Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Journal Article
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Journal Article
Fulltext
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Journal Article
Fulltext
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Conference Paper
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Conference Paper
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Conference Paper
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Conference Paper
Fulltext
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramleow, Martin; Lang, Klaus-Dieter
Book Article
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Book Article
Fulltext
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Conference Paper
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.
Journal Article
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
2017Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Conference Paper
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.
Conference Paper
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.
Conference Paper
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.
Conference Paper
2017Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.
Journal Article
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael
Patent
Fulltext
2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.
Conference Paper
2017Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.
Conference Paper
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.
Conference Paper
2017Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.
Journal Article
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.
Journal Article
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.
Conference Paper
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.
Conference Paper
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga
Patent
Fulltext
2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei
Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong
Conference Paper
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, P.; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.
Conference Paper
Fulltext
2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong
Journal Article
Fulltext
2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.
Journal Article
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.
Conference Paper
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, K.; Lang, K.-D.
Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Conference Paper
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, K.; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.
Conference Paper
2016Interposer - an enabling technology for fan-out hybrid pixel modules
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.
Abstract
Fulltext
2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.
Conference Paper
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, K.; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.
Conference Paper
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, K.; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.
Journal Article
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong
Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, K.; Wegner, M.; Fischer, T.; Lang, K.-D.
Conference Paper
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, H.; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.
Conference Paper
2016Wafer level chip scale packaging
Töpper, M.
Book Article
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, C.-A.; Zoschke, K.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.; Lang, K.-D.
Conference Paper
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, H.-D.; Mukhopadhyay, B.; Mackowiak, P.; Kröhnert, K.; Ehrmann, O.; Lang, K.-D.
Journal Article
Fulltext
2015Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.
Journal Article
Fulltext
2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, K.; Manier, C.-A.; Wilke, M.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2015Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D.
Conference Paper
Fulltext
2015Electrical buffer storage for energy harvesting
Hahn, R.; Möller, K.-C.
Book Article
2015HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D.
Conference Paper
2015Hochauflösende Magnetfeld-Positionssensoren
Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K.
Conference Paper
2015Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong
Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2015Mikrobatterie und Verfahren zum Herstellen einer Mikrobatterie
Hahn, Robert
Patent
Fulltext
2015Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, M.; Fischer, T.; Walter, H.; Toepper, M.; Lang, K.-D.
Conference Paper
2015Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong
Conference Paper
2015Sea water magnesium fuel cell power supply
Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D.
Journal Article
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Conference Paper
2015Small fuel cell system with cartridges for controlled hydrogen generation
Hahn, R.; Gabler, A.; Thoma, A.; Glaw, F.; Lang, K.D.
Journal Article
2015A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.
Conference Paper
2015Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding
Zoschke, K.; Lang, K.-D.
Conference Paper
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.
Conference Paper
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, K.; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.
Conference Paper
2014Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, M.; Fischer, T.; Walter, H.; Töpper, M.; Lang, K.-D.
Conference Paper
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Conference Paper
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Conference Paper
2014Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.
Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.
Journal Article
Fulltext
2014Große H2-Zelle mit innenliegenden Kathoden in Form von Taschen
Hahn, Robert; Krebs, Martin; Schmalz, Michael
Patent
Fulltext
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Journal Article
2014Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.
Conference Paper
2014Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, K.; Fischer, T.; Oppermann, H.; Lang, K.-D.
Conference Paper
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.
Journal Article
2014Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.
Conference Paper
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.
Conference Paper
2013An advanced MEMS sensor packaging concept for use in harsh environments
Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong
Conference Paper
2013Bumping technologies
Töpper, Michael; Lu, D.
Book Article
2013Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.
Conference Paper
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.
Conference Paper
Fulltext
2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, K.; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Dalla Piazza, S.; Allegato, G.; Lang, K.-D.
Conference Paper
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.
Conference Paper
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.
Conference Paper
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.
Journal Article
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2013Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D.
Conference Paper
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.
Conference Paper
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.
Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael
Patent
Fulltext
2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.
Conference Paper
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.
Conference Paper
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.
Conference Paper
2012Copper filling of TSVs for interposer applications
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Patent
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Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Kim, S.; Wilke, M.; Klein, M.; Toepper, M.; Solzbacher, F.
Conference Paper
2007Energieversorgung von energieautarken Sensoren
Hahn, R.
Journal Article
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.
Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.
Journal Article
2007Foil type micro PEM fuel cell with self-breathing cathode side
Wagner, S.; Hahn, R.; Reichl, H.
Book Article
2007Gaserzeuger und Verfahren zum Herstellen von Gasen
Hahn, R.
Patent
Fulltext
2007Laser-Display-System auf Basis von MEMS-Scannern
Specht, H.; Kurth, S.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.; Mehner, J.
Conference Paper
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Magnetisches Bauelement mit Spiralspule(n), Arrays solcher Bauelemente und Verfahren zu ihrer Herstellung
Hahn, R.
Patent
Fulltext
2007Mikrobrennstoffzellensystem sowie Verfahren zu seiner Herstellung
Hahn, R.; Hebling, C.; Schmitz, A.
Patent
Fulltext
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.
Conference Paper
2007Performance and reliability test of MEMS optical scanners
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Conference Paper
2007Prospects and yield of electrochemical wafer plating for bumping and signal routing
Dietrich, L.; Töpper, M.; Fritzsch, Th.; Ehrmann, O.; Reichl, H.
Conference Paper
2007Schaltanordnung
Hahn, R.
Patent
Fulltext
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.
Journal Article
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.
Conference Paper
2007Thermal constraints of PEM micro fuel cells for portable electronics
Hahn, R.; Wagner, S.; Reichl, H.
Book Article
2007Thin film encapsulation for secondary batteries on wafer level
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K.
Conference Paper
2007Wafer level processing of silicon arrays for implantable medical devices
Bhandari, R.; Negi, S.; Rieth, L.; Töpper, M.; Normann, R.A.; Solzbacher, F.
Conference Paper
2006Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air
So, Y.-H.; Stark, E.J.; Li, Y.; Kisting, S.; Achen, A.; Baranek, K.; Scheck, D.; Hetzner, J.; Folkenroth, J.J.; Töpper, M.; Baumgartner, T.
Journal Article
2006Assembly and hermetic encapsulation of wafer level secondary batteries
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Brennstoffzellenanordnung
Hahn, R.; Wagner, S.
Patent
Fulltext
2006Brennstoffzellensystem
Holl, K.; Kreidler, B.; Krebs, M.; Ilic, D.; Wagner, S.; Hahn, R.
Patent
Fulltext
2006Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2006Design of integrated inductances based on ferromagnetic LTCC layers
Hahn, R.; Sommer, G.; Dörr, I.; Schwerzel, S.; Reichl, H.; Muller, E.
Journal Article
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2006FEA simulation of thin film coils to power wireless neural interfaces
Kim, S.; Scholz, O.; Zoschke, K.; Harrison, R.; Solzbacher, F.; Klein, M.; Toepper, M.
Conference Paper
2006Hochfrequenzsender sowie Verfahren zu dessen Betrieb
Niedermayer, M.; Hahn, R.; Guttowski, S.; Thomasius, R.; Morgenstern, H.; Schrank, K.
Patent
Fulltext
2006Kanalstruktur zur ortsaufgeloesten Messung von Brennstoffzellen
Hahn, R.
Patent
Fulltext
2006Low profile power inductors based on ferromagnetic LTCC technology
Hahn, R.; Krumbholz, S.; Reichl, H.
Conference Paper
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.
Patent
Fulltext
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
Fulltext
2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.
Conference Paper
2006Polymer based thin film coils as a power module of wireless neural interfaces
Kim, S.; Buschick, K.; Zoschke, K.; Klein, M.; Toepper, M.; Black, D.; Harrison, R.; Tathireddy, P.; Solzbacher, F.
Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.
Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.
Conference Paper
2006WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Journal Article
2005Aufbau und Hermetisierung einer ultraflachen aufladbaren Mikrobatterie
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.
Conference Paper
2005Batterie, insbesondere Mikrobatterie, und deren Herstellung mit Hilfe von Wafer-Level-Technologie
Hahn, R.
Patent
Fulltext
2005Capacitive humidity sensors based on oxidized photoBCB polymer films: Enhanced sensitivity and response time
Tetelin, A.; Pellet, C.; Achen, A.; Toepper, M.
Conference Paper
2005Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C.; Kim, J.Y.; Wolf, M.J.; Engelmann, G.; Ehrmann, O.; Yu, J.; Reichl, H.
Conference Paper
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.
Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.
Conference Paper
2005Herstellung dünner Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewicz, K.; Jürgensen, N.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
2005Herstellung von dünnen Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewics, K.; Jürgensen, N.; Ehrmann, O.; Voigt, A.; Reichl, H.
Journal Article
2005The importance of polymers in wafer-level packaging
Töpper, M.
Conference Paper
2005Low Cost Manufacturing of Foil-Type Micro Fuel Cells
Wagner, S.; Hahn, R.; God, R.; Monser, H.-P.
Journal Article
2005Miniaturisierte, magnetische Bauelemente und Verfahren zu ihrer Herstellung mit Hilfe von Wafer-Level-Technologie
Hahn, R.
Patent
Fulltext
2005A novel 24-kHz resonant scanner for high-resolution laser display
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2005Novel Hermetic WLP Technology using Low-Temperature Passivation
Töpper, M.; Leib, J.; Mund, D.
Conference Paper
2005Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D.
Conference Paper
2005Ein resonanter 24 kHz Scanner für hoch auflösende Laserdisplays
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.
Conference Paper
2005A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
Töpper, M.; Voigt, A.; Heinrich, M.; Hauck, K.; Mientus, R.; Gruetzner, G.; Ehrmann, O.
Conference Paper
2005The status of micro fuel cell technology and its contribution to the energy supply of autonomous sensors
Hahn, R.; Wagner, S.; Reichl, H.
Conference Paper
2005Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.
Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.
Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components: A Key Technology for the System in Package Approach
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.
Conference Paper
2005Water solubility and diffusivity in BCB resins used in microelectronic packaging and sensor applications
Tetelin, A.; Achen, A.; Pouget, V.; Pellet, C.; Töpper, M.; Lachaud, J.-L.
Conference Paper
2005WLCSP technology direction
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.
Conference Paper
2005WLP Photoresists for the 21st Century
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Fischer, T.; Baumgartner, T.; Reichl, H.
Conference Paper
2004Application of micromirror arrays for Hadamard transform optics
Hanf, M.; Kurth, S.; Billep, D.; Hahn, R.; Faust, W.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2004Autonomous energy supply for electronic grains and wireless sensors
Hahn, R.
Journal Article
2004Brennstoffzellenstack mit Bipolarplatten
Hahn, R.
Patent
Fulltext
2004Characterization of electroplated leadfree bumps
Wolf, M.J.; Jang, S.-Y.; Ehrmann, O.; Reichl, H.; Paik, K.-W.
Journal Article
2004Development of a planar micro fuel cell with thin film and micro patterning technologies
Hahn, R.; Wagner, S.; Schmitz, A.; Reichl, H.
Conference Paper
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.
Journal Article
2004A MEMs based planar micro fuel cell with self breathing cathode side
Wagner, S.; Hahn, R.; Krumbholz, S.; Reichl, H.
Conference Paper
2004New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Leib, R.; Töpper, M.
Conference Paper
2004Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates
Töpper, M.; Mund, D.; Leib, J.
Conference Paper
2004Schaltungsmodul, Verfahren zum Herstellen eines Schaltungsmoduls und Traeger zum Aufnehmen von Halbleiterelementen
Hahn, R.; Lang, O.
Patent
Fulltext
2004Stability of planar PEMFC in printed circuit board technology
Schmitz, A.; Wagner, S.; Hahn, R.; Uzun, H.; Hebling, C.
Journal Article
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.
Conference Paper
2004The wafer-level packaging evolution
Töpper, M.; Garrou, P.
Journal Article
2003CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Schreiber, T.; Reichl, H.; Paik, K.W.
Journal Article
2003Interfacial adhesion analysis of BCB / TiW / Cu / PbSn technology in wafer level packaging
Töpper, M.; Achen, A.; Reichl, H.
Conference Paper
2003Thermal management of portable micro fuel cell stacks
Hahn, R.; Krumm, M.; Reichl, H.
Conference Paper
2002300mm Wafer Bumping: Printing Systems and Technologies
Töpper, M.; Kloesner, J.; Kasulke, P.; Denise, O.; Myers, J.; Heyen, R.
Conference Paper
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Reichl, H.; Paik, K.W.
Journal Article
2002Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Reichl, H.; Paik, K.W.
Journal Article
2001Application of high and low wafer bonding processes for bulk micromachined components
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Gessner, T.
Conference Paper
2001Einsatz von Mikrospiegel-Arrays zur Lichtmodulation in einem Hadamard-Transformations-Spektrometer
Hanf, M.; Kurth, S.; Faust, W.; Hahn, R.; Heinz, S.; Dötzel, W.; Gessner, T.
Conference Paper
2001Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen
Küchler, M.; Hiller, K.; Hahn, R.; Bertz, A.; Gessner, T.
Conference Paper
2001Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.
Patent
Fulltext
2001"SECAP" International Advanced Packaging Consortium: Formed to Standardize Process Equipment for Wafer Level Packaging Technologies for 300mm
Töpper, M.; Reichl, H.
Journal Article
2000Characteristics of fritting contacts utilized for micromachined wafer probe cards
Itoh, T.; Suga, T.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Reichl, H.
Journal Article
2000The european CSP perspective
Töpper, M.; Schubert, A.; Reichl, H.
Journal Article
2000Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.
Conference Paper
2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J.
Journal Article
2000Future Power Supplies for Portable Electronics and Their Environmental Issues
Hahn, R.; Müller, J.
Conference Paper
2000High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Industrial Working Group for Lead Free Interconnection Systems in Electronics
Hahn, R.; Müller, J.
Conference Paper
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.
Conference Paper
2000Reliability of flip chip and chip size packages
Reichl, H.; Schubert, A.; Töpper, M.
Conference Paper
2000Surface modification due to technological treatment evaluated by SPM and XPS techniques
Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K.
Conference Paper
2000Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Verfahren und Vorrichtung zur Herstellung eines Verbundes zwischen einem Traegerkoerper und mindestens einer darin enthaltenen Komponente
Krabe, D.; Lang, G.; Springer, A.; Hagenbuechle, M.; Buschick, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Patent
Fulltext
2000Wafer level chip size package challenges
Töpper, M.; Reichl, H.
Journal Article
2000Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.
Conference Paper
2000Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H.
Journal Article
1999Analogously working micromirror arrays
Kehr, K.; Kurth, S.; Mehner, J.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.
Conference Paper
1999Anwendung von Niedertemperatur-Bondverfahren für die Herstellung von Microscanner-Arrays hoher Frequenz
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.
Conference Paper
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.
Book Article
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.
Journal Article
1999Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
Hiller, K.; Wiemer, M.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Milekhin, A.; Friedrich, M.; Zahn, D.
Conference Paper
1999High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.
Journal Article
1999Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K.; Töpper, M.; Hahn, R.; Ehrmann, O.; Reichl, H.
Conference Paper
1999Low cost electroless copper metallization of BCB for high-density wiring systems
Töpper, M.; Stolle, T.; Reichl, H.
Conference Paper
1999Low-temperature approaches for fabrication of high-frequency microscanners
Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Wiemer, M; Schubert, I.
Conference Paper
1999A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J.
Journal Article
1999A MCM-D-type module for the ATLAS pixel detector
Becks, K.-H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Truzzi, C.; Wolf, J.
Conference Paper
1999Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Journal Article
1999Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H.
Conference Paper
1999Synchronously working micromirrors for beam steering: Design and application aspects
Kurth, S.; Kehr, K.; Mehner, J.; Kaufmann, C.; Hahn, R.; Seidel, R.; Dötzel, W.; Gessner, T.
Conference Paper
1999Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Conference Paper
1998Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Töpper, M.; Scherpinski, K.; Hahn, R.; Ehrmann, O.; Reichl, H.; Schmaus, C.; Bechtold, F.
Conference Paper
1998Deployment of State-of -the-Art Technology for Implantable Medical Systems
Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
Dietrich, L.; Engelmann, G.; Ehrmann, O.; Reichl, H.
Conference Paper
1998Low thermal resistivity adhesive bonding of ceramic substrates to high performance coolers for the fabrication of power MCMs
Hahn, R.; Hoehne, J.; Schmidt, M.; Reichl, H.
Journal Article
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.
Journal Article
1998A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.
Conference Paper
1998Novel packaging concept for high power multichip modules
Hahn, R.; Töpper, M.; Reichl, H.
Journal Article
1998Thermal measurements with liquid cooled microchannel heat sinks
Glaw, V.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K.
Conference Paper
1997Dünnfilmmehrlagenverdrahtung mit photosensitivem BCB auf Keramik-, Dickschicht- und LTCC-Substraten für MCM
Töpper, M.; Glaw, V.; Hahn, R.; Schaldach, M.; Schmaus, C.; Bechtold, F.; Reichl, H.
Conference Paper
1997Effektives Simulationstool für das thermische Management elektronischer Packages
Kamp, A.; Hahn, R.; Schmidt, M.; Dai, W.; Reichl, H.
Journal Article
1997Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.
Conference Paper
1997High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.
Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.
Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Micro channel cooler for application for micro- and power-electronics
Hahn, R.; Wittke, K.; Glaw, V.; Töpfer, M.; Ginolas, A.; Brunner, D.
Conference Paper
1997Multichip-modules for high frequency applications
Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H.
Conference Paper
1997Shear test for adhesion measurement of small structures
Schammler, G.; Buschick, K.; Hahn, R.; Reichl, H.
Conference Paper
1997System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H.
Conference Paper
1997Thermal conductivity of PbSn and AuSn flip chip bumps
Hahn, R.; Kamp, A.; Reichl, H.
Conference Paper
1997Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applications
Hahn, R.; Kamp, A.; Hoehne, J.; Töpfer, M.; Reichl, H.
Conference Paper
1997Der Weg zum Chip-Size-Package
Töpper, M.; Reichl, H.
Journal Article
1996Alternative solder deposition using transfer technique
Töpper, M.; Wolf, J.; Reichl, H.
Conference Paper
1996Design concept for singlemode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.
Journal Article
1996Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Integrated thermo-optical switch based on polymer rib waveguides
Töpper, M.; Moosburger, R.; Fischbeck, G.; Kostrzewa, C.; Petermann, K.
Conference Paper
1996MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H.
Conference Paper
1996Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O.
Book Article
1996Metallisierung von Polymeren für Dünnfilmverdrahtungen
Töpper, M.; Schmidt, R.; Hannemann, M.; Schammler, G.; Hempel, G.
Journal Article
1996Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.
Patent
Fulltext
1996The photolysis of pure and mixed palladium acetate thin films
Töpper, M.; Stolle, T.; Wäsche, M.
Journal Article
1996Redistribution technology for chip scale package using photosensitive BCB
Töpper, M.; Simon, J.; Reichl, H.
Journal Article
1996Thin film technologies for single-mode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.; Krabe, D.; Reichl, H.
Conference Paper
1995A comparison of flip chip technology with chip size packages
Simon, J.; Töpper, M.; Reichl, H.; Chmiel, G.
Conference Paper
1995On-Chip Umverdrahtung - eine Möglichkeit zur Anpassung von Chip- und Leiterplattenraster
Chmiel, G.; Töpper, M.; Simon, J.; Reichl, H.
Conference Paper
1995Planare Multichip-Einbettung bei Dünnfilm-Hybriden auf keramischen Substraten
Buschik, K.; Chmiel, G.; Ehrmann, O.; Glaw, V.; Paredes, A.; Wolf, J.
Book Article
1994Thinfilm multichip modules - Process development using photosensitive benzocyclobutane
Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A.
Conference Paper