Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2021Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration
Braun, T.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Schneider-Ramelow, M.		Conference Paper
2021Optisches System, Trägersubstrat und Verfahren zum Herstellen eines optischen Systems:
Manier, Charles-Alix; Oppermann, Hermann; Zoschke, Kai; Tekin, Tolga		Patent
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2020Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, K.; MacKowiak, P.; Kröhnert, K.; Oppermann, H.; Jürgensen, N.; Wietstruck, M.; Göritz, A.; Tolunay Wipf, S.; Kaynak, M.; Lang, K.-D.		Conference Paper
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin		Conference Paper
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2020Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries
Elia, G.A.; Greco, G.; Kamm, P.H.; Garcia-Moreno, F.; Raoux, S.; Hahn, R.		Journal Article
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2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.		Journal Article
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.		Journal Article
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter		Conference Paper
2019Fabrication of high voltage capable TSV using backside via last process and laser abblation of dry film BCB
MacKowiak, P.; Wilke, M.; Wöhrmann, M.; Gernhard, R.; Zoschke, K.; Lang, K.-D.; Scheider-Ramelow, M.; Ngo, H.-D.		Conference Paper
2019Herstellung extrem kleiner Batterien mit Dünnwafer-Bondprozessen
Hahn, R.; Hoeppner, K.; Ferch, M.; Zoschke, K.; Lang, K.-D.		Conference Paper
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter		Conference Paper
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.		Conference Paper
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.		Journal Article
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2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter		Conference Paper
2019Moduleinheit mit integrierten Antennen
Ndip, Ivan; Zoschke, Kai; Lang, Klaus-Dieter		Patent
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2019An Overview about the Excimer Laser Ablation of Different Polymers and their Application for Wafer and Panel Level Packaging
Gernhardt, R.; Wöhrmann, M.; Müller, F.; Hauck, K.; Töpper, M.; Lang, K.-D.; Hichri, H.; Arendt, M.		Conference Paper
2019Panel Level Packaging - From Idea to Industrialization -
Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D.		Conference Paper
2019Ultra thin force and acceleration sensor embedded in flexible thin film substrates using thin chip handling, bonding and carrier release technologies
MacKowiak, P.; Erbacher, K.; Zoschke, K.; Al-Magazachi, S.; Bäuscher, M.; Schiffer, M.; Lang, K.-D.; Ngo, H.-D.		Conference Paper
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.		Conference Paper
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter		Conference Paper
2018Characteristics of Li-ion micro batteries fully batch fabricated by micro-fluidic MEMS packaging
Hahn, R.; Ferch, M.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Elia, G.A.		Journal Article
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong		Journal Article
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2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.		Conference Paper
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.		Conference Paper
2018The Evolution of Panel Level Packaging
Aschenbrenner, Rolf; Töpper, M.; Braun, Tanja; Ostmann, A.		Conference Paper
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.		Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.		Conference Paper
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.		Conference Paper
2018Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M		Conference Paper
2018Influence of the electrode nano/microstructure on the electrochemical properties of graphite in aluminum batteries
Greco, G.; Tatchev, D.; Hoell, A.; Krumrey, M.; Raoux, S.; Hahn, R.; Elia, G.A.		Journal Article
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2018Investigation of low temperature bonding process using indium bumps
Fritzsch, Thomas; Kavianpour, F.; Rothermund, Mario; Oppermann, Hermann; Ehrmann, Oswin; Lang, Klaus-Dieter		Journal Article
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens		Journal Article
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2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter		Book Article
2018Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.		Conference Paper
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter		Book Article
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2018Simulation and Electrical Characterization of a Novel 2D-Printed Incontinence Sensor with Conductive Polymer PEDOT:PSS for Medical Applications
Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong		Conference Paper
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.		Conference Paper
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.		Conference Paper
2017Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs
Kasinski, K.; Grybos, P.; Kmon, P.; Maj, P.; Szczygiel, R.; Zoschke, K.		Journal Article
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.		Conference Paper
2017Development of micro batteries based on micro fluidic MEMS packaging
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.		Conference Paper
2017Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
Wipf, S.T.; Göritz, A.; Wietstruck, M.; Cirillo, M.; Wipf, C.; Zoschke, K.; Kaynak, M.		Conference Paper
2017Fabrication of 3D hybrid pixel detector modules based on TSV processing and advanced flip chip assembly of thin read out chips
Zoschke, K.; Opperman, H.; Fritzsch, T.; Rothermund, M.; Oestermann, U.; Grybos, P.; Kasinski, K.; Maj, P.; Szczygiel, R.; Voges, S.; Lang, K.-D.		Conference Paper
2017Innovative excimer laser dual damascene process for ultra-fine line multi-layer routing with 10 µm pitch micro-vias for wafer level and panel level packaging
Woehrmann, M.; Hichri, H.; Gernhardt, R.; Hauck, K.; Braun, T.; Toepper, M.; Arendt, M.; Lang, K.-D.		Conference Paper
2017Insights into the reversibility of aluminum graphite batteries
Elia, G.A.; Hasa, I.; Greco, G.; Diemant, T.; Marquardt, K.; Hoeppner, K.; Behm, R.J.; Hoell, A.; Passerini, S.; Hahn, R.		Journal Article
2017Klebeverfahren zum Verbinden zweier Wafer
Zoschke, Kai; Töpper, Michael		Patent
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2017Laser direct patterning of polymer resins for structured adhesive wafer to wafer bonding
Zoschke, Kai; Lang, K.-D.		Conference Paper
2017Micro patterned test cell arrays for high-throughput battery materials research
Hahn, R.; Ferch, M.; Hoeppner, K.; Queisser, M.; Marquardt, K.; Elia, G.A.		Conference Paper
2017A novel wafer-level packaging method for a direct-backside-exposure pressure sensor anodically bonded to a silicon-interposer with a thin-film glass layer
Hu, X.; Bäuscher, M.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Lang, K.-D.; Fritz, M.; Hansen, U.; Maus, S.; Gyenge, O.; Ngo, H.-D.		Conference Paper
2017Polyacrylonitrile Separator for High-Performance Aluminum Batteries with Improved Interface Stability
Elia, G.A.; Ducros, J.-B.; Sotta, D.; Delhorbe, V.; Brun, A.; Marquardt, K.; Hahn, R.		Journal Article
2017Progress on TSV technology for Medipix3RX chip
Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.		Journal Article
2017The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter		Conference Paper
2017Silizium Einbett-Technologie mittels Wafer Level Packaging für GaN Leistungselektronik-Bauteilen
Manier, Charles-Alix; Gernhardt, R.; Zoschke, K.; Moens, P.; Oppermann, H.; Lang, K.-D.		Conference Paper
2017Stress-compensating MEMS sensor assembly
Etschmaier, H.; Singulani, A.; Tak, C.; Zoschke, K.; Jaeger, D.; Opperman, H.		Conference Paper
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.		Conference Paper
2017Verfahren zur Herstellung eines Halbleiterbauelements und Halbleiterbauelement
Oppermann, Hermann; Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Tekin, Tolga		Patent
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2016BCB-based dry film low k permanent polymer with sub 4 µm vias for advanced WLP and FO-WLP applications
Toepper, Michael; Braun, Tanja; Gernhardt, Robert; Wilke, Martin; Mackowiak, Piotr; Lang, Klaus-Dieter; O'Connor, Corey; Barr, Robert; Aoude, Tina; Calvert, Jeffrey; Gallagher, Michael; Kim, Jong-Uk; Politis, Andrew; Iagodkine, Ellisei		Conference Paper
2016Characterization of anodic bondable LTCC for wafer-level packaging
Hu, Xiaodong; Bäuscher, Manuel; MacKowiak, Piotr; Zhang, Yucheng; Hoelck, Ole; Walter, Hans; Ihle, Martin; Ziesche, Steffen; Hansen, Ulli; Maus, Simon; Gyenge, Oliver; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klausdieter; Ngo, Haduong		Conference Paper
2016Development and fabrication of a very high-g sensor for very high impact applications
Mackowiak, Piotr; Mukhopadhyay, B.; Hu, X.; Ehrmann, O.; Lang, K.-D.; Linke, S.; Chu, A.; Ngo, H.-D.		Conference Paper
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2016Development of a novel high reliable Si-based trace humidity sensor array for aerospace and process industry
Zhou, Shuyao; Dao, Q.C.; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Weiland, T.; Pohl, Olaf; Noack, Volker; Ngo, Ha Duong		Journal Article
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2016Development of edgeless TSV X-ray detectors
Sarajlic, M.; Zhang, J.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Wilke, M.; Zoschke, K.; Graafsma, H.		Journal Article
2016Embedding of wearable electronics into smart sensor insole
Hubl, M.; Pohl, O.; Noack, V.; Hahlweg, P.; Ehm, C.; Derleh, M.; Weiland, T.; Schick, E.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Schwartzinger, T.; Jablonski, T.; Maurer, J.-P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.		Conference Paper
2016Energy-autarkic smart sensor insole for telemedical patient monitoring
Hubl, M.; Weiland, T.; Pohl, O.; Noack, V.; Schlegel, J.; Müller, H.-H.; Hampicke, D.; Gregorius, P.; Hahn, R.; Ehrmann, O.; Lang, K.-D.; Shin, E.; Ngo, H.-D.		Conference Paper
2016Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
Zoschke, Kai; Lang, Klaus-Dieter		Conference Paper
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, Markus; Juergensen, Nils; Lutz, Mario; Wilke, Martin; Duan, Xiaomin; Ndip, Ivan; Töpper, Michael; Lang, Klaus-Dieter		Conference Paper
2016Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
Kroehnert, Kevin; Glaw, V.; Engelmann, G.; Jordan, R.; Samulewicz, K.; Hauck, K.; Cronin, R.; Robertson, M.; Ehrmann, O.; Lang, K.-D.		Conference Paper
2016Interposer - an enabling technology for fan-out hybrid pixel modules: Abstract
Fritzsch, Thomas; Zoschke, K.; Wöhrmann, M.; Lang, K.-D.		Conference Paper
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2016Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design
Hu, X.; Meng, M.; Baeuscher, M.; Hansen, U.; Maus, S.; Gyenge, O.; Mackowiak, P.; Mukhopadhyay, B.; Vokmer, N.; Ehrmann, O.; Dieter Lang, K.; Ngo, H.-D.		Conference Paper
2016Laser direct patterning of dry etch BCB adhesive layers for low temperature permanent wafer-to-wafer bonding
Zoschke, Kai; Kim, J.-U.; Wegner, M.; Gallagher, M.; Barr, R.; Calvert, J.; Töpper, M.; Lang, K.-D.		Conference Paper
2016LiTaO3 capping technology for wafer level chip size packaging of SAW filters
Zoschke, Kai; Wegner, M.; Lopper, C.; Klein, M.; Gruenwald, R.; Schoenbein, C.; Lang, K.-D.		Conference Paper
2016Novel High Reliable Si-Based Trace Humidity Sensor Array for Aerospace and Process Industry
Zhou, S.Y.; Mukhopadhyay, B.; Mackowiak, P.; Ehrmann, O.; Kröhnert, K.; Gernhardt, R.; Lang, K.D.; Woratz, M.; Herrmann, P.; Volkmer, N.; Pohl, O.; Noack, V.; Ngo, H.D.		Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.		Conference Paper
2016An Overview and Future Perspectives of Aluminum Batteries
Elia, G.A.; Marquardt, K.; Hoeppner, K.; Fantini, S.; Lin, R.; Knipping, E.; Peters, W.; Drillet, J.-F.; Passerini, S.; Hahn, R.		Journal Article
2016Packaging solution for a novel silicon-based trace humidity sensor using coulometric method
Mackowiak, Piotr; Mukhopadhyay, Biswajit; Ehrmann, Oswin; Lang, Klaus-Dieter; Woratz, Michael; Herrmann, Peter; Pohl, Olaf; Noack, Volker; Zhou, Suyao; Dao, Quoc Cuong; Hoang, Thanh Hai; Ngo, Ha-Duong		Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.		Conference Paper
2016Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
Zoschke, Kai; Wegner, M.; Fischer, T.; Lang, K.-D.		Conference Paper
2016A thermally enhanced bond interface for pixelated LEDs in adaptive front lighting systems
Oppermann, Hermann; Brink, M.; Ehrmann, O.; Groetsch, S.; Plößl, A.; Pfeuffer, A.; Malm, N. von; Groß, T.; Fiederling, R.; Kürschner, R.; Lang, K.-D.		Conference Paper
2016Wafer level chip scale packaging
Töpper, Michael		Book Article
2016Wafer Level Packaging and System Integration
Wolf, M. Jürgen; Ehrmann, Oswin		Book Article
2016Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems
Manier, Charles-Alix; Zoschke, Kai; Wilke, Martin; Oppermann, Hermann; Ruffieux, David; Piazza, Silvio dalla; Suni, Tommi; Dekker, James; Allegato, Giorgio; Lang, Klaus-Dieter		Conference Paper
2016A WSi-WSiN-Pt metallization scheme for silicon carbide-based high temperature microsystems
Ngo, Ha-Duong; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter		Journal Article
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2015Advanced liquid-free, piezoresistive, SOI-based pressure sensors for measurements in harsh environments
Ngo, H.D.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.		Journal Article
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2015Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices
Zoschke, Kai; Manier, Charles-Alix; Wilke, Martin; Oppermann, Hermann; Ruffieux, D.; Dekker, J.; Jaakkola, A.; Piazza, S. dalla; Allegato, G.; Lang, Klaus-Dieter		Conference Paper
2015Design, fabrication, and testing of silicon-integrated Li-ion secondary micro batteries with interdigital electrodes
Hoeppner, K.; Ferch, M.; Froebe, A.; Gernhardt, R.; Hahn, R.; Mackowiak, P.; Mukhopadhyay, B.; Roder, S.; Saalhofen, I.; Lang, K.-D.		Conference Paper
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2015Electrical buffer storage for energy harvesting
Hahn, R.; Möller, K.-C.		Book Article
2015HIPIMS in full face erosion circular cathode for semiconductor applications
Bellido-Gonzalez, V.; Papa, F.; Azzopardi, A.; Brindley, J.; Li, H.; Vetushka, A.; Kroehnert, K.; Ehrmann, O.; Lang, K.-D.; Mackowiak, P.; Fernandez, I.; Wennberg, A.; Ngo, H.D.		Conference Paper
2015Hochauflösende Magnetfeld-Positionssensoren
Paul, J.; Knoll, H.; Lenkl, A.; Tide, R.; Theis, M.; Saumer, M.; Vetter, C.; Piorra, A.; Meyners, D.; Lofink, F.; Fichtner, S.; Wagner, B.; Zoschke, K.		Conference Paper
2015Investigation of DRIE etching performance on signal quality of a SOI based pressure sensors for harsh environments
Mackowiak, Piotr; Meinecke, Fabian; Mukhopadhyay, Biswajit; Hoang, Thanh Hai; Dao, Quoc-Cuong; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha-Duong		Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.		Conference Paper
2015Mikrobatterie und Verfahren zum Herstellen einer Mikrobatterie
Hahn, Robert		Patent
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2015Next generation thin film polymers for WLP applications and their mechanical characterization
Woehrmann, Markus; Fischer, Thorsten; Walter, Hans; Toepper, Michael; Lang, Klaus-Dieter		Conference Paper
2015Plasma enhanced atomic layer deposition by means of an Anode Layer Ion Source for electronics packaging applications
Bellido-Gonzalez, V.; Monaghan, D.; Daniel, B.; Li, Heqing; Papa, Frank; Kröhnert, Kevin; Ehrmann, Oswin; Lang, Klaus-Dieter; Mackowiak, Piotr; Ngo, Ha-Duong		Conference Paper
2015Sea water magnesium fuel cell power supply
Hahn, R.; Mainert, J.; Glaw, F.; Lang, K.-D.		Journal Article
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.		Conference Paper
2015Small fuel cell system with cartridges for controlled hydrogen generation
Hahn, R.; Gabler, A.; Thoma, A.; Glaw, F.; Lang, K.D.		Journal Article
2015A sub-4 µm via technology of thinfilm polymers using scanning laser ablation
Töpper, M.; Hauck, K.; Schima, M.; Jaeger, D.; Lang, K.-D.		Conference Paper
2015Technologies for wafer level MEMS capping based on permanent and temporary wafer bonding
Zoschke, Kai; Lang, Klaus-Dieter		Conference Paper
2015Thin wafer handling using mechanical- or laser-debondable temporary adhesives
Fleming, D.; Kim, J.-U.; Okada, J.; Wang, K.; Gallagher, M.; Barr, B.; Calvert, J.; Zoschke, K.; Wegner, M.; Töpper, M.; Rapps, T.; Griesbach, T.; Lutter, S.		Conference Paper
2015Wafer level packaging for hermetical encapsulation of MEMS resonators
Manier, Charles-Alix; Zoschke, Kai; Oppermann, Hermann; Ruffieux, D.; Piazza, S. dalla; Suni, T.; Dekker, J.; Allegato, G.		Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.		Journal Article
2014Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Zoschke, Kai; Wilke, M.; Wegner, M.; Kaletta, K.; Manier, C.A.; Oppermann, H.; Wietstruck, M.; Tillack, B.; Kaynak, M.; Lang, K.-D.		Conference Paper
2014Characterization of thin polymer films with the focus on lateral stress and mechanical properties and their relevance to microelectronics
Wöhrmann, Markus; Fischer, Thorsten; Walter, Hans; Töpper, Michael; Lang, Klaus-Dieter		Conference Paper
2014A compact, versatile, miniature timing microsystem using two co-integrated wafer-level packaged silicon resonators
Ruffieux, D.; Scolari, N.; Le, T.C.; Beuchat, P.A.; Jaakkola, A.; Pensala, T.; Dekker, J.; Dixit, P.; Manier, C.A.; Zoschke, K.; Oppermann, H.		Conference Paper
2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf		Conference Paper
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter		Conference Paper
2014Evaluation and signal conditioning of piezoresistive silicon pressure sensor
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.-D.; Ngo, H.-D.		Conference Paper
2014Flip chip assembly of thinned chips for hybrid pixel detector applications
Fritzsch, T.; Zoschke, K.; Woehrmann, M.; Rothermund, M.; Huegging, F.; Ehrmann, O.; Oppermann, H.; Lang, K.D.		Journal Article
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2014Große H2-Zelle mit innenliegenden Kathoden in Form von Taschen
Hahn, Robert; Krebs, Martin; Schmalz, Michael		Patent
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2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter		Conference Paper
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter		Journal Article
2014Modeling and optimization of BiCMOS embedded through-silicon vias for RF-grounding
Wietstruck, M.; Kaynak, M.; Marschmeyer, S.; Wipf, C.; Tekin, I.; Zoschke, K.; Tillack, B.		Conference Paper
2014Temporary handling technology for advanced wafer level packaging applications based on adhesive bonding and laser assisted de-bonding
Zoschke, Kai; Fischer, Thorsten; Oppermann, Hermann; Lang, Klaus-Dieter		Conference Paper
2014A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µ W RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.-C.; Dalla Piazza, S.; Staub, F.; Zoschke, K.; Manier, C.-A.; Oppermann, H.; Suni, T.; Dekker, J.; Allegato, G.		Journal Article
2014Wireless pressure sensor system
Gao, X.; Mackowiak, P.; Mukhopadhyay, B.; Ehrmann, O.; Lang, K.D.; Ngo, H.D.		Conference Paper
20133D integration of standard integrated circuits
Puschmann, R.; Böttcher, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.; Ziesmann, M.		Conference Paper
2013An advanced MEMS sensor packaging concept for use in harsh environments
Berg, Jochen von; Cavalloni, Claudio; Mukhopadhyay, Biswajit; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter; Ngo, Ha Duong		Conference Paper
2013Bumping technologies
Töpper, Michael; Lu, D.		Book Article
2013Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.		Conference Paper
2013Design, fabrication and testing of silicon-integrated Li-ion secondary micro batteries with side-by-side electrodes
Hoeppner, K.; Ferch, M.; Eisenreich, M.; Marquardt, K.; Hahn, R.; MacKowiak, P.; Mukhopadhyay, B.; Ngo, H.-D.; Gernhardt, R.; Toepper, M.; Lang, K.-D.		Conference Paper
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2013Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies
Zoschke, Kai; Manier, C.-A.; Wilke, M.; Jürgensen, N.; Oppermann, H.; Ruffieux, D.; Dekker, J.; Heikkinen, H.; Piazza, S. dalla; Allegato, G.; Lang, K.-D.		Conference Paper
2013Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging
Hansen, U.; Maus, S.; Töpper, M.		Conference Paper
2013A miniature timing microsystem using two silicon resonators
Ruffieux, D.; Baborowski, J.; Scolari, N.; Le, T.C.; Jaakkola, A.; Pensala, T.; Dekker, J.; Manier, C.A.; Zoschke, K.; Oppermann, H.		Conference Paper
2013Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
Lin, D.-S.; Wodnicki, R.; Zhuang, X.; Woychik, C.; Thomenius, K.E.; Fisher, R.A.; Mills, D.M.; Byun, A.J.; Burdick, W.; Khuri-Yakub, P.; Bonitz, B.; Davies, T.; Thomas, G.; Otto, B.; Töpper, M.; Fritzsch, T.; Ehrmann, O.		Journal Article
2013Silicon interposers with TSVs - a basis for wafer level 3D system integration
Zoschke, Kai; Wolf, J.; Ehrmann, Oswin; Lang, Klaus-Dieter		Conference Paper
2013Strain energy driven adhesion test for adherence characterization of thin polymer films for microelectronic applications
Wöhrmann, M.; Töpper, M.; Lang, K.-D.		Conference Paper
2013Temporary and Permanent Adhesives for Thin Wafer Handling and Assembly
Oliver, M.; Kim, J.-U.; Wang, Z.; Okada, J.; Iagodkine, E.; Choubey, A.; Anzures, E.; Fleming, D.; Dhoble, A.; Truong, C.; Gallagher, M.; Zoschke, K.; Wegner, M.; Töpper, M.		Conference Paper
2013Vacuum packaging at wafer level for MEMS using gold-tin metallurgy
Manier, C.-A.; Zoschke, K.; Oppermann, H.; Ruffieux, D.; Dalla Piazza, S.; Suni, T.; Dekker, J.; Allegato, G.		Conference Paper
2013Verfahren zum Herstellen einer Beschichtung eines Substrats
Wilke, Martin; Töpper, Michael		Patent
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2013A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks
Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.		Conference Paper
2013Via-last technology for the interconnection of flash and processor chip for mobile applications
Puschmann, R.; Böttcher, M.; John, P.; Bartussek, I.; Manier, C.; Zoschke, K.; Grafe, J.; Ziesmann, M.		Conference Paper
2013Wafer level packaging for ultra thin (6 µm) high brightness LEDs using embedding technology
Kleff, J.; Töpper, M.; Dietrich, L.; Oppermann, H.; Herrmann, S.		Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.		Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.		Conference Paper
2012Coating techniques for 3D-packaging applications
Töpper, M.; Wilke, M.; Röder, J.; Fischer, T.; Lopper, C.		Conference Paper
2012Copper filling of TSVs for interposer applications
Jurgensen, N.; Huynh, Q.H.; Engelmann, G.; Ngo, H.-D.; Ehrmann, O.; Lang, K.-D.; Uhlig, A.; Dretschkow, T.; Rohde, D.; Worm, O.; Jager, C.		Conference Paper
2012Development of rechargeable micro batteries based on micro channel structures
Hahn, Robert; Höppner, K.; Marquardt, K.; Eisenreich, M.; Ferch, M.; Wilke, M.; Lang, K.-D.		Conference Paper
2012Development of silicon integrated rechargeable lithium microbatteries
Marquardt, Krystan; Stolle, T.; Ferch, M.; Hahn, Robert; Thunman, M.		Conference Paper
2012Discharge performance dependence on electrode thickness for Li 4Ti5O12/LiMn2O4 cells for application in wafer-integrated microbatteries
Thunman, M.; Marquardt, K.; Hahn, R.; Kober, D.; Goerke, O.; Schubert, H.		Conference Paper
2012Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.		Journal Article
2012High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing
Itabashi, T.; Kotani, M.; Zussman, M.P.; Zoschke, K.; Fischer, T.; Töpper, M.; Ishida, H.		Conference Paper
2012Innovation driver of the next decade: Heterogeneous integration
Lang, Klaus-Dieter; Pötter, Harald; Aschenbrenner, Rolf; Becker, Karl-Friedrich; Boettcher, Lars; Ehrmann, Oswin; Wilke, Martin; Toepper, Michael		Journal Article
2012Innovation Driver of the Next Decade: Technology Follows Application
Lang, K.-D.; Pötter, H.; Aschenbrenner, R.; Becker, K.-F.; Boettcher, L.; Ehrmann, O.; Wilke, M.; Toepper, M.		Book Article
2012Low temperature wafer level bonding using benzocyclobutene adhesive polymers
Gallagher, M.; Kim, J.-U.; Huenger, E.; Zoschke, K.; Lopper, C.; Toepper, M.		Journal Article
2012Modelling and characterisation of smart power devices
Wunderle, B.; Ras, M.A.; Springborn, M.; May, D.; Kleff, J.; Oppermann, H.; Töpper, M.; Caroff, T.; Schacht, R.; Mitova, R.		Conference Paper
2012Packaged BiCMOS embedded RF-MEMS switches with integrated inductive loads
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Barth, R.; Knoll, D.; Korndorfer, F.; Scholz, R.; Schulz, K.; Wipf, C.; Tillack, B.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Ulusoy, A.C.; Purtova, T.; Liu, G.; Schumacher, H.		Conference Paper
2012Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K.; Fischer, T.; Töpper, M.; Fritzsch, T.; Ehrmann, O.; Itabashi, T.; Zussman, M.P.; Souter, M.; Oppermann, H.; Lang, K.-D.		Conference Paper
2012Process modeling of dry etching for the 3D-integration with tapered TSVs
Wilke, M.; Töpper, M.; Huynh, H.Q.; Lang, K.D.		Conference Paper
2012Prototype ATLAS IBL modules using the FE-I4A front-end readout chip
Albert, J.; Alex, M.; Alimonti, G.; Allport, P.; Altenheiner, S.; Ancu, S.; Andreazza, A.; Arguin, J.; Arutinov, D.; Backhaus, M.; Bagolini, A.; Ballansat, J.; Barbero, M.; Barbier, G.; Bates, R.; Battistin, M.; Baudin, P.; Beau, T.; Beccherle, R.; Beck, H.; Benoit, M.; Bensinger, J.; Bomben, M.; Borri, M.; Boscardin, M.; Direito, J.B.; Bousson, N.; Boyd, R.G.; Breugnon, P.; Bruni, G.; Bruschi, M.; Buchholz, P.; Buttar, C.; Cadoux, F.; Calderini, G.; Caminada, L.; Capeans, M.; Casse, G.; Catinaccio, A.; Cavalli-Sforza, M.; Chauveau, J.; Chu, M.; Ciapetti, M.; Cindro, V.; Citterio, M.; Clark, A.; Cobal, M.; Coelli, S.; Colijn, A.; Colin, D.; Collot, J.; Crespo-Lopez, O.; Dalla Betta, G.; Darbo, G.; DaVia, C.; David, P.; Debieux, S.; Delebecque, P.; Devetak, E.; DeWilde, B.; Girolamo, B. di; Dinu, N.; Dittus, F.; Diyakov, D.; Djama, F.; Dobos, D.; Doonan, K.; Dopke, J.; Dorholt, O.; Dube, S.; Dushkin, A.; Dzahini, D.; Egorov, K.; Ehrmann, O.; Elldge, D.; Elles, S.; Elsing, M.; Eraud, L.; Ereditato, A.		Journal Article
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2012RF-MEMS switch module in a 0.25 µm BiCMOS technology
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Scholz, R.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Elkhouly, M.; Kaletta, K.; Suchodoletz, M.V.; Zoschke, K.; Wilke, M.; Ehrmann, O.; Mühlhaus, V.; Liu, G.; Purtova, T.; Ulusoy, A.C.; Schumacher, H.; Tillack, B.		Conference Paper
2012Silicon integrated micro batteries based on deep reactive ion etching and through silicon via technologies
Hahn, R.; Marquardt, K.; Thunman, M.; Töpper, M.; Wilke, M.; Ferch, M.; Huynh, Q.H.; Lang, K.D.		Conference Paper
2012Via last technology for direct stacking of processor and flash
Puschmann, R.; Bottcher, M.; Ziesmann, M.; Bartusseck, I.; Windrich, F.; Fiedler, C.; John, P.; Manier, C.; Zoschke, K.; Grafe, J.; Oppermann, H.; Wolf, M.J.; Lang, K.D.		Conference Paper
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter		Conference Paper
20113D stacking approaches for mold embedded packages
Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter		Conference Paper
2011Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications
Fritzsch, T.; Jordan, R.; Oppermann, H.; Ehrmann, O.; Töpper, M.; Baumgartner, T.; Lang, K.-D.		Journal Article
2011Design and evaluation of a passive self-breathing micro fuel cell for autonomous portable applications
Weiland, M.; Wagner, S.; Hahn, R.; Reichl, H.		Conference Paper
2011Elektrochemisches Element und Verfahren zur Herstellung eines elektrochemischen Elements
Hahn, Robert; Marquardt, Krystan		Patent
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2011Entwicklung und Design von selbstatmenden Mikrobrennstoffzellen fur autarke Sensoren mit pulsformiger Last
Weiland, M.; Reichl, H.; Wagner, S.; Hahn, R.		Conference Paper
2011Evaluation of the packaging and encapsulation reliability in fully integrated, fully wireless 100 channel Utah Slant Electrode Array (USEA): Implications for long term functionality
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.		Conference Paper
2011High channel-count neural interfaces for multiple degree-of-freedom neuroprosthetics
Rieth, L.; Franklin, R.; Tathireddy, P.; Sharma, R.; Williams, L.; Tenore, F.; Merugu, S.; Rothermund, M.; Jaeger, D.; Töpper, M.; Oppermann, H.; Harrison, R.; Solzbacher, F.		Conference Paper
2011Influences of current collector foils with different opening ratios in passive polymer electrolyte membrane fuel cells
Krumbholz, S.; Kaiser, J.; Weiland, M.; Hahn, R.; Reichl, H.		Journal Article
2011Long term in vitro functional stability and recording longevity of fully integrated wireless neural interfaces based on the Utah Slant Electrode Array
Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.		Journal Article
2011Low temperature cure of BCB and the influence on the mechanical stress
Wöhrmann, M.; Töpper, M.; Walter, H.; Lang, K.-D.		Conference Paper
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.		Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Drews, J.; Knoll, D.; Korndörfer, F.; Wipf, C.; Schulz, K.; Suchodoletz, M.V.; Zoschke, K.; Kaletta, K.; Ehrmann, O.; Leidich, S.; Kurth, S.; Tillack, B.		Conference Paper
2011MEMS module integration into SiGe BiCMOS technology for embedded system applications
Kaynak, M.; Wietstruck, M.; Zhang, W.; Scholz, R.; Drews, J.; Marschmeyer, S.; Knoll, D.; Korndorfer, F.; Schulz, K.; Wipf, C.; Wolansky, D.; Kaletta, K.; Wegner, M.; Ehrmann, O.; Tillack, B.		Conference Paper
2011Towards palm-size autonomous helicopters
Bouabdallah, S.; Bermes, C.; Grzonka, S.; Gimkiewicz, C.; Brenzikofer, A.; Hahn, R.; Schafroth, D.; Grisetti, G.; Burgard, W.; Siegwart, R.		Journal Article
2011TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
Zoschke, K.; Wolf, J.; Lopper, C.; Kuna, I.; Jurgensen, N.; Glaw, V.; Samulewicz, K.; Roder, J.; Wilke, M.; Wunsch, O.; Klein, M.; Suchodoletz, M.V.; Oppermann, H.; Braun, T.; Wieland, R.; Ehrmann, O.		Conference Paper
2011Ultra low temperature PBO-polymer for wafer level packaging applications
Töpper, Michael; Fischer, Thorsten; Bader, V.; Lang, Klaus-Dieter; Matsuie, N.; Motobe, T.; Minegishi, T.; Knaus, M.		Conference Paper
2011Vergleichende Tests von Mikrobrennstoffzellensystemen
Hahn, R.; Wagner, S.; Lang, K.-D.; Blechert, M.		Conference Paper
2011Wafer-level glass-caps for advanced optical applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Zoschke, K.; Toepper, M.		Conference Paper
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.		Conference Paper
2010Anodic bonding at low voltage using microstructured borosilicate glass thin-films
Leib, J.; Hansen, U.; Maus, S.; Feindt, H.; Hauck, K.; Zoschke, K.; Toepper, M.		Conference Paper
2010BiCMOS embedded RF-MEMS switch for above 90 GHz applications using backside integration technique
Kaynak, M.; Wietstruck, M.; Scholz, R.; Drews, J.; Barth, R.; Ehwald, K.E.; Fox, A.; Haak, U.; Knoll, D.; Korndörfer, F.; Marschmeyer, S.; Schulz, K.; Wipf, C.; Wolansky, D.; Tillack, B.; Zoschke, K.; Fischer, T.; Kim, Y.S.; Kim, J.S.; Lee, W.-G.; Kim, J.W.		Conference Paper
2010Carrierless design for handling and processing of ultrathin wafers
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Seng, T.C.; Tabuchi, T.		Conference Paper
2010A comparison of thin film polymers for wafer level packaging
Töpper, M.; Fischer, T.; Baumgartner, T.; Reichl, H.		Conference Paper
2010Development of charged particle detectors by integrating gas amplification stages and CMOS ASICs on wafer level
Kaminski, J.; Baumgartner, T.; Desch, K.; Ehrmann, O.; Fritzsch, T.; Krautscheid, T.; Mayer, S.; Töpper, M.		Conference Paper
2010Dry film photo resists and polymers - The low cost option for standard and 3-D wafer level packaging
Baumgartner, T.; Hauck, K.; Töpper, M.; Manessis, D.; Ehrmann, O.; Lang, K.-D.; Liebsch, W.; Ehlin, M.; Itabashi, T.		Conference Paper
2010Energy autonomous sensor systems: Towards a ubiquitous sensor technology
Belleville, M.; Fanet, H.; Fiorini, P.; Nicole, P.; Pelgrom, M.J.M.; Piguet, C.; Hahn, R.; Hoof, C. van; Vullers, R.; Tartagni, M.; Cantatore, E.		Journal Article
2010Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
Zoschke, K.; Wegner, M.; Wilke, M.; Jürgensen, N.; Lopper, C.; Kuna, I.; Glaw, V.; Röder, J.; Wünsch, O.; Wolf, M.J.; Ehrmann, O.; Reichl, H.		Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.		Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.		Conference Paper
2010Hermetic BSG thin film coatings for harsh environment applications
Maus, S.; Hansen, U.; Leib, J.; Toepper, M.		Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.		Conference Paper
2010Integration of carrierless ultrathin wafers into a TSV process flow
Bieck, F.; Spiller, S.; Molina, F.; Töpper, M.; Lopper, C.; Kuna, I.; Fischer, T.; Röder, J.; Dietrich, L.; Tabuchi, T.		Conference Paper
2010Light weight 12W PEM fuel cell system for UAVs
Hahn, R.; Wagner, S.; Krumbholz, S.; Blechert, M.; Höppner, K.; Stolle, T.; Reichl, H.		Conference Paper
2010Mikrobrennstoffzellen mit bedarfsgerechter Wasserstofferzeugung
Hahn, R.		Journal Article
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.		Conference Paper
2010Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.		Conference Paper
2010Silicon interposer for heterogeneous integration
Wolf, M.J.; Zoschke, K.; Wieland, R.; Klein, M.; Lang, K.-D.; Reichl, H.		Conference Paper
2010Silicon-interposer with high density Cu-filled TSVs
Wieland, R.; Zoschke, K.; Jürgensen, N.; Merkel, R.; Nebrich, L.; Wolf, J.		Conference Paper
2010Tapered through-silicon-via interconnects for wafer-level packaging of sensor devices
Leib, J.; Bieck, F.; Hansen, U.; Looi, K.-K.; Ngo, H.-D.; Seidemann, V.; Shariff, D.; Studzinski, D.; Suthiwongsunthorn, N.; Tan, K.; Wilke, R.; Yam, K.-L.; Töpper, M.		Journal Article
2010Temperature and humidity control of a micro PEM fuel cell stack
Kunde, C.; Hanke-Rauschenbach, R.; Mangold, M.; Kienle, A.; Sundmacher, K.; Wagner, S.; Hahn, R.		Journal Article
2010Verfahren zur hermetischen Verkapselung eines Mikrosystems
Hahn, R.; Marquardt, K.		Patent
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2010Wafer level processing of integrated passive components using polyimide or polybenzoxazole/copper multilayer technology
Zoschke, K.; Fischer, T.; Töpper, M.; Samulewicz, K.; Wünsch, O.; Röder, J.; Lutz, M.; Ehrmann, O.; Reichl, H.		Journal Article
2010Wafer-level glass capping with optical integration
Hansen, U.; Maus, S.; Leib, J.; Toepper, M.		Conference Paper
2009A 3-D packaging concept for cost effective packaging of MEMS and ASIC on wafer level
Baumgartner, T.; Töpper, M.; Klein, M.; Schmid, B.; Knödler, D.; Kuisma, H.; Nurmi, S.; Kattelus, H.; Dekker, J.; Schachler, R.		Conference Paper
20093-D Thin Chip Integration Technology - from Technology Development to Application
Fritzsch, T.; Mrossko, R.; Baumgartner, T.; Toepper, M.; Klein, M.; Wolf, J.; Wunderle, B.; Reichl, H.		Conference Paper
20093D integration of image sensor SiP using TSV silicon interposer
Wolf, M.J.; Zoschke, K.; Klumpp, A.; Wieland, R.; Klein, M.; Nebrich, L.; Heinig, A.; Limansyah, I.; Weber, W.; Ehrmann, O.; Reichl, H.		Conference Paper
20093D process integration - requirements and challenges
Wolf, M.J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Nebrich, L.; Klein, M.; Oppermann, H.; Ramm, P.; Ehrmann, O.; Reichl, H.		Conference Paper
2009Bauteilanordnung und Verfahren zu dessen Herstellung
Oppermann, H.; Klein, M.; Toepper, M.; Wolf, J.		Patent
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2009BCB with nano-filled BaSrTiO3 for thin film capacitors
Töpper, M.; Fischer, T.; Zoschke, K.; Zang, M.; Teipel, U.; Fehrenbacher, U.; Reichl, H.		Conference Paper
2009Brennstoffzellenanordnung
Hahn, R.; Kunde, C.		Patent
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2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.		Conference Paper
2009Design study of the bump on flexible lead by FEA for wafer level packaging
Eidner, I.; Wunderle, B.; Pan, K.L.; Wolf, M.J.; Ehrmann, O.; Reichl, H.		Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Hahn, R.; Marquardt, K.; Blechert, M.; Lehmann, M.; Töpper, M.; Wilke, M.; Semionyk, P.; Reichl, H.		Conference Paper
2009Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries
Marquardt, K.; Hahn, R.; Blechert, M.; Lehmann, M.; Töpper, M.; Reichl, H.		Journal Article
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.		Conference Paper
2009Elektrochemischer Reaktor, seine Verwendung zur Stromversorgung eines Systems und Verfahren zum Erzeugen von Wasserstoff
Hahn, R.; Benz, S.		Patent
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2009Energy autonomous sensor systems: State and perspectives of a ubiquitous sensor technology
Belleville, M.; Fanet, H.; Fiorini, P.; Nicole, P.; Pelgrom, M.J.M.; Piguet, C.; Hahn, R.; Hoof, C. van; Vullers, R.; Tartagni, M.; Cantatore, E.		Conference Paper
2009Fabrication of 3-D microstructures with permanent dielectric dry film
Baumgartner, T.; Hauck, K.; Zoschke, K.; Töpper, M.; Uno, H.; Liebsch, W.; Yun, H.; Ehlin, M.J.; Dietz, K.H.		Conference Paper
2009Functional Unit and Method aor the Production thereof
Wolf, J.; Zoschke, K.; Fischer, T.; Topper, M.; Reichl, H.		Patent
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2009A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level
Maus, S.; Hansen, U.; Leib, J.; Töpper, M.		Journal Article
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2009Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H.		Book Article
2009Influence of structure dimensions on self-breathing micro fuel cells
Wagner, S.; Krumbholz, S.; Hahn, R.; Reichl, H.		Conference Paper
2009Integrated wireless neural interface based on the Utah electrode array
Kim, S.; Bhandari, R.; Klein, M.; Negi, S.; Rieth, L.; Tathireddy, P.; Töpper, M.; Oppermann, H.; Solzbacher, F.		Journal Article
2009Low cost wafer-level 3-D integration without TSV
Töpper, M.; Baumgartner, T.; Klein, M.; Fritzsch, T.; Roeder, J.; Lutz, M.; Suchodoletz, M. von; Oppermann, H.; Reichl, H.		Conference Paper
2009Novel multi-layer wiring build-up using electrochemical pattern replication (ECPR)
Fredenberg, M.; Möller, P.; Töpper, M.		Conference Paper
2009Optimierung von Andruckstrukturen für Mikrobrennstoffzellen in Leichtbauweise
Wagner, S.; Krumbholz, S.; Andre, F.; Anders, H.; Hahn, R.; Reichl, H.		Conference Paper
2009Photonic system-in-package technologies using thin glass substrates
Brusberg, L.; Schröder, H.; Töpper, M.; Reichl, H.		Conference Paper
2009PICSiP: New system-in-package technology using a high bandwidth photonic interconnection layer for converged microsystems
Tekin, T.; Töpper, M.; Reichl, H.		Conference Paper
2009Reliability study of the bump on flexible lead for wafer level packaging
Kolb, I.; Wolf, M.J.; Ehrmann, O.; Reichl, H.		Conference Paper
2009Robust and Hermetic Borosilicate Glass Coatings by E-Beam Evaporation
Hansen, U.; Maus, S.; Leib, J.; Töpper, M.		Journal Article
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2009Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H.		Conference Paper
2009Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging
Hansen, U.; Leib, J.; Maus, S.; Gyenge, O.; Töpper, M.		Conference Paper
2009Thin hermetic passivation of semiconductors using low temperature borosilicate glass - Benchmark of a new wafer-level packaging technology
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Fischer, T.; Zoschke, K.; Toepper, M.		Conference Paper
2009Wafer level chip scale packaging
Töpper, Michael		Book Article
20083D packaging for image sensor application
Wolf, M.J.; Klumpp, A.; Wieland, R.; Zoschke, K.; Klein, M.; Nebrich, L.; Heinig, A.; Weber, W.; Limansyah, I.; Ramm, P.; Reichl, H.		Conference Paper
2008Bump on flexible lead for wafer level packaging
Eidner, I.; Buschick, K.; Dietrich, L.; Pan, K.L.; Minkus, M.; Wolf, M.J.; Ehrmann, O.; Reichl, H.		Conference Paper
2008Development of micro fuel cells with organic substrates and electronics manufacturing technologies
Hahn, R.; Wagner, S.; Krumbholz, S.; Reichl, H.		Conference Paper
2008Dreidimensionale Mikrobatterie und Verfahren zu deren Herstellung
Hahn, R.; Woehrle, T.; Wurm, C.		Patent
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2008Duenne Gehaeusefolie fuer galvanische Elemente
Kohlberger, M.; Perner, A.; Krebs, M.; Woehrle, T.; Hahn, R.; Marquardt, K.		Patent
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2008Funktionseinheit und Verfahren zu deren Herstellung
Wolf, J.; Zoschke, K.; Fischer, T.; Toepper, M.; Reichl, H.		Patent
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2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.		Conference Paper
2008Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.		Conference Paper
2008Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M.		Journal Article
2008Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators
Hahn, R.; Wagner, S.; Krumbholz, S.; Reichl, H.		Conference Paper
2008Profile of the wafer level ECD gold bumps under variable parameters
Jing, X.M.; Engelmann, G.; Chen, D.; Wolf, J.; Ehrmann, O.; Reichl, H.		Journal Article
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.		Conference Paper
2008Verfahren und Vorrichtung zum stoffschluessigen Fuegen metallischer Anschlussstrukturen
Zwanzig, M.; Fiedler, S.; Schmidt, R.; Scheel, W.; Toepper, M.		Patent
Fulltext
2008Verfahren zum Herstellen einer halbleiterbasierten Schaltung und halbleiterbasierte Schaltung mit dreidimensionaler Schaltungstopologie
Reichl, H.; Wolf, J.; Wieland, R.; Zoschke, K.		Patent
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2008Verfahren zur Herstellung einer Lotmetallisierung
Hutter, M.; Engelmann, G.; Töpper, M.; Oppermann, H.		Patent
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2007Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N.		Conference Paper
2007Aqueous-base-developable benzocyclobutene (BCB)-based material - An emerging dielectric material for microelectronics
So, Y.-H.; Stark, E.; Kisting, S.; Scheck, D.; Baranek, K.; Toepper, M.; Baumgartner, T.		Conference Paper
2007Befüllbare Batterie und Brennstoffdispenser
Hahn, R.		Patent
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2007Brennstoffzellenanordnung
Hahn, R.		Patent
Fulltext
2007Brennstoffzellenstack in Leichtbauweise
Hahn, R.		Patent
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2007Conformal coating and patterning of 3D structures on wafer level with electrophoretic photoresists
Fischer, T.; Töpper, M.; Jürgensen, N.; Ehrmann, O.; Wiemer, M.; Reichl, H.		Conference Paper
2007Copper / Benzocyclobutene multi layer wiring - A Flexible base technology for wafer level integration of passive components
Zoschke, K.; Wolf, J.; Ehrmann, O.; Toepper, M.; Reichl, H.		Conference Paper
2007ECD wafer bumping and packaging for pixel detector applications
Fritzsch, T.; Jordan, R.; Ehrmann, O.; Reichl, H.		Conference Paper
2007Electromagnetic compatibility of two novel packaging concepts of an inductively powered neural interface
Kim, S.; Wilke, M.; Klein, M.; Toepper, M.; Solzbacher, F.		Conference Paper
2007Energieversorgung von energieautarken Sensoren
Hahn, R.		Journal Article
2007Evaluation of micro structured glass layers as dielectric-and passivation material for wafer level integrated thin film capacitors and resistors
Zoschke, K.; Feige, C.; Wolf, J.; Mund, D.; Töpper, M.; Ehrmann, O.; Schmückle, F.J.; Reichl, H.		Conference Paper
2007Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Kaletta, K.; Schmückle, F.J.; Reichl, H.		Journal Article
2007Foil type micro PEM fuel cell with self-breathing cathode side
Wagner, S.; Hahn, R.; Reichl, H.		Book Article
2007Gaserzeuger und Verfahren zum Herstellen von Gasen
Hahn, R.		Patent
Fulltext
2007Laser-Display-System auf Basis von MEMS-Scannern
Specht, H.; Kurth, S.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.; Mehner, J.		Conference Paper
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.		Conference Paper
2007Magnetisches Bauelement mit Spiralspule(n), Arrays solcher Bauelemente und Verfahren zu ihrer Herstellung
Hahn, R.		Patent
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2007Mikrobrennstoffzellensystem sowie Verfahren zu seiner Herstellung
Hahn, R.; Hebling, C.; Schmitz, A.		Patent
Fulltext
2007Packaging concepts for neuroprosthetic implants
Töpper, M.; Klein, M.; Wilke, M.; Oppermann, H.; Kim, S.; Tathireddy, P.; Solzbacher, F.; Reichl, H.		Conference Paper
2007Performance and reliability test of MEMS optical scanners
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.		Conference Paper
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.		Conference Paper
2007Prospects and yield of electrochemical wafer plating for bumping and signal routing
Dietrich, L.; Töpper, M.; Fritzsch, Th.; Ehrmann, O.; Reichl, H.		Conference Paper
2007Schaltanordnung
Hahn, R.		Patent
Fulltext
2007Switchable polymer-based thin film coils as a power module for wireless neural interfaces
Kim, S.; Zoschke, K.; Klein, M.; Black, D.; Buschick, K.; Toepper, M.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Solzbacher, F.		Journal Article
2007System integration of the utah electrode array using a biocompatible flip chip under bump metallization scheme
Bhandari, R.; Negi, S.; Rieth, L.; Toepper, M.; Kim, S.; Klein, M.; Oppermann, H.; Normann, R.A.; Solzbacher, F.		Conference Paper
2007Thermal constraints of PEM micro fuel cells for portable electronics
Hahn, R.; Wagner, S.; Reichl, H.		Book Article
2007Thin film encapsulation for secondary batteries on wafer level
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.		Conference Paper
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.		Conference Paper
2007Wafer bonding with BCB and SU-8 for MEMS packaging
Wiemer, M.; Jia, C.; Toepper, M.; Hauck, K.		Conference Paper
2007Wafer level processing of silicon arrays for implantable medical devices
Bhandari, R.; Negi, S.; Rieth, L.; Töpper, M.; Normann, R.A.; Solzbacher, F.		Conference Paper
2006Aqueous-base-developable benzocyclobutene (BCB)-based material curable in air
So, Y.-H.; Stark, E.J.; Li, Y.; Kisting, S.; Achen, A.; Baranek, K.; Scheck, D.; Hetzner, J.; Folkenroth, J.J.; Töpper, M.; Baumgartner, T.		Journal Article
2006Assembly and hermetic encapsulation of wafer level secondary batteries
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.		Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.		Conference Paper
2006Brennstoffzellenanordnung
Hahn, R.; Wagner, S.		Patent
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2006Brennstoffzellensystem
Holl, K.; Kreidler, B.; Krebs, M.; Ilic, D.; Wagner, S.; Hahn, R.		Patent
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2006Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
Dietrich, L.; Toepper, M.; Ehrmann, O.; Reichl, H.		Conference Paper
2006Design of integrated inductances based on ferromagnetic LTCC layers
Hahn, R.; Sommer, G.; Dörr, I.; Schwerzel, S.; Reichl, H.; Muller, E.		Journal Article
2006Experience in fabrication of multichip-modules for the ATLAS pixel detector
Fritzsch, T.; Jordan, R.; Töpper, M.; Kuna, I.; Lutz, M.; Defo Kamga, F.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.		Conference Paper
2006FEA simulation of thin film coils to power wireless neural interfaces
Kim, S.; Scholz, O.; Zoschke, K.; Harrison, R.; Solzbacher, F.; Klein, M.; Toepper, M.		Conference Paper
2006Hochfrequenzsender sowie Verfahren zu dessen Betrieb
Niedermayer, M.; Hahn, R.; Guttowski, S.; Thomasius, R.; Morgenstern, H.; Schrank, K.		Patent
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2006Kanalstruktur zur ortsaufgeloesten Messung von Brennstoffzellen
Hahn, R.		Patent
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2006Low profile power inductors based on ferromagnetic LTCC technology
Hahn, R.; Krumbholz, S.; Reichl, H.		Conference Paper
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.		Patent
Fulltext
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.		Patent
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2006Packaging of radiation and particle detectors
Fritzsch, T.; Jordan, R.; Glaw, V.; Töpper, M.; Dietrich, L.; Wolf, J.; Ehrmann, O.; Oppermann, H.; Reichl, H.; Wermes, N.		Conference Paper
2006Polymer based thin film coils as a power module of wireless neural interfaces
Kim, S.; Buschick, K.; Zoschke, K.; Klein, M.; Toepper, M.; Black, D.; Harrison, R.; Tathireddy, P.; Solzbacher, F.		Conference Paper
2006Stackable thin film multi layer substrates with integrated passive components
Zoschke, K.; Buschick, K.; Scherpinski, K.; Fischer, T.; Wolf, J.; Ehrmann, O.; Jordan, R.; Reichl, H.; Schmuckle, F.J.		Conference Paper
2006Thin film substrate technology and FC interconnection for very high frequency applications
Töpper, M.; Rosin, T.; Fritzsch, T.; Jordan, R.; Mekonnen, G.; Sakkas, C.; Kunkel, R.; Scherpinski, K.; Schmidt, D.; Oppermann, H.; Dietrich, L.; Beling, A.; Eckhardt, T.; Bach, H.-G.; Reichl, H.		Conference Paper
2006WLCSP technology direction
Töpper, M.; Claw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.		Journal Article
2005Aufbau und Hermetisierung einer ultraflachen aufladbaren Mikrobatterie
Marquardt, K.; Hahn, R.; Luger, T.; Reichl, H.		Conference Paper
2005Batterie, insbesondere Mikrobatterie, und deren Herstellung mit Hilfe von Wafer-Level-Technologie
Hahn, R.		Patent
Fulltext
2005Capacitive humidity sensors based on oxidized photoBCB polymer films: Enhanced sensitivity and response time
Tetelin, A.; Pellet, C.; Achen, A.; Toepper, M.		Conference Paper
2005Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
Jurenka, C.; Kim, J.Y.; Wolf, M.J.; Engelmann, G.; Ehrmann, O.; Yu, J.; Reichl, H.		Conference Paper
2005Fabrication of application specific integrated passive devices using wafer level packaging technologies
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.		Conference Paper
2005Fabrication of Multichip-Modules for Pixel Detectors
Fritzsch, T.; Jordan, R.; Töpper, M.; Röder, J.; Kuna, I.; Lutz, M.; Wolf, M.J.; Ehrmann, O.; Oppermann, H.; Reichl, H.		Conference Paper
2005Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps
Oppermann, H.; Hutter, M.; Klein, M.; Engelmann, G.; Töpper, M.; Wolf, J.		Conference Paper
2005Herstellung dünner Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewicz, K.; Jürgensen, N.; Töpper, M.; Ehrmann, O.; Reichl, H.		Journal Article
2005Herstellung von dünnen Chip-Kontaktierungsmetallisierungen auf der Basis von Lift-off und PVD
Hauck, K.; Samulewics, K.; Jürgensen, N.; Ehrmann, O.; Voigt, A.; Reichl, H.		Journal Article
2005The importance of polymers in wafer-level packaging
Töpper, M.		Conference Paper
2005Low Cost Manufacturing of Foil-Type Micro Fuel Cells
Wagner, S.; Hahn, R.; God, R.; Monser, H.-P.		Journal Article
2005Miniaturisierte, magnetische Bauelemente und Verfahren zu ihrer Herstellung mit Hilfe von Wafer-Level-Technologie
Hahn, R.		Patent
Fulltext
2005A novel 24-kHz resonant scanner for high-resolution laser display
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.		Conference Paper
2005Novel Hermetic WLP Technology using Low-Temperature Passivation
Töpper, M.; Leib, J.; Mund, D.		Conference Paper
2005Photo-Resist Technology for Wafer Level Packaging and MEMS Applications
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Baumgartner, T.; Reichl, H.; Tönnies, D.		Conference Paper
2005Ein resonanter 24 kHz Scanner für hoch auflösende Laserdisplays
Kurth, S.; Kaufmann, C.; Hahn, R.; Mehner, J.; Dötzel, W.; Gessner, T.		Conference Paper
2005A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
Töpper, M.; Voigt, A.; Heinrich, M.; Hauck, K.; Mientus, R.; Gruetzner, G.; Ehrmann, O.		Conference Paper
2005The status of micro fuel cell technology and its contribution to the energy supply of autonomous sensors
Hahn, R.; Wagner, S.; Reichl, H.		Conference Paper
2005Technologien, Anwendungen und Zukunft des WLP
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.		Conference Paper
2005Technology Requirements for Chip-On-Chip Packaging Solution
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.		Conference Paper
2005Technology requirements for chip-on-chip packaging solutions
Töpper, M.; Fritzsch, T.; Glaw, V.; Jordan, R.; Lopper, C.; Röder, J.; Dietrich, L.; Lutz, M.; Oppermann, H.; Ehrmann, O.; Reichl, H.		Conference Paper
2005W-band flip-chip VCO in thin-film environment
Töpper, M.; Schmückle, F.J.; Lenk, F.; Hutter, M.; Klein, M.; Oppermann, H.; Engelmann, G.; Riepe, K.; Heinrich, W.		Conference Paper
2005Wafer Level Fabrication of Integrated Passive Components: A Key Technology for the System in Package Approach
Zoschke, K.; Wolf, M.J.; Töpper, M.; Ehrmann, O.; Reichl, H.		Conference Paper
2005Water solubility and diffusivity in BCB resins used in microelectronic packaging and sensor applications
Tetelin, A.; Achen, A.; Pouget, V.; Pellet, C.; Töpper, M.; Lachaud, J.-L.		Conference Paper
2005WLCSP technology direction
Töpper, M.; Glaw, V.; Zoschke, K.; Ehrmann, O.; Reichl, H.		Conference Paper
2005WLP Photoresists for the 21st Century
Töpper, M.; Lopper, C.; Röder, J.; Hauck, K.; Fischer, T.; Baumgartner, T.; Reichl, H.		Conference Paper
2004Application of micromirror arrays for Hadamard transform optics
Hanf, M.; Kurth, S.; Billep, D.; Hahn, R.; Faust, W.; Heinz, S.; Dötzel, W.; Gessner, T.		Conference Paper
2004Autonomous energy supply for electronic grains and wireless sensors
Hahn, R.		Journal Article
2004Brennstoffzellenstack mit Bipolarplatten
Hahn, R.		Patent
Fulltext
2004Characterization of electroplated leadfree bumps
Wolf, M.J.; Jang, S.-Y.; Ehrmann, O.; Reichl, H.; Paik, K.-W.		Book Article
2004Development of a planar micro fuel cell with thin film and micro patterning technologies
Hahn, R.; Wagner, S.; Schmitz, A.; Reichl, H.		Conference Paper
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.		Conference Paper
2004Flexible circuit carrier with integrated passives for high density integration
Fischer, T.; Zoschke, K.; Scherpinski, K.; Buschick, K.; Ehrmann, O.; Wolf, M.J.; Reichl, H.		Journal Article
2004A MEMs based planar micro fuel cell with self breathing cathode side
Wagner, S.; Hahn, R.; Krumbholz, S.; Reichl, H.		Conference Paper
2004New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
Leib, R.; Töpper, M.		Conference Paper
2004Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates
Töpper, M.; Mund, D.; Leib, J.		Conference Paper
2004Schaltungsmodul, Verfahren zum Herstellen eines Schaltungsmoduls und Traeger zum Aufnehmen von Halbleiterelementen
Hahn, R.; Lang, O.		Patent
Fulltext
2004Stability of planar PEMFC in printed circuit board technology
Schmitz, A.; Wagner, S.; Hahn, R.; Uzun, H.; Hebling, C.		Journal Article
2004Thin film integration of passives - single components, filters, integrated passive devices
Zoschke, K.; Wolf, J.; Töpper, M.; Ehrmann, O.; Fritzsch, T.; Scherpinski, K.; Reichl, H.; Schmückle, F.-J.		Conference Paper
2004The wafer-level packaging evolution
Töpper, M.; Garrou, P.		Journal Article
2003CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Schreiber, T.; Reichl, H.; Paik, K.W.		Journal Article
2003Interfacial adhesion analysis of BCB / TiW / Cu / PbSn technology in wafer level packaging
Töpper, M.; Achen, A.; Reichl, H.		Conference Paper
2003Thermal management of portable micro fuel cell stacks
Hahn, R.; Krumm, M.; Reichl, H.		Conference Paper
2002300mm Wafer Bumping: Printing Systems and Technologies
Töpper, M.; Kloesner, J.; Kasulke, P.; Denise, O.; Myers, J.; Heyen, R.		Conference Paper
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.		Conference Paper
2002Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Gloor, H.; Reichl, H.; Paik, K.W.		Journal Article
2002Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
Jang, S.Y.; Wolf, J.; Ehrmann, O.; Reichl, H.; Paik, K.W.		Journal Article
2001Application of high and low wafer bonding processes for bulk micromachined components
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Gessner, T.		Conference Paper
2001Einsatz von Mikrospiegel-Arrays zur Lichtmodulation in einem Hadamard-Transformations-Spektrometer
Hanf, M.; Kurth, S.; Faust, W.; Hahn, R.; Heinz, S.; Dötzel, W.; Gessner, T.		Conference Paper
2001Einsatzerfahrungen mit einer Multiplex-Ätzanlage für tiefes Siliziumätzen
Küchler, M.; Hiller, K.; Hahn, R.; Bertz, A.; Gessner, T.		Conference Paper
2001Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.		Patent
Fulltext
2001"SECAP" International Advanced Packaging Consortium: Formed to Standardize Process Equipment for Wafer Level Packaging Technologies for 300mm
Töpper, M.; Reichl, H.		Journal Article
2000Characteristics of fritting contacts utilized for micromachined wafer probe cards
Itoh, T.; Suga, T.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Reichl, H.		Journal Article
2000The european CSP perspective
Töpper, M.; Schubert, A.; Reichl, H.		Journal Article
2000Fab integrated packaging (FIP): A new concept for high reliability wafer-level chip size packaging
Töpper, M.; Auersperg, J.; Glaw, V.; Kaskoun, K.; Prack, E.; Keser, B.; Coskina, P.; Jäger, D.; Petter, D.; Ehrmann, O.; Samulewicz, K.; Meinherz, C.; Fehlberg, S.; Karduck, C.; Reichl, H.		Conference Paper
2000First MCM-D modules for the b-physics layer of the ATLAS pixel detector
Töpper, M.; Bäsken, O.; Becks, K.-H.; Ehrmann, O.; Gerlach, P.; Grah, C.; Gregor, I.M.; Linder, C.; Meuser, S.; Richardson, J.; Wolf, J.		Journal Article
2000Future Power Supplies for Portable Electronics and Their Environmental Issues
Hahn, R.; Müller, J.		Conference Paper
2000High density pixel detector module using flip chip and thin film technology
Wolf, J.; Gerlach, P.; Beyne, E.; Töpper, M.; Dietrich, L.; Becks, K.H.; Wermes, N.; Ehrmann, O.; Reichl, H.		Conference Paper
2000Industrial Working Group for Lead Free Interconnection Systems in Electronics
Hahn, R.; Müller, J.		Conference Paper
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.		Conference Paper
2000Reliability of flip chip and chip size packages
Reichl, H.; Schubert, A.; Töpper, M.		Conference Paper
2000Surface modification due to technological treatment evaluated by SPM and XPS techniques
Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K.		Conference Paper
2000Thin chip integration (TCI-modules) - a novel technique for manufacturing three dimensional IC-packages
Töpper, M.; Scherpinski, K.; Spörle, H.-P.; Landesberger, C.; Ehrmann, O.; Reichl, H.		Conference Paper
2000Verfahren und Vorrichtung zur Herstellung eines Verbundes zwischen einem Traegerkoerper und mindestens einer darin enthaltenen Komponente
Krabe, D.; Lang, G.; Springer, A.; Hagenbuechle, M.; Buschick, K.; Ehrmann, O.; Scheel, W.; Reichl, H.		Patent
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2000Wafer level chip size package challenges
Töpper, M.; Reichl, H.		Journal Article
2000Wafer level package using double balls
Töpper, M.; Glaw, V.; Coskina, P.; Auersperg, J.; Samulewicz, K.; Lange, M.; Karduck, C.; Fehlberg, S.; Ehrmann, O.; Reichl, H.		Conference Paper
2000Wafer-level chip size package (WL-CSP)
Töpper, M.; Fehlberg, S.; Scherpinski, K.; Karduck, C.; Glaw, V.; Heinricht, K.; Coskina, P.; Ehrmann, O.; Reichl, H.		Journal Article
1999Analogously working micromirror arrays
Kehr, K.; Kurth, S.; Mehner, J.; Kaufmann, C.; Hahn, R.; Dötzel, W.; Gessner, T.		Conference Paper
1999Anwendung von Niedertemperatur-Bondverfahren für die Herstellung von Microscanner-Arrays hoher Frequenz
Wiemer, M.; Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.		Conference Paper
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.		Book Article
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
Töpper, M.; Dietrich, L.; Engelmann, G.; Fehlberg, S.; Gerlach, P.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.		Conference Paper
1999Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu/PbSn technology
Töpper, M.; Gerlach, P.; Dietrich, L.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Wolf, J.; Ehrmann, O.; Becks, K.-H.; Reichl, H.		Journal Article
1999Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
Hiller, K.; Wiemer, M.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Milekhin, A.; Friedrich, M.; Zahn, D.		Conference Paper
1999High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.		Journal Article
1999Integration of NiCr resistors in a multilayer Cu/BCB wiring system
Scherpinski, K.; Töpper, M.; Hahn, R.; Ehrmann, O.; Reichl, H.		Conference Paper
1999Low cost electroless copper metallization of BCB for high-density wiring systems
Töpper, M.; Stolle, T.; Reichl, H.		Conference Paper
1999Low-temperature approaches for fabrication of high-frequency microscanners
Hiller, K.; Hahn, R.; Kaufmann, C.; Kurth, S.; Kehr, K.; Gessner, T.; Dötzel, W.; Wiemer, M.; Schubert, I.		Conference Paper
1999A MCM-D-type module for the atlas pixel detector
Becks, K.H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Töpper, M.; Truzzi, C.; Wolf, J.		Journal Article
1999A MCM-D-type module for the ATLAS pixel detector
Becks, K.-H.; Beyne, E.; Ehrmann, O.; Gerlach, P.; Gregor, I.M.; Pieters, P.; Truzzi, C.; Wolf, J.		Conference Paper
1999Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.		Journal Article
1999Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H.		Conference Paper
1999Synchronously working micromirrors for beam steering: Design and application aspects
Kurth, S.; Kehr, K.; Mehner, J.; Kaufmann, C.; Hahn, R.; Seidel, R.; Dötzel, W.; Gessner, T.		Conference Paper
1999Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.		Conference Paper
1998Chip size package - the option of choice for miniaturized medical devices
Töpper, M.; Schaldach, M.; Fehlberg, S.; Karduck, C.; Meinherz, C.; Heinricht, K.; Bader, V.; Hoster, L.; Coskina, P.; Kloeser, J.; Ehrmann, O.; Reichl, H.		Conference Paper
1998Combination of MCM-C technology with MCM-D technology using photosensitive polymers
Töpper, M.; Scherpinski, K.; Hahn, R.; Ehrmann, O.; Reichl, H.; Schmaus, C.; Bechtold, F.		Conference Paper
1998Deployment of State-of -the-Art Technology for Implantable Medical Systems
Töpper, M.; Schaldach, M.; Müller, J.; Starke, M.; Tessier, T.; Ehrmann, O.; Reichl, H.		Conference Paper
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.		Conference Paper
1998Gold and gold-tin wafer bumping by electrochemical deposition for flip chip and TAB
Dietrich, L.; Engelmann, G.; Ehrmann, O.; Reichl, H.		Conference Paper
1998Low thermal resistivity adhesive bonding of ceramic substrates to high performance coolers for the fabrication of power MCMs
Hahn, R.; Hoehne, J.; Schmidt, M.; Reichl, H.		Journal Article
1998Mask aligners in advanced packaging
Töpper, M.; Tönnies, D.; Wolf, J.; Engelmann, G.; Reichl, H.		Journal Article
1998A multichip module integration technology for high-speed analog and digital applications
Töpper, M.; Mangold, T.; Wolf, J.; Reichl, H.; Russer, P.		Conference Paper
1998Novel packaging concept for high power multichip modules
Hahn, R.; Töpper, M.; Reichl, H.		Journal Article
1998Thermal measurements with liquid cooled microchannel heat sinks
Glaw, V.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.		Conference Paper
1997BCB - a polymer for thinfilm applications
Töpper, M.; Ehrmann, O.; Reichl, H.; Glaw, V.; Wolf, J.; Fischbeck, G.; Petermann, K.		Conference Paper
1997Dünnfilmmehrlagenverdrahtung mit photosensitivem BCB auf Keramik-, Dickschicht- und LTCC-Substraten für MCM
Töpper, M.; Glaw, V.; Hahn, R.; Schaldach, M.; Schmaus, C.; Bechtold, F.; Reichl, H.		Conference Paper
1997Effektives Simulationstool für das thermische Management elektronischer Packages
Kamp, A.; Hahn, R.; Schmidt, M.; Dai, W.; Reichl, H.		Journal Article
1997Embedding technology - a chip-first approach using BCB
Töpper, M.; Buschick, K.; Wolf, J.; Glaw, V.; Hahn, R.; Dabek, A.; Ehrmann, O.; Reichl, H.		Conference Paper
1997High performance cooling technology for Multi Chip Modules (MCM-D) with planar embedded dice
Hahn, R.; Töpper, M.; Schmidt, M.; Kamp, A.; Ginolas, A.; Wolf, J.; Glaw, V.; Buschick, K.; Ehrmann, O.; Reichl, H.		Conference Paper
1997High performance liquid cooled aluminium nitride heat sinks
Hahn, R.; Glaw, V.; Ginolas, A.; Töpfer, M.; Wittke, K.; Reichl, H.		Conference Paper
1997High power multi chip modules employing the planar embedding technique and microchannel water heat sinks
Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Töpper, M.; Ehrmann, O.; Reichl, H.		Journal Article
1997High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Töpper, M.; Hahn, R.; Kamp, A.; Ginolas, A.; Schmidt, M.; Wolf, J.; Glaw, V.; Ehrmann, O.; Reichl, H.		Conference Paper
1997Laser machining of ceramics for MCM-D applications
Glaw, V.; Hahn, R.; Wolf, J.; Töpper, M.; Buschick, K.; Hein, U.; Ginolas, A.; Ehrmann, O.; Reichl, H.		Conference Paper
1997Measurement of PbSn and AuSn flip chip area bump thermal resistance
Hahn, R.; Kamp, A.; Reichl, H.		Conference Paper
1997Micro channel cooler for application for micro- and power-electronics
Hahn, R.; Wittke, K.; Glaw, V.; Töpfer, M.; Ginolas, A.; Brunner, D.		Conference Paper
1997Multichip-modules for high frequency applications
Wolf, J.; Schmückle, S.J.; Owzar, A.; Töpper, M.; Buschick, K.; Reichl, H.		Conference Paper
1997Shear test for adhesion measurement of small structures
Schammler, G.; Buschick, K.; Hahn, R.; Reichl, H.		Conference Paper
1997System Integration for High Frequency Applications
Töpper, M.; Wolf, J.; Schmückle, F.J.; Heinrich, W.; Buschick, K.; Owzar, A.; Ehrmann, O.; Reichl, H.		Conference Paper
1997Thermal conductivity of PbSn and AuSn flip chip bumps
Hahn, R.; Kamp, A.; Reichl, H.		Conference Paper
1997Thermal simulation of aluminium nitride heat spreaders for varíous advanced electronic packaging applications
Hahn, R.; Kamp, A.; Hoehne, J.; Töpfer, M.; Reichl, H.		Conference Paper
1997Der Weg zum Chip-Size-Package
Töpper, M.; Reichl, H.		Journal Article
1996Alternative solder deposition using transfer technique
Töpper, M.; Wolf, J.; Reichl, H.		Conference Paper
1996Design concept for singlemode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.		Journal Article
1996Fabrication of high power MCMs by planar embedding technique and active cooling
Töpper, M.; Hahn, R.; Wolf, J.; Glaw, V.; Buschick, K.; Hoehne, J.; Schmidt, M.; Ehrmann, O.; Reichl, H.		Conference Paper
1996Integrated thermo-optical switch based on polymer rib waveguides
Töpper, M.; Moosburger, R.; Fischbeck, G.; Kostrzewa, C.; Petermann, K.		Conference Paper
1996MCM-D with embedded active and passive components
Töpper, M.; Wolf, J.; Glaw, V.; Buschick, K.; Dabek, A.; Dietrich, L.; Ehrmann, O.; Reichl, H.		Conference Paper
1996Mehrlagenverdrahtung für MCM-D und Chip Size Package
Töpper, M.; Buschick, K.; Wolf, J.; Dietrich, L.; Ehrmann, O.		Book Article
1996Metallisierung von Polymeren für Dünnfilmverdrahtungen
Töpper, M.; Schmidt, R.; Hannemann, M.; Schammler, G.; Hempel, G.		Journal Article
1996Palladiumhaltiges Precursormaterial und Verfahren zur Herstellung von metallischen Mikrostrukturen auf dielektrischen Substraten mit einem palladiumhaltigen Precursormaterial
Toepper, M.; Stolle, T.; Krabe, D.; Chmiel, G.; Schammler, G.; Reichl, H.		Patent
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1996The photolysis of pure and mixed palladium acetate thin films
Töpper, M.; Stolle, T.; Wäsche, M.		Journal Article
1996Redistribution technology for chip scale package using photosensitive BCB
Töpper, M.; Simon, J.; Reichl, H.		Journal Article
1996Thin film technologies for single-mode polymer waveguides
Töpper, M.; Fischbeck, G.; Moosburger, R.; Petermann, K.; Krabe, D.; Reichl, H.		Conference Paper
1995A comparison of flip chip technology with chip size packages
Simon, J.; Töpper, M.; Reichl, H.; Chmiel, G.		Conference Paper
1995On-Chip Umverdrahtung - eine Möglichkeit zur Anpassung von Chip- und Leiterplattenraster
Chmiel, G.; Töpper, M.; Simon, J.; Reichl, H.		Conference Paper
1995Planare Multichip-Einbettung bei Dünnfilm-Hybriden auf keramischen Substraten
Buschik, K.; Chmiel, G.; Ehrmann, O.; Glaw, V.; Paredes, A.; Wolf, J.		Book Article
1994Thinfilm multichip modules - Process development using photosensitive benzocyclobutane
Chmiel, G.; Töpper, M.; Jöhren, C.; Achen, A.		Conference Paper