16 (2014), No.5, pp.1067-1072
Fraunhofer IZM


Arranz, Pol; Anzizu, Maria; Vallvé, Xavier; Schischke, Karsten; Helmy, Mohamed; Alonso, Juan Carlos; Rodrigo, Julio:
LCA to go for PV systems: Analysis tool for optimized PV design and green marketing. (Conference "Going Green - CARE INNOVATION" <10, 2014, Vienna>)
Österreichische Gesellschaft für System- und Automatisierungstechnik -SAT-: Going Green - CARE INNOVATION 2014. Proceedings. CD-ROM: November 17-20, 2014, Vienna. Vienna, 2014
urn:nbn:de:0011-n-3159344
Volltext
Fraunhofer IZM


Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.:
A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS). (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1321-1327
info:doi/10.1109/ECTC.2014.6897463
Fraunhofer IZM


Hubl, M.; Blechert, M.; Engelhardt, M.; Jung, E.; Lang, K.D.:
Lensless live cell imaging with thermoelectric cooled cell-microscope. (Deutsche Gesellschaft für Biomedizinische Technik (DGBMT Jahrestagung) <48, 2014, Hannover>)
Biomedizinische Technik, Vol.59 (2014), No. S1, pp.S577-S578
Fraunhofer IZM


Ospina, Jose Luis; Maher, Paul; Schischke, Karsten:
Life Cycle Assessment as a practical tool in the eco-design and promotion of eco-innovative electronics - the case of the IAMECO computers. (Conference "Going Green - CARE INNOVATION" <10, 2014, Vienna>)
Österreichische Gesellschaft für System- und Automatisierungstechnik -SAT-: Going Green - CARE INNOVATION 2014. Proceedings. CD-ROM: November 17-20, 2014, Vienna. Vienna, 2014
urn:nbn:de:0011-n-3159350
Volltext
Fraunhofer IZM


Brusberg, L.; Herbst, C.; Neitz, M.; Schröder, H.; Lang, K.-D.:
Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology. (European Conference on Optical Communication (ECOC) <40, 2014, Cannes>)
Institute of Electrical and Electronics Engineers -IEEE-: European Conference on Optical Communication, ECOC 2014. Vol.2: Cannes, France, 21 - 25 September 2014. Piscataway, NJ: IEEE, 2014, pp. 1301-1303
info:doi/10.1109/ECOC.2014.6964253
Fraunhofer IZM


Windrich, Frank; Malanin, Mikhail; Eichhorn, Klaus-Jochen; Voit, Brigitte; Lang, Klaus-Dieter:
Low-temperature photosensitive polyimide processing for use in 3D integration technologies. (Materials Research Society (Spring Meeting) <2014, San Francisco/Calif.>)
MRS online proceedings library. Online resource, Vol.1692 (2014)
info:doi/10.1557/opl.2014.520
Fraunhofer IZM


Grabbert, N.; Wang, B.; Avnon, A.; Zhuo, S.; Datsyuk, V.; Trotsenko, S.; Mackowiak, P.; Kaletta, K.; Lang, K.-D.; Ngo, H.-D.:
Mechanical properties of individual composite poly(methyl-methacrylate) -multiwalled carbon nanotubes nanofibers. (International Conference on Structural Nano Composites (NANOSTRUC) <2, 2014, Madrid>)
Institute of Physics -IOP-, London: 2nd International Conference on Structural Nano Composites, NANOSTRUC 2014: 20-21 May 2014, Madrid, Spain. Bristol: IOP Publishing, 2014. (IOP conference series. Materials science and engineering 64), Art. 012005, 7 pp.
info:doi/10.1088/1757-899X/64/1/012005
Fraunhofer IZM


Manessis, D.; Karaszkiewicz, S.; Kierdorf, J.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.:
A "microSD" sized RF transceiver manufactured as an embedded system-in-package. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 396-401
info:doi/10.1109/ESTC.2014.6962744
Fraunhofer IZM


Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Lang, Klaus-Dieter:
Microstructural and mechanical analyses of Ag sintered joints. (PCIM Europe <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2014. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings. CD-ROM: Nuremberg, 20 – 22 May 2014. Berlin: VDE-Verlag, 2014, pp. 1085-1092
Fraunhofer IZM


Hahn, Daniel; Straube, Stefan; Abelein, Ulrich; Middendorf, Andreas; Lang, Klaus-Dieter:
Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors. (Electronic Circuit World Convention (ECWC) <13, 2014, Nürnberg>)
European Institute of Printed Circuits -EIPC-: Connecting the world. Proceedings. CD-ROM: ECWC13, 13th Electronic Circuits World Convention, 7 – 9 May 2014, Nuremberg, Germany. Berlin: VDE-Verlag, 2014, 4 pp.
urn:nbn:de:0011-n-3159369
Volltext
Fraunhofer IZM


Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.:
Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding. (Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) <14, 2014, Newport Beach/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2014: 19-23 January 2014, Newport Beach, California. Piscataway, NJ: IEEE, 2014, pp. 83-85
info:doi/10.1109/SiRF.2014.6828523
Fraunhofer IZM


Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.:
A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Journal of microelectronics and electronic packaging, Vol.11 (2014), No.3, pp.115-121
info:doi/10.4071/imaps.421
Fraunhofer IZM


Masuzawa, T.; Hoene, E.; Hoffmann, S.; Lang, K.-D.:
Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter. (International Power Electronics Conference (IPEC) <7, 2014, Hiroshima>)
Institute of Electrical and Electronics Engineers -IEEE-: International Power Electronics Conference, IPEC-Hiroshima 2014 - ECCE-Asia. Vol.3: Hiroshima, Japan, 18 - 21 May 2014. Piscataway, NJ: IEEE, 2014, pp. 2366-2371
info:doi/10.1109/IPEC.2014.6869920
Fraunhofer IZM


Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D.:
Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 7-9 April 2014, Ghent , Belgium. Piscataway, NJ: IEEE, 2014, 6 pp.
info:doi/10.1109/EuroSimE.2014.6813828
Fraunhofer IZM


Hartmann, S.; Hölck, O.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.:
Molecular dynamic simulations of maximum pull-out forces of embedded CNTs for sensor applications and validating nano scale experiments. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 7-9 April 2014, Ghent , Belgium. Piscataway, NJ: IEEE, 2014, pp. 380-385
info:doi/10.1109/EuroSimE.2014.6813830
Fraunhofer IZM
Fraunhofer ENAS


Oppermann, Hermann; Dietrich, Lothar; Weber, Constanze; Ziedorn, Morten; Aschenbrenenr, Rolf:
Nanoporous gold bumps for thermocompression bonding. (International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) <4, 2014, Tokyo>)
Suga, T.: 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. Proceedings: 15-16 July 2014, Tokyo, Japan. Piscataway, NJ: IEEE, 2014, pp. 61
Fraunhofer IZM


Karlsson, C.; Cavero, P.; Tekin, T.; Pouhè, D.:
A new broadband antenna for satellite communications. (Topical Conference on Antennas and Propagation in Wireless Communications (APWC) <4, 2014, Palm Beach>)
IEEE: IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications, APWC 2014. Proceedings: 3-9 August 2014, Palm Beach. Piscataway, NJ: IEEE, 2014, pp. 800-803
info:doi/10.1109/APWC.2014.6905588
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.:
Next generation high power electronic module based on embedded power semiconductors. (International Conference and Exhibition on Device Packaging <10, 2014, Scottsdale/Ariz.>)
International Conference and Exhibition on Device Packaging 2014: Scottsdale, Arizona, USA, 10-13 March 2014. Red Hook, NY: Curran, 2014, pp. 122-126
Fraunhofer IZM


Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D.:
Next Generation Substrates - wie elektronische Systeme maskenlos gedruckt werden. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <7, 2014, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2014: Von Hochstrom bis Hochintegration; Vorträge der 7. DVS/GMM-Tagung in Fellbach am 11. und 12. Februar 2014. Düsseldorf: DVS Media, 2014. (DVS-Berichte 301), pp. 241-244
Fraunhofer IZM


Wong, C.S.; Bennett, N.S.; Manessis, D.; Danilewsky, A.; McNally, P.J.:
Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages
Microelectronic engineering, Vol.117 (2014), pp.48-56
info:doi/10.1016/j.mee.2013.12.020
Fraunhofer IZM


Schischke, Karsten:
Ökodesign von Unterhaltungselektronik und IKT - Beispiele und Denkanstöße: Vortrag gehalten bei der ETV Donnerstagslektion, Berlin, 8.5.2014
2014
urn:nbn:de:0011-n-2906172
Volltext
Fraunhofer IZM


Feix, G.; Hutter, M.; Hoene, E.; Lang, K.-D.:
On double sided cooling. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 289-294
info:doi/10.1109/ESTC.2014.6962724
Fraunhofer IZM


Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. (International Conference on Materials for Advanced Technologies (ICMAT) <7, 2013, Singapore>)
Microelectronics reliability, Vol.54 (2014), No.6-7, pp.1223-1227
info:doi/10.1016/j.microrel.2014.02.018
Fraunhofer ENAS
Fraunhofer IZM


Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.:
On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach. (International Symposium on Electromagnetic Compatibility (EMC) <2014, Raleigh/NC>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Symposium on Electromagnetic Compatibility, EMC 2014. Proceedings: 4-8 August 2014, Raleigh, North Carolina. Piscataway, NJ: IEEE, 2014, pp. 491-495
info:doi/10.1109/ISEMC.2014.6899022
Fraunhofer IZM


Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.:
Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads. (International Symposium on Electromagnetic Compatibility (EMC) <2014, Raleigh/NC>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Symposium on Electromagnetic Compatibility, EMC 2014. Proceedings: 4-8 August 2014, Raleigh, North Carolina. Piscataway, NJ: IEEE, 2014, pp. 234-239
info:doi/10.1109/ISEMC.2014.6898976
Fraunhofer IZM


Oppermann, Hermann:
Optisches Kopplungssystem mit einem optischen Koppler und einem lichtdurchlässigen äußeren Medium sowie Herstellung und Verwendung eines solchen Systems
2014
Fraunhofer IZM


Klein, K.; Hoene, E.; Lang, K.-D.:
Packages for fast switching HV GaN power devices. (PCIM Europe <2014, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2014. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. Proceedings. CD-ROM: Nuremberg, 20 – 22 May 2014. Berlin: VDE-Verlag, 2014, 8 pp.
Fraunhofer IZM


Hoene, E.; Ostmann, A.; Marczok, C.:
Packaging very fast switching semiconductors. (International Conference on Integrated Power Electronics Systems (CIPS) <8, 2014, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2014, 8th International Conference on Integrated Power Electronics Systems. Proceedings: February, 25-27, 2014 Nuremberg/Germany. Berlin: VDE-Verlag, 2014. (ETG-Fachbericht 141), pp. 502-508
Fraunhofer IZM


Wunderle, B.; Springborn, M.; May, D.; Mrossko, R.; Abo Ras, M.; Manier, C.-A.; Oppermann, H.; Mitova, R.:
Phase change based thermal buffering of transient loads for power converter. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <20, 2014, London>)
Institute of Electrical and Electronics Engineers -IEEE-: 20th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2014: September 24 - 26, 2014, Greenwich, London. Piscataway, NJ: IEEE, 2014, 7 pp.
info:doi/10.1109/THERMINIC.2014.6972516
Fraunhofer ENAS
Fraunhofer IZM


Tekin, T.; Pleros, N.; Apostolopoulos, D.:
Photonic interconnects for data centers. (Optical Fiber Communications Conference and Exhibition (OFC) <2014, San Francisco/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: Optical Fiber Communications Conference and Exhibition, OFC 2014. Vol.1: San Francisco, California, USA, 9 - 13 March 2014. Piscataway, NJ: IEEE, 2014, pp. 480-482
info:doi/10.1364/OFC.2014.Th1D.6
Fraunhofer IZM


Tekin, T.; Hakansson, A.; Pleros, N.; Apostolopoulos, D.:
Photonic interconnects for data centers. (International Symposium on Microelectronics <47, 2014, San Diego/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: 47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging: San Diego, 13.-16.10.2014. San Diego/Calif., 2014, pp. 862-865
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.:
Power electronics packages with embedded components - recent trends and developments
Printed circuit design & fab, Vol.31 (2014), No.5, pp.54-60
Fraunhofer IZM


Becker, K.-F.; Koch, M.; Voges, S.; Thomas, T.; Fliess, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Precision jetting of solder paste - a versatile tool for small volume production. (International Symposium on Microelectronics <47, 2014, San Diego/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: 47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging: San Diego, 13.-16.10.2014. San Diego/Calif., 2014, pp. 438-443
Fraunhofer IZM


Hoffmann, S.; Hoene, E.; Lang, K.-D.:
Predicting magnetic coupling of power inductors. (International Symposium on Electromagnetic Compatibility (EMC Europe) <2014, Gothenburg>)
Institute of Electrical and Electronics Engineers -IEEE-: International Symposium on Electromagnetic Compatibility, EMC Europe 2014. Vol.1: Gothenburg, Sweden, 1 - 4 September 2014; Proceedings. Piscataway, NJ: IEEE, 2014, pp. 223-228
info:doi/10.1109/EMCEurope.2014.6930907
Fraunhofer IZM


Wróblewski, G.; Sloma, M.; Kallmayer, C.; Marques, J.; Haberland, J.; Janczak, D.; Jakubowska, M.:
Printed electroluminescent structures for smart cards. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 619-623
info:doi/10.1109/ESTC.2014.6962820
Fraunhofer IZM


Schreier-Alt, T.; Ansorge, F.; Chmiel, G.; Lang, K.-D.:
Prozessoptimierung und Produktprüfung von QFN-Bauteilen mit dem iForce-Stressmesschip. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <7, 2014, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2014: Von Hochstrom bis Hochintegration; Vorträge der 7. DVS/GMM-Tagung in Fellbach am 11. und 12. Februar 2014. Düsseldorf: DVS Media, 2014. (DVS-Berichte 301), pp. 148-153
Fraunhofer IZM


Hartmann, S.; Blaudeck, T.; Hölck, O.; Hermann, S.; Schulz, S.E.; Gessner, T.; Wunderle, B.:
Quantitative in-situ scanning electron microscope pull-out experiments and molecular dynamics simulations of carbon nanotubes embedded in palladium
Journal of applied physics, Vol.115 (2014), No.14, Art.144301, 9 pp.
info:doi/10.1063/1.4870871
Fraunhofer IZM
Fraunhofer ENAS


Schreier-Alt, T.; Heimerle, D.; Ring, K.; Möhler, A.; Baar, C.; Ansorge, F.:
Raffungsmodelle für die Qualifikation von Einpresskontakten für Leiterplatten
Produktion von Leiterplatten und Systemen : PLUS, (2014), No.6, pp.1288-1298
Fraunhofer IZM


Schima, Mario; Wagenitz, K.; Wendling, R.; Grafe, J.; Wiesbauer, H.; Uhrmann, T.; Wolf, M.J.; Lang, K.-D.:
Recent results and developments in temporary wafer bonding and –debonding on 300mm leading edge tools. (Smart Systems Integration Conference (SSI) <2014, Vienna>)
Gessner, T.: Smart Systems Integration 2014: Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Aachen: Apprimus-Verlag, 2014, pp. 565-567
Fraunhofer IZM


Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg:
Reliability assessment of molded smart power modules. (International Conference on Integrated Power Electronics Systems (CIPS) <8, 2014, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2014, 8th International Conference on Integrated Power Electronics Systems. Proceedings: February, 25-27, 2014 Nuremberg/Germany. Berlin: VDE-Verlag, 2014. (ETG-Fachbericht 141), pp. 55-62
Fraunhofer IZM


Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.:
Reliability improvements in electronic systems by combining condition monitoring approaches. (International Conference on Electronics Packaging (ICEP) <2014, Toyama>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Electronics Packaging, ICEP 2014: 23-25 April 2014, Toyama, Japan. Piscataway, NJ: IEEE, 2014, pp. 511-516
urn:nbn:de:0011-n-3016497
info:doi/10.1109/ICEP.2014.6826732
Volltext
Fraunhofer IZM


Hefer, Jan; Rojahn, Johannes:
Sensorsystem zum Überwachen eines Objekts
2014
Fraunhofer IZM


Steller, Wolfram; Meinecke, C.; Gottfried, Knut; Woldt, Gregor; Günther, W.; Wolf, M. Jürgen; Lang, Klaus-Dieter:
SIMEIT-project: High precision inertial sensor integration on a modular 3D-interposer platform. (Electronic Components and Technology Conference (ECTC) <64, 2014, Orlando/Fla.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 64th Electronic Components and Technology Conference, ECTC 2014: 27-30 May 2014, Orlando, Florida, USA. Piscataway, NJ: IEEE, 2014, pp. 1218-1225
info:doi/10.1109/ECTC.2014.6897446
Fraunhofer IZM
Fraunhofer ENAS


Schröder, H.; Brusberg, L.; Böttger, G.:
Strategies for glass based photonic system integration. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 333-339
info:doi/10.1109/ESTC.2014.6962732
Fraunhofer IZM


Löher, T.; Ostmann, A.; Seckel, M.:
Stretchable and deformable electronic systems in thermoplastic matrix materials. (IEEE CPMT Symposium Japan (ICSJ) <2014, Kyoto>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE CPMT Symposium Japan, ICSJ 2014: "Packaging for future optoelectronics, RF/hig-speed electronics and bioelectronics", 4-6 November 2014, Kyoto. Piscataway, NJ: IEEE, 2014, pp. 177-181
info:doi/10.1109/ICSJ.2014.7009639
Fraunhofer IZM


Fitzpatrick, C.; Hickey, S.; Schischke, K.; Maher, P.:
Sustainable life cycle engineering of an integrated desktop PC: A small to medium enterprise perspective
Journal of cleaner production, Vol.74 (2014), pp.155-160
info:doi/10.1016/j.jclepro.2014.03.042
Fraunhofer IZM


Schoerle, S.; Hoene, E.; Hoffmann, S.; Kuczmik, A.; Lang, K.-D.:
System simulation of automotive high voltage grids: Modelling of power converters and connecting cables. (Vehicle Power and Propulsion Conference (VPPC) <2014, Coimbra>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Vehicle Power and Propulsion Conference, VPPC 2014: 27-30 October 2014, Coimbra. Piscataway, NJ: IEEE, 2014, 6 pp.
info:doi/10.1109/VPPC.2014.7007141
Fraunhofer IZM


Dimitrova, Gergana; Nissen, Nils; Stobbe, Lutz; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter:
Tablet PCs through the lens of environment - design trends and impacts on the environmental performance. (Conference "Going Green - CARE INNOVATION" <10, 2014, Vienna>)
Österreichische Gesellschaft für System- und Automatisierungstechnik -SAT-: Going Green - CARE INNOVATION 2014. Proceedings. CD-ROM: November 17-20, 2014, Vienna. Vienna, 2014
urn:nbn:de:0011-n-3159392
Volltext
Fraunhofer IZM


Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D.:
Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding. (Electronics Packaging Technology Conference (EPTC) <16, 2014, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 16th Electronics Packaging Technology Conference, EPTC 2014. Proceedings: 3-5 December 2014, Singapore. Singapore: Research Publishing, 2014, pp. 209-214
info:doi/10.1109/EPTC.2014.7028324
Fraunhofer IZM


Springborn, M.; Wunderle, B.; May, D.; Mrossko, R.; Manier, C.-A.; Oppermann, H.; Ras, M.A.; Mitova, R.:
Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <15, 2014, Ghent>)
Institute of Electrical and Electronics Engineers -IEEE-: 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 7-9 April 2014, Ghent , Belgium. Piscataway, NJ: IEEE, 2014, pp. 547-558
info:doi/10.1109/EuroSimE.2014.6813857
Fraunhofer IZM


Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter:
Thermo-mechanical simulation of sintered Ag die attach for high temperature applications. (International Conference and Exhibition on High Temperature Electronics (HiTEC) <2014, Albuquerque/NM>)
International Microelectronics and Packaging Society -IMAPS-: International Conference and Exhibition on High Temperature Electronics, HiTEC 2014: Albuquerque, New Mexico, USA, 13 - 15 May 2014. Red Hook, NY: Curran, 2014, pp. 288-294
Fraunhofer IZM


Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.:
Thin glass characterization in the radio frequency range. (Pacific Rim Conference on Ceramic and Glass Technology <10, 2013, Coronado/Calif.>)
Akedo, J.: Advances in multifunctional materials and systems II: A collection of papers presented at the 10th Pacific Rim Conference on Ceramic and Glass Technology [PACRIM 10], June 2-6, 2013, Coronado, California. Hoboken/NJ: Wiley, 2014. (Ceramic Transactions 245), pp. 37-50
info:doi/10.1002/9781118771402.ch4
Fraunhofer IZM
Fraunhofer ISIT


Hickey, Stewart; Fitzpatrick, Colin; Maher, Paul; Ospina, Jose; Schischke, Karsten; Beigl, Peter; Vidorreta, Itziar; Yang, Mona; Williams, Ian; den Boer, Emilia:
Towards Zero Waste in Industrial Networks: A case study of the D4R laptop
Proceedings of the ICE - Waste and Resource Management, Vol.167 (2014), No.3, pp.101-108
urn:nbn:de:0011-n-3200128
info:doi/10.1680/warm.13.00031
Volltext
Fraunhofer IZM


Schischke, Karsten; Nissen, Nils; Lang, Klaus-Dieter:
Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook. (Conference "Going Green - CARE INNOVATION" <10, 2014, Vienna>)
Österreichische Gesellschaft für System- und Automatisierungstechnik -SAT-: Going Green - CARE INNOVATION 2014. Proceedings. CD-ROM: November 17-20, 2014, Vienna. Vienna, 2014
urn:nbn:de:0011-n-3159403
Volltext
Fraunhofer IZM


Rymanov, V.; Stöhr, A.; Dülme, S.; Tekin, T.:
Triple transit region photodiodes (TTR-PDs) providing high millimeter wave output power
Optics Express, Vol.22 (2014), No.7, pp.7550-7558
info:doi/10.1364/OE.22.007550
Fraunhofer IZM


Saettler, P.; Hecker, M.; Boettcher, M.; Rudolph, C.; Wolter, K.J.:
TSV-annealing: A thermo-mechanical assessment. (Electronics System Integration Technology Conference (ESTC) <5, 2014, Helsinki>)
Institute of Electrical and Electronics Engineers -IEEE-: ESTC 2014, Electronics System Integration Technology Conference: Helsinki, Finland; 16.09. - 18.09.2014. Piscataway, NJ: IEEE, 2014, pp. 229-234
info:doi/10.1109/ESTC.2014.6962712
Fraunhofer IZM


Ostmann, A.; Lang, K.-D.; Vanfleteren, J.; Nowottnick, M. :
Übertragung des außenstromlosen Nickel-Metallisierungs-Verfahrens in die Mikrosystemtechnik
Berlin, TU, Diss., 2014
urn:nbn:de:kobv:83-opus4-58889
Fraunhofer IZM


Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.:
A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
IEEE journal of solid-state circuits, Vol.49 (2014), No.1, pp.212-222
info:doi/10.1109/JSSC.2013.2282111
Fraunhofer IZM


Wojnowski, M.; Pressel, K.; Beer, G.; Heinig, Andy; Dittrich, Michael; Wolf, Jürgen:
Vertical interconnections using through encapsulant via (TEV) and through silicon via (TSV) for high-frequency system-in-package integration. (Electronics Packaging Technology Conference (EPTC) <16, 2014, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 16th Electronics Packaging Technology Conference, EPTC 2014. Proceedings: 3-5 December 2014, Singapore. Singapore: Research Publishing, 2014, pp. 122-127
urn:nbn:de:0011-n-3263728
info:doi/10.1109/EPTC.2014.7028413
Volltext
Fraunhofer EAS
Fraunhofer IZM


Domurat-Linde, André; Hoene, Eckart; Ringkleff, Thomas; Enzinger, Tobias:
Vorrichtung und elektrische Baugruppe zum Wandeln einer Gleichspannung in eine Wechselspannung
2014
Fraunhofer IZM


Schischke, K.; Nissen, N.F.; Lang, K.D.:
Welding equipment under the energy-related products directive - the process of developing eco-design criteria
Journal of industrial ecology, Vol.18 (2014), No.4, pp.517-528
info:doi/10.1111/jiec.12164
Fraunhofer IZM


Radecker, M.; Yang, Y.; Nicollini, A.; Le, L.; Lang, K.-D.; Kruse, P.D.; Feistel, K.; Teixeira, L.; Dennstedt, D.; Herfurth, M.:
A wide range power cell for modular interleaving supplies. (European Conference on Power Electronics and Applications (EPE) <16, 2014, Lappeenranta>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2014. Vol.4: 26-28 August 2014, Lappeenranta, Finland. Piscataway, NJ: IEEE, 2014, pp. 3002-3010
info:doi/10.1109/EPE.2014.6911019
Fraunhofer IZM


Niedermayer, M.; Bennecke, S.; Wirth, R.; Armbruster, E.; Lang, K.-D.:
Wireless condition monitoring for industrial applications based on radio sensor nodes with energy harvesting
International journal on advances in networks and services, Vol.7 (2014), No.3&4, pp.130-137
Fraunhofer IZM


Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.:
Wireless pressure sensor system. (International Conference on Sensors Instrument and Information Technology (ICSIIT) <2014, Guangzhou>)
Yarlagadd, P.: Advances in Measurements and Information Technologies: International Conference on Sensors Instrument and Information Technology, ICSIIT 2014, held in Guangzhou, on 18-19 January 2014. Dürnten: Trans Tech Publications, 2014. (Applied mechanics and materials 530-531), pp. 75-78
info:doi/10.4028/www.scientific.net/AMM.530-531.75
Fraunhofer IZM


Saettler, P.; Boettcher, M.; Wolter, K.J.:
µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 7 pp.
info:doi/10.1109/EuroSimE.2013.6529947
Fraunhofer IZM


Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.:
3D integration of standard integrated circuits. (International 3D Systems Integration Conference (3DIC) <2013, San Francisco/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International 3D Systems Integration Conference, 3DIC 2013: 2-4 October 2013, San Francisco, Calif.. Piscataway, NJ: IEEE, 2013, 7 pp.
info:doi/10.1109/3DIC.2013.6702314
Fraunhofer IZM


Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Parthenopoulos, M.; Goerner, L.; Boettcher, M.; Grafe, J.; Wolf, J.M.:
3D TSV - Influence of electrolyte composites and anneal temperatures to copper protrusion and planarization. (Materials Research Society (Spring Meeting) <2013, San Francisco/Calif.>)
Borst, C.: Evolutions in planarization. Equipment, materials, techniques and applications: April 1 - 5, 2013, San Francisco, California, USA. New York, NY: Cambridge University Press, 2013. (MRS Proceedings 1560), pp. 48-58
info:doi/10.1557/opl.2013.904
Fraunhofer IZM


Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.:
Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 372-382
info:doi/10.1109/ECTC.2013.6575598
Fraunhofer IZM


Böttger, G.; Schröder, H.; Jordan, R.:
Active or passive fiber-chip-alignment: Approaches to efficient solutions. (Conference "Optoelectronic Interconnects" <13, 2013, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic interconnects XIII: 3 - 6 February 2013, San Francisco, California, United States. Bellingham, WA: SPIE, 2013. (Proceedings of SPIE 8630), Paper 863006
info:doi/10.1117/12.2014176
Fraunhofer IZM


Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong:
An advanced MEMS sensor packaging concept for use in harsh environments. (Electronics Packaging Technology Conference (EPTC) <15, 2013, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section, Reliability CPMT EDS Chapter: IEEE 15th Electronics Packaging Technology Conference, EPTC 2013: Singapore, 11 - 13 December 2013. Piscataway, NJ: IEEE, 2013, pp. 98-102
info:doi/10.1109/EPTC.2013.6745692
Fraunhofer IZM


Georgi, L. von; Kahle, R.; Lang, K.-D.; Bauer, J.; Braun, T.; Becker, K.-F.; Jung, E.:
Anwendungen hydrophober Oberflächenmodifikationen in der Mikrosystemtechnik
Galvanotechnik, Vol.104 (2013), No.9, pp.1864-1872
Fraunhofer IZM


Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers. (Workshop on Signal and Power Integrity (SPI) <17, 2013, Paris>)
Institute of Electrical and Electronics Engineers -IEEE-: 17th IEEE Workshop on Signal and Power Integrity, SPI 2013: 12-15 May 2013, Paris. New York, NY: IEEE, 2013, 4 pp.
info:doi/10.1109/SaPIW.2013.6558345
Fraunhofer IZM


Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.:
Applying a physics-based via model for the simulation of Through Silicon Vias. (Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) <22, 2013, San Jose/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013: San Jose, California, USA, 27 - 30 October 2013. Piscataway, NJ: IEEE, 2013, pp. 65-68
info:doi/10.1109/EPEPS.2013.6703468
Fraunhofer IZM


Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D.:
Approach for reliability of thermal interface materials in battery cell sensors. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <19, 2013, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013. Proceedings: Berlin, Germany, 25 - 27 September 2013. Piscataway, NJ: IEEE, 2013, pp. 348-351
info:doi/10.1109/THERMINIC.2013.6675179
Fraunhofer IZM


Saettler, P.; Boettcher, M.; Rudolph, C.; Wolter, K.-J.:
Bath chemistry and copper overburden as influencing factors of the TSV annealing. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1753-1758
info:doi/10.1109/ECTC.2013.6575812
Fraunhofer IZM


Töpper, Michael; Lu, D.:
Bumping technologies
Tong, H.-M.: Advanced Flip Chip Packaging. New York: Springer Science+Business Media, 2013, pp. 53-84
info:doi/10.1007/978-1-4419-5768-9_3
Fraunhofer IZM


Negendank, M.; Weber, C.; Müller, S.; Reimers, W.:
Coextrusion and mechanical characterization of aluminum coated Mg-profiles. (International Conference on Material Forming (ESAFORM) <16, 2013, Aveiro>)
Alves de Sousa, Ricardo: The Current State-of-the-Art on Material Forming: Selected, peer reviewed papers from the 16th ESAFORM Conference on Material Forming, April 22-24, 2013, Aveiro, Portugal. Dürnten: Trans Tech Publications, 2013. (Key engineering materials 554-557), pp. 767-775
info:doi/10.4028/www.scientific.net/KEM.554-557.767
Fraunhofer IZM


Zech, C.; Hulsmann, A.; Schlechtweg, M.; Georgi, L.; Gulan, H.; Ambacher, O.:
A compact, universal and cost-efficient antenna setup for mmW-radar applications. (International Conference on Radar <2013, Adelaide>)
Institute of Electrical and Electronics Engineers -IEEE-: International Conference on Radar 2013: 9-12 September 2013, Adelaide, Australia; Proceedings. Piscataway, NJ: IEEE, 2013, pp. 417-421
info:doi/10.1109/RADAR.2013.6652025
Fraunhofer IAF
Fraunhofer IZM


Foerster, J.; Truppel, I.; Bochow-Ness, O.; Geyer, M.:
Comparison of acoustic sensor systems for quality analysis of asparagus using scanning laser vibrometry for visualization
Computers and electronics in agriculture, Vol.91 (2013), pp.10-18
info:doi/10.1016/j.compag.2012.11.007
Fraunhofer IZM


Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.:
Comparison of methods for impedance modeling of power distribution networks. (International Symposium on Electromagnetic Compatibility (EMC) <2013, Brugge>)
Institute of Electrical and Electronics Engineers -IEEE-: International Symposium on Electromagnetic Compatibility, EMC Europe 2013: Brugge, Belgium, 2 - 6 September 2013. Piscataway, NJ: IEEE, 2013, pp. 51-56
Fraunhofer IZM


Chancerel, Perrine; Rotter, Vera Susanne; Ueberschaar, Maximilian; Marwede, Max; Nissen, Nils F.; Lang, Klaus-Dieter:
Data availability and the need for research to localize, quantify and recycle critical metals in information technology, telecommunication and consumer equipment. (International Solid Waste Association (World Congress) <2013, Vienna>)
Waste management & research, Vol.31 (2013), No.10, Supplement, pp.3-16
info:doi/10.1177/0734242X13499814
Fraunhofer IZM


Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.:
Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications. (European Fuel Cell Piero Lunghi Conference & Exhibition (EFC) <4, 2011, Rome>)
Basile, A.: European fuel cell 2011: The 4th edition of the "European Fuel Cell Technology & Applications Piero Lunghi Conference & Exhibition", EFC 11, has been held in Rome, Italy, from 14th to 16th December 2011. Amsterdam: Elsevier, 2013. (International journal of hydrogen energy 38.2013, Nr.1), pp. 440-446
info:doi/10.1016/j.ijhydene.2012.09.117
Fraunhofer IZM


Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter:
Design Features of Current Tablet Computers to Facilitate Disassembly and Repair. (International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <8, 2013, Jeju/Korea>)
Korea Institute of Industrial Technology -KITECH-, Seoul: Proceedings of the 8th Ecodesign 2013: Jeju, Korea, December 4th-6th
urn:nbn:de:0011-n-2837281
Volltext
Fraunhofer IZM


Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.:
Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes. (International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications (PowerMEMS) <13, 2013, London>)
Beeby, S.: PowerMEMS 2013, 13th International Conference on Micro- and Nano-Technology for Power Generation and Energy Conversion Applications. Conference Proceedings: London, 3rd - 6th December 2013. London: IOP, 2013. (Journal of physics. Conference series 476.2013), Art. 012086, 6 pp.
info:doi/10.1088/1742-6596/476/1/012086
Fraunhofer IZM


Schneider-Ramelow, Martin; Geißler, U.; Schmitz, S.; Grübl, W.; Schuch, B.:
Development and status of Cu ball/wedge bonding in 2012
Journal of Electronic Materials, Vol.42 (2013), No.3, pp.558-595
info:doi/10.1007/s11664-012-2383-0
Fraunhofer IZM


Yang, Y.; Radecker, M.; Guttowski, S.; Lang, K.-D.; Fontana da Silva, B.; Bellinaso, L.V.; Engleitner, R.; Vazquez Carazo, A.:
Development of a 40 Watts 5 kV converter using Piezoelectric Transformer for Rheoelectrical damper application. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>)
Gessner, Thomas (Ed.): Smart Systems Integration 2013. CD-ROM: Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Böttcher, L.:
Development of embedded high power electronics modules for automotive applications. (International Conference and Exhibition on Device Packaging <9, 2013, Scottsdale/Ariz.>)
International Microelectronics and Packaging Society -IMAPS-: 9th International Conference and Exhibition on Device Packaging, DPC 2013: Scottsdale/Fountain Hills, Arizona, USA, 11-14 March 2013. Red Hook, NY: Curran, 2013, pp. 886-899
Fraunhofer IZM


Heimann, Marcus; Schröder, Henning; Marx, Sebastian; Lang, Klaus-Dieter:
Dielectric elastomer actuators for adaptive photonic microsystems. (Conference "Organic Photonic Materials and Devices" <15, 2013, San Francisco/Calif.>)
Tabor, C.: Organic Photonic Materials and Devices XV: San Francisco, California, USA; February 02, 2013. Bellingham, WA: SPIE, 2013. (Proceedings of SPIE 8622), Paper 862209
info:doi/10.1117/12.2004334
Fraunhofer IZM


Kumar, A.; Gosciniak, J.; Volkov, V.S.; Papaioannou, S.; Kalavrouziotis, D.; Vyrsokinos, K.; Weeber, J.C.; Hassan, K.; Markey, L.; Dereux, A.; Tekin, T.; Waldow, M.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.; Bozhevolnyi, S.I.:
Dielectric-loaded plasmonic waveguide components: Going practical. Review
Laser & photonics reviews, Vol.7 (2013), No.6, pp.938-951
info:doi/10.1002/lpor.201200113
Fraunhofer IZM


Schischke, Karsten; Stobbe, Lutz; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.:
Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version August 2013
Berlin: Fraunhofer IZM, 2013
urn:nbn:de:0011-n-2551119
urn:nbn:de:0011-n-255111-18
Volltext
Volltext
Fraunhofer IZM


Thomasius, R.; Guttowski, S.; Brockmann, C.; Benecke, S.; Kravcenko, E.; Niedermayer, M.; Nachsel, R.:
Drahtlose Sensorsysteme für die zustandsorientierte Instandhaltung und Logistik
Technisches Messen : TM, Vol.80 (2013), No.2, pp.45-52
info:doi/10.1524/teme.2013.0006
Fraunhofer IZM


Niedermayer, M.; Armbruster, E.; Wirth, R.; Haubold, A.; Benecke, S.; Lang, K.-D.:
Early-Warning System for Machine Failures. Self-Sufficient Radio Sensor Systems for Wireless Condition Monitoring. (International Conference on Sensor Technologies and Applications (SENSORCOMM) <7, 2013, Barcelona>)
Yurish, S.: SENSORCOMM 2013, the Seventh International Conference on Sensor Technologies and Applications: August 25 - 31, 2013, Barcelona, Spain. Red Hook, NY: Curran, 2013, pp. 225-230
Fraunhofer IZM


Hoene, E.; Schörle, S.:
Einfluss der Wechselwirkungen zwischen HV-Komponenten auf die EMV des Fahrzeugs. (Fachtagung "Elektromagnetische Verträglichkeit in der Kfz-Technik" <6, 2013, Stuttgart>)
Richter, M.: Elektromagnetische Verträglichkeit in der Kfz-Technik: Vorträge der 6. GMM-Fachtagung vom 26. bis 27. September 2013 in Stuttgart. Berlin: VDE-Verlag, 2013. (GMM-Fachbericht 77), pp. 29-34
Fraunhofer IZM


Curran, B.; Öz, A.; Linz, Torsten; Ndip, Ivan; Guttowski, Stephan; Lang, Klaus-Dieter:
Electrical modeling of the power delivery to an LED array packaged in a textile. (Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <2013, Nara>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2013: Nara, Japan, 12 - 15 December 201. Piscataway, NJ: IEEE, 2013, pp. 116-121
urn:nbn:de:0011-n-2738397
info:doi/10.1109/EDAPS.2013.6724403
Volltext
Fraunhofer IZM


Hoene, E.; Hoffmann, S.; Zeiter, O.:
Electrical, thermal and electromagnetic design of a SiC solar inverter: A case study. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 470-477
Fraunhofer IZM


Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.:
Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs. (Progress in Electromagnetics Research Symposium (PIERS) <2013, Stockholm>)
Electromagnetics Academy, Cambridge/Mass.: PIERS 2013 Stockholm. Progress in Electromagnetics Research Symposium. Proceedings. Online resource: August 12-15, 2013, Stockholm, Sweden. Cambridge/Mass.: Electromagnetics Academy, 2013, pp. 1137-1142
Fraunhofer IZM


Krshiwoblozki, Malte von; Linz, Torsten; Neudeck, Andreas; Kallmayer, Christine:
Electronics in textiles – adhesive bonding technology for reliably embedding electronic modules into textile circuits. (International Conference on Smart Materials, Structures, and Systems <4, 2012, Terme>)
Diamond, D. et al.: Wearable/wireless body sensor networks for healthcare applications: Selected, peer reviewed papers from CIMTEC 2012 - 4th International Conference on Smart Materials, Structures and Systems, June 10-14, 2012, Terme, Italy. Durnten-Zurich: Trans Tech, 2013. (Advances in science and technology 85), pp. 1-10
urn:nbn:de:0011-n-2722336
info:doi/10.4028/www.scientific.net/AST.85.1
Volltext
Fraunhofer IZM


Pitwon, R.; Schröder, H.; Brusberg, L.; Graham-Jones, J.; Wang, K.:
Embedded planar glass waveguide optical interconnect for data centre applications. (Conference "Optoelectronic Interconnects" <13, 2013, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic interconnects XIII: 3 - 6 February 2013, San Francisco, California, United States. Bellingham, WA: SPIE, 2013. (Proceedings of SPIE 8630), Paper 86300Z
info:doi/10.1117/12.2008299
Fraunhofer IZM


Göhre, J.-M.:
Entwicklung und Implementierung einer verbesserten Lastwechseltestmethode zur experimentellen Bestimmung der Zuverlässigkeit von Dickdrahtbonds in Leistungsmodulen
Berlin, TU, Diss., 2013
urn:nbn:de:kobv:83-opus4-41128
Fraunhofer IZM


Schneider-Ramelow, M.; Göhre, J.-M.; Geißler, U.; Schmitz, S.; Lang, K.-D.:
European R&D trends in wire bonding technologies. (International Symposium on Microelectronics (IMAPS) <45, 2012, San Diego/Calif.>)
45th International Symposium on Microelectronics, IMAPS 2012. Vol.1: 9-13 September 2012, San Diego. Red Hook, NY: Curran, 2013, pp. 209-214
Fraunhofer IZM


Habenicht, S.; Funke, H.J.; Gruber, D.; Oelgeschlager, D.; Schumacher, O.; Gehn, R.; Walczyk, S.; Mavinkurve, A.; Reiners, T.; Fiederling, R.; Vogl, M.; Schug, J.; Willwohl, H.; Blandin, J.; Hutter, M.; Ehrhardt, C.; Oppermann, H.:
The european SEEL (solutions for energy efficient lighting) project High temperature electronics for LED-lighting architectures. (International Conference and Exhibition on High Temperature Electronics Network (HiTEN) <2013, Oxford>)
International Microelectronics Assembly and Packaging Society -IMAPS-: International Conference and Exhibition on High Temperature Electronics Network, HiTEN 2013: July 8-10, 2013; St. Catherine's College Oxford; Oxford, United Kingdom. Red Hook, NY: Curran, 2013, pp. 193-206
Fraunhofer IZM


Braun, Tanja:
Feuchtediffusion in partikelgefüllten Epoxidharzen für die Mikroelektronik
Stuttgart: Fraunhofer Verlag, 2013
Zugl.: Berlin, TU, Diss., 2013
ISBN 3-8396-0534-2
ISBN 978-3-8396-0534-9
urn:nbn:de:0011-n-2384614
Volltext
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2012/2013
Berlin: Fraunhofer IZM, 2013
urn:nbn:de:0011-n-2421034
Volltext
Fraunhofer IZM


Braun, Tanja; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Lang, K.-D.:
From wafer level to panel level mold embedding. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1235-1242
info:doi/10.1109/ECTC.2013.6575733
Fraunhofer IZM


Windrich, F.; Schenke, A.:
Front to backside alignment for TSV based 3D integration. (International 3D Systems Integration Conference (3DIC) <2013, San Francisco/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International 3D Systems Integration Conference, 3DIC 2013: 2-4 October 2013, San Francisco, Calif.. Piscataway, NJ: IEEE, 2013, 6 pp.
info:doi/10.1109/3DIC.2013.6702371
Fraunhofer IZM


Ifland, D.; Ansorge, F.; Baar, C.; Lang, K.-D.:
Generative Fertigungstechnologien für eine Direktintegration von mikroelektronischen Komponenten und Kontaktstrukturen
Galvanotechnik, Vol.104 (2013), No.8, pp.1638-1643
Fraunhofer IZM


Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.:
Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1500-1507
info:doi/10.1109/ECTC.2013.6575770
Fraunhofer IZM


Hansen, U.; Maus, S.; Töpper, M.:
Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1524-1530
info:doi/10.1109/ECTC.2013.6575774
Fraunhofer IZM


Wolf, M. Jürgen; Lang, Klaus-Dieter:
Heterogeneous 3D integration for smart systems. (MikroSystemTechnik Kongress <2013, Aachen>)
VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-: MikroSystemTechnik Kongress 2013: Von Bauelementen zu Systemen; 14. - 16. Oktober 2013 in Aachen. Berlin: VDE-Verlag, 2013, pp. 192-195
Fraunhofer IZM


Lang, Klaus-Dieter:
Heterointegration technologies for multifunctional systems. (European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>)
Gessner, T.: Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM: Como, Italy, 23 - 24 March 2010. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Bauwelinck, J.; Vaernewyck, R.; Verbrugghe, J.; Soenen, W.; Moeneclaey, B.; Van Praet, C.; Vyncke, A.; Torfs, G.; Yin, X.; Qiu, X.Z.; Vandewege, J.; Sotiropoulos, N.; De Waardt, H.; Cronin, R.; Maxwell, G.; Tekin, T.; Bakopoulos, P.; Lai, C.P.; Townsend, P.D.:
High-speed electronics for short-link communication. (European Conference and Exhibition on Optical Communication (ECOC) <39, 2013, London>)
Institution of Engineering and Technology -IET-: 39th European Conference and Exhibition on Optical Communication, ECOC 2013, pp. 164-166
info:doi/10.1049/cp.2013.1327
Fraunhofer IZM


Palandöken, M.; Tekin, T.:
Integration platform of dual wavelength signal source for 120GHz wireless communication systems. (European Society for Precision Engineering and Nanotechnology (EUSPEN International Conference) <13, 2013, Berlin>)
Leach, R. (Ed.): 13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013. Proceedings. Vol.1: 27th May to 31st May 2013, Berlin, Germany. Bedford: Euspen, 2013, pp. 47-50
Fraunhofer IZM


Nowak, M.; Lee, C.; Ndip, I.; Goetz, M.:
Introduction. (International Symposium on Microelectronics (IMAPS) <45, 2012, San Diego/Calif.>)
45th International Symposium on Microelectronics, IMAPS 2012. Vol.1: 9-13 September 2012, San Diego. Red Hook, NY: Curran, 2013
Fraunhofer IZM


Ndip, I.; Yu, J.; Rouzaud, A.; Hoffmeyer, M.:
Introduction. (International Symposium on Microelectronics (IMAPS) <46, 2013, Orlando/Fla.>)
International Microelectronics Assembly and Packaging Society -IMAPS-: 46th International Symposium on Microelectronics, IMAPS 2013: September 30 - October 3, 2013, Orlando, Florida. Reston, Va.: IMAPS, 2013
Fraunhofer IZM


Sage, S.; John, P.; Dobritz, S.; Börnge, J.; Vitiello, J.; Böttcher, M.:
Investigation of different methods for isolation in through silicon via for 3D integration
Microelectronic engineering, Vol.107 (2013), pp.61-64
info:doi/10.1016/j.mee.2012.11.027
Fraunhofer IZM


Wolf, M.J.; Kapitza, H.; Pressel, K.; Perrocheau, J.; Maquille, Y. de; Kwakman, L.F.T.; Rouzaud, A.:
JEMSIP 3D. Major results & achievements from the project and exploitation thereof in future products . (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>)
Gessner, Thomas (Ed.): Smart Systems Integration 2013. CD-ROM: Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Pennicard, D.; Lange, S.; Smoljanin, S.; Hirsemann, H.; Graafsma, H.; Epple, M.; Zuvic, M.; Lampert, M.-O.; Fritzsch, T.; Rothermund, M.:
The LAMBDA photon-counting pixel detector. (International Conference on Synchrotron Radiation Instrumentation (SRI) <11, 2012, Lyon>)
Institute of Physics -IOP-, London: 11th International Conference on Synchrotron Radiation Instrumentation, SRI 2012: 9 - 13 July 2012, Lyon, France. Bristol: IOP Publishing, 2013. (Journal of physics. Conference series 425.2013, Pt.1-21), Art. 062010, 6 pp.
info:doi/10.1088/1742-6596/425/6/062010
Fraunhofer IZM


Manessis, Dionysios; Podlasly, Andreas; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Large-scale manufacturing of embedded subsystems-in-substrates and a 3D-stacking approach for a miniaturised medical system integration. (European Microelectronics and Packaging Conference (EMPC) <2013, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: European Microelectronics and Packaging Conference, EMPC 2013: 9-12 September 2013, Grenoble, France. Piscataway, NJ: IEEE, 2013, 6 pp.
Fraunhofer IZM


Pamminger, R.; Krautzer, F.; Wimmer, W.; Schischke, K.:
"LCA to go" - Environmental assessment of machine tools according to requirements of small and medium-sized enterprises (SMEs) - Development of the methodological concept. (International Conference on Life Cycle Engineering (LCE) <20, 2013, Singapore>)
Nee, A.Y.C.: Re-engineering manufacturing for sustainability. 20th CIRP International Conference on Life Cycle Engineering 2013. Proceedings: Singapore, 17-19 April 2013. Singapore: Springer Science+Business Media, 2013, pp. 481-486
info:doi/10.1007/978-981-4451-48-2_78
Fraunhofer IZM


Middendorf, Andreas; Jerchel, Kathleen; Günther, Julia; Rothe, Michael:
Life Cycle Engineering von Turbomaschinen mithilfe der Mikrosystemtechnik
wt Werkstattstechnik online, Vol.103 (2013), No.7/8, pp.622-623
Fraunhofer IZM


Ansorge, F.; Ifland, D.; Baar, C.; Lang, K.-D.:
Löten ade - elektronische Systeme aus dem Drucker?
Produktion von Leiterplatten und Systemen : PLUS, (2013), No.6, Juni, pp.1285-1288
Fraunhofer IZM


Vyrsokinos, K.; Papaioannou, S.; Kalavrouziotis, D.; Zacharatos, F.; Markey, L.; Weeber, J.-C.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Waldow, M.; Giannoulis, G.; Apostolopoulos, D.; Tekin, T.; Avramopoulos, H.; Pleros, N.:
Low energy routing platforms for optical interconnects using active plasmonics integrated with Silicon Photonics. (International Conference on Transparent Optical Networks (ICTON) <15, 2013, Cartagena>)
Jaworski, M.: 15th International Conference on Transparent Optical Networks, ICTON 2013: Cartagena, Spain, 23 - 27 June 2013 . Piscataway, NJ: IEEE, 2013
info:doi/10.1109/ICTON.2013.6603023
Fraunhofer IZM


Dorward, R.M.; Symington, K.; Brusberg, L.; Kropp, J.-R.; Miller, A.; Pitwon, R.; Whalley, S.:
Market drivers and architectural requirements for backplane inter-connect capacities in next generation PON head-end equipment in the access network. (International Conference on Transparent Optical Networks (ICTON) <15, 2013, Cartagena>)
Jaworski, M.: 15th International Conference on Transparent Optical Networks, ICTON 2013: Cartagena, Spain, 23 - 27 June 2013 . Piscataway, NJ: IEEE, 2013
info:doi/10.1109/ICTON.2013.6602802
Fraunhofer IZM


Sousa, M.F.; Hölck, O.; Braun, T.; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.D.:
Mechanically relevant chemical shrinkage of epoxy molding compounds. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 6 pp.
info:doi/10.1109/EuroSimE.2013.6529962
Fraunhofer IZM


Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.:
Microstructure investigation of Cu/SnAg solid-liquid interdiffusion interconnects by Electron Backscatter Diffraction. (Electronics Packaging Technology Conference (EPTC) <15, 2013, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section, Reliability CPMT EDS Chapter: IEEE 15th Electronics Packaging Technology Conference, EPTC 2013: Singapore, 11 - 13 December 2013. Piscataway, NJ: IEEE, 2013, pp. 318-323
info:doi/10.1109/EPTC.2013.6745735
Fraunhofer IZM


Jung, E.:
Microtechnology for the HighTec medical industry. (Medical Electronics Symposium <7, 2012, Tempe/Ariz.>)
MicroElectronics Packaging and Test Engineering Council -MEPTEC-: MEPTEC/SMTA Medical Electronics Symposium 2012. Vol.2: Tempe, Arizona, USA, 26 - 27 September 2012. Red Hook, NY: Curran, 2013. (MEPTEC Symposium Proceedings 50), pp. 211-224
Fraunhofer IZM


Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.:
A miniature timing microsystem using two silicon resonators. (European Frequency and Time Forum (EFTF) <2013, Prague>)
IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society: Joint European Frequency and Time Forum and International Frequency Control Symposium, EFTF/IFC 2013. Vol.2: Prague, Czech Republic, 21 - 25 July 2013. Piscataway, NJ: IEEE, 2013, pp. 750-753
info:doi/10.1109/EFTF-IFC.2013.6702234
Fraunhofer IZM


Richter, M.; Wackerle, M.; Kibler, S.; Biehl, M.; Koch, T.; Müller, C.; Halter, Roman; Nuffer, J.; Zeiter, O.:
Miniaturized drug delivery system TUDOS with accurate metering of microliter volumes. (International Conference on Sensors and Measurement Technology (SENSOR) <16, 2013, Nuremberg>)
AMA Fachverband für Sensorik e.V., Wunstorf: AMA Conferences 2013. Proceedings. With SENSOR, OPTO, IRS 2. CD-ROM: Nürnberg Exhibition Centre, Germany, 14. - 16.5.2013. Wunstorf: AMA Service, 2013, pp. 420- 425
info:doi/10.5162/sensor2013/C5.2
Fraunhofer EMFT
Fraunhofer IBMT
Fraunhofer ITEM Halter (Publica)
Fraunhofer LBF
Fraunhofer IZM


Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.:
Modeling and minimizing the inductance of bond wire interconnects. (Workshop on Signal and Power Integrity (SPI) <17, 2013, Paris>)
Institute of Electrical and Electronics Engineers -IEEE-: 17th IEEE Workshop on Signal and Power Integrity, SPI 2013: 12-15 May 2013, Paris. New York, NY: IEEE, 2013, 4 pp.
info:doi/10.1109/SaPIW.2013.6558344
Fraunhofer IZM


Lang, K.-D.; Ndip, I.; Guttowksi, S.:
Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components. (Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) <13, 2013, Austin/Tex.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2013: IEEE Radio & Wireless Week, RWW 2013; 21-23 January 2013, Austin, Texas. New York, NY: IEEE, 2013, pp. 12-14
info:doi/10.1109/SiRF.2013.6489416
Fraunhofer IZM


Böhme, Christian; Ostmann, A.; Schneider-Ramelow, M.:
Modular microsystems with embedded components. (International Symposium on Microelectronics (IMAPS) <46, 2013, Orlando/Fla.>)
International Microelectronics Assembly and Packaging Society -IMAPS-: 46th International Symposium on Microelectronics, IMAPS 2013: September 30 - October 3, 2013, Orlando, Florida. Reston, Va.: IMAPS, 2013, pp. 735-739
Fraunhofer IZM


Walter, H.; Hölck, O.; Dobrinski, H.; Stuermann, J.; Braun, T.; Bauer, J.; Wittler, O.; Lang, K.D.:
Moisture induced swelling in epoxy moulding compounds. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1703-1708
urn:nbn:de:0011-n-2642995
info:doi/10.1109/ECTC.2013.6575803
Volltext
Fraunhofer IZM


Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.; Lang, K.D.:
Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 5 pp.
info:doi/10.1109/EuroSimE.2013.6529958
Fraunhofer IZM


Hartmann, S.; Hölck, O.; Wunderle, B.:
Molecular dynamics simulations for mechanical characterization of CNT/gold interface and its bonding strength. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 8 pp.
info:doi/10.1109/EuroSimE.2013.6529903
Fraunhofer IZM


Geißler, Ute; Göhre, J.-M.; Thomas, S.; Schneider-Ramelow, M.; Lang, K.-D.:
A new aluminium alloy for heavy wire bonding in power: First tests of bonding behaviour and reliability. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 1081-1085
Fraunhofer IZM


Wittke, K.; Scheel, W.; Kising, M.; Rinn, A.:
Nothing is as it seems - A contribution to changes in the base and filler materials during fusion brazing
Welding and cutting, Vol.12 (2013), No.3, pp.154-161
Fraunhofer IZM


Boehme, C.; Vieroth, R.; Hirvonen, M.:
A novel packaging concept for electronics in textile UHF antennas. (International Symposium on Microelectronics (IMAPS) <45, 2012, San Diego/Calif.>)
45th International Symposium on Microelectronics, IMAPS 2012. Vol.1: 9-13 September 2012, San Diego. Red Hook, NY: Curran, 2013, pp. 425-432
Fraunhofer IZM


Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.:
On the crack and delamination risk optimization of a Si-interposer for LED packaging. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 5 pp.
info:doi/10.1109/EuroSimE.2013.6529891
Fraunhofer IZM


Hirvonen, Mervi; Böhme, Christian; Severac, Daniel; Maman, Mickael:
On-body propagation performance with textile antennas 867 MHz
IEEE Transactions on Antennas and Propagation, Vol.61 (2013), No.4, Pt.2, pp.2195-2199
info:doi/10.1109/TAP.2012.2234713
Fraunhofer IZM


Brusberg, Lars; Schröder, Henning; Pitwon, Richard; Miller, Allen; Whalley, Simon; Herbst, Christian; Röder, Julia; Lang, Klaus-Dieter:
Optical backplane for board-to-board interconnection based on a glass panel gradient-index mulitmode waveguide technology. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 260-267
info:doi/10.1109/ECTC.2013.6575581
Fraunhofer IZM


Heimann, M.; Liesegang, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.:
Optical system components for navigation grade fiber optic gyroscopes. (Conference "Emerging Technologies in Security and Defence" <2013, Dresden>)
Lewis, K.L.: Emerging Technologies in Security and Defence and Quantum Security II and Unmanned Sensor Systems X: 23-26 September 2013, Dresden, Germany. Bellingham, WA: SPIE, 2013. (Proceedings of SPIE 8899)
info:doi/10.1117/12.2029097
Fraunhofer IZM


Domurat-Linde, A.:
Optimierung des Störemissionsverhaltens von Leistungsmodulen im UKW-Frequenzbereich
Düsseldorf: VDI-Verlag, 2013
(Fortschritt-Berichte VDI, Reihe 21: Elektrotechnik 409)
Zugl.: Berlin, TU, Diss., 2013
ISBN 978-3-18-340921-1
Fraunhofer IZM


Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.:
Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
IEEE transactions on ultrasonics, ferroelectrics and frequency control, Vol.60 (2013), No.7, pp.1356-1375
info:doi/10.1109/TUFFC.2013.2709
Fraunhofer IZM


Aschenbrenner, Rolf; Becker, Karl-Friedrich; Braun, Tanja; Ostmann, Andreas:
Panel level packaging - a manufacturing solution for cost-effective systems. (Pan Pacific Microelectronics Symposium <18, 2013, Maui/Hawaii>)
Surface Mount Technology Association -SMTA-: 18th Pan Pacific Microelectronics Symposium, PAN PAC 2013. Proceedings: January 22-24, 2013, Makena Beach and Golf Resort in Maui, Hawaii. Red Hook, NY: Curran, 2013, pp. 68-73
Fraunhofer IZM


Braun, T.; Bauer, J.; Becker, K.-F.; Kahle, R.; Bader, V.; Voges, S.; Jordan, R.; Aschenbrenner, R.; Lang, K.D.:
Panel level packaging for LED lighting. (China International Forum on Solid State Lighting (ChinaSSL) <10, 2013, Beijing>)
Institute of Electrical and Electronics Engineers -IEEE-: 10th China International Forum on Solid State Lighting, ChinaSSL 2013: Beijing, China, 10-12 November 2013. Piscataway, NJ: IEEE, 2013, pp. 100-103
info:doi/10.1109/SSLCHINA.2013.7177323
Fraunhofer IZM


Tcheg, P.; Wang, B.; Palandöken, M.; Tekin, T.:
Photonic flip-flop based solutions to overcome memory-wall challenges. (European Society for Precision Engineering and Nanotechnology (EUSPEN International Conference) <13, 2013, Berlin>)
Leach, R. (Ed.): 13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013. Proceedings. Vol.1: 27th May to 31st May 2013, Berlin, Germany. Bedford: Euspen, 2013, pp. 39-42
Fraunhofer IZM


Schreier-Alt, T.; Chmiel, G.; Ansorge, F.; Lang, K.-D.:
Piezoresistive stress sensor for inline monitoring during assembly and packaging of QFN. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 2126-2131
info:doi/10.1109/ECTC.2013.6575874
Fraunhofer IZM


Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas:
Power electronics packages with embedded components - recent trends and developments. (Surface Mount Technology Association (SMTA International Conference) <2013, Fort Worth/Tex.>)
Surface Mount Technology Association -SMTA-: SMTA International Conference 2013. Be Part of the Solution. Vol.1: Fort Worth, Texas, USA, 13-17 October 2013. Red Hook, NY: Curran, 2013, pp. 337-342
Fraunhofer IZM


Ostmann, A.; Boettcher, L.; Hofmann, T.; Neeb, C.; Kuschke, R.; Manessis, D.; Lang, K.-D.:
Power modules with embedded chips for automotive applications. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 414-420
Fraunhofer IZM


Ostmann, A.; Boettcher, L.; Manessis, D.; Karaszkiewicz, S.; Lang, K.-D.:
Power modules with embedded components. (European Microelectronics and Packaging Conference (EMPC) <2013, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: European Microelectronics and Packaging Conference, EMPC 2013: 9-12 September 2013, Grenoble, France. Piscataway, NJ: IEEE, 2013, 4 pp.
Fraunhofer IZM


Becker, K.-F.; Koch, M.; Bauer, J.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Precision jetting of glob top materials - A methodology for process optimization. (International Symposium on Microelectronics (IMAPS) <45, 2012, San Diego/Calif.>)
45th International Symposium on Microelectronics, IMAPS 2012. Vol.1: 9-13 September 2012, San Diego. Red Hook, NY: Curran, 2013, pp. 351-358
Fraunhofer IZM


Dimitrova, Gergana; Schischke, Karsten; Stobbe, Lutz; Nissen, Nils F; Schlösser, Alexander:
Product Design Trends and Impacts on Recyclability: The Case of Mobile IT Devices: Disassembly Analysis of Slates: Design for Repair and Recycling Evaluation
Berlin, 2013
urn:nbn:de:0011-n-2837340
Volltext
Fraunhofer IZM


Ens, A.; Zech, C.; Hülsmann, A.; Georgi, L.; Becker, K.-F.:
Radar based detection and tracking of objects under poor visibility conditions. (International Conference on Sensors and Measurement Technology (SENSOR) <16, 2013, Nuremberg>)
AMA Fachverband für Sensorik e.V., Wunstorf: AMA Conferences 2013. Proceedings. With SENSOR, OPTO, IRS 2. CD-ROM: Nürnberg Exhibition Centre, Germany, 14. - 16.5.2013. Wunstorf: AMA Service, 2013, pp. 263-267
info:doi/10.5162/sensor2013/B5.1
Fraunhofer IAF
Fraunhofer IZM


Vanfleteren, J.; Bossuyt, F.; Löher, T.; Hsu, Y.-Y.; Gonzalez, M.; Günther, J.:
Reliability and application scenarios of stretchable electronics realized using printed circuit board technologies
Someya, T.: Stretchable electronics. Weinheim: Wiley-VCH, 2013, pp. 207-233
info:doi/10.1002/9783527646982.ch9
Fraunhofer IZM


Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.:
Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 13 pp.
info:doi/10.1109/EuroSimE.2013.6529943
Fraunhofer IZM


Prakash, Siddharth; Liu, Ran; Schischke, Karsten; Stobbe, Lutz; Gensch, Carl-Otto:
Schaffung einer Datenbasis zur Ermittlung ökologischer Wirkungen der Produkte der Informations- und Kommunikationstechnik (IKT): Teilvorhaben C des Gesamtvorhabens Ressourcenschonung im Aktionsfeld Informations- und Kommunikationstechnik (IKT)
Berlin: UBA, 2013
(Texte - Umweltbundesamt 82/2013)
Fraunhofer IZM


Jung, E.; Blechert, M.; Schuldt, V.; Hubl, M.; Georg, L.; Lang, K.-D.:
Sensor integrated microfluidics for compact micro-reactors. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 504-509
info:doi/10.1109/ECTC.2013.6575619
Fraunhofer IZM


Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter:
Silicon interposers with TSVs - a basis for wafer level 3D system integration. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>)
Gessner, Thomas (Ed.): Smart Systems Integration 2013. CD-ROM: Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Masuzawa, T.; Hoene, E.:
A simplification method of a modeling of stray magnetic couplings in EMC filters. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 779-786
Fraunhofer IZM


Masuzawa, T.; Hoene, E.:
A simplification method of a modeling of stray magnetic couplings in EMC filters. (European Conference on Power Electronics and Applications (EPE) <15, 2013, Lille>)
European Power Electronics and Drives Association -EPE-: 15th European Conference on Power Electronics and Applications, EPE 2013. Vol.2: Lille, France, 2 - 6 September 2013. Piscataway, NJ: IEEE, 2013, pp. 1424-1433
info:doi/10.1109/EPE.2013.6631887
Fraunhofer IZM


Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D.:
Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>)
Institute of Electrical and Electronics Engineers -IEEE-: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013: 14-17 April 2013, Wroclaw, Poland. New York, NY: IEEE, 2013, 8 pp.
info:doi/10.1109/EuroSimE.2013.6529961
Fraunhofer IZM


Becker, K.-F.; Thomas, T.; Bauer, J.; Kahle, R.; Braun, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Smart power module molding advances: Evaluating high temperature suitability of molding compounds. (International Symposium on Microelectronics (IMAPS) <46, 2013, Orlando/Fla.>)
International Microelectronics Assembly and Packaging Society -IMAPS-: 46th International Symposium on Microelectronics, IMAPS 2013: September 30 - October 3, 2013, Orlando, Florida. Reston, Va.: IMAPS, 2013, pp. 177-182
Fraunhofer IZM


Wöhrmann, M.; Töpper, M.; Lang, K.-D.:
Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications. (International Conference on Thermosets <3, 2013, Berlin>)
Fraunhofer-Einrichtung für Polymermaterialien und Composite -PYCO-, Teltow: Thermosets 2013. From Monomers to Components: Proceedings of the 3rd International Conference on Thermosets; 18-20 September 2013, Berlin, Germany. Teltow: Fraunhofer PYCO, 2013, pp. 53-61
Fraunhofer IZM


Schreier-Alt, T.; Fraunhofer, F.A.:
Stressmessung auf Chip-Ebene - Ein Fahrtenschreiber für die Elektronikverarbeitung
Galvanotechnik, Vol.104 (2013), No.8, pp.1644-1653
Fraunhofer IZM


Straube, Stefan; Hahn, Daniel; Jerchel, Kathleen; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter:
System reliability as a key for managing complex requirements, such as robust design of microsystems. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>)
Gessner, Thomas (Ed.): Smart Systems Integration 2013. CD-ROM: Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Bossuyt, F.; Löher, T.:
Technologies and processes used in printed circuit board fabrication for the realization of stretchable electronics
Someya, T.: Stretchable electronics. Weinheim: Wiley-VCH, 2013, pp. 187-205
info:doi/10.1002/9783527646982.ch8
Fraunhofer IZM


Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.:
Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly. (International Conference and Exhibition on Device Packaging <9, 2013, Scottsdale/Ariz.>)
International Microelectronics and Packaging Society -IMAPS-: 9th International Conference and Exhibition on Device Packaging, DPC 2013: Scottsdale/Fountain Hills, Arizona, USA, 11-14 March 2013. Red Hook, NY: Curran, 2013, pp. 525-536
Fraunhofer IZM


Nagel, M.; Matheisen, C.; Sawallich, S.; Dobritz, S.; Kurz, H.:
Terahertz transceiver microprobe for chip-inspection applications using optoelectronic time-domain reflectometry. (International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz) <38, 2013, Mainz>)
IEEE Microwave Theory and Techniques Society: 38th International Conference on Infrared, Millimeter and Terahertz Waves, IRMMW-THz 2013: Mainz, Germany, 1 - 6 September 2013. Piscataway, NJ: IEEE, 2013, 2 pp.
info:doi/10.1109/IRMMW-THz.2013.6665732
Fraunhofer IZM


Kallmayer, C.; Pahl, B.; Grams, A.; Marques, J.; Lang, K.-D.; Suwald, T.:
Thermoplastic based system-in-package for RFID application. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 449-454
info:doi/10.1109/ECTC.2013.6575610
Fraunhofer IZM


Marques, J.; Pahl, B.; Kallmayer, C.:
Thermoplastic packaging and embedding technology for ID-cards. (European Microelectronics and Packaging Conference (EMPC) <2013, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: European Microelectronics and Packaging Conference, EMPC 2013: 9-12 September 2013, Grenoble, France. Piscataway, NJ: IEEE, 2013, 5 pp.
Fraunhofer IZM


Braun, Tanja; Becker, K.-F.; Koch, M.; Thomas, T.; Amende, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Transfer molding compounds for power electronic applications - a qualification methodology for HT capable materials. (International Conference on Electronics Packaging (ICEP) <13, 2013, Osaka>)
Japan Institute of Electronics Packaging -JIEP-: 13th International Conference on Electronics Packaging, ICEP 2013. Proceedings. CD-ROM: Held from April 10 to 12, 2013 in Osaka, Japan. Osaka, 2013, pp. 816-824
Fraunhofer IZM


Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.:
Transient Liquid Phase Soldering-An emerging joining technique for power electronic devices. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 591-598
Fraunhofer IZM


Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter:
Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Microelectronics reliability, Vol.53 (2013), No.8, pp.1111-1116
info:doi/10.1016/j.microrel.2013.02.014
Fraunhofer IZM


Lang, Klaus-Dieter; Pötter, Harald; Bochow-Neß, Olaf; Becker, Karl-Friedrich; Wolf, M. Jürgen:
Trends in der Systemintegration
Elektronik, (2013), No.13, pp.32-39
Fraunhofer IZM


Hoene, E.; Ostmann, A.; Lai, B.T.; Marczok, C.; Müsing, A.; Kolar, J.W.:
Ultra-low-inductance power module for fast switching semiconductors. (PCIM Europe <2013, Nuremberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe 2013. Proceedings. CD-ROM: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013. Berlin: VDE-Verlag, 2013, pp. 198-205
Fraunhofer IZM


Schmidt, Ralf; Zwanzig, M.; Schneider-Ramelwo, M.:
Ursachen und Vermeidung des Black-Pad-Defekts beim Löten von SMDs
Produktion von Leiterplatten und Systemen : PLUS, Vol.15 (2013), No.5, pp.1080-1087
Fraunhofer IZM


Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.:
Vacuum packaging at wafer level for MEMS using gold-tin metallurgy. (European Microelectronics and Packaging Conference (EMPC) <2013, Grenoble>)
Institute of Electrical and Electronics Engineers -IEEE-: European Microelectronics and Packaging Conference, EMPC 2013: 9-12 September 2013, Grenoble, France. Piscataway, NJ: IEEE, 2013, 8 pp.
Fraunhofer IZM


Wilke, Martin; Töpper, Michael:
Verfahren zum Herstellen einer Beschichtung eines Substrats
2013
Fraunhofer IZM


Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.:
A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks. (International Solid-State Circuits Conference (ISSCC) <60, 2013, San Francisco/Calif.>)
Fujino, L.C.: IEEE International Solid-State Circuits Conference, ISSCC 2013. Digest of technical papers: San Francisco, California, USA, 17 - 21 February 2013. New York, NY: IEEE, 2013, pp. 196-197
info:doi/10.1109/ISSCC.2013.6487697
Fraunhofer IZM


Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.:
Via-last technology for the interconnection of flash and processor chip for mobile applications. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>)
Gessner, Thomas (Ed.): Smart Systems Integration 2013. CD-ROM: Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2013
Fraunhofer IZM


Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.:
Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology. (Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings: 28-31 May 2013, Las Vegas, NV, USA. New York, NY: IEEE, 2013, pp. 1219-1224
info:doi/10.1109/ECTC.2013.6575730
Fraunhofer IZM


Kalavrouziotis, D.; Papaioannou, S.; Giannoulis, G.; Apostolopoulos, D.; Hassan, K.; Markey, L.; Weeber, J.-C.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Baus, M.; Karl, M.; Tekin, T.; Tsilipakos, O.; Pitilakis, A.; Kriezis, E.E.; Avramopoulos, H.; Vyrsokinos, K.; Pleros, N.:
0.48Tb/s (12x40Gb/s) WDM transmission and high-quality thermo-optic switching in dielectricloaded plasmonics
Optics Express, Vol.20 (2012), No.7, pp.7655-7662
info:doi/10.1364/OE.20.007655
Fraunhofer IZM


Dobritz, S.; Grafe, J.; Rudolph, C.; Böttcher, M.; Wolf, M.J.; Lang, K.-D.:
3D integration - technology and test strategy. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <6, 2012, Zurich>)
Gessner, T. (Ed.): Smart Systems Integration 2012. CD-ROM: Zurich, Switzerland, 21 - 22 March 2012, 6th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2012
Fraunhofer IZM


Papaioannou, S.; Kalavrouziotis, D.; Vyrsokinos, K.; Weeber, J.C.; Hassan, K.; Markey, L.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Baus, M.; Tekin, T.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.:
Active plasmonics in WDM traffic switching applications
Scientific Reports, Vol.2 (2012), Art.652
info:doi/10.1038/srep00652
Fraunhofer IZM


Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B.:
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012: 16 - 18 April 2012, Cascais, Portugal. Piscataway: IEEE, 2012, pp. 1/11-1/11
info:doi/10.1109/ESimE.2012.6191698
Fraunhofer ENAS
Fraunhofer IZM


Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B.:
Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation. (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <13, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. Vol.1: San Diego, California, USA, 30 May - 1 June 2012. New York, NY: IEEE, 2012, pp. 176-186
info:doi/10.1109/ITHERM.2012.6231428
Fraunhofer IZM


Schröder, Henning; Brusberg, L.; Arndt-Staufenbiel, Norbert; Richlowski, Karim; Ranzinger, Christian; Lang, Klaus-Dieter:
Advanced thin glass based photonic PCB integration. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 194-202
info:doi/10.1109/ECTC.2012.6248827
Fraunhofer IZM


Brusberg, L.; Queisser, M.; Gentsch, C.; Schröder, H.; Lang, K.D.:
Advances in CO2-laser drilling of glass substrates. (International Conference on Photonic Technologies <2012, Fürth>)
Physics procedia, Vol.39 (2012), pp.548-555
info:doi/10.1016/j.phpro.2012.10.072
Fraunhofer IZM


Brusberg, Lars; Schröder, Henning:
Aktives optisches Kabel mit transparentem elektro-optischem Baugruppenträger
2012
Fraunhofer IZM


Geißler, Ute; Milke, Eugen; Prenosil, Peter; Schneider-Ramelow, Martin; Lang, Klaus-Dieter:
Alternative Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <6, 2012, Fellbach>)
Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-: Elektronische Baugruppen und Leiterplatten, EBL 2012. CD-ROM: Hochentwickelte Baugruppen in Europa, 6. DVS/GMM-Tagung vom 14. bis 15. Februar 2012 in Fellbach. Berlin: VDE-Verlag, 2012. (GMM-Fachbericht 71), pp. 227-232
Fraunhofer IZM


Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.:
Analysis and comparison of methods for extracting the inductance and capacitance of TSVs. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 407-411
info:doi/10.1109/EPTC.2012.6507117
Fraunhofer IZM


Domurat-Linde, A.; Hoene, E.:
Analysis and reduction of radiated EMI of power modules. (International Conference on Integrated Power Electronics Systems (CIPS) <7, 2012, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2012, 7th International Conference on Integrated Power Electronics Systems. Proceedings: March, 6 - 8, 2012, Nuremberg, Germany; incl. CD-ROM. Berlin: VDE-Verlag, 2012. (ETG-Fachbericht 133), Art.6170622
Fraunhofer IZM


Oppermann, H.:
Assembly and interconnect formation in MEMS/MOEMS application. (Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <11, 2012, San Francisco/Calif.>)
Garcia-Blanco, S.M.: Reliability, packaging, testing and characterization of MEMS/MOEMS and nanodevices XI: 23 - 24 January 2012, San Francisco, California, United States. Bellingham, WA: SPIE, 2012. (Proceedings of SPIE 8250), Paper 825002
info:doi/10.1117/12.912820
Fraunhofer IZM


Oppermann, H.; Hutter, M.:
Au/Sn Solder
Ramm, P. et al.: Handbook of wafer bonding. Weinheim: Wiley-VCH, 2012, pp. 119-138
info:doi/10.1002/9783527644223.ch7
Fraunhofer IZM


Jaeschke, Johannes:
Bewertung der Lebensdauer von Lotverbindungen unter Betrachtung des Fehlermechanismus Elektromigration
Stuttgart: Fraunhofer Verlag, 2012
Zugl.: Berlin, TU, Diss., 2012
ISBN 3-8396-0431-1
ISBN 978-3-8396-0431-1
urn:nbn:de:0011-n-2139013
Volltext
Fraunhofer IZM


Oppermann, H.; Rothermund, M.; Jurgensen, N.; Yen, U.; Essig, K.:
Die bonding in embedded substrates. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 294-296
info:doi/10.1109/EPTC.2012.6507095
Fraunhofer IZM


Jordan, R.; Hutter, M.; Oppermann, H.:
Challenges in LED packaging and green lighting. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360474, 8 pp.
Fraunhofer IZM


Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.:
Characterization of interconnects and RF components on glass interposers. (International Symposium on Microelectronics (IMAPS) <45, 2012, San Diego/Calif.>)
2012
Fraunhofer IZM


Saettler, P.; Boettcher, M.; Wolter, K.-J.:
Characterization of the annealing behavior for copper-filled TSVs. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 619-624
info:doi/10.1109/ECTC.2012.6248895
Fraunhofer IZM


Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.:
Coating techniques for 3D-packaging applications. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1673-1676
info:doi/10.1109/ECTC.2012.6249063
Fraunhofer IZM


Jung, Erik; Georgi, Leopold; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal:
Combination of channel- and droplet-based microfluidics for complex PoC devices. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1567-1570
info:doi/10.1109/ECTC.2012.6249044
Fraunhofer IZM


Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.:
Combined reliability testing: An approach to assure reliability under complex loading conditions. (International Conference on Integrated Power Electronics Systems (CIPS) <7, 2012, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2012, 7th International Conference on Integrated Power Electronics Systems. Proceedings: March, 6 - 8, 2012, Nuremberg, Germany; incl. CD-ROM. Berlin: VDE-Verlag, 2012. (ETG-Fachbericht 133), Art.6170633
Fraunhofer IZM


Yang, Y.:
Comparative analysis of load resonant converters for a normalized, control and integration suitable design concept
Dresden, TU, Diss., 2012
Fraunhofer IZM


Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.:
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Microelectronics reliability, Vol.52 (2012), No.7, pp.1285-1290
info:doi/10.1016/j.microrel.2012.03.019
Fraunhofer IZM


Abelein, Ulrich; Lochner, Helmut; Hahn, Daniel; Straube, Stefan:
Complexity, quality and robustness - the challenges of tomorrow´s automotive electronics. (Design, Automation and Test in Europe Conference & Exhibition (DATE) <15, 2012, Dresden>)
Preas, K.: Design, Automation & Test in Europe Conference & Exhibition, DATE 2012. Vol.2: Dresden, Germany, 12 - 16 March 2012; proceedings. Piscataway/NJ: IEEE, 2012, pp. 870-871
Fraunhofer IZM


Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Foerster, Philipp:
Contacting electronics to fabric circuits with nonconductive adhesive bonding
Journal of the Textile Institute : JOTI, Vol.103 (2012), No.10, pp.1139-1150
urn:nbn:de:0011-n-1988247
info:doi/10.1080/00405000.2012.664867
Volltext
Fraunhofer IZM


Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C.:
Copper filling of TSVs for interposer applications. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 759-763
info:doi/10.1109/EPTC.2012.6507186
Fraunhofer IZM


Niedermayer, Michael:
Cost driven design of smart microsystems
Norwood/Mass.: Artech House, 2012
(Artech House integrated microsystems series)
ISBN 978-1-608-07084-8
Fraunhofer IZM


Giannoulis, G.; Kalavrouziotis, D.; Apostolopoulos, D.; Papaioannou, S.; Kumar, A.; Bozhevolnyi, S.; Markey, L.; Hassan, K.; Weeber, J.-C.; Dereux, A.; Baus, M.; Karl, M.; Tekin, T.; Tsilipakos, O.; Pitilakis, A.K.; Kriezis, E.E.; Vyrsokinos, K.; Avramopoulos, H.; Pleros, N.:
Data transmission and thermo-optic tuning performance of dielectric-loaded plasmonic structures hetero-integrated on a silicon chip
IEEE Photonics Technology Letters, Vol.24 (2012), No.5, pp.374-376
info:doi/10.1109/LPT.2011.2177964
Fraunhofer IZM


Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.:
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Microelectronics reliability, Vol.52 (2012), No.7, pp.1266-1271
info:doi/10.1016/j.microrel.2012.03.016
Fraunhofer IZM
Fraunhofer ENAS


Gili-De-Villasante, O.; Tcheg, P.; Wang, B.; Suna, A.; Giannoulis, G.; Lazarous, I.; Apostolopoulos, D.; Avramopoulos, H.; Pleros, N.; Baus, M.; Karl, M.; Tekin, T.:
Design, fabrication and characterisation of fully etched TM grating coupler for photonic integrated system-in-package. (Conference "Silicon Photonics and Photonic Integrated Circuits" <3, 2012, Brussels>)
Vivien, L.: Silicon Photonics and Photonic Integrated Circuits III: April 2012, Brussels, Belgium. Bellingham, WA: SPIE, 2012. (Proceedings of SPIE 8431), Paper 84310G
info:doi/10.1117/12.922846
Fraunhofer IZM


Dudek, R.; Brämer, B.; Auersperg, J.; Pufall, R.; Walter, H.; Seiler, B.; Wunderle, B.:
Determination of interface fracture parameters by shear testing using different theoretical approaches. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012: 16 - 18 April 2012, Cascais, Portugal. Piscataway: IEEE, 2012, pp. 624-633
info:doi/10.1109/ESimE.2012.6191793
Fraunhofer ENAS
Fraunhofer IZM


Simon, E.; Kallmeyer, C.; Schneider-Ramelow, M.; Lang, K.-D.:
Development of a multi-terminal crimp package for smart textile integration. (Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>)
Beyne, Eric (General Chair): 4th Electronic System-Integration Technology Conference, ESTC 2012: Amsterdam, Netherlands, 17 - 20 September 2012. New York, NY: IEEE, 2012, 6 pp.
info:doi/10.1109/ESTC.2012.6542057
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.:
Development of embedded power electronics modules. (Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>)
Beyne, Eric (General Chair): 4th Electronic System-Integration Technology Conference, ESTC 2012: Amsterdam, Netherlands, 17 - 20 September 2012. New York, NY: IEEE, 2012, 6 pp.
info:doi/10.1109/ESTC.2012.6542167
Fraunhofer IZM


Hahn, R.; Höppner, K.; Marquardt, K.; Eisenreich, M.; Ferch, M.; Wilke, M.; Lang, K.-D.:
Development of rechargeable micro batteries based on micro channel structures. (International Conference on Green Computing and Communications (GreenCom) <2012, Besancon>)
IEEE Computer Society: IEEE International Conference on Green Computing and Communications, GreenCom 2012: In conjunction with Conference on Internet of Things, and Conference on Cyber, Physical and Social Computing; 20. - 23. November 2012, Besancon, Frankreich. New York, NY: IEEE, 2012, pp. 619-623
info:doi/10.1109/GreenCom.2012.96
Fraunhofer IZM


Marquardt, K.; Stolle, T.; Ferch, M.; Hahn, R.; Thunman, M.:
Development of silicon integrated rechargeable lithium microbatteries. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <6, 2012, Zurich>)
Gessner, T. (Ed.): Smart Systems Integration 2012. CD-ROM: Zurich, Switzerland, 21 - 22 March 2012, 6th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2012
Fraunhofer IZM


Balaj, I.; Raschke, R.; Baum, M.; Uhlig, S.; Wiemer, M.; Gessner, T.; Grafe, J.:
Development of transfer Electrostatic Carriers (T-ESC®) for thin 300mm wafer handling using seal glass bonding technology. (International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <6, 2012, Zurich>)
Gessner, T. (Ed.): Smart Systems Integration 2012. CD-ROM: Zurich, Switzerland, 21 - 22 March 2012, 6th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components. Berlin: VDE-Verlag, 2012, Paper 53
Fraunhofer ENAS
Fraunhofer IZM


Thunman, M.; Marquardt, K.; Hahn, R.; Kober, D.; Goerke, O.; Schubert, H.:
Discharge performance dependence on electrode thickness for Li 4Ti5O12/LiMn2O4 cells for application in wafer-integrated microbatteries. (Symposium "Rechargeable Lithium and Lithium Ion Batteries" <2011, Boston/Mass.>)
Sunkara, M.K.: Rechargeable lithium and lithium ion batteries: Papers originally presented in the Symposium "Rechargeable Lithium and Lithium Ion Batteries" held during the 220th meeting of the Electrochemical Society, in Boston, Massachusetts, from October 9 to 14, 2011. Pennington, NJ: ECS, 2012. (ECS Transactions 41, Nr.41), pp. 147-157
info:doi/10.1149/1.4717972
Fraunhofer IZM


Prakash, S.; Liu, R.; Schischke, K.; Stobbe, P.L.:
Early replacement of notebooks considering environmental impacts. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art. 6360532
Fraunhofer IZM


Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter:
Eco-reliability - a combined approach to balance environment with reliability. (International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <7, 2011, Kyoto>)
Matsumoto, Mitsutaka: Design for Innovative Value Towards a Sustainable Society: Proceedings of EcoDesign 2011: 7th International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Kyoto. Dordrecht: Springer, 2012, pp. 409-412
info:doi/10.1007/978-94-007-3010-6_78
Fraunhofer IZM


Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D.:
Eco-reliability as a new approach of multi-criteria optimisation. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360449
Fraunhofer IZM


Panchenko, I.; Grafe, J.; Mueller, M.; Wolter, K.-J.:
Effects of bonding pressure on quality of SLID interconnects. (Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>)
Beyne, Eric (General Chair): 4th Electronic System-Integration Technology Conference, ESTC 2012: Amsterdam, Netherlands, 17 - 20 September 2012. New York, NY: IEEE, 2012, 7 pp.
info:doi/10.1109/ESTC.2012.6542097
Fraunhofer IZM


Kripfgans, Johannes; Schneider-Ramelow, M.; Schmitz, S.; Müller, W.H.:
Einfluss der Drahtbondgeometrie auf die plastischen Dehnungen in Heel-Bereich von AlSi1-Standard-Drahtbondverbindungen
Produktion von Leiterplatten und Systemen : PLUS, Vol.14 (2012), No.12, pp.2717-2727
Fraunhofer IZM


Nissen, Nils F.:
Einsatz von Biopolymeren in der IT
Greenletter, (2012), No.3, pp.3-4
Fraunhofer IZM


Lang, Klaus-Dieter; Nissen, Nils F.; Middendorf, Andreas; Chancerel, Perrine ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Stuttgart: Fraunhofer Verlag, 2012
ISBN 978-3-8396-0439-7
ISBN 3-8396-0439-7
ISBN 978-1-4673-4512-5
Fraunhofer IZM


Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.:
Embedded power electronics for automotive applications. (International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) <7, 2012, Taipei>)
7th International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT 2012. Proceedings: October 24 (Wed)- 26 (Fri), 2012, Taipei Nangang Exhibition Center. Piscataway, NJ: IEEE, 2012, pp. 163-166
info:doi/10.1109/IMPACT.2012.6420235
Fraunhofer IZM


Besiou, Maria; Wassenhove, N. Luk van; Williams, Ian; Ongondo, Francis; Curran, Tony; O´Connor, Clementine; Man-Yu Yang, Mona; Dietrich, Johannes; Marwede, Max; Gallo, Maitane; Arnaiz, Sixto; Woolman, Tim; Kopacek, Bernd; Obersteiner, Gudrun:
Enablers and barriers for producer responsibility in the electrical and electronic equipment sector. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012
Fraunhofer IZM


Schlosser, A.; Stobbe, L.; Nissen, N.F.; Schappi, B.; Lang, K.-D.:
Energy efficient network equipment for data centers. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360440
Fraunhofer IZM


Benecke, Stephan; Rückschloss, Jana; Middendorf, Andreas; Nissen, Nils F.; Lang, Klaus-Dieter:
Energy Harvesting for Distributed Microsystems - The Link between Environmental Performance and Availability of Power Supply. (International Symposium on Environmentally Conscious Design and Inverse Manufacturing (EcoDesign) <7, 2011, Kyoto>)
Matsumoto, Mitsutaka: Design for Innovative Value Towards a Sustainable Society: Proceedings of EcoDesign 2011: 7th International Symposium on Environmentally Conscious Design and Inverse Manufacturing, Kyoto. Dordrecht: Springer, 2012, pp. 183-190
info:doi/10.1007/978-94-007-3010-6_36
Fraunhofer IZM


Benecke, S.; Ruckschloss, J.; Nissen, N.F.; Lang, K.-D.:
Energy harvesting on its way to a reliable and green micro energy source. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360446
Fraunhofer IZM


Schlomann, B.; Stobbe, L.; Nissen, N.F.:
Energy saving potential of converged ICT and CE. (International Conference on Consumer Electronics (ICCE) <30, 2012, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Conference on Consumer Electronics, ICCE 2012: Las Vegas, Nevada, USA, 13 - 16 January 2012. New York, NY: IEEE, 2012, pp. 79-80
info:doi/10.1109/ICCE.2012.6161749
Fraunhofer ISI ISI-P-159-12
Fraunhofer IZM


Braun, T.; Bauer, J.; Georgi, L.; Becker, K.F.; Koch, M.; Aschenbrenner, R.; Lang, K.D.:
Enhancement of barrier properties of encapsulants for harsh environment applications. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1418-1425
info:doi/10.1109/ECTC.2012.6249022
Fraunhofer IZM


Braun, Tanja; Bauer, Jörg; Georgi, Leopold; Becker, Karl-Friedrich; Koch, Mathias; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Enhancement of Humidity Barrier Properties of Polymers with Micro- and Nano-sized Filler Particles. (Workshop "Mikro-Nano-Integration" <4, 2012, Berlin>)
Hoffmann, Martin (Ed.): Mikro-Nano-Integration. CD-ROM: Beiträge des 4. GMM-Workshops; 12.-13. November 2012 in Berlin. Berlin: VDE-Verlag, 2012. (GMM-Fachbericht 74), 6 pp.
Fraunhofer IZM


Brusberg, L.:
Entwicklung einer einmodigen Wellenleitertechnologie in Dünnglas für die photonische Systemintegration
Stuttgart: Fraunhofer Verlag, 2012
Zugl.: Berlin, TU, Diss., 2012
ISBN 3-8396-0432-X
ISBN 978-3-8396-0432-8
Fraunhofer IZM


Ospina, J.L.; Maher, P.; Schischke, K.; Schlosser, A.:
Environmental product assessments for small computer and laptop companies - MicroPro's experience with Eco-design of product service systems. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360426
Fraunhofer IZM


Benecke, S.; Rueckschloss, J.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.:
Environmentally conscious design of autonomous power supplies for distributed micro-systems. (International Symposium on Sustainable Systems and Technology (ISSST) <2012, Boston>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Symposium on Sustainable Systems and Technology, ISSST 2012: 16-18 May 2012, Boston, MA. Piscataway: IEEE, 2012, 5 pp.
info:doi/10.1109/ISSST.2012.6227978
Fraunhofer IZM


Nissen, Nils F.:
ErP - the European directive on ecodesign
Goodship, Vanessa: Waste electrical and electronic equipment (WEEE) Handbook. Cambridge: Woodhead Publishing, 2012. (Woodhead publishing series in eletronic and optical materials), Chapter 18
Fraunhofer IZM


Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.:
Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality. (International Solid-State Sensors, Actuators and Microsystems Conference <16, 2011, Beijing>)
Sensors and Actuators. A, Vol.188 (2012), pp.167-172
info:doi/10.1016/j.sna.2011.11.015
Fraunhofer IZM


Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D.:
Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten. (Tagung Elektronische Baugruppen und Leiterplatten (EBL) <6, 2012, Fellbach>)
Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-: Elektronische Baugruppen und Leiterplatten, EBL 2012. CD-ROM: Hochentwickelte Baugruppen in Europa, 6. DVS/GMM-Tagung vom 14. bis 15. Februar 2012 in Fellbach. Berlin: VDE-Verlag, 2012. (GMM-Fachbericht 71), pp. 237-242
Fraunhofer ENAS
Fraunhofer IZM


Sbeiti, Mohamad; Müller, Wolfgang H.; Geißler, Ute; Schneider-Ramelow, Martin; Schmitz, Stefan:
FE-thermo mechanische Analyse zur Beschreibung der Ausbildung der intermetallischen Phase beim Drahtbonden
Produktion von Leiterplatten und Systemen : PLUS, Vol.14 (2012), No.5, pp.1125-1131
Fraunhofer IZM


Foerster, P.; Dils, C.; Kallmayer, C.; Löher, T.; Lang, K.-D.:
First approach to cost-efficient fine pitch NCA flip-chip assembly on thermoplastic polyurethane printed circuit boards. (Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>)
Beyne, Eric (General Chair): 4th Electronic System-Integration Technology Conference, ESTC 2012: Amsterdam, Netherlands, 17 - 20 September 2012. New York, NY: IEEE, 2012, 6 pp.
info:doi/10.1109/ESTC.2012.6542055
Fraunhofer IZM


Schmidt, Ralf; Zwanzig. M.; Marcos, D.; Wirth, A.; Löher, T.; Seckel, M.:
Flexible Mikroverdrahtungsstrukturen für implantierbare Elektroden
Produktion von Leiterplatten und Systemen : PLUS, (2012), No.5, pp.1155-1160
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2011/2012
Berlin: Fraunhofer IZM, 2012
urn:nbn:de:0011-n-2052470
Volltext
Fraunhofer IZM


Chancerel, P.; Deubzer, O.; Nissen, N.F.; Lang, K.-D.:
From CRT to flat displays - Consequences for collection and recycling. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360483
Fraunhofer IZM


Niedermayer, Michael; Wirth, Rainer; Kravcenko, Eduard; Benecke, Stephan:
Frühwarnsystem für Maschinenausfälle: Energieautarke Funksensorsysteme zum Condition Monitoring
Produktion von Leiterplatten und Systemen : PLUS, (2012), No.3, pp.636-645
Fraunhofer IZM


Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Heterogenous integration - packaging on and in organic substrates. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012, pp. 142-151
Fraunhofer IZM


Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.:
High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing. (International 3D Systems Integration Conference (3DIC) <2011, Osaka>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International 3D Systems Integration Conference, 3DIC 2011: Osaka, Japan, 31 January - 2 February 2012 (postponed from October 2011). Piscataway, NJ: IEEE, 2012, pp. 202-205
info:doi/10.1109/3DIC.2012.6263003
Fraunhofer IZM


Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Chancerel, P.; Schischke, K.; Ruckschloss, J.; Campo, F.; Benito, G.:
How to support SMEs in the sustainable design of their products. the LiMaS project approach. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art.6360528
Fraunhofer IZM


Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.:
Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Advancing microelectronics, Vol.39 (2012), No.1, pp.14-19
Fraunhofer IZM


Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.:
Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.2: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012, pp. 914-920
Fraunhofer IZM


Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.:
In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012: 16 - 18 April 2012, Cascais, Portugal. Piscataway: IEEE, 2012, pp. 199-204
urn:nbn:de:0011-n-2064608
info:doi/10.1109/ESimE.2012.6191727
Volltext
Fraunhofer IZM
Fraunhofer ENAS


Göhre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter:
Influence of bonding parameters on the reliability of heavy wire bonds on power semiconductors. (International Conference on Integrated Power Electronics Systems (CIPS) <7, 2012, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2012, 7th International Conference on Integrated Power Electronics Systems. Proceedings: March, 6 - 8, 2012, Nuremberg, Germany; incl. CD-ROM. Berlin: VDE-Verlag, 2012. (ETG-Fachbericht 133), pp. 279-290
Fraunhofer IZM


Tesarski, S.J.; Wymysowski, A.; Hölck, O.:
Influence of conversion level on simulation results of crosslinked polymers. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012: 16 - 18 April 2012, Cascais, Portugal. Piscataway: IEEE, 2012, pp. 391-397
info:doi/10.1109/ESimE.2012.6191759
Fraunhofer IZM


Domurat-Linde, A.; Lang, K.D.; Hoene, E.:
Influence of IGBT-module switching characteristics to radio frequency noise. (International Symposium on Electromagnetic Compatibility (EMC Europe) <11, 2012, Rome>)
Institute of Electrical and Electronics Engineers -IEEE-: EMC Europe 2012, International Symposium on Electromagnetic Compatibility: September 17-21, 2012, Rome, Italy; Proceedings. Piscataway/NJ: IEEE, 2012, Art. 6396769
info:doi/10.1109/EMCEurope.2012.6396769
Fraunhofer IZM


Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael:
Innovation driver of the next decade: Heterogeneous integration
Chip scale review, Vol.16 (2012), No.2, pp.21-25
Fraunhofer IZM


Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.:
Innovation Driver of the Next Decade: Technology Follows Application
Microsystems Technology in Germany 2012. Mikrosystemtechnik in Deutschland 2012. Berlin: Trias Consult, 2012, pp. 18-23
Fraunhofer IZM


Tsilipakos, O.; Pitilakis, A.; Yioultsis, T.V.; Papaioannou, S.; Vyrsokinos, K.; Kalavrouziotis, D.; Giannoulis, G.; Apostolopoulos, D.; Avramopoulos, H.; Tekin, T.; Baus, M.; Karl, M.; Hassan, K.; Weeber, J.C.; Markey, L.; Dereux, A.; Kumar, A.; Bozhevolnyi, S.I.; Pleros, N.; Kriezis, E.E.:
Interfacing dielectric-loaded plasmonic and silicon photonic waveguides: Theoretical analysis and experimental demonstration
IEEE Journal of Quantum Electronics, Vol.48 (2012), No.5, pp.678-687
info:doi/10.1109/JQE.2012.2189757
Fraunhofer IZM


Lam, Carl W.; Pascualena Aguirre, Muskilda; Schischke, Karsten; Nissen, Nils F.; Ogunseitan, Oladele A.; Schoenung, Julie M.:
International harmonization of models for selecting less toxic chemical alternatives: Effect of regulatory disparities in the United States and Europe
Integrated environmental assessment and management, Vol.8 (2012), No.4, pp.723-730
info:doi/10.1002/ieam.1305
Fraunhofer IZM


Sigliano, R.; Chiang, K.-N.; Ndip, I.; Chan, B.:
Introduction: 2011 International Symposium on Microelectronics. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012
Fraunhofer IZM


Bochow-Ness, O.; Grams, A.; Hoene, E.; Huber, S.; Lang, K.-D.; Potter, H.; Prewitz, T.; Wittier, .O.; Wust, F.:
Investigation of pulse overload-behavior of a high-current connector with transient-thermo-electric FEM simulation. (PCIM Europe <2012, Nürnberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. CD-ROM: Nuremberg, 8 - 10 May 2012. Proceedings. Berlin: VDE-Verlag, 2012, pp. 525-532
Fraunhofer IZM


Boehnnig, M.; Hoelck, O.:
Kinetic analysis of gas sorption and gas induced dilation and relaxation behaviour of PIM-1 compared to other glassy polymers. (Euromembrane Conference <2012, London>)
Procedia Engineering, Vol.44 (2012), pp.719-720
info:doi/10.1016/j.proeng.2012.08.544
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Böttcher, L.; Ostmann, A.; Jung, E.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Schneider Ramelow, M.; Lang, K.-D.:
Large area mold embedding technology with PCB based redistribution. (International Electronics Manufacturing Technology Conference (IEMT) <35, 2012, Ipoh>)
IEEE Components, Packaging, and Manufacturing Technology Society: 35th IEEE/CPMT International Electronic Manufacturing Technology Symposium, IEMT 2012: Ipoh, Perak, Malaysia, 6 - 8 November 2012. Piscataway: IEEE, 2012, pp. 317-323
info:doi/10.1109/IEMT.2012.6521803
Fraunhofer IZM


Kallmayer, C.; Simon, E.:
Large area sensor integration in textiles. (International Multi-Conference on Systems, Signals and Devices (SSD) <9, 2012, Chemnitz>)
Institute of Electrical and Electronics Engineers -IEEE-: 9th International Multi-Conference on Systems, Signals and Devices, SSD 2012: 20 - 23 March 2012; Enhält 4 Teil-Konferenzen: International Conference on Systems, Analysis & Automatic Control (SAC); International Conference on Power Electrical Systems (PES); International Conference on Communication & Signal Processing (CSP); Conference on Sensors, Circuits & Instrumentation Systems (SCI). New York, NY: IEEE, 2012, 5 pp.
info:doi/10.1109/SSD.2012.6198112
Fraunhofer IZM


Böttcher, Lars:
Leistungselektronik in Leiterplatten einbetten: Aktueller Stand, Ergebnisse und Demonstratoren zur Einbettung von Leistungshalbleitern in Leiterplatten - basierend auf Leiterplatten-Prozessen
Elektronik, (2012), No.2, pp.30-35
Fraunhofer IZM


Schischke, K.; Nissen, N.F.; Sherry, J.; O'Rafferty, S.; O'Connor, F.; Sitek, J.; Pamminger, R.; Wimmer, W.:
Life Cycle thinking in small and medium sized enterprises - Status quo and strategic needs in the electronics sector. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art. 6360527
Fraunhofer IZM


Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian:
Lignin in der Elektronik. (Fachkongress "Biobasierte Polymere - Kunststoffe der Zukunft" <2012, Berlin>)
Bundesministerium für Ernährung, Landwirtschaft und Verbraucherschutz -BMELV-, Berlin: BMELV-Fachkongress Biobasierte Polymere - Kunststoffe der Zukunft 2012. Vorträge: 25./26. November 2012, Berlin. Gülzow: FNR, 2012. (Gülzower Fachgespräche 41), pp. 313-324
Fraunhofer IZM


Curran, B.; Reichl, H. :
Loss modeling in non-ideal transmission lines for optimal signal integrity
Berlin, TU, Diss., 2012
urn:nbn:de:kobv:83-opus-35507
Fraunhofer IZM


Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.:
Low temperature wafer level bonding using benzocyclobutene adhesive polymers. (Annual IMAPS International Conference and Exhibition on Device Packaging (DPC) <8, 2012, Scottsdale/Fountain Hills, Ariz.>)
IMAPS Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT). Online journal, (2012), No.DPC, 24 pp.
info:doi/10.4071/2012DPC-wp13
Fraunhofer IZM


Manessis, D.; Podlasly, A.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.:
Manufacturing of miniaturised microsystems for low power wireless body-area-networks (BAN) medical applications-technological challenges and achievements. (Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>)
Beyne, Eric (General Chair): 4th Electronic System-Integration Technology Conference, ESTC 2012: Amsterdam, Netherlands, 17 - 20 September 2012. New York, NY: IEEE, 2012, 6 pp.
info:doi/10.1109/ESTC.2012.6542169
Fraunhofer IZM


Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D.:
Mass flows of selected target materials in LED products. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art. 6360476
Fraunhofer IZM


Marwede, Max; Schischke, Karsten; Arranz, Pol; Hickey, Stewart; Fitzpatrick, Colin; Ospina, Jose; Yang, Mona; Nissen, Nils F.; Lang, Klaus-Dieter:
Methodology to identify design for recycling measures for high-tech sectors. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012. Taking Green to the Next Level. Proceedings: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012
Fraunhofer IZM


Schaeppi, B.; Bogner, T.; Schloesser, A.; Stobbe, L.; Asuncao, M.D. de:
Metrics for energy efficiency assessment in data centers and server rooms. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, 6 pp.
Fraunhofer IZM


Jung, E.; Hubl, M.:
Micro camera based Lensless Microscope for a miniaturized diagnostic platform. (Deutsche Gesellschaft für Biomedizinische Technik (DGBMT Jahrestagung) <46, 2012, Jena>)
Deutsche Gesellschaft für Biomedizinische Technik -DGBMT-: BMT 2012, Biomedizinische Technik. Proceedings 46. DGBMT Jahrestagung: Jena, September 16 - 19, 2012. Berlin: De Gruyter, 2012. (Biomedizinische Technik 57, 2012, Supplement 1), pp. 447
Fraunhofer IZM


Jung, Erik:
Microdevices for the Medical Industry - Technology, Perspectives and Hurdles for Commercialization -: A biased view from Applied Research. (Conference on Commercialization of Micro and Nano Systems (COMS) <17, 2012, Tonsberg>)
COMS 2012, Commercialization of Micro and Nano Systems: 24th-27th June 2012, Tønsberg, Vestfold, Norway, CD-ROM. Tonsberg, 2012
Fraunhofer IZM


Hölck, Ole; Wunderle, Bernhard:
Microelectronics packaging materials: Correlating structure and property using molecular dynamics simulations
Iwamoto, Nancy: Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Boston/Mass.: Springer US, 2012, pp. 149-186
info:doi/10.1007/978-1-4614-1728-6_10
Fraunhofer IZM


Großer, V.; Gerritzen, A.; Jung, E.:
Mobiles optisches Analysegerät
2012
Fraunhofer IZM


Scogna, A.C.; Engin, A.E.; Ndip, I.:
Modeling and optimization of electronic packaging structures for signal and power integrity. (DesignCon <2012, Santa Clara>)
DesignCon 2012: Where Chipheads Connect. Vol.4: 30 January - 2 February 2012, Santa Clara. Red Hook, NY: Curran, 2012, pp. 2831-2879
Fraunhofer IZM


Linz, Torsten; Simon, Erik; Walter, Hans:
Modeling embroidered contacts for electronics in textiles
Journal of the Textile Institute : JOTI, Vol.103 (2012), No.6, pp.644-653
urn:nbn:de:0011-n-1955190
info:doi/10.1080/00405000.2011.597568
Volltext
Fraunhofer IZM


Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.:
Modelling and characterisation of smart power devices. (International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) <18, 2012, Budapest>)
Institute of Electrical and Electronics Engineers -IEEE-: 18th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2012: 25-27 September 2012, Budapest, Hungary. Grenoble: EDA Publishing, 2012, pp. 229-237
Fraunhofer IZM
Fraunhofer ENAS


Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.:
Modelling the shape, length and radiation characteristics of bond wire antennas
IET microwaves, antennas & propagation, Vol.6 (2012), No.10, pp.1187-1194
info:doi/10.1049/iet-map.2012.0147
Fraunhofer IZM


Oppermann, H.; Dietrich, L.:
Nanoporous gold bumps for low temperature bonding
Microelectronics reliability, Vol.52 (2012), No.2, pp.356-360
info:doi/10.1016/j.microrel.2011.06.027
Fraunhofer IZM


Geißler, Ute; Schneider-Ramelow, M.; Milke, E.:
Neue Drahtwerkstoffe für den Einsatz im Wedge/Wedge-Bondprozess
Deutscher Verband für Schweißen und Verwandte Verfahren e.V. -DVS-: Jahrbuch Mikroverbindungstechnik 2012/2013. Düsseldorf: DVS-Media-Verlag, 2012, pp. 100-111
Fraunhofer IZM


Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.:
Novel conformal antenna concept for security applications. (European Conference on Antennas and Propagation (EUCAP) <6, 2012, Prague>)
European Association on Antennas and Propagation -EurAAP-: 6th European Conference on Antennas and Propagation, EUCAP 2012: Prague, Czech Republic, 26 - 30 March 2012. Piscataway/NJ: IEEE, 2012, pp. 147-150
info:doi/10.1109/EuCAP.2012.6205964
Fraunhofer IZM


Durix, L.; Dreßler, M.; Coutellier, D.; Wunderle, B.:
On the development of a modified button shear specimen to characterize the mixed mode delamination toughness
Engineering fracture mechanics, Vol.84 (2012), pp.25-40
info:doi/10.1016/j.engfracmech.2011.12.015
Fraunhofer IZM


Nissen, Nils F.; Stobbe, Lutz; Lang, Klaus-Dieter:
Open questions on standby and networked standby. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, 19 pp.
Fraunhofer IZM


Fioranelli, F.; Salous, S.; Ndip, I.:
Optmized patch-like antennas for through the wall radar imaging and preliminary results with frequency modulated interrupted continuous wave. (International Symposium on Signals, Systems and Electronics (ISSSE) <9, 2012, Potsdam>)
Institute of Electrical and Electronics Engineers -IEEE-: International Symposium on Signals, Systems and Electronics, ISSSE 2012: Potsdam, Germany, 3 - 5 October 2012. Piscataway, NJ: IEEE, 2012, Art. 6374334
info:doi/10.1109/ISSSE.2012.6374334
Fraunhofer IZM


Deubzer, O.; Nissen, N.F.; Lang, K.-D.:
Overview of RoHS 2.0 and status of exemptions. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012, Art. 6360461
Fraunhofer IZM


Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.:
Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads. (International Microwave Symposium (IMS) <2012, Montréal>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE MTT-S International Microwave Symposium, IMS 2012: 17-22 June 2012, Montreal, QC, Canada. New York, NY: IEEE, 2012, Art. 6259417
info:doi/10.1109/MWSYM.2012.6259417
Fraunhofer IZM


Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.:
Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012, pp. 181-188
Fraunhofer IZM


Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.:
Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1054-1061
info:doi/10.1109/ECTC.2012.6248966
Fraunhofer IZM


Arranz, Pol; Tarragó, Joan; Vallvé, Xavier; Marwede, Max; Boer, Emilia den; Rothe, Michael; Wuest, Felix; Middendorf, Andreas; Cocciantelli, Jean-Michel; Lippert, Michael:
Practical Demonstrator. Design for Recycling Photovoltaic System. (Joint International Conference and Exhibition "Electronics Goes Green" <4, 2012, Berlin>)
Lang, Klaus-Dieter et al.: Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany. Stuttgart: Fraunhofer Verlag, 2012
Fraunhofer IZM


Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.:
Process modeling of dry etching for the 3D-integration with tapered TSVs. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 803-809
info:doi/10.1109/ECTC.2012.6248925
Fraunhofer IZM


Krejci, I.; Piana, C.; Howitz, S.; Wegener, T.; Fiedler, S.; Zwanzig, M.; Schmitt, D.; Daum, N.; Meier, K.; Lehr, C.M.; Batista, U.; Zemljic, S.; Messerschmidt, J.; Franzke, J.; Wirth, M.; Gabor, F.:
Process optimization and biocompatibility of cell carriers suitable for automated magnetic manipulation
Acta biomaterialia, Vol.8 (2012), No.3, pp.1239-1247
info:doi/10.1016/j.actbio.2011.08.031
Fraunhofer IZM
Fraunhofer IBMT


Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Di Girolamo, B.; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.:
Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Journal of Instrumentation, Vol.7 (2012), No.11, Art.P11010, 46 pp.
info:doi/10.1088/1748-0221/7/11/P11010
Fraunhofer IZM


Schmitz, S.; Schneider-Ramelow, M.:
Qualitätsprüfung von Drahtbondverbindungen - Stand der Technik 2012
Produktion von Leiterplatten und Systemen : PLUS, (2012), No.9, pp.2013-2030
Fraunhofer IZM


Sbeiti, Mohamad; Müller, W.H.; Schneider-Ramelow, M.; Geißler, U.; Schmitz, S.:
Quantifying diffusion for an ultrasonic wire bonding process by applying the theory of material forces. (International Association of Applied Mathematics and Mechanics (GAMM Annual Meeting) <83, 2012, Darmstadt>)
Alber, H.-D.: 83rd Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM). Special issue: March 26-30, 2012, Darmstadt, Germany. Weinheim: Wiley-VCH, 2012. (Proceedings in applied mathematics and mechanics 12.2012, Nr.1), pp. 369-370
info:doi/10.1002/pamm.201210173
Fraunhofer IZM


Deubzer, O.:
Reducing hazardous substances in electronics
Goodship, Vanessa: Waste electrical and electronic equipment (WEEE) Handbook. Cambridge: Woodhead Publishing, 2012. (Woodhead publishing series in eletronic and optical materials), pp. 442-465
info:doi/10.1533/9780857096333.4.442
Fraunhofer IZM


Diehm, R.; Nowottnick, M.; Pape, U.:
Reduction of voids in solder joints an alternative to vacuum soldering. (IPC APEX EXPO <2012, San Diego/Calif.>)
IPC Association Connecting Electronics Industries, Bannockburn/Ill.: IPC APEX EXPO 2012. Vol.1: San Diego, California, USA, 28 February - 1 March 2012. Red Hook, NY: Curran, 2012, pp. 425-442
Fraunhofer IZM


Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D.:
Reliability of power semiconductor modules combining active and passive temperature cycling. (PCIM Europe <2012, Nürnberg>)
MESAGO PCIM GmbH, Stuttgart: PCIM Europe : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. CD-ROM: Nuremberg, 8 - 10 May 2012. Proceedings. Berlin: VDE-Verlag, 2012, pp. 1611-1613
Fraunhofer IZM


Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.:
RF-MEMS switch module in a 0.25 µm BiCMOS technology. (Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) <12, 2012, Santa Clara/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF 2012. Digest of Papers: 16-18 Jan. 2012, Santa Clara, Calif.. New York, NY: IEEE, 2012, pp. 25-28
info:doi/10.1109/SiRF.2012.6160150
Fraunhofer IZM


Pötter, H.; Hampicke, M.; Seifert, S.; Thomas, M.:
RFID plus: Aktive Funk-Etiketten zur Bestandskontrolle
wt Werkstattstechnik online, Vol.102 (2012), No.7-8, pp.535-536
Fraunhofer IZM


Niedermayer, Michael; Scholtz, Hendrik; Bonim, Thomas; Guttowski, Stephan; Lang, Klaus-Dieter:
Robust 3D radio sensor systems with embedded active and passive components for industrial applications. (International Conference on Green and Smart Technology (GST) <2012, Jeju/Korea>)
Cho, H.-S.: Green and smart technology with sensor applications: International conferences, GST and SIA 2012, Jeju Island, Korea, November 28 - December 2, 2012; Proceedings. Berlin: Springer, 2012. (Communications in computer and information science 338), pp. 336-341
info:doi/10.1007/978-3-642-35251-5_47
Fraunhofer IZM


Vanfleteren, J.; Loeher, T.; Gonzalez, M.; Bossuyt, F.; Vervust, T.; Wolf, I. de; Jablonski, M.:
SCB and SMI: Two stretchable circuit technologies, based on standard printed circuit board processes
Circuit World, Vol.38 (2012), No.4, pp.232-242
info:doi/10.1108/03056121211280440
Fraunhofer IZM


Hohwieler, Eckhard; Eggers, Achim; Schallock, Burkhard; Baumann, Michael; Kraft, Manfred; Urban, Kamilla; Niedermayer, Michael; Schlenker, Dirk; Schrank, Kai; Patzlaff, Marcel; Erdene-Ochir, Tuguldur; Chemnitz, Moritz; Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V., München; TU Berlin:
Selbstorganisierende Produktion - SOPRO: Wissenschaftliches Vorprojekt im Förderrahmenprogramm "Mikrosystemtechnik". Projektlaufzeit: 01.03.2008 - 31.08.2011, gemeinsamer Abschlussbericht
Berlin, 2012
Fraunhofer IPK
Fraunhofer IOSB
Fraunhofer IPA
Fraunhofer IZM


Großer, V.; Brockmann, C.:
Sensoranordnung zur Feststellung von Unregelmäßigkeiten in oder an Fahrstromleitungen für schienengebundene Fahrzeuge
2012
Fraunhofer IZM


Voigt, S.; Wolfrum, J.; Pfeiffer, M.; Keutel, T.; Brockmann, C.; Grosser, V.; Lissek, S.; During, H.; Rusek, B.; Braunschweig, M.; Kurth, S.; Gessner, T.:
Sensornetzwerk zum Monitoring von Hochspannungsleitungen. (Kongress "Smart Grid" <2012, Stuttgart>)
Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-: VDE Kongress "Smart Grid" 2012. Intelligente Energieversorgung der Zukunft. CD-ROM: Kongressbeitäge; 5. - 6. November 2012, Internationales Congresscenter Stuttgart (ICS); 5. - 6. November 2012; Bd. 1 - Kongressbeiträge; Bd. 2 - Posterbeiträge. Berlin: VDE-Verlag, 2012, 5 pp.
Fraunhofer ENAS
Fraunhofer IZM


Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.:
Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1571-1577
info:doi/10.1109/ECTC.2012.6249045
Fraunhofer IZM


Brusberg, Lars; Schröder, Henning; Queiser, Marco; Lang, Klaus-Dieter:
Single-mode glass waveguide platform for DWDM chip-to-chip interconnects. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1532-1539
info:doi/10.1109/ECTC.2012.6249039
Fraunhofer IZM


Brusberg, L.; Neitz, M.; Schröder, H.:
Single-mode glass waveguide technology for optical interchip communication on board level. (Conference "Optoelectronic Interconnects" <12, 2012, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic interconnects XII: 23 - 25 January 2012, San Francisco, California, United States. Bellingham, WA: SPIE, 2012. (Proceedings of SPIE 8267), Paper 82670M
info:doi/10.1117/12.905984
Fraunhofer IZM


Chancerel, Perrine:
Small - but rich in precious resources: Collection of mobile phones and other small electronic devices
Recycling international, Vol.9 (2012), November, pp.46-51
Fraunhofer IZM


Briindel, M.; Scholz, U.; Haag, F.; Graf, E.; Braun, T.; Becker, K.-F.:
Substrateless sensor packaging using wafer level fan-out technology. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 441-444
info:doi/10.1109/EPTC.2012.6507124
Fraunhofer IZM


Dereux, A.; Weeber, J.-C.; Bozhevolnyi, S.I.; Kriezis, E.; Pleros, N.; Tekin, T.; Baus, M.; Avramopoulos, H.:
Surface plasmon circuitry in opto-electronics. (Conference on Lasers and Electro-Optics (CLEO) <2012, San Jose/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: Conference on Lasers and Electro-Optics, CLEO 2012: San Jose, California, USA, 6 - 11 May 2012. Piscataway, NJ: IEEE, 2012, pp. 3052-3053
Fraunhofer IZM


Dereux, A.; Weeber, J.-C.; Bozhevolnyi, S.I.; Kriezis, E.; Pleros, N.; Tekin, T.; Baus, M.; Avramopoulos, H.:
Surface plasmon circuitry in opto-electronics. (Quantum Electronics and Laser Science Conference (QELS) <2012, San Jose/Calif.>)
Optical Society of America -OSA-, Washington/D.C.: Quantum Electronics and Laser Science Conference: Conference on Lasers and Electro-Optics 2012 ; 6 - 11 May 2012, San Jose, California, United States. Washington, DC: OSA, 2012, Paper QM2K.5
info:doi/10.1364/QELS.2012.QM2K.5
Fraunhofer IZM


Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.:
Systematic design and optimization of bond wire antennas using the M3-approach. (Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) <2012, Taipei>)
Institute of Electrical and Electronics Engineers -IEEE-: Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). Proceedings: December 9-11, 2012, Taipei, Taiwan. Piscataway, NJ: IEEE, 2012, pp. 85-88
info:doi/10.1109/EDAPS.2012.6469433
Fraunhofer IZM


Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter:
Technologies and Trends to Improve Power Electronic Packaging. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012, pp. 430-437
Fraunhofer IZM


Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter:
A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics. (International Conference on Electronics Packaging (ICEP) <2012, Tokyo>)
Orii, Y.: ICEP-IAAC 2012, International Conference on Electronics Packaging. IMAPS All Asia Conference. CD-ROM: April 17 - 20, 2012, Tokyo, Japan. Tokyo, 2012
Fraunhofer IZM


Braun, T.; Brundel, M.; Becker, K.-F.; Kahle, R.; Piefke, K.; Scholz, U.; Haag, F.; Bader, V.; Voges, S.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D.:
Through mold via technology for multi-sensor stacking. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 316-321
info:doi/10.1109/EPTC.2012.6507099
Fraunhofer IZM


Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.:
Transfer molding technology for smart power electronics modules - materials and processes. (International Symposium on Microelectronics (IMAPS) <44, 2011, Long Beach/Calif.>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS 2011, 44th International Symposium on Microelectronics. Proceedings. Vol.1: Long Beach, California, USA, 9 - 13 October 2011. Red Hook, NY: Curran, 2012, pp. 83-89
Fraunhofer IZM


Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.:
Transfer molding technology for smart power electronics modules: Materials and processes
Journal of microelectronics and electronic packaging, Vol.9 (2012), No.2, pp.78-86
info:doi/10.4071/imaps.320
Fraunhofer IZM


Ehrhardt, C.; Hutter, M.; Oppermann, H.; Lang, K.-D.:
Transient liquid phase soldering for lead-free joining of power electronic modules in high temperature applications. (International High Temperature Electronics Conference (HiTEC) <2012, Albuquerque/NM>)
International Microelectronics and Packaging Society -IMAPS-: International High Temperature Electronics Conference, HiTEC 2012: May 8-10, 2012; Albuquerque Marriott Pyramid North, Albuquerque, New Mexico, USA, International Conference and Tabletop Exhibition on High Temperature Electronics 2012. Washington/DC: IMAPS, 2012, pp. 25-33
Fraunhofer IZM


Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.:
Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling. (International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>)
Institute of Electrical and Electronics Engineers -IEEE-: 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012: 16 - 18 April 2012, Cascais, Portugal. Piscataway: IEEE, 2012, pp. 134-139
info:doi/10.1109/ESimE.2012.6191718
Fraunhofer IZM
Fraunhofer ENAS


Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.:
Via last technology for direct stacking of processor and flash. (Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 62nd Electronic Components and Technology Conference, ECTC 2012: May 29 2012-June 1 2012, San Diego, CA. New York, NY: IEEE, 2012, pp. 1327-1332
info:doi/10.1109/ECTC.2012.6249006
Fraunhofer IZM


Barbero, M.; Fritzsch, T.; Gonella, L.; Hügging, F.; Krüger, H.; Rothermund, M.; Wermes, N.:
A via last TSV process applied to ATLAS pixel detector modules: Proof of principle demonstration
Journal of Instrumentation, Vol.7 (2012), Art. P08008, 9 pp.
info:doi/10.1088/1748-0221/7/08/P08008
Fraunhofer IZM


Großer, V.; Gerritzen, A.:
Vorrichtung zum Erfassen und Entfernen von schädlichem Gewebe
2012
Fraunhofer IZM


Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter:
Wafer level 3D system integration based on silicon interposers with through silicon vias. (Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings: 5 - 7 December 2012, Resort World Sentosa, Singapore. New York, NY: IEEE, 2012, pp. 8-13
info:doi/10.1109/EPTC.2012.6507041
Fraunhofer IZM


Hampicke, Maik; Pötter, Harald; Großer, Volker; Brockmann, Carsten; Niedermayer, Michael; Benecke, Stefan:
Wireless Sensor Networks in der industriellen Automation. Status & Trends
INNO: Innovative Technik - neue Anwendungen, Vol.17 (2012), No.51, pp.1-3
Fraunhofer IZM


Kalavrouziotis, D.; Giannoulis, G.; Apostolopoulos, D.; Papaioannou, S.; Kumar, A.; Bozhevolnyi, S.; Markey, L.; Hassan, K.; Weeber, J.C.; Dereux, A.; Baus, M.; Karl, M.; Tolga, T.; Tsilipakos, O.; Pitilakis, A.; Kriezis, E.E.; Avramopoulos, H.; Vyrsokinos, K.; Pleros, N.:
10 Gb/s transmission and thermo-optic resonance tuning in silicon-plasmonic waveguide platform. (European Conference and Exhibition on Optical Communication (ECOC) <37, 2011, Geneva>)
Electrosuisse: 37th European Conference and Exhibition on Optical Communication, ECOC 2011. Vol.1: Geneva, Switzerland, 18 - 22 September 2011. Piscataway: IEEE, 2011, Art. 6066097
Fraunhofer IZM


Ansorge, F.; Ifland, D.; Baar, C.; Heumann, K.; Stigler, T.; Lang, K.D.:
3-dimensionaler Druck für kostengünstige Individualisierung im Mikro- und Nanobereich
Produktion von Leiterplatten und Systemen : PLUS, (2011), No.11, pp.2681-2685
Fraunhofer IZM


Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
3D stacking approaches for mold embedded packages. (European Microelectronics and Packaging Conference (EMPC) <18, 2011, Brighton>)
International Microelectronics and Packaging Society -IMAPS-: 18th European Microelectronics and Packaging Conference, EMPC 2011. Proceedings. CD-ROM: Brighton, 12th-15th September 2011. Andover, Hampshire: IMAPS UK, 2011
Fraunhofer IZM


Jordan, G.; McCarthy, D.N.; Schlepple, N.; Krißler, J.; Schröder, H.; Kofod, G.:
Actuated micro-optical submount using a dielectric elastomer actuator
IEEE ASME transactions on mechatronics, Vol.16 (2011), No.1, pp.98-102
info:doi/10.1109/TMECH.2010.2089991
Fraunhofer IZM


Linz, Torsten:
Analysis of failure mechanisms of machine embroidered electrical contacts and solutions for improved reliability
Ghent, Univ., Diss., 2011
ISBN 978-90-8578-453-1
Fraunhofer IZM


Walter, Hans; Hölck, Ole:
Analysis of moisture and time dependent material parameters. (MicroCar Conference <4, 2011, Leipzig>)
Michel, B.: MicroCar 2011. Micro materials, nano materials for automotives. Proceedings: 4th MicroCar Conference - MicroCar 2011, March 1st, in Leipzig. Berlin: Fraunhofer IZM, 2011. (Micromaterials and Nanomaterials 13.2011), pp. 206-209
Fraunhofer IZM


Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.:
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks. (Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI-THERM) <27, 2011, San Jose/Calif.>)
IEEE Components, Packaging, and Manufacturing Technology Society: Twenty Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2011. Proceedings: San Jose, CA, USA, March 20-24, 2011. Piscataway: IEEE, 2011, pp. 116-124
info:doi/10.1109/STHERM.2011.5767188
Fraunhofer IZM


Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd:
Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens. (Electronics Packaging Technology Conference (EPTC) <13, 2011, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: EPTC 2011, 13th Electronics Packaging Technology Conference: 7th-9th December 2011, Singapore. New York, NY: IEEE, 2011
Fraunhofer IZM


Tesarski, S.J.; Wymysowski, A.; Hölck, O.:
Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach - Preliminary results. (International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011: Linz, Austria, 18 - 20 April 2011. New York, NY: IEEE, 2011, pp. 444-448
info:doi/10.1109/ESIME.2011.5765833
Fraunhofer IZM


AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B.:
Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials. (NSTI Nanotechnology Conference and Expo <14, 2011, Boston>)
Laudon, M. et al.: Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011. Vol.2: Nanotechnology 2011: electronics, devices, fabrication, MEMS, fluidics and computational. Boca Raton, Fla.: CRC Press, 2011, pp. 159-163
Fraunhofer IZM
Fraunhofer ENAS


Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.:
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. (International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) <11, 2010, Bordeaux>)
Microelectronics reliability, Vol.51 (2011), No.6, pp.1027-1034
info:doi/10.1016/j.microrel.2011.03.014
Fraunhofer IZM
Fraunhofer ENAS


Hampicke, M.; Meyer, S.; Friedrich, D.; Erler, D.; Quaas, H.; Pötter, H.; Dinkelacker, P.; Jäger, A.:
BMBF-Projekt SELBST: Ein innovatives Dienstleistungskonzept zur Unterstützung älterer Menschen und deren Angehörige. (Kongress Ambient Assisted Living (AAL) <4, 2011, Berlin>)
Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-: Demographischer Wandel - Assistenzsysteme aus der Forschung in den Markt. Tagungsbeiträge. CD-ROM: 4. Deutscher AAL-Kongress mit Ausstellung, 25. - 26. Januar 2011, Berlin, Ambient Assisted Living. Berlin: VDE-Verlag, 2011, Paper3.1
Fraunhofer IZM


Böttner, H.; Schischke, K.; Nissen, N.F.:
Carbon footprinting of information technology products based on ISO standards: Fujitsu case study. (International Conference on Consumer Electronics (ICCE) <1, 2011, Berlin>)
Schwetlick, H.: 1st IEEE International Conference on Consumer Electronics, ICCE 2011. Proceedings: September 6-8, 2011, Berlin, Germany. New York, NY: IEEE, 2011, pp. 291-295
info:doi/10.1109/ICCE-Berlin.2011.6031836
Fraunhofer IZM


Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D.:
Characterization of deformation properties of metals in 3D ICs. (International Workshop on Stress Management for 3D ICs Using Through Silicon Vias <2010, Albany/NY, San Francisco/Calif., Dresden>)
Zschech, E.: Stress Management for 3D ICs Using Through Silicon Vias: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, March 16, 2010; San Francisco, CA, July 13, 2010; Dresden, Germany, October 20, 2010. New York, N.Y.: AIP Press, 2011. (AIP Conference Proceedings 1378), pp. 67-76
info:doi/10.1063/1.3615696
Fraunhofer IZM


Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.:
Chip embedding technology developments leading to the emergence of miniaturized system-in-packages. (European Microelectronics and Packaging Conference (EMPC) <18, 2011, Brighton>)
International Microelectronics and Packaging Society -IMAPS-: 18th European Microelectronics and Packaging Conference, EMPC 2011. Proceedings. CD-ROM: Brighton, 12th-15th September 2011. Andover, Hampshire: IMAPS UK, 2011, pp. 551-558
Fraunhofer IZM


Brusberg, L.; Schlepple, N.; Schröder, H.:
Chip-to-chip communication by optical routing inside a thin glass substrate. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 805-812
info:doi/10.1109/ECTC.2011.5898603
Fraunhofer IZM


Georgi, Leopold; Jung, Erik; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal:
Combination of channel- and droplet- based microfluidics for complex PoC-Devices. (International Conference on Multi-Material Micro Manufacture (4M) <8, 2011, Stuttgart>)
Kück, H.: 4M 2011, 8th International Conference on Multi-Material Micro Manufacture. Proceedings: 8 - 10 November 2011, Stuttgart, Germany. Singapore: Research Publishing, 2011, pp. 183-186
info:doi/10.3850/978-981-07-0319-6_196
Fraunhofer IZM


Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.:
Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. (International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011: Linz, Austria, 18 - 20 April 2011. New York, NY: IEEE, 2011, pp. 486-492
info:doi/10.1109/ESIME.2011.5765840
Fraunhofer IZM


Guenther, J.; Rothe, M.; Hefer, J.; Middendorf, A.; Lang, K.-D.:
Condition monitoring system adapted for photovoltaic power converter. (International Conference on Environment and Electrical Engineering (EEEIC) <10, 2011, Rome>)
Institute of Electrical and Electronics Engineers -IEEE-: 10th International Conference on Environment and Electrical Engineering, EEEIC 2011. Vol.2: Rome, Italy, 8 - 11 May 2011; conference proceedings. Piscataway/NJ: IEEE, 2011, pp. 1101-1104
info:doi/10.1109/EEEIC.2011.5874830
Fraunhofer IZM


Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.:
Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Nuclear instruments and methods in physics research, Section A. Accelerators, spectrometers, detectors and associated equipment, Vol.650 (2011), No.1, pp.189-193
info:doi/10.1016/j.nima.2010.11.089
Fraunhofer IZM


Vogler, U.; Windrich, F.; Schenke, A.; Völkel, R.; Böttcher, M.; Zoberbier, R.:
Cost-effective lithography for TSV-structures. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1407-1411
info:doi/10.1109/ECTC.2011.5898696
Fraunhofer IZM


Schneider-Ramelow, Martin; Geißler, Ute, Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard:
Cu-Ball/Wedge Bonden: Entwicklung und Status 2011. Tl.2
Produktion von Leiterplatten und Systemen : PLUS, Vol.13 (2011), No.9, pp.2092-2111
Fraunhofer IZM


Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard:
Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Tl.1
Produktion von Leiterplatten und Systemen : PLUS, Vol.13 (2011), No.8, pp.1852-1871
Fraunhofer IZM


Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard:
Cu-Ball/Wedge-bonden: Entwicklung und Status 2011. Tl.3
Produktion von Leiterplatten und Systemen : PLUS, Vol.13 (2011), No.10, pp.2385-2399
Fraunhofer IZM


Bossuyt, F.; Guenther, J.; Löher, T.; Seckel, M.; Sterken, T.; Vries, J. de:
Cyclic endurance reliability of stretchable electronic substrates
Microelectronics reliability, Vol.51 (2011), No.3, pp.628-635
info:doi/10.1016/j.microrel.2010.09.032
Fraunhofer IZM


Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.:
Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications. (European Fuel Cell Piero Lunghi Conference & Exhibition (EFC) <4, 2011, Rome>)
Cigolotti, V.: 4th European Fuel Cell Piero Lunghi Conference & Exhibition 2011. Proceedings: December 14 - 16, 2011, Rome, Italy. Rome: ENEA, 2011, pp. 139-140
Fraunhofer IZM


Marwede, Max; Schischke, Karsten; Hickey, Stewart; Arranz, Pol; Ospina, Jose; Ting, Angela:
Design for recycling measures for waste prevention in high-tech sectors: The case of laptop computers and photovoltaic modules. (International Conference on Waste Management and Technology (ICWMT) <6, 2011, Suzhou/China>)
Li, Jinhui: 6th International Conference on Waste Management and Technology, ICWMT 2011. Selected proceedings: August 30 - September 1, 2011, Suzhou, China. Irvine/Calif.: Scientific Research Publishing, 2011, pp. 233-239
Fraunhofer IZM


Nissen, N. F.; Wittler, O.; Middendorf, A.; Lang, K.-D.:
Eco-Reliability - A Fusion of GreenTech and HighTech
Micromaterials and nanomaterials, Vol.13 (2011), pp.94-97
Fraunhofer IZM


Ohnimus, F.; Reichl, H. (Prüfer) :
Efficient integration of planar antennas considering electromagnetic interactions at board level
Berlin, TU, Diss., 2011
urn:nbn:de:kobv:83-opus-30388
Fraunhofer IZM


Morgenstern, H.; Reichl, H. (Prüfer) :
Effiziente Verifikation der Robustheit komplexer integrierter Schaltungen
Berlin, TU, Diss., 2011
urn:nbn:de:kobv:83-opus-30414
Fraunhofer IZM


Kleff, J.; Engelmann, G.; Oppermann, H.; Reichl, H.:
Electromigration in electroplated gold micro contacts. (Electronics Packaging Technology Conference (EPTC) <13, 2011, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: EPTC 2011, 13th Electronics Packaging Technology Conference: 7th-9th December 2011, Singapore. New York, NY: IEEE, 2011, pp. 277-282
info:doi/10.1109/EPTC.2011.6184431
Fraunhofer IZM


Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D.:
Electronics condition monitoring for improving sustainability of power electronics. (Global Conference on Sustainable Manufacturing <8, 2011, Abu Dhabi>)
Seliger, Günther et al.: Advances in sustainable manufacturing: Proceedings of the 8th Global Conference on Sustainable Manufacturing, GCSM 2010. 22th-24th November, 2010, Abu Dhabi. Berlin: Springer, 2011, pp. 171-175
info:doi/10.1007/978-3-642-20183-7_25
Fraunhofer IZM


Hahn, Robert; Marquardt, Krystan:
Elektrochemisches Element und Verfahren zur Herstellung eines elektrochemischen Elements
2011
Fraunhofer IZM


Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.:
Embedding technology for manufacturing of high density SiP. (International Microelectronics and Packaging Society (IMAPS Nordic Annual Conference) <2011, Espoo>)
International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter: IMAPS Nordic Annual Conference 2011. CD-ROM: 5-8 June 2011, Dipoli Congress Center, Espoo, Finland. Oslo: IMAPS Nordic, 2011, pp. 282-288
Fraunhofer IZM


Radecker, M.; Bisogno, F.E.; Zinchenko, L.:
An energy-based heuristic operator method for resonant power circuit estimation predicting parameter sensitivity. (International Symposium on Circuits and Systems (ISCAS) <2011, Rio de Janeiro>)
Institute of Electrical and Electronics Engineers -IEEE-: IEEE International Symposium on Circuits and Systems, ISCAS 2011. Proceedings Vol.3: 15. Mai -18. Mai 2011, Rio de Janeiro, Brazil. New York, NY: IEEE, 2011, pp. 1912-1915
info:doi/10.1109/ISCAS.2011.5937962
Fraunhofer IZM


Weiland, M.; Reichl, H.; Wagner, S.; Hahn, R.:
Entwicklung und Design von selbstatmenden Mikrobrennstoffzellen fur autarke Sensoren mit pulsformiger Last. (Konferenz "Systems Integration - Mikrosystemtechnik-Lösungen im Gebäude der Zukunft" <4, 2011, Dortmund>)
Schlaak, H.F.: MikroSystemTechnik Kongress 2011: 10.-12. Oktober 2011, Darmstadt. Berlin: VDE-Verlag, 2011, pp. 394-397
Fraunhofer IZM


Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias:
Entwicklungsrichtungen für das Leistungshalbleiter Packaging
Produktion von Leiterplatten und Systemen : PLUS, Vol.13 (2011), No.6, pp.1382-1392
Fraunhofer IZM


Schrage, J.; Stuebbe, O.; Brusberg, L.; Soenmez, Y.; Schroeder, H.; Schuhmann, R.:
Evaluation of graded index glass waveguides for board-level WDM optical chip-to-chip communications. (Optoelectronic Interconnects and Component Integration Conference <11, 2011, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic Interconnects and Component Integration XI: 24 - 26 January 2011, San Francisco, California, United States. Bellingham, WA: SPIE, 2011. (Proceedings of SPIE 7944), Paper 794406
info:doi/10.1117/12.876458
Fraunhofer IZM


Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.:
Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality. (International Solid-State Sensors, Actuators and Microsystems Conference <16, 2011, Beijing>)
Institute of Electrical and Electronics Engineers -IEEE-: 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011: 5-9 June 2011, Beijing. New York, NY: IEEE, 2011, pp. 1204-1207
info:doi/10.1109/TRANSDUCERS.2011.5969317
Fraunhofer IZM


Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard:
Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1079-1085
info:doi/10.1109/ECTC.2011.5898644
Fraunhofer IZM
Fraunhofer ENAS


Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.:
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Microelectronics reliability, Vol.51 (2011), No.6, pp.1046-1053
info:doi/10.1016/j.microrel.2011.03.009
Fraunhofer IZM


Böttcher, L.:
Fan-out and embedded panel discussion: Embedded technology and latest developments. (International Conference and Exhibition on Device Packaging <7, 2011, Scottsdale>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS International Conference and Exhibition on Device Packaging: In Conjunction with the Global Business Council, GBC 2011 Spring Conference, pp. 1182-1191
Fraunhofer IZM


Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann:
Fortschritte beim Aufbau von Leistungshalbleitern
Mikroproduktion, (2011), No.6, pp.48-55
Fraunhofer IZM


Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd:
Fracture-mechanical interface characterisation for thermo-mechanical co-design: An effcient and comprehensive method for critical mixed-mode data extraction. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1459-1467
info:doi/10.1109/ECTC.2011.5898703
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2010/2011
Berlin: Fraunhofer IZM, 2011
urn:nbn:de:0011-n-1589495
Volltext
Fraunhofer IZM


Sigliano, R.; Chan, B.; Ndip, I.; Chiang, K.-N.:
From the technical chairs
Advancing microelectronics, Vol.38 (2011), No.5, pp.7
Fraunhofer IZM


Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.:
Future Packaging: Die Fertigungslinie zur SMT/Hybrid/Packaging 2011
Productronic, Vol.31 (2011), No.4, pp.30-31
Fraunhofer IZM


Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.:
Future Packaging - Technologien, Produkte, Visionen
Community Dialog, Vol.6 (2011), No.1, pp.3
Fraunhofer IZM


Marwede, Max; Reller, Armin:
Future return flows of cadmium-telluride from photovoltaic waste: The use of dynamic substance flow analysis to predict potential recycling flows resulting from the production and end-of-life waste of photovoltaics. (International Conference on Waste Management and Technology (ICWMT) <6, 2011, Suzhou/China>)
Li, Jinhui: 6th International Conference on Waste Management and Technology, ICWMT 2011. Selected proceedings: August 30 - September 1, 2011, Suzhou, China. Irvine/Calif.: Scientific Research Publishing, 2011, pp. 251-256
Fraunhofer IZM


Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N.; Hofmann, J.; Marx, S.:
Glass panel processing for electrical and optical packaging. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 625-633
info:doi/10.1109/ECTC.2011.5898578
Fraunhofer IZM


Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.:
High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics. (Eurosensors <25, 2011, Athens>)
Eurosensors XXV Conference 2011: September 4.-7., 2011, Athens, Greece. Amsterdam: Elsevier, 2011. (Procedia engineering 25.2011), pp. 1365-1368
info:doi/10.1016/j.proeng.2011.12.337
Fraunhofer IZM


Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.:
High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
IEEE transactions on components, packaging and manufacturing technology, Vol.1 (2011), No.10, pp.1627-1641
info:doi/10.1109/TCPMT.2011.2164915
Fraunhofer IZM


Göhre, J.; Schneider-Ramelow, M.; Becker, K.-F.; Hutter, M.:
Immersion silver as universal surface finish for COB technology. (International Symposium on Microelectronics (IMAPS) <43, 2010, Raleigh/NC>)
International Microelectronics and Packaging Society -IMAPS-: 43rd International Symposium on Microelectronics, IMAPS 2010: Raleigh, North Carolina, USA, 31 October - 4 November. Red Hook, NY: Curran, 2011, pp. 867-873
Fraunhofer IZM


Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.:
The impact of moisture absorption on the electrical characteristics of organic dielectric materials. (International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011: Linz, Austria, 18 - 20 April 2011. New York, NY: IEEE, 2011, pp. 209-213
info:doi/10.1109/ESIME.2011.5765791
Fraunhofer IZM


Schmitz, S.; Schneider-Ramelow, M.; Schröder, S.:
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °c
Microelectronics reliability, Vol.51 (2011), No.1, pp.107-112
info:doi/10.1016/j.microrel.2010.07.062
Fraunhofer IZM


Krumbholz, S.; Kaiser, J.; Weiland, M.; Hahn, R.; Reichl, H.:
Influences of current collector foils with different opening ratios in passive polymer electrolyte membrane fuel cells
Journal of power sources, Vol.196 (2011), No.12, pp.5277-5281
info:doi/10.1016/j.jpowsour.2010.08.027
Fraunhofer IZM


Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M.:
Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick. (European Microwave Conference (EuMC) <41, 2011, Manchester>)
41st European Microwave Conference, EuMC 2011. Proceedings: 10-13 October 2011, Manchester, UK, European Microwave Week. Manchester, 2011, pp. 1035-1038
Fraunhofer IZM


Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.:
Integration of planar antennas considering electromagnetic interactions at board level
IEEE transactions on electromagnetic compatibility, Vol.53 (2011), No.4, pp.1005-1014
info:doi/10.1109/TEMC.2011.2131656
Fraunhofer IZM


Goehre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.:
Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test. (International Conference on Integrated Power Electronics Systems (CIPS) <6, 2010, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2010, 6th International Conference on Integrated Power Electronics Systems. Proceedings: March, 16 - 18, 2010 Nuremberg/Germany. Berlin: VDE-Verlag, 2011. (ETG-Fachbericht 121), Art. 5730637
Fraunhofer IZM


Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.:
Interface formation in the US-wedge/wedge-bond process of AlSi1/CuNiAu contacts
Journal of Electronic Materials, Vol.40 (2011), No.2, pp.239-246
info:doi/10.1007/s11664-010-1439-2
Fraunhofer IZM


Domurat-Linde, A.; Hoene, E.:
Investigation and PEEC based simulation of radiated emissions produced by power electronic converters. (International Conference on Integrated Power Electronics Systems (CIPS) <6, 2010, Nuremberg>)
Energietechnische Gesellschaft -ETG-: CIPS 2010, 6th International Conference on Integrated Power Electronics Systems. Proceedings: March, 16 - 18, 2010 Nuremberg/Germany. Berlin: VDE-Verlag, 2011. (ETG-Fachbericht 121), Art. 5730671
Fraunhofer IZM


Dowha, .; Wymysowski, A.; Wittler, O.:
Investigation of thin films by nanoindentation with doe and numerical methods. (International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011: Linz, Austria, 18 - 20 April 2011. New York, NY: IEEE, 2011, Art. 5765768, 7 pp.
info:doi/10.1109/ESIME.2011.5765768
Fraunhofer IZM


Niedermayer, M.:
Kostengetriebener Entwurf drahtloser Sensornetzwerke: Ganzheitliche Entwurfsmethodik zur Kostenoptimierung
Saarbrücken: Südwestdeutscher Verlag für Hochschulschriften, 2011
Zugl.: Berlin, TU, Diss., 2011
ISBN 978-3-8381-2591-6
Fraunhofer IZM


Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A.:
Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique. (Semiconductor Conference <2011, Dresden>)
Institute of Electrical and Electronics Engineers -IEEE-: SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM: 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition. New York, NY: IEEE, 2011, Art. 6068737
info:doi/10.1109/SCD.2011.6068737
Fraunhofer ENAS
Fraunhofer IZM


Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.:
Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Journal of neural engineering, Vol.8 (2011), No.4, Art. 045004
info:doi/10.1088/1741-2560/8/4/045004
Fraunhofer IZM


Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D.:
Low temperature cure of BCB and the influence on the mechanical stress. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 392-400
info:doi/10.1109/ECTC.2011.5898543
Fraunhofer IZM


Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.:
Low temperature glass-thin-films for use in power applications. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 255-261
info:doi/10.1109/ECTC.2011.5898522
Fraunhofer IZM


Schreier-Alt, T.; Stark, J.M.:
Measurement of pressure distribution during MEMS and Flip Chip encapsulation
Advancing microelectronics, Vol.38 (2011), No.3, pp.18-20
Fraunhofer IZM


Pabst, O.; Schiffer, M.; Obermeier, E.; Tekin, T.; Lang, K.-D.; Ngo, H.-D.:
Measurement of Young's modulus and residual stress of thin SiC layers for MEMS high temperature applications. (Conference "Smart Sensors, Actuators, and MEMS" <5, 2011, Prague>)
Schmid, U.: Smart sensors, actuators, and MEMS V: 18-20 April 2011, Prague, Czech Republic. Bellingham, WA: SPIE, 2011. (Proceedings of SPIE 8066), Paper 806608
info:doi/10.1117/12.886453
Fraunhofer IZM
Fraunhofer IOF


Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.:
MEMS module integration into SiGe BiCMOS technology for embedded system applications. (Semiconductor Conference <2011, Dresden>)
Institute of Electrical and Electronics Engineers -IEEE-: SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM: 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition. New York, NY: IEEE, 2011, Art. 6068738
info:doi/10.1109/SCD.2011.6068738
Fraunhofer IZM
Fraunhofer ENAS


Kaynak, M.; Wietstruck, M.; Zhang, W.; Scholz, R.; Drews, J.; Marschmeyer, S.; Knoll, D.; Korndorfer, F.; Schulz, K.; Wipf, C.; Wolansky, D.; Kaletta, K.; Wegner, M.; Ehrmann, O.; Tillack, B.:
MEMS module integration into SiGe BiCMOS technology for embedded system applications. (Symposium on ULSI Process Integration <7, 2011, Boston>)
Claeys, C.: ULSI process integration 7: Seventh Symposium on ULSI Process Integration held in Boston, MA at the 220th meeting of the Electrochemical Society, October 9 - 14, 2011. Pennington, NJ: ECS, 2011. (ECS transactions Vol.41, No.7), pp. 191-202
info:doi/10.1149/1.3633299
Fraunhofer IZM


Specht, H.; Kurth, S.; Gessner, T.; Fiess, R.; Krayl, O.; Krueger, M.; Wiest, G.; Hilberath, T.:
Method for characterizing movable micro-mirror for projector used in e.g. digital camera, involves determining function parameters of micro-mirror by evaluating device, based on detected portions of test image of micro-mirror
2011
Fraunhofer IZM
Fraunhofer ENAS


Hahn, Daniel; Straube, Stefan; Middendorf, Andreas; Lochner, Helmut; Abelein, Ulrich; Lang, Klaus-Dieter:
Eine Methodik zur Analyse erhöhter Beanspruchungen von Halbleiterkomponenten und deren AVT hinsichtlich geänderter Anforderungen im Automobil. (VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik (Fachtagung) <5, 2011, Hamburg-Harburg>)
Informationstechnische Gesellschaft -ITG-: Zuverlässigkeit und Entwurf: 5. GI/GMM/ITG-Fachtagung vom 27. bis 29. September 2011 in Hamburg-Harburg. Berlin: VDE-Verlag, 2011. (ITG-Fachbericht 231), pp. 126-127
Fraunhofer IZM


Hampicke, M.; Rochlitzer, R.; Pötter, H.; Hoherz, C.; Nachsel, R.:
Mikrosystemtechnik als Schlüssel für die Entwicklung von AAL-Lösungen - Beispiele für realisierte Anwendungen. (Kongress Ambient Assisted Living (AAL) <4, 2011, Berlin>)
Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-: Demographischer Wandel - Assistenzsysteme aus der Forschung in den Markt. Tagungsbeiträge. CD-ROM: 4. Deutscher AAL-Kongress mit Ausstellung, 25. - 26. Januar 2011, Berlin, Ambient Assisted Living. Berlin: VDE-Verlag, 2011, Paper8.1
Fraunhofer IZM


Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.:
Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies. (International Symposium on Microelectronics (IMAPS) <43, 2010, Raleigh/NC>)
International Microelectronics and Packaging Society -IMAPS-: 43rd International Symposium on Microelectronics, IMAPS 2010: Raleigh, North Carolina, USA, 31 October - 4 November. Red Hook, NY: Curran, 2011, pp. 881-885
Fraunhofer IZM


Benecke, S.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.:
Modeling and optimization of energy harvesting-systems under non-ideal operating temperatures with regard to availability of power-supply and reduction of environmental impacts. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1703-1710
info:doi/10.1109/ECTC.2011.5898741
Fraunhofer IZM


Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.:
Modelling of metal degradation in power devices under active cycling conditions. (International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011: Linz, Austria, 18 - 20 April 2011. New York, NY: IEEE, 2011, pp. 100-105
info:doi/10.1109/ESIME.2011.5765771
Fraunhofer IZM


Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.:
Modular microelectronics by system-in-packages with embedded components. (European Microelectronics and Packaging Conference (EMPC) <18, 2011, Brighton>)
International Microelectronics and Packaging Society -IMAPS-: 18th European Microelectronics and Packaging Conference, EMPC 2011. Proceedings. CD-ROM: Brighton, 12th-15th September 2011. Andover, Hampshire: IMAPS UK, 2011, Art. 6142365
Fraunhofer IZM


Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.:
Modular system packaging by embedding: Technologies, applications and perspectives. (Surface Mount Technology Association (SMTA International Conference) <2011, Forth Worth/Tex.>)
Surface Mount Technology Association -SMTA-: SMTA International Conference 2011. Vol.1: Fort Worth, Texas, USA, 16 - 20 October 2011. Red Hook, NY: Curran, 2011, pp. 21-27
Fraunhofer IZM


Idzik, K.R.; Cywinski, P.J.; Cranfield, C.G.; Mohr, G.J.; Beckert, R.:
Molecular Recognition of the Antiretroviral Drug Abacavir: Towards the Development of a Novel Carbazole-Based Fluorosensor
Journal of Fluorescence, Vol.21 (2011), No.3, pp.1195-1204
info:doi/10.1007/s10895-010-0798-7
Fraunhofer IZM


Iwamoto, Nancy; Hölck, Ole; Noijen, Sander:
Multiscale perspectives of interface delamination in microelectronic packaging applications
Molecular simulation, Vol.37 (2011), No.8, pp.710-717
info:doi/10.1080/08927022.2011.551882
Fraunhofer IZM


Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf:
NCA flip-chip bonding with thermoplastic elastomer adhesives: Fundamental failure mechanisms and opportunities of polyurethane bonded NCA-interconnects. (Electronics Packaging Technology Conference (EPTC) <13, 2011, Singapore>)
Institute of Electrical and Electronics Engineers -IEEE-: EPTC 2011, 13th Electronics Packaging Technology Conference: 7th-9th December 2011, Singapore. New York, NY: IEEE, 2011, pp. 223-230
urn:nbn:de:0011-n-1955201
info:doi/10.1109/EPTC.2011.6184421
Volltext
Fraunhofer IZM


Stopford, J.; Henry, A.; Manessis, D.; Bennett, N.; Horan, K.; Allen, D.; Wittge, J.; Boettcher, L.; Cowley, A.; McNally, P.J.:
Non-destructive X-Ray mapping of strain & warpage of die in packaged chips. (European Microelectronics and Packaging Conference (EMPC) <18, 2011, Brighton>)
International Microelectronics and Packaging Society -IMAPS-: 18th European Microelectronics and Packaging Conference, EMPC 2011. Proceedings. CD-ROM: Brighton, 12th-15th September 2011. Andover, Hampshire: IMAPS UK, 2011, Art. 6142359
Fraunhofer IZM


Maxwell, D.; McAndrew, L.; Schischke, K.; Stobbe, L.; Nissen, N.F.; White, O.:
Non-energy related policy options to foster eco-design of electronics products. (International Conference on Consumer Electronics (ICCE) <1, 2011, Berlin>)
Schwetlick, H.: 1st IEEE International Conference on Consumer Electronics, ICCE 2011. Proceedings: September 6-8, 2011, Berlin, Germany. New York, NY: IEEE, 2011, pp. 281-285
info:doi/10.1109/ICCE-Berlin.2011.6031846
Fraunhofer IZM


Engleitner, R.; Renes Pinheiro, J.; Ecke Bisogno, F.; Radecker, M.; Yang, Y.:
Normalized statical analysis with frequency and load variation for the Class-E converter based on Piezoelectric Transformers
Controle & Automacao, Vol.22 (2011), No.6, pp.573-584
info:doi/10.1590/S0103-17592011000600003
Fraunhofer IZM


Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang:
Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection. (European Microelectronics and Packaging Conference (EMPC) <18, 2011, Brighton>)
International Microelectronics and Packaging Society -IMAPS-: 18th European Microelectronics and Packaging Conference, EMPC 2011. Proceedings. CD-ROM: Brighton, 12th-15th September 2011. Andover, Hampshire: IMAPS UK, 2011, 7 pp.
Fraunhofer IZM


Zimmermann, L.; Preve, G.B.; Tekin, T.; Rosin, T.; Landles, K.:
Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform
IEEE Journal of Selected Topics in Quantum Electronics, Vol.17 (2011), No.3, pp.645-651
info:doi/10.1109/JSTQE.2010.2084992
Fraunhofer HHI
Fraunhofer IZM


Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D.:
Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects. (Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices Conference <10, 2011, San Francisco/Calif.>)
Garcia-Blanco, S.: Reliability, packaging, testing and characterization of MEMS/MOEMS and nanodevices X: 24 - 25 January 2011, San Francisco, California, United States; organized as a part of SPIE Photonics West' MOEMS-MEMS Symposium. Bellingham, WA: SPIE, 2011. (Proceedings of SPIE 7928), Paper 792805
info:doi/10.1117/12.877099
Fraunhofer IZM


Dereux, A.; Hassan, K.; Weeber, J.-C.; Djellali, N.; Bozhevolnyi, S.I.; Tsilipakos, O.; Pitilakis, A.; Kriezis, E.; Papaioannou, S.; Vyrsokinos, K.; Pleros, N.; Tekin, T.; Baus, M.; Kalavrouziotis, D.; Giannoulis, G.; Avramopoulos, H.:
Parametric study of dielectric loaded surface plasmon polariton add-drop filters for hybrid silicon/plasmonic optical circuitry. (Conference "Quantum Sensing and Nanophotonic Devices" <8, 2011, San Francisco/Calif.>)
Razeghi, M.: Quantum sensing and nanophotonic devices VIII: 23 - 27 January 2011, San Francisco, California, United States; Part of SPIE photonics west. Bellingham, WA: SPIE, 2011. (Proceedings of SPIE 7945), Paper 794513
info:doi/10.1117/12.873165
Fraunhofer IZM


Oppermann, H.; Hutter, M.; Ehrhardt, C.:
Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
2011
Fraunhofer IZM


Hefer, J.; Brockmann, C.; Thomasius, R.:
Possibilities and limitations of wireless sensor systems. (Sensor + Test Conference <2011, Nürnberg>)
AMA Fachverband für Sensorik e.V., Wunstorf: Sensor + Test Conference 2011. Proceedings. CD-ROM: 06.07.-09.07.2011, Nürnberg, 15th International Conference on Infrared Sensors & Systems (SENSOR 2011); 12th International Conference on Infrared Sensors and Systems (IRS(2) 2011); 10th INternational Confernce on Optical Technologies for Sensing Measurement (OPTO 2011). Wunstorf: AMA Service, 2011, pp. 451-454
info:doi/10.5162/sensor11/c5.1
Fraunhofer IZM


Braun, Tanja; Becker, Karl-Friedrich; Böttcher, Lars; Ostmann, Andreas; Jung, Erik; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Lang, Klaus-Dieter:
Potential of large area mold embedded packages with pcb based redistribution. (International Wafer-Level Packaging Conference (IWLPC) <8, 2011, Santa Clara/Calif.>)
Surface Mount Technology Association -SMTA-: 8th Annual International Wafer-Level Packaging Conference & Tabletop Exhibition 2011, IWLPC 2011: Santa Clara, California, USA 3-6 October 2011. Red Hook, NY: Curran, 2011, pp. 54-61
Fraunhofer IZM


Rotter, V.S.; Chancerel, P.; Schill, W.-P.:
Practicalities of individual producer responsibility under the WEEE directive: Experiences in Germany
Waste management & research, Vol.29 (2011), No.9, pp.931-944
info:doi/10.1177/0734242X11415753
Fraunhofer IZM


Spiller, S.; Molina, F.; Wolf, J.M.; Grafe, J.; Schenke, A.; Toennies, D.; Hennemeyer, M.; Tabuchi, T.; Auer, H.:
Processing of ultrathin 300 mm wafers with carrierless technology. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 984-988
info:doi/10.1109/ECTC.2011.5898629
Fraunhofer IZM


Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.:
Realization of power modules by chip embedding technology. (International Conference and Exhibition on Device Packaging <7, 2011, Scottsdale>)
International Microelectronics and Packaging Society -IMAPS-: IMAPS International Conference and Exhibition on Device Packaging: In Conjunction with the Global Business Council, GBC 2011 Spring Conference, pp. 83-87
Fraunhofer IZM


Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.:
Reliability analysis of low temperature low pressure Ag-sinter die attach. (NSTI Nanotechnology Conference and Expo <14, 2011, Boston>)
Laudon, M. et al.: Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011. Vol.2: Nanotechnology 2011: electronics, devices, fabrication, MEMS, fluidics and computational. Boca Raton, Fla.: CRC Press, 2011, pp. 149-154
Fraunhofer IZM


Klein, M.; Hutter, M.; Engelmann, G.; Fritzsch, T.; Oppermann, H.; Dietrich, L.; Wolf, M.J.; Brämer, B.; Dudek, R.; Reichl, H.:
Reliability investigation of large GaAs pixel detectors flip-chip-bonded on Si readout chips
IEEE transactions on components, packaging and manufacturing technology, Vol.1 (2011), No.3, pp.359-366
info:doi/10.1109/TCPMT.2011.2108299
Fraunhofer IZM


Tekin, T.:
Review of packaging of optoelectronic, photonic, and MEMS components
IEEE Journal of Selected Topics in Quantum Electronics, Vol.17 (2011), No.3, pp.704-719
info:doi/10.1109/JSTQE.2011.2113171
Fraunhofer IZM


Marwede, Max:
Schließen von Stoffkreisläufen kritischer Rohstoffe durch das Recycling von Photovoltaik-Produktionsabfällen und -Modulen: Langfristszenarien zu Rohstoffbedarf und Recyclingflüssen mittels einer dynamischen Materialflussanalyse. (Wissenschaftskongress Abfall- und Ressourcenwirtschaft <1, 2011, Straubing>)
Deutsche Gesellschaft für Abfallwirtschaft -DGAW-, Berlin: I. Wissenschaftskongress Abfall- und Ressourcenwirtschaft 2011. Tagungsband: Am 29. und 30. März 2011 in Straubing. Putbus: Wissenschaftsverlag Putbus, 2011, pp. 49-58
Fraunhofer IZM


Stegmeier, S.; Fleischer, M.; Tawil, A.; Hauptmann, P.; Endres, H.-E.:
Sensing of CO2 at room temperature using work function readout of (hetero-)polysiloxanes sensing layers. (Eurosensors <23, 2009, Lausanne>)
Sensors and Actuators. B, Vol.154 (2011), No.2, pp.206-212
info:doi/10.1016/j.snb.2009.12.071
Fraunhofer IZM


Jung, E.; Wichert, R.; John, M.; Norgaß, T.:
Sensors for vital data monitoring in an AAL setting. (Deutsche Gesellschaft für Biomedizinische Technik (Jahrestagung) <45, 2011, Freiburg>)
Biomedizinische Technik, Vol.56 (2011), Supplement 1, 8 pp.
info:doi/10.1515/bmt.2011.832
Fraunhofer FIRST
Fraunhofer IZM
Fraunhofer IIS


Kopp, C.; Bernabe, S.; Bakir, B.B.; Fedeli, J.; Orobtchouk, R.; Schrank, F.; Porte, H.; Zimmermann, L.; Tekin, T.:
Silicon photonic circuits: On-CMOS integration, fiber optical coupling, and packaging
IEEE Journal of Selected Topics in Quantum Electronics, Vol.17 (2011), No.3, pp.498-509
info:doi/10.1109/JSTQE.2010.2071855
Fraunhofer IZM


Schreier-Alt, T.; Rehme, F.; Ansorge, F.; Reichl, H.:
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Microelectronics reliability, Vol.51 (2011), No.3, pp.668-675
info:doi/10.1016/j.microrel.2010.10.008
Fraunhofer IZM


Morgenstern, H.:
Simulation elektrostatischer Entladungen: Effiziente Verifikation der Robustheit integrierter Schaltungen beim Auftreten von elektrostatischen Entladungen
Saarbrücken: Südwestdeutscher Verlag für Hochschulschriften, 2011
Zugl.: Berlin, TU, Diss., 2011
ISBN 978-3-8381-2585-5
Fraunhofer IZM


Engleitner, R.; Bisogno, F.E.; Pinheiro, J.R.; Rech, C.; Michels, L.; Radecker, M.:
Small-signal modeling of a DC-DC Class-E piezoconverter based on generalized averaging method. (International Symposium on Industrial Electronics (ISIE) <2011, Gdansk>)
Institute of Electrical and Electronics Engineers -IEEE-: 2011 IEEE International Symposium on Industrial Electronics, ISIE 2011. Proceedings Vol.1: Gdansk, Poland, 27 - 30 June 2011. Piscataway, NJ: IEEE, 2011, pp. 396-401
info:doi/10.1109/ISIE.2011.5984191
Fraunhofer IZM


Schreier-Alt, T.; Unterhofer, K.; Ansorge, F.; Lang, K.-D.:
Stress analysis during assembly and packaging. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1684-1690
info:doi/10.1109/ECTC.2011.5898738
Fraunhofer IZM


Löher, Thomas; Böttcher, Lars; Schütze, David; Karaszkiewicz, Stefan; Ostmann, Andreas; Aschenbrenner, Rolf:
System Packaging by Embedding: Technologies, Examples and Perspectives. (International Conference on Electronics Packaging (ICEP) <2011, Nara>)
Uenishi, K.: ICEP 2011, International Conference on Electronics Packaging. CD-ROM: April 13 - 15, 2011, Nara, Japan. Kyoto, 2011, 5 pp.
Fraunhofer IZM


Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.:
System-in-Packages with embedded components for modular systems. (International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) <6, 2011, Taipei>)
6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011: 19-21 Oct. 2011, Taipei. Piscataway: IEEE, 2011, pp. 294-297
info:doi/10.1109/IMPACT.2011.6117180
Fraunhofer IZM


Geißler, U.; Funck, J.; Schneider-Ramelow, M.:
Temperatur und Interdiffusion beim US-Wedge/Wedge-Bondverschweißen von Al-Drähten auf Ni/Flash-Au
Produktion von Leiterplatten und Systemen : PLUS, Vol.13 (2011), No.1, pp.145-150
Fraunhofer IZM


Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.:
Temperature moisture and mode mixity dependent EMC-Copper (oxide) interfacial toughness. (Annual Conference on Experimental and Applied Mechanics <2010, Indianapolis>)
Proulx, T.A.: Experimental and applied mechanics. Proceedings of the 2010 Annual Conference on Experimental and Applied Mechanics. Vol.6. New York: Springer, 2011. (Conference proceedings of the Society for Experimental Mechanics series), pp. 393-404
Fraunhofer IZM


Brusberg, L.; Lang, G.; Schröder, H.:
Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level. (Optoelectronic Interconnects and Component Integration Conference <11, 2011, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic Interconnects and Component Integration XI: 24 - 26 January 2011, San Francisco, California, United States. Bellingham, WA: SPIE, 2011. (Proceedings of SPIE 7944), Paper 79440C
info:doi/10.1117/12.874508
Fraunhofer IZM


Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D.:
Through mold vias for stacking of mold embedded packages. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 48-54
info:doi/10.1109/ECTC.2011.5898490
Fraunhofer IZM


Bouabdallah, S.; Bermes, C.; Grzonka, S.; Gimkiewicz, C.; Brenzikofer, A.; Hahn, R.; Schafroth, D.; Grisetti, G.; Burgard, W.; Siegwart, R.:
Towards palm-size autonomous helicopters
Journal of intelligent and robotic systems, Vol.61 (2011), No.1-4, pp.445-471
info:doi/10.1007/s10846-010-9483-y
Fraunhofer IZM


Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.:
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 836-843
info:doi/10.1109/ECTC.2011.5898608
Fraunhofer EMFT
Fraunhofer IZM


Guttowski, Stephan; Zurwehn, Volker; Hefer, J.; Wussow, K.:
Überwachungssystem für eine Vielzahl von Objekten
2011
Fraunhofer IZM


Töpper, Michael; Fischer, Thorsten; Bader, V.; Lang, Klaus-Dieter; Matsuie, N.; Motobe, T.; Minegishi, T.; Knaus, M.:
Ultra low temperature PBO-polymer for wafer level packaging applications. (International Conference on Electronics Packaging (ICEP) <2011, Nara>)
Uenishi, K.: ICEP 2011, International Conference on Electronics Packaging. CD-ROM: April 13 - 15, 2011, Nara, Japan. Kyoto, 2011, pp. 452-455
Fraunhofer IZM


Oppermann, Hermann; Jordan, Rafael; Glaw, Veronika; Mukhopadhyay, Biswajit:
Verfahren zur Herstellung von mechanischen Anschlägen zur Selbstjustage und Vorrichtung mit Anschlägen zur Selbstjustage
2011
Fraunhofer IZM


Hahn, R.; Wagner, S.; Lang, K.-D.; Blechert, M.:
Vergleichende Tests von Mikrobrennstoffzellensystemen. (Konferenz "Systems Integration - Mikrosystemtechnik-Lösungen im Gebäude der Zukunft" <4, 2011, Dortmund>)
Schlaak, H.F.: MikroSystemTechnik Kongress 2011: 10.-12. Oktober 2011, Darmstadt. Berlin: VDE-Verlag, 2011, pp. 367-370
Fraunhofer IZM


Baganz, D.; Staaks, G.; Jauernik, O.; Wecke, N.; Jauernik, S.; Balzer, H.-U.; Großer, Volker; Brockmann, Carsten:
Vorrichtung zur induktiven Energieübertragung
2011
Fraunhofer IZM


Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.:
Wafer-level glass-caps for advanced optical applications. (Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>)
IEEE Components, Packaging, and Manufacturing Technology Society: IEEE 61st Electronic Components and Technology Conference, ECTC 2011: Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings. Piscataway/NJ: IEEE, 2011, pp. 1642-1648
info:doi/10.1109/ECTC.2011.5898732
Fraunhofer IZM


Lang, Klaus-Dieter:
Zuverlässigkeit mulitfunktionaler Systeme. Neue Strategien bei der Produktanalyse und Qualitätssicherung in der Produktion erforderlich
Community.dialog. SMT hybrid packaging, Vol.6 (2011), No.1, pp.1-2
Fraunhofer IZM


Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.:
3-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 66-73
info:doi/10.1109/ECTC.2010.5490887
Fraunhofer IZM


Ramm, P.; Klumpp, A.; Weber, J.; Lietaer, N.; Taklo, M.; Raedt, W. de; Fritzsch, T.; Couderc, P.:
3D integration technology: Status and application development. (European Solid-State Circuits Conference (ESSCIRC) <36, 2010, Seville>)
IEEE Solid-State Circuits Society: 2010 Proceedings of the ESSCIRC: Sevilla, Spain, 14 - 16 September 2010. Piscataway, NJ, USA: IEEE, 2010, pp. 9-16
info:doi/10.1109/ESSCIRC.2010.5619857
Fraunhofer IZM


Lietaer, N.; Taklo, M.M.V.; Schjolberg-Henriksen, K.; Ramm, P.:
3D interconnect technologies for advanced MEMS/NEMS applications. (Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects" <2009, Vienna>)
Flake, J.: Processing, Materials, and Integration of Damascene and 3D Interconnects: Papers originally presented in the Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects", held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009. Pennington, NJ: ECS, 2010. (ECS transactions Vol.25, Issue 38), pp. 87-95
info:doi/10.1149/1.3390661
Fraunhofer IZM


Ramm, P.; Klumpp, A.; Weber, J.; Taklo, M.M.V.:
3D System-on-Chip technologies for More than Moore systems
Microsystem Technologies, Vol.16 (2010), No.7, pp.1051-1055
info:doi/10.1007/s00542-009-0976-1
Fraunhofer IZM


Klumpp, A.; Ramm, P.; Wieland, R.:
3D-integration of silicon devices: A key technology for sophisticated products. (Design, Automation and Test in Europe Conference (DATE) <2010, Dresden>)
Association for Computing Machinery -ACM-, Special Interest Group on Design Automation -SIGDA-: Design, Automation and Test in Europe 2010. Proceedings: ICC, Dresden, Germany, 8-12 March, 2010. New York, NY: IEEE, 2010, pp. 1678-1683
Fraunhofer IZM


Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.:
Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors. (PCIM Europe <2010, Nürnberg>)
PCIM Europe 2010: International Exhibition & Conference for POWER ELECTRONICS INTELLIGENT MOTION POWER QUALITY, 4 - 6 May 2010, Exhibition Centre Nuremberg, Proceedings. Stuttgart: Mesago PCIM, 2010, pp. 760-761
Fraunhofer IZM


Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.:
An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
International journal of microwave and wireless technologies, Vol.2 (2010), No.3-4, pp.273-281
info:doi/10.1017/S1759078710000450
Fraunhofer IZM


Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.:
Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 136-138
info:doi/10.1109/ESTC.2010.5642855
Fraunhofer IZM


Pufall, R.; Michel, B.; Kaulfersch, E.:
Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?. (Nanotechnology Conference and Expo <2010, Anaheim/Calif.>)
Laudon, M.: Nanotechnology 2010. Life Sciences, Medicine, Diagnostics, Bio Materials and Composites. Vol.2: An interdisciplinary integrative forum on nanotechnology, biotechnology and microtechnology; June 21 - 24, 2010, Anaheim, California, U.S.A. Boca Raton, Fla.: CRC Press, 2010, pp. 1-4
Fraunhofer IZM


Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B.:
Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies. (Nanotechnology Conference and Expo <2010, Anaheim/Calif.>)
Laudon, M.: Nanotechnology 2010. Technical proceedings of the NSTI Nanotechnology Conference and Expo - Nanotech Conference & Expo. Vol.2: Electronics, devices, fabrication, MEMS, fluidics and computational: An interdisciplinary integrative forum on nanotechnology, biotechnology and microtechnology; June 21 - 24, 2010, Anaheim, California, U.S.A. Boca Raton, Fla.: CRC Press, 2010, pp. 161-164
Fraunhofer ENAS
Fraunhofer IZM


Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B.:
Advanced virtual testing of structural integrity in microelectronic assemblies. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 128-135
info:doi/10.1109/ESTC.2010.5642815
Fraunhofer IZM


Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.:
Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation. (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM) <12, 2010, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. Vol.1: Las Vegas, Nevada, USA, 2 - 5 June 2010. New York, NY: IEEE, 2010, pp. 1-11
info:doi/10.1109/ITHERM.2010.5501343
Fraunhofer IZM


Weiland, M.; Reichl, H.; Wagner, S.:
Analysis of the transient characteristics of a passive micro fuel cell for sensor applications. (International Conference on Sensor Technologies and Applications (SENSORCOMM) <4, 2010, Venice>)
Lloret Mauri, J.: Fourth International Conference on Sensor Technologies and Applications, SENSORCOMM 2010: Venice//Mestre, Italy, 18 - 25 July 2010; proceedings. Piscataway/NJ: IEEE, 2010, pp. 521-524
info:doi/10.1109/SENSORCOMM.2010.84
Fraunhofer IZM


Gaul, H.; Schneider-Ramelow, M.; Reichl, H.:
Analytic model verification of the interfacial friction power in Al us w/w bonding on Au pads
IEEE transactions on components and packaging technologies, Vol.33 (2010), No.3, pp.607-613
info:doi/10.1109/TCAPT.2010.2049847
Fraunhofer IZM


Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.:
Anodic bonding at low voltage using microstructured borosilicate glass thin-films. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 678-681
info:doi/10.1109/ESTC.2010.5642923
Fraunhofer IZM


Pötter, H.; Hampicke, M.; Lang, K.-D.:
Application Center Smart System Integration - An example for efficient technology transfer. (European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>)
Gessner, T.: Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM: Como, Italy, 23 - 24 March 2010. Berlin: VDE-Verlag, 2010
Fraunhofer IZM


Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.:
Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 177-183
info:doi/10.1109/ESTC.2010.5642971
Fraunhofer IZM


Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R.:
Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Materials science, Vol.28 (2010), No.3, pp.655-662
Fraunhofer IZM


Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R.:
Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test. (International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) <11, 2010, Bordeaux>)
Institute of Electrical and Electronics Engineers -IEEE-: 11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems, EuroSimE 2010: Bordeaux / France; 26.-28.04.2010. Piscataway/NJ: IEEE, 2010, pp. 442-446
info:doi/10.1109/ESIME.2010.5464549
Fraunhofer IZM


Ohlander, A.; Strohhöfer, C.; Bock, K.; Scot, S.M.; Ali, Z.; Musil, P.; Kyselovic, J.:
Assembly of a polymer lab-on-chip device for impedimetric measurements of D-dimers in whole blood. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 2: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 1004-1009
info:doi/10.1109/ECTC.2010.5490824
Fraunhofer IZM


Moro, A.J.; Cywinski, P.J.; Körsten, S.; Mohr, G.J.:
An ATP fluorescent chemosensor based on a Zn(II)-complexed dipicolylamine receptor coupled with a naphthalimide chromophore
Chemical communications, Vol.46 (2010), No.7, pp.1085-1087
info:doi/10.1039/b919661g
Fraunhofer IZM


Benecke, J.; Linde, A.; Dickmann, S.:
Automatic HF model generation and impedance optimization for low voltage DC motors. (International Conference on Electrical Machines (ICEM) <18, 2008, Vilamoura>)
COMPEL. International Journal for computation and mathematics in electrical and electronic engineering, Vol.29 (2010), No.5, pp.1294-1308
info:doi/10.1108/03321641011061506
Fraunhofer IZM


Klein, M.:
Beschreibung der Modellbildung des Thermokompressions-Bondvorganges an galvanisch abgeschiedenen Strukturen
Berlin, TU, Diss., 2010
urn:nbn:de:kobv:83-opus-28724
Fraunhofer IZM


Kaynak, M.; Wietstruck, M.; Scholz, R.; Drews, J.; Barth, R.; Ehwald, K.E.; Fox, A.; Haak, U.; Knoll, D.; Korndörfer, F.; Marschmeyer, S.; Schulz, K.; Wipf, C.; Wolansky, D.; Tillack, B.; Zoschke, K.; Fischer, T.; Kim, Y.S.; Kim, J.S.; Lee, W.-G.; Kim, J.W.:
BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique. (International Electron Devices Meeting (IEDM) <2010, San Francisco/Calif.>)
IEEE Electron Devices Society: IEEE International Electron Devices Meeting, IEDM 2010: San Francisco, 6 - 8 December 2010. Piscataway/NJ: IEEE, 2010, pp. 36.5.1-36.5.4
info:doi/10.1109/IEDM.2010.5703488
Fraunhofer IZM


Mazzuferi, M.; Bovolenta, R.; Bocchi, M.; Braun, T.; Bauer, J.; Jung, E.; Iafelice, B.; Guerrieri, R.; Destro, F.; Borgatti, M.; Bianchi, N.; Simonato, M.; Gambari, R.:
The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells
Biomaterials, Vol.31 (2010), No.6, pp.1045-1054
info:doi/10.1016/j.biomaterials.2009.10.025
Fraunhofer IZM


Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T.:
Carrierless design for handling and processing of ultrathin wafers. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 316-322
info:doi/10.1109/ECTC.2010.5490953
Fraunhofer IZM


Manessis, D.; Boettcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.:
Chip embedding technology developments leading to the emergence of miniaturized system-in-packages. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 2: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 803-810
info:doi/10.1109/ECTC.2010.5490733
Fraunhofer IZM


Schröder, H.:
Chip-to-chip photonic packaging by using thin glass based waveguide substrates on board and module level. (European Conference and Exhibition on Optical Communication (ECOC) <36, 2010, Torino>)
Institute of Electrical and Electronics Engineers -IEEE-: 36th European Conference and Exhibition on Optical Communication, ECOC 2010: 19-23 Sept. 2010, Torino, Italy. New York, NY: IEEE, 2010, Art. 5621158
info:doi/10.1109/ECOC.2010.5621158
Fraunhofer IZM


Deubzer, O.; Nissen, N.F.; Riedel, H.; Gaugele, J.; Ulmer, D.:
A comfortable world without standby - the zero Watt inside (ZeWIn) system. (International Symposium and Environmental Exhibition "Care Innovation" <8, 2010, Vienna>)
Austrian Society for Systems Engineering and Automation: Going Green. CARE INNOVATION 2010. Abstract Book: From legal compliance to energy-efficient products and services, 8th International Symposium and Environmental Exhibition; November 8-11, 2010, VIenna, Austria. Vienna, 2010, pp. 34
Fraunhofer IZM


Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B.:
Comparative study of residual stress measurement techniques with high spatial resolution. (International Conference on Experimental Mechanics (ICEM) <4, 2009, Singapore>)
Quan, C.: Fourth International Conference on Experimental Mechanics 2009. Vol.1: 18 - 20 November 2009, Singapore; ICEM 2009. Bellingham, WA: SPIE, 2010. (Proceedings of SPIE 7522), Paper 752224
info:doi/10.1117/12.851853
Fraunhofer ENAS
Fraunhofer IZM


Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H.:
A comparison of thin film polymers for wafer level packaging. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 2: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 769-776
info:doi/10.1109/ECTC.2010.5490751
Fraunhofer IZM


Jung, E.; Sichert, A.; Hilgarth, A.; Utz, R.:
Concept for a microsystem based implementation of the thermal vision of the pit viper. (KogWis <10, 2010, Potsdam>)
Haack, J. (Ed.) et al.: Proceedings of KogWis 2010: 10th Biannual Meeting of the German Society for Cognitive Science. Potsdam: Univ.-Verlag, 2010. (Potsdam Cognitive Science Series 2), pp. 207
Fraunhofer IZM


Middendorf, A.; Günther, J.; Rothe, M.; Nissen, N.; Lang, K.-D.:
Condition Monitoring for Maintenance, Repair and ReUse: Abstract. (International Symposium and Environmental Exhibition "Care Innovation" <8, 2010, Vienna>)
Austrian Society for Systems Engineering and Automation: Going Green. CARE INNOVATION 2010. Abstract Book: From legal compliance to energy-efficient products and services, 8th International Symposium and Environmental Exhibition; November 8-11, 2010, VIenna, Austria. Vienna, 2010, pp. 33
Fraunhofer IZM


Becker, K.-F.; Kurz, A.; Reichl, H.; Koch, M.; Bauer, J.; Braun, T.:
Contactless material deposition by jetting for heterogeneous system integration. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 1061-1062
info:doi/10.1109/ESTC.2010.5642929
Fraunhofer IZM


Tekin, T.:
Converging technologies and demands toward high-bandwidth optical interconnects. (Conference "Optoelectronic Interconnects and Component Integration" <9, 2010, San Francisco/Calif.>)
Glebov, A.L.: Optoelectronic interconnects and component integration IX: 25 - 27 January 2010, San Francisco, California, United States. Bellingham, WA: SPIE, 2010. (Proceedings of SPIE 7607), Paper 76070E
info:doi/10.1117/12.843043
Fraunhofer IZM


Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.:
Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 184-187
info:doi/10.1109/ESTC.2010.5642901
Fraunhofer IZM


Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B.:
Crack and damage in low-k BEoL stacks under assembly and CPI aspects. (International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) <11, 2010, Bordeaux>)
Institute of Electrical and Electronics Engineers -IEEE-: 11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems, EuroSimE 2010: Bordeaux / France; 26.-28.04.2010. Piscataway/NJ: IEEE, 2010, pp. 484-489
info:doi/10.1109/ESIME.2010.5464540
Fraunhofer IZM


Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.:
Degradation of Heavy Wire Bond Interfaces
Bodo's power systems, (2010), No.6, pp.34-36
Fraunhofer IZM


Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.:
Delamination and combined compound cracking of EMC-copper interfaces. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 114-120
info:doi/10.1109/ECTC.2010.5490893
Fraunhofer IZM


Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.:
Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes. (Loughborough Antennas and Propagation Conference (LAPC) <6, 2010, Loughborough>)
Loughborough Antennas and Propagation Conference, LAPC 2010. Conference proceedings: 8 - 9 November 2010, Burleigh Court Conference Centre, Loughborough University, UK. New York, NY: IEEE, 2010, pp. 257-260
info:doi/10.1109/LAPC.2010.5666160
Fraunhofer IZM


Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.:
Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring. (Loughborough Antennas and Propagation Conference (LAPC) <6, 2010, Loughborough>)
Loughborough Antennas and Propagation Conference, LAPC 2010. Conference proceedings: 8 - 9 November 2010, Burleigh Court Conference Centre, Loughborough University, UK. New York, NY: IEEE, 2010, pp. 265-268
info:doi/10.1109/LAPC.2010.5666257
Fraunhofer IZM


Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.:
Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
International journal of microwave science and technology, Vol.2010 (2010), Art.535307, 9 pp.
info:doi/10.1155/2010/535307
Fraunhofer IZM


Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B.:
Design and development of a miniaturized black body device for in-situ IR-camera calibration. (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM) <12, 2010, Las Vegas/Nev.>)
12th IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Piscataway, NJ: IEEE, 2010, Art. 5501265
info:doi/10.1109/ITHERM.2010.5501265
Fraunhofer IZM


Herz, M.; Horsch, D.; Wachutka, G.; Lueth, T.C.; Richter, M.:
Design of ideal circular bending actuators for high performance micropumps
Sensors and Actuators. A, Vol.163 (2010), No.1, pp.231-239
info:doi/10.1016/j.sna.2010.05.018
Fraunhofer IZM


Feix, G.; Marczok, C.; Hoene, E.; Napierala, T.; Fuerst, D.:
Development of a highly reliable power electronic unit for helicopters. (International Conference on Electrical Systems for Aircraft, Railway and Ship Propulsion (ESARS) <2010, Bologna>)
Electrical Systems for Aircraft, Railway and Ship Propulsion, ESARS 2010: 19-21 Oct. 2010, Bologna. Piscataway, NJ: IEEE, 2010, Art. 5665222
info:doi/10.1109/ESARS.2010.5665222
Fraunhofer IZM


Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M.:
Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 718-721
info:doi/10.1109/ESTC.2010.5642941
Fraunhofer IZM


Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.:
DoE simulations and measurements with the microDAC stress chip for material and package investigations. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 998-1001
info:doi/10.1109/ESTC.2010.5642977
Fraunhofer IZM


Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.:
Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging. (International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) <11, 2010, Xi'an>)
Bi, K.: 11th International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2010: 16 - 19 Aug. 2010, Xi'an, China. Piscataway, NJ: IEEE, 2010, pp. 50-54
info:doi/10.1109/ICEPT.2010.5582369
Fraunhofer IZM


Destro, F.; Borgatti, M.; Iafelice, B.; Gavioli, R.; Braun, T.; Bauer, J.; Böttcher, L.; Jung, E.; Bocchi, M.; Guerrieri, R.; Gambari, R.:
Effects of biomaterials for Lab-on-a-chip production on cell growth and expression of differentiated functions of leukemic cell lines
Journal of materials science. Materials in medicine, Vol.21 (2010), No.9, pp.2653-2664
info:doi/10.1007/s10856-010-4125-2
Fraunhofer IZM


Wege, S.:
Einfluss der Leiterplattenqualität auf Ausfälle elektronischer Baugruppen. (Konferenz "Elektronik-Design - Leiterplatten - Baugruppen" <18, 2010, Fellbach>)
Fachverband Elektronik-Design -FED-: Integration und Effizienz - notwendig und möglich: Konferenzband zur 18. FED-Konferenz "Elektronik-Design - Leiterplatten - Baugruppen 2010", 16.-18. Sept. 2010, Fellbach. Berlin, 2010, pp. 541-554
Fraunhofer IZM


Halser, K.; Huang, L.; Auerswald, E.; Schmidt, R.:
Einfluss der Materialeigenschaften auf das Ausfallverhalten von Leiterplatten-Durchkontaktierungen. (Fachtagung Elektronische Baugruppen und Leiterplatten (EBL) <5, 2010, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2010: Zuverlässigkeit und Systemintegration. Vorträge der 5. DVS/GMM-Tagung in Fellbach am 24. und 25. Februar 2010. Düsseldorf: DVS Media, 2010. (DVS-Berichte 265), pp. 209-213
Fraunhofer IZM


Wolf, J.; Engelmann, G.; Oppermann, H.; Reichl, H.:
Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
2010
Fraunhofer IZM


Adams, T.:
Embedded ultrasonic sensors for automotive radar
Sensors. Online journal, (2010), No.3, March
Fraunhofer IZM


Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.:
Embedding of electronic and system in package using added manufacturing technologies. (European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>)
Gessner, T.: Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM: Como, Italy, 23 - 24 March 2010. Berlin: VDE-Verlag, 2010
Fraunhofer IZM


Ansorge, F.; Heumann, K.; Ifland, D.; Reichl, H.:
Embedding of electronic and system in package using generative processes. (International Conference on Advanced Research in Virtual and Rapid Prototyping (VR@P) <4, 2009, Leiria, Portugal>)
Silva Bartolo, P.J. da: Innovative developments in design and manufacturing: 4th International Conference on Advanced research in virtual and rapid prototyping, Proceedings of VR@P4, 6th to 10th Oct. 2009, Leiria, Portugal. Boca Raton, Fla.: CRC Press, 2010, pp. 301-304
Fraunhofer IZM


Jaeschke, J.; Müller, W.H.; Nissen, N.; Reichl, H.:
Employing solder joints of concave shape for monitoring electromigration independently of material interfaces. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 270-275
info:doi/10.1109/ESTC.2010.5642976
Fraunhofer IZM


Klumpp, A.; Ramm, P.:
Enabling technologies for 3D integration
Michel, B. et al.: Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday. Dresden: ddp Goldenbogen, 2010, pp. 104-119
Fraunhofer IZM


Belleville, M.; Fanet, H.; Fiorini, P.; Nicole, P.; Pelgrom, M.J.M.; Piguet, C.; Hahn, R.; Hoof, C. van; Vullers, R.; Tartagni, M.; Cantatore, E.:
Energy autonomous sensor systems: Towards a ubiquitous sensor technology. (International Workshop on Advances in Sensors and Interfaces (IWASI) <3, 2009, Trani>)
Microelectronics journal, Vol.41 (2010), No.11, pp.740-745
info:doi/10.1016/j.mejo.2010.01.009
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Entwicklung eines Prüfverfahrens zur Klassifizierung von Flussmitteln: Abschlussbericht. Forschungsvorhaben AIF-Projekt 15.711 N; DVS-Nr.: 07.059
2010
Fraunhofer IZM


Eckert, T.:
Entwicklung und Aufbau einer Monitorstruktur für Lotkontakte bei kombinierter Belastung
Stuttgart: Fraunhofer Verlag, 2010
Zugl.: Berlin, TU, Diss., 2010
ISBN 3-8396-0116-9
ISBN 978-3-8396-0116-7
urn:nbn:de:0011-n-1289325
Volltext
Fraunhofer IZM


Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.:
Equivalent circuit modeling of signal vias considering their return current paths. (Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) <2010, Beijing>)
Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2010: 12-16 April 2010, Beijing. Piscataway, NJ: IEEE, 2010, pp. 629-632
info:doi/10.1109/APEMC.2010.5475699
Fraunhofer IZM


Nissen, N.F.; Stobbe, L.; Schischke, K.; Schlösser, A.; Mudgal, S.; Thornton, A.:
EuP and ErP Progress of Implementation: Abstract. (International Symposium and Environmental Exhibition "Care Innovation" <8, 2010, Vienna>)
Austrian Society for Systems Engineering and Automation: Going Green. CARE INNOVATION 2010. Abstract Book: From legal compliance to energy-efficient products and services, 8th International Symposium and Environmental Exhibition; November 8-11, 2010, VIenna, Austria. Vienna, 2010, pp. 28
Fraunhofer IZM


Ramm, P.; Lietaer, N.; Raedt, W. de; Fritzsch, T.; Hilt, T.; Couderc, P.; Val, C.; Mathewson, A.; Razeeb, K.M.; Stam, F.; Klumpp, A.; Weber, J.; Taklo, M.:
The European 3D technology platform (e-CUBES)
Future fab international, (2010), No.34
Fraunhofer IZM


Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.:
Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 3: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 1385-1392
info:doi/10.1109/ECTC.2010.5490637
Fraunhofer IZM


Schmidt, Ralf; Rauschenbach, S.; Hutter, M.; Teichmann, P.:
Fe-basierte lötbare Oberflächen mit reduziertem Phasenwachstum für erhöhte Betriebstemperaturen. (Fachtagung Elektronische Baugruppen und Leiterplatten (EBL) <5, 2010, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2010: Zuverlässigkeit und Systemintegration. Vorträge der 5. DVS/GMM-Tagung in Fellbach am 24. und 25. Februar 2010. Düsseldorf: DVS Media, 2010. (DVS-Berichte 265), pp. 77-81
Fraunhofer IZM


Vogel, D.; Maus, I.; Michel, B.:
fibDAC stress relief - A novel stress measurement approach with high spatial resolution. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 287-291
info:doi/10.1109/ESTC.2010.5642818
Fraunhofer IZM


Schneider-Ramelow, M.; Göhre, J.-M.:
Ein Finish für alles: Immersion-Silber eignet sich zum Golddrahtbonden und bietet sich als multifunktionales Leiterplattenfinish an
Elektronik, (2010), No.17, pp.38-43
Fraunhofer IZM


Schulz, A.; Wotschadlo, J.; Heinze, T.; Mohr, G.J.:
Fluorescent nanoparticles for ratiometric pH-monitoring in the neutral range
Journal of Materials Chemistry, Vol.20 (2010), No.8, pp.1475-1482
info:doi/10.1039/b918427a
Fraunhofer IZM


Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2009/2010
Berlin: Fraunhofer IZM, 2010
urn:nbn:de:0011-n-1407141
Volltext
Fraunhofer IZM


Linz, Torsten; Simon, E.; Walter, H.:
Fundamental analysis of embroidered contacts for electronics in textiles. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 688-692
urn:nbn:de:0011-n-1745712
info:doi/10.1109/ESTC.2010.5642823
Volltext
Fraunhofer IZM


Wolf, M.J.; Reichl, H.; Lang, K.-D.:
Future perspectives: From packaging to system integration
Michel, B. et al.: Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday. Dresden: ddp Goldenbogen, 2010, pp. 16-27
Fraunhofer IZM


Ansorge, F.; Stigler, T.; Heumann, K.; Ifland, D.; Reichl, H.:
Generative Herstelltechnologien im Mikro- und Nanobereich zu Aufbau und Kontaktierung von Mikro-Mechatronischen Systemen. (Workshop Technologien und Werkstoffe der Mikrosystem- und Nanotechnik <2, 2010, Darmstadt>)
VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-: Technologien und Werkstoffe der Mikrosystem- und Nanotechnik. Vorträge des 2. GMM-Workshops 2010. CD-ROM: 10. bis 11. Mai 2010 in Darmstadt. Berlin: VDE-Verlag, 2010. (GMM-Fachbericht 65), 5 pp.
Fraunhofer IZM


Tekin, T.; Zimmermann, L.; Schröder, H.; Dumon, P.; Bogaerts, W.; Galan, J.V.; Sanchis, P.; Whelan-Curtin, W.; Beggs, D.:
Generic packaging concepts in the frame of network of excellence ePIXnet. (Conference "Integrated Optics - Devices, Materials, and Technologies" <14, 2010, San Francisco/Calif.>)
Broquin, J.-E.: Integrated optics: Devices, materials, and technologies XIV: 25 - 27 January 2010, San Francisco, California, United States. Bellingham, WA: SPIE, 2010. (Proceedings of SPIE 7604), Paper 76040I
info:doi/10.1117/12.842999
Fraunhofer IZM


Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.:
Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 269-274
info:doi/10.1109/ECTC.2010.5490961
Fraunhofer IZM


Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.:
GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects. (Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>)
IEEE Components, Packaging, and Manufacturing Technology Society: 60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 3: 1-4 June 2010, Las Vegas, NV, USA. New York, NY: IEEE, 2010, pp. 1647-1652
info:doi/10.1109/ECTC.2010.5490760
Fraunhofer IZM


Schmidt, R.; Zwanzig, M.; Moritz, H.:
Gravitationsgestützte galvanische Abscheidung zur Erzeugung dreidimensional kristallin strukturierter Oberflächen
Galvanotechnik, Vol.101 (2010), No.5, pp.1010-1015
Fraunhofer IZM


Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.:
Heat-removal performance scaling of interlayer cooled chip stacks. (Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM) <12, 2010, Las Vegas/Nev.>)
Institute of Electrical and Electronics Engineers -IEEE-: 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010. Vol.1: Las Vegas, Nevada, USA, 2 - 5 June 2010. New York, NY: IEEE, 2010, Art. 5501254
info:doi/10.1109/ITHERM.2010.5501254
Fraunhofer IZM


Chancerel, P.; Schischke, K.; Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Campo, F.J.:
Helping SMEs to care for eco-innovation beyond legal compliance: Abstract. (International Symposium and Environmental Exhibition "Care Innovation" <8, 2010, Vienna>)
Austrian Society for Systems Engineering and Automation: Going Green. CARE INNOVATION 2010. Abstract Book: From legal compliance to energy-efficient products and services, 8th International Symposium and Environmental Exhibition; November 8-11, 2010, VIenna, Austria. Vienna, 2010, pp. 41-42
Fraunhofer IZM


Maus, S.; Hansen, U.; Leib, J.; Toepper, M.:
Hermetic BSG thin film coatings for harsh environment applications. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2010, Seville>)
Courtois, B.: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010: Seville, Spain, 5-7 May 2010; including the Conference on CAD, Design and Test and the Conference on Microfabrication, Integration and Packaging. Piscataway/NJ: IEEE, 2010, pp. 242-246
Fraunhofer IZM


Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.:
Hermeticity of eutectic bond layers for sensor packages on wafer-level. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 521-525
info:doi/10.1109/ESTC.2010.5642817
Fraunhofer IZM


Wolf, M.J.:
Heterogeneous system integration: A key technology for future microelectronic applications. (European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>)
Gessner, T.: Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM: Como, Italy, 23 - 24 March 2010. Berlin: VDE-Verlag, 2010
Fraunhofer IZM


Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.:
High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures. (European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>)
Gessner, T.: Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM: Como, Italy, 23 - 24 March 2010. Berlin: VDE-Verlag, 2010
Fraunhofer IZM


Döscher, H.; Lilienkamp, G.; Iskra, P.; Daum, W.; Helsch, G.; Becker, S.; Wrobel, R.J.; Weiss, H.; Suchorski, Y.:
High-quality ZrO2 /Si (001) thin films by a sol-gel process: Preparation and characterization
Journal of applied physics, Vol.107 (2010), No.9, Art. 094103
info:doi/10.1063/1.3340830
Fraunhofer IZM


Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.:
Highly integrated advanced power electronic systems for automotive applications. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 139-143
info:doi/10.1109/ESTC.2010.5642963
Fraunhofer IZM


Förster, T.P.:
Hydrogelwellenleiter als Basis eines Biosensors
Berlin, TU, Diss., 2010
urn:nbn:de:kobv:83-opus-27060
Fraunhofer IZM


Schneider-Ramelow, M.; Göhre, J.-M.; Becker, K.-F.; Hutter, M.:
Immersion Ag als Au-drahtbondbares und COB-geeignetes Universal-Finish für die multi-funktionale Leiterplatte. (Fachtagung Elektronische Baugruppen und Leiterplatten (EBL) <5, 2010, Fellbach>)
Lang, K.-D.: Elektronische Baugruppen und Leiterplatten, EBL 2010: Zuverlässigkeit und Systemintegration. Vorträge der 5. DVS/GMM-Tagung in Fellbach am 24. und 25. Februar 2010. Düsseldorf: DVS Media, 2010. (DVS-Berichte 265), pp. 216-222
Fraunhofer IZM


Schlosser, M.; Iskra, P.; Abelein, U.; Lange, H.; Lochner, H.; Sulima, T.; Wiest, F.; Zilbauer, T.; Schmidt, B.; Eisele, I.; Hansch, W.:
The Impact Ionization MOSFET (IMOS) as low-voltage optical detector. (European Symposium on Semiconductor Detectors <11, 2009, Wildbad Kreuth>)
Andricek, L.: New Developments in Radiation Detectors. 11th European Symposium on Semiconductor Detectors 2009. Proceedings: Wildbad Kreuth, Bavaria, Germany, 07-11 June 2009. New York: Elsevier Science, 2010. (Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment 624.2010, Nr.2), pp. 524-527
info:doi/10.1016/j.nima.2010.05.060
Fraunhofer IZM


Böttcher, Lars; Manessis, Dionysios; Ostmann, Andreas; Karaszkiewicz, Stefan; Aschenbrenner, Rolf; Lang, Klaus-Dieter:
Implementation of chip embedding processes for the creation of miniaturized system-in-packages. (Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>)
Institute of Electrical and Electronics Engineers -IEEE-: 3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1: Berlin, Germany, 13 - 16 September 2010. New York, NY: IEEE, 2010, pp. 98-103
info:doi/10.1109/ESTC.2010.5642942
Fraunhofer IZM


Tesarski, S.J.; Holck, O.; Platek, B.T.; Wymyslowski, A.:
Influence of meso-scale analysis parameters of cross-linked polymers on final simulation results. (International Spring Seminar on Electronics Technology (ISSE) <33, 2010, Warsaw>)
Nicolics, J.: 33rd International Spring Seminar on Electronics Technology, ISSE 2010: Polymer Electronics and Nanotechnologies: Towards System Integration: Warsaw, Poland, 12 - 16 May 2010; conference proceedings. Piscataway: IEEE, 2010, pp. 408-411
info:doi/10.1109/ISSE.2010.5547359
Fraunhofer IZM