Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Book Article
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Abstract
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Conference Paper
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Conference Paper
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Journal Article
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Conference Paper
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Journal Article
Fulltext
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Conference Paper
2018The Evolution of Panel Level Packaging
Aschenbrenner, R.; Töpper, M.; Braun, T.; Ostmann, A.
Conference Paper
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Conference Paper
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Conference Paper
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
Fulltext
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
Fulltext
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) For Wireless Urine Detection In Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Conference Paper
Fulltext
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Journal Article
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Conference Paper
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2018Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Conference Paper
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2017Aluminium-Scandium als alternative Bond-Pad-Chip-Metallisierung für Leistungshalbleiter
Geißler, Ute; Schneider-Ramelow, M.
Journal Article
2017Competitive evaluation of planar embedded class and polymer waveguides in data center environments
Pitwon, R.; Wang, K.; Yamauchi, A.; Ishigure, T.; Schröder, H.; Neitz, M.; Singh, M.
Journal Article
Fulltext
2017Design and demonstration of a photonic integrated glass interposer for mid-board-optical engines
Neitz, M.; Wöhrmann, M.; Zhang, R.; Fikry, M.; Marx, S.; Schröder, H.
Conference Paper
2017Design, fabrication and connectorization of high-performance multimode glass waveguides for board-level optical interconnects
Brusberg, L.; Fortusini, D.D.; Schröder, H.; Jiang, W.C.; Zakharian, A.R.; Kuchinsky, S.A.; Fiebig, C.; Li, S.; Kobyakov, A.; Evans, A.F.
Conference Paper
2017Development of a multi-project fan-out wafer level packaging platform
Braun, T.; Raatz, S.; Maass, U.; Dijk, M. van; Walter, H.; Hölck, O.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Wöhrmann, M.; Voges, S.; Huhn, M.; Lang, K.-D.; Wietstruck, M.; Scholz, R.F.; Mai, A.; Kaynak, M.
Conference Paper
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2017Forschung für die Elektroniksysteme von morgen: Vortrag gehalten auf dem 20. Elektroniktechnologie Kolleg; Colonia de Sant Jordi, Mallorca, Spanien; 29.03.-03.04.2017
Aschenbrenner, Rolf
Presentation
Fulltext
2017Insertion loss study for panel-level single-mode glass waveguides
Neitz, M.; Röder-Ali, J.; Marx, S.; Herbst, C.; Frey, C.; Schröder, H.; Lang, K.-D.
Conference Paper
2017International and industrial standardization of optical circuit board technologies
Pitwon, R.; Immonen, M.; Wu, J.; Brusberg, L.; Itoh, H.; Shioda, T.; Dorresteiner, S.; Yan, H.J.; Schröder, H.; Manessis, D.; Schneider, P.; Wang, K.
Book Article
2017Materials and Concepts for Textile Sensor Systems: Presentation held at 9th International Conference on Materials for Advanced Technologies (ICMAT 2017); Singapur; 18.-23.06.2017
Aschenbrenner, Rolf; Kallmayer, Christine
Presentation
Fulltext
2017Modular power electronics, realized by PCB embedding technology: Presentation held at Productronica 2017, 14.11. bis 17.11.2017, München
Böttcher, Lars; Karaszkiewicz, Stefan; Manessis, Dionysios; Ostmann, Andreas
Presentation
Fulltext
2017Panel Level Embedding for Power and Sensor Applications: Presentation held at IMAPS MicroTech 2017, 16.03.2017
Aschenbrenner, Rolf
Presentation
Fulltext
2017Panel Level Packaging for Power Applications: Presentation held at "From Nano to Micro Power Electronics and Packaging" Workshop (IMAPS) 2017; Tours, Frankreich; 11-12.10.2017
Aschenbrenner, Rolf
Presentation
Fulltext
2017Panel processing for high volume/high mix manufacturing
Aschenbrenner, Rolf; Ostmann, Andreas
Conference Paper
Fulltext
2017Pulsed laser beam identification of SEE-sensitive regions and observation of additional failure modes relevant for RHA in Digital Isolators: Presentation held at 5th Workshop on Laser Testing of Radiation Effects on Components and Systems, RADLAS 2017, October 9, 2017, Montpellier, France
Schmitz, Simone; Steffens, Michael; Metzger, Stefan; Wolf, Raphael; Beck, Peter; Wind, Michael; Poizat, Marc
Presentation
Fulltext
2017Real-time gesture recognition using a particle filtering approach
Li, F.; Köping, L.; Schmitz, S.; Grzegorzek, M.
Conference Paper
2017The roadmap of development of piezoresistive micro mechanical sensors for harsh environment applications
Ngo, Ha-Duong; Mackowiak, Piotr; Grabbert, Niels; Weiland, Thomas; Hu, Xiaodong; Schneider-Ramelow, Martin; Ehrmann, Oswin; Lang, Klaus-Dieter
Conference Paper
2017Shrinkage Measurements of UV‐Curable Adhesives: An elegant method based on a laser distance sensor for in‐situ measurements of the polymerization shrinkage
Lewoczko‐Adamczyk, W.; Marx, S.; Schröder, H.
Journal Article
2017Trends in fan-out wafer and panel level packaging
Braun, T.; Becker, K.-F.; Wöhrmann, M.; Töpper, M.; Böttcher, L.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Aluminum-Scandium: A Material for Semiconductor Packaging
Geißler, Ute; Thomas, Sven; Schneider-Ramelow, Martin; Mukhopadhyay, Biswajit; Lang, Klaus-Dieter
Journal Article
2016Analysis of multi-mode to single-mode conversion at 635 nm and 1550 nm
Zamora, V.; Bogatzki, A.; Arndt-Staufenbiel, N.; Hofmann, J.; Schröder, H.
Conference Paper
2016Chip embedding - The key for efficient power electronics solutions: Presentation held at MRS Spring Meeting 2016; Phoenix, AZ, USA; 28.03.-01.04.2016
Aschenbrenner, Rolf
Presentation
Fulltext
2016Compact power electronic modules realized by PCB embedding technology
Löher, T.; Karaszkiewicz, S.; Böttcher, L.; Ostmann, A.
Conference Paper
2016Development of a sensor concept to in situ measure process data in a transfer mold process
Kahle, R.; Becker, K.-F.; Bauer, J.; Braun, T.; Thomas, T.; Lang, K.-D.
Conference Paper
2016Electro-optical circuit board with single-mode glass waveguide optical interconnects
Brusberg, L.; Neitz, M.; Pernthaler, D.; Weber, D.; Sirbu, B.; Herbst, C.; Frey, C.; Queisser, M.; Wöhrmann, M.; Manessis, D.; Schild, B.; Oppermann, H.; Eichhammer, Y.; Schröder, H.; Håkansson, A.; Tekin, T.
Conference Paper
2016Electrochemical sensors based on printed circuit board technologies
Güth, F.; Arki, P.; Löher, T.; Ostmann, A.; Joseph, Y.
Journal Article
Fulltext
2016Embedded die packages and modules for power electronics applications
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2016Encapsulation of smart power electronic devices - Thermal degradation and dielectric behavior
Thomas, T.; Gineiger, S.; Becker, K.-F.; Georgi, L.; Lang, K.-D.
Conference Paper
2016Die Endmontagelinie für die Flugzeugproduktion der Zukunft
Knöpfel, Martin; Lödding, Hermann (Prüfer); Fischer, Kathrin (Prüfer); Friedewald, Alex (Betreuer); Schröder, Hendrik (Betreuer); Lagutin, Wladislav (Betreuer); Susemihl, Hendrik (Betreuer)
Master Thesis
2016Entwicklung einer Mikrokamera mit eingebetteter Bildverarbeitung auf Basis der Panel-Level-Packaging-Technologie
Böhme, Christian; Ostmann, Andreas; Schrank, Kai; Lang, Klaus-Dieter
Journal Article
2016Flottenmanagement und Buchungsplattform in Shared E-Fleet
Hudert, Sebastian; Koetschan, Christian; Kötter, Falko; Natzke, Norman; Noffke, Kai; Sanchez, David; Schmitz, Stefan; Taylor, Tim
Book Article
2016Foldable fan-out wafer level packaging
Braun, T.; Becker, K.-F.; Raatz, S.; Minkus, M.; Bader, V.; Bauer, J.; Aschenbrenner, R.; Kahle, R.; Georgi, L.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016Fully automated hybrid diode laser assembly using high precision active alignment
Böttger, G.; Weber, D.; Scholz, F.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2016High viscosity paste dosing for microelectronic applications
Thomas, Tina; Voges, S.; Braun, T.; Raatz, S.; Kahle, R.; Becker, K.-F.; Koch, M.; Fliess, M.; Bauer, J.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2016In-situ measuring module for transfer molding process monitoring
Kahle, Ruben; Braun, T.; Bauer, J.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2016Inline monitoring of epoxy molding compound in transfer molding process for smart power modules
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.
Conference Paper
2016Integration Technologies for Smart Textiles: Presentation held at MRS Spring Meeting 2016; Phoenix, AZ, USA; 28.03.-01.04.2016
Aschenbrenner, Rolf
Presentation
Fulltext
2016Large area processes for 3D shaped electronics
Ostmann, A.; Loeher, T.; Seckel, M.; Lang, K.-D.
Conference Paper
2016Large optical backplane with embedded graded-index glass waveguides and fiber-flex termination
Brusberg, L.; Whalley, S.; Charles, R.; Pitwon, A.; Faridi, F.R.; Schröder, H.
Journal Article
2016Low Cost chemiresistor arrays for the detection of VOC's
Wete, E.P.; Dittrich, R.; Joseph, Y.; Becking, D.; Panskus, R.; Ostmann, A.
Conference Paper
2016Multi-layer electro-optical circuit board fabrication on large panel
Schröder, H.; Neitz, M.; Whalley, S.; Herbst, C.; Frey, C.
Conference Paper
2016On-chip automation of cell-free protein synthesis: New opportunities due to a novel reaction mode
Georgi, V.; Georgi, Leopold; Blechert, Martin; Bergmeister, Merlin; Zwanzig, M.; Wüstenhagen, Doreen A.; Bier, Frank F.; Jung, Erik; Kubick, Stefan
Journal Article
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016Panel Level Embedding for Power and Sensor Applications: Presentation held at 37. International Electronics Manufacturing Technology Conference (IEMT) 2016; Penang, Malaysia; 20.-22.09.2016
Aschenbrenner, Rolf
Presentation
Fulltext
2016Planar polymer and glass graded index waveguides for data center applications
Pitwon, R.; Yamauchi, A.; Brusberg, L.; Wang, K.; Ishigure, T.; Schröder, H.; Neitz, M.; Worrall, A.
Conference Paper
2016Potential and challenges of fan-out panel level packaging
Braun, T.; Becker, K.-F.; Kahle, R.; Raatz, S.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Wöhrmann, M.; Lang, K.-D.
Conference Paper
2016The reliability of wire bonding using Ag and Al
Schneider-Ramelow, Martin; Ehrhardt, Christian
Journal Article
2016SiN-assisted flip-chip adiabatic coupler between SiPh and Glass OPCBs
Poulopoulos, G.; Baskiotis, C.; Kalavrouziotis, D.; Brusberg, L.; Schröder, H.; Apostolopoulos, D.; Avramopoulos, H.
Conference Paper
2016Trägersystem für mikrooptische und/oder andere Funktionselemente der Mikrotechnik
Schröder, Henning; Böttger, Gunnar; Marx, Sebastian; Arndt-Staufenbiel, Norbert
Patent
Fulltext
2016Verfahren zur Bereitstellung eines Mehrlagenverbundes mit optischer Glaslage
Brusberg, Lars; Schröder, Henning
Patent
Fulltext
2016Versatile thin-panel-glass-based assembly platform for electro-optical and micro-optical components
Böttger, G.; Weber, D.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2016Visuelle und mechanische Prüfung von Drahtbondverbindungen
Schneider-Ramelow, Martin; Ehrhardt, C.; Höfer, J.; Schmitz, S.; Lang, K.-D.
Journal Article
2015Advanced approach of calculating wire bond pull test correction factors
Schmitz, Stefan; Kripfgans, J.; Schneider-Ramelow, M.; Müller, W.H.; Lang, K.-D.
Book Article
2015Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2015 Hochstromkontakte für Smart-Power Mechanics
Ansorge, F.; Ratke, H.; Schreier-Alt, T.; Baar, C.; Ifland, D.; Lang, K.-D.
Journal Article
2015Building blocks for actively-aligned micro-optical systems in rapid prototyping and small series production
Böttger, G.; Queisser, M.; Arndt-Staufenbiel, N.; Schröder, H.; Lang, K.-D.
Conference Paper
2015A compact W-band LFMCW radar module with high accuracy and integrated signal processing
Zech, C.; Hülsmann, A.; Schlechtweg, M.; Reinold, Steffen; Giers, Christof; Kleiner, Bernhard; Georgi, L.; Kahle, R.; Becker, K.-F.; Ambacher, O.
Conference Paper
2015Correlation between chip metallization properties and the mechanical stability of heavy Cu wire bonds
Gross, David; Haag, S.; Reinold, M.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2015Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2015Dependency of the porosity and the layer thickness on the reliability of Ag sintered joints during active power cycling
Weber, Constanze; Hutter, Matthias; Schmitz, Stefan; Lang, Klaus-Dieter
Conference Paper
2015Development of a microcamera with embedded image processor using panel level packaging
Ostmann, A.; Boehme, C.; Schrank, K.; Lang, K.-D.
Conference Paper
2015Development of advanced power modules for electric vehicle applications
Manessis, D.; Boettcher, L.; Ostmann, A.; Lang, K.-D.; Whalley, S.
Conference Paper
2015Diffusion barrier stability against Cu diffusion under the influence of heavy Cu wire bonding
Gross, David; Haag, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2015Display glass for low-loss and high-density optical interconnects in electro-optical circuit boards with eight optical layers
Brusberg, L.; Whalley, S.; Herbst, C.; Schröder, H.
Journal Article
Fulltext
2015Electro-optical backplane demonstrator with integrated multimode gradient-index thin glass waveguide panel
Schröder, H.; Brusberg, L.; Pitwon, R.; Whalley, S.; Wang, K.; Miller, A.; Herbst, C.; Weber, D.; Lang, K.-D.
Conference Paper
2015Embedded power modules - a new approach using Power Core and High Power PCB
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Conference Paper
2015From fan-out wafer to fan-out panel level packaging
Braun, Tanja; Becker, Karl-Friedrich; Raatz, Stefan; Bader, Volker; Bauer, Jochen; Aschenbrenner, Rolf; Voges, Steve; Thomas, Tina; Kahle, Ruben; Lang, Klaus-Dieter
Conference Paper
2015A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Conference Paper
2015Glass-based Manufacturing and Prototyping Platform PhotPack: New concepts for integrating various optical components in actively aligned glass assemblies
Böttger, G.; Seifert, S.; Schröder, H.
Journal Article
2015Heterogeneous integration of a miniaturized W-band radar module
Becker, Karl-Friedrich; Georgi, L,; Kahle, R.; Koch, M.; Voges, S.; Brandenburger, F.; Höfer, J.; Ehrhardt, C.; Zech, C.; Baumann, B.; Huelsmann, A.; Grasenack, A.; Reinold, S., Kleiner, B.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2015High performance ion-exchanged integrated waveguides in thin glass for board-level multimode optical interconnects
Brusberg, L.; Schröder, H.; Herbst, C.; Frey, C.; Fiebig, C.; Zakharian, A.; Kuchinsky, S.; Liu, X.; Fortusini, D.; Evans, A.
Conference Paper
2015Influence of humidity on reliability of plastic packages
Braun, Tanja; Bauer, Jörg; Becker, Karl-Friedrich; Hölck, Ole; Walter, Hans; Dijk, M. van; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2015Intelligente Steckverbinder und Anschlusstechnologien für die Produktion der Zukunft
Michels, J.S.; Mödinger, R.; Meier, O.; Baar, C.; Ansorge, F.; Schiefelbein, F.-P.
Conference Paper
2015Large area compression molding for Fan-out Panel Level Packing
Braun, Tanja; Raatz, Stefan; Voges, Steve; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Becker, Karl-Friedrich; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2015Large Area LED Package
Goullon, L.; Jordan, R.; Braun, T.; Bauer, J.; Becker, F.; Hutter, M.; Schneider-Ramelow, M.; Lang, K.D.
Conference Paper
2015Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O.
Conference Paper
2015Material and process trends for moving from FOWLP to FOPLP
Braun, Tanja; Voges, S.; Töpper, Michael; Wilke, Martin; Wöhrmann, M.; Maaß, Uwe; Huhn, Max; Becker, Karl-Friedrich; Raatz, Stefan; Kim, J.-U.; Aschenbrenner, Rolf; Lang, Klaus-Dieter; O'Connor, C.; Barr, R.; Calvert, J.; Gallagher, M.; Iagodkine, E.; Aoude, T.; Politis, A.
Conference Paper
2015Messvorrichtung und Fluidikvorrichtung zum Messen einer Menge einer zu untersuchenden Substanz
Jung, Erik; Georgi, Leopold; Kubick, Stefan
Patent
Fulltext
2015Microelectronic Packaging in the 21st Century: Honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday
Aschenbrenner, Rolf; Schneider-Ramelow, Martin
Book
2015Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D.
Journal Article
2015Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Journal Article
2015Next generation high power electronic modules based on embedded power semiconductors
Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Hoene, E.; Ostmann, A.
Journal Article
2015Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.
Journal Article
Fulltext
2015Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides
Pitwon, R.C.A.; Brusberg, L.; Schröder, H.; Whalley, S.; Wang, K.; Miller, A.; Stevens, P.; Worrall, A.; Messina, A.; Cole, A.
Journal Article
2015Silicon photonics packaging on board-level
Brusberg, Lars; Weber, D.; Pernthaler, D.; Mukhopadhyay, B.; Böttger, G.; Schröder, H.; Tekin, T.
Conference Paper
2015Single-mode board-level interconnects for silicon photonics
Brusberg, L.; Manessis, D.; Herbst, C.; Neitz, M.; Schild, B.; Töpper, M.; Schröder, H.; Tekin, T.
Conference Paper
2015Smart Power Mechanics – Elektrische Anschlusstechnologien für Morgen
Schreier-Alt, T.; Ansorge, F.; Baar, C.; Radtke, H.; Amende, T.
Conference Paper
2015Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
Brusberg, L.; Schröder, H.; Ranzinger, C.; Queisser, M.; Herbst, C.; Marx, S.; Hofmann, J.; Neitz, M.; Pernthaler, D.; Lang, K.-D.
Conference Paper
2015Thin glass based electro-optical circuit board (EOCB): Waveguide process, PCB technology, and coupling interfaces
Schröder, H.; Brusberg, L.
Conference Paper
201424"×18" fan-out panel level packing
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Bauer, Jörg; Kahle, Ruben; Bader, V.; Thomas, Tina; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance
Neeb, C.; Teichrib, J.; Doncker, R.W. de; Boettcher, L.; Ostmann, A.
Conference Paper
2014Adhesive-based self-alignment mechanisms for modular stacked microsystems
Braun, T.; Jagodzinska, Jagoda; Becker, Karl-Friedrich; Bauer, Jörg; Georgi, Leopold; Ostmann, Andreas; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014Array fiber welding on micro optical glass substrates for chip-to-fiber coupling
Schröder, H.; Neitz, M.; Brusberg, L.; Queiser, M.; Arndt-Staufenbiel, N.; Lang, K.-D.
Conference Paper
2014Challenges and opportunities for Fan-out Panel Level Packaging (FOPLP)
Braun, Tanja; Becker, Karl-Friedrich; Voges, Steve; Thomas, Tina; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2014CMOS biosensor using TSV interposer technology
Ebefors, T.; Fredlund, J.; Jung, E.; Braun, T.
Journal Article
2014CO2-laser drilling of TGVs for glass interposer applications
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Presentation
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Conference Paper
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Hoene, E.; Ostmann, A.; Marczok, C.
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Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
Journal Article
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Conference Paper
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Book Article
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Ostmann, A.; Lang, K.-D.; Vanfleteren, J.; Nowottnick, M.
Dissertation
Fulltext
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Conference Paper
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Brusberg, Lars; Schröder, Henning
Patent
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Jung, Erik; Georgi, Leopold; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal
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Ostmann, A.; Hofmann, T.; Neeb, C.; Boettcher, L.; Manessis, D.; Lang, K.-D.
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Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
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Sbeiti, Mohamad; Müller, Wolfgang H.; Geißler, Ute; Schneider-Ramelow, Martin; Schmitz, Stefan
Journal Article
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Conference Paper
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Becker, Karl-Friedrich; Braun, T.; Bauer, J.; Böttcher, L.; Ostmann, A.; Pahl, B.; Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
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Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Journal Article
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Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
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Book Article
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Conference Paper
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Conference Paper
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Conference Paper
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Conference Paper
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Conference Paper
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Conference Paper
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Patent
Fulltext
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Geißler, Ute; Schneider-Ramelow, M.; Milke, E.
Book Article
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Bulavinov, Andrey; Schenkel, Jörg; Pinchuk, Roman; Schröder, Hans-Christian
Conference Paper
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Schmitz, S.; Schneider-Ramelow, M.
Journal Article
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Conference Paper
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Goehre, J.; Schmitz, S.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
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Limmer, S.; Schneider, A.; Boehme, C.; Fey, D.; Schmitz, S.; Graupner, A.; Sülzle, M.
Conference Paper
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Conference Paper
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Conference Paper
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Conference Paper
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Schneider-Ramelow, Martin; Hutter, Matthias; Oppermann, Hermann; Göhre, Jens-Martin; Schmitz, Stefan; Hoene, Eckart; Lang, Klaus-Dieter
Conference Paper
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Braun, T.; Brundel, M.; Becker, K.-F.; Kahle, R.; Piefke, K.; Scholz, U.; Haag, F.; Bader, V.; Voges, S.; Thomas, T.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
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Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Aschenbrenner, R.; Schneider-Ramelow, M.; Thomas, T.; Bochow-Ness, O.; Lang, K.-D.
Conference Paper
2012Transfer molding technology for smart power electronics modules: Materials and processes
Becker, K.-F.; Joklitschke, D.; Braun, T.; Koch, M.; Thomas, T.; Schreier-Alt, T.; Bader, V.; Bauer, J.; Nowak, T.; Bochow-Ness, O.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
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Schuck, H.; Bauerfeld, F.; Knoll, T.; Velten, T.; Zwanzig, M.; Schmidt, R.; Kallmayer, C.
Conference Paper
20113-dimensionaler Druck für kostengünstige Individualisierung im Mikro- und Nanobereich
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Journal Article
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Braun, Tanja; Becker, Karl-F.; Voges, Steve; Thomas, Tina; Töpper, Michael; Fischer, Thorsten; Kahle, Ruben; Bader, Volker; Bauer, Jörg; Aschenbrenner, Rolf; Lang, Klaus-Dieter
Conference Paper
2011Actuated micro-optical submount using a dielectric elastomer actuator
Jordan, G.; McCarthy, D.N.; Schlepple, N.; Krißler, J.; Schröder, H.; Kofod, G.
Journal Article
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Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Ostmann, A.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
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Brusberg, L.; Schlepple, N.; Schröder, H.
Conference Paper
2011Combination of channel- and droplet- based microfluidics for complex PoC-Devices
Georgi, Leopold; Jung, Erik; Bauer, Jörg; Braun, Tanja; Schuldt, Victoria; Metwally, Khaled; Robert, Laurent; Khan-Malek, Chantal
Conference Paper
2011Cu-Ball/Wedge Bonden: Entwicklung und Status 2011. Tl.2
Schneider-Ramelow, Martin; Geißler, Ute, Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
2011Cu-Ball/Wedge-Bonden: Entwicklung und Status 2011. Tl.1
Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
2011Cu-Ball/Wedge-bonden: Entwicklung und Status 2011. Tl.3
Schneider-Ramelow, Martin; Geißler, Ute; Schmitz, Stefan; Grübl, Wolfgang; Schuch, Bernhard
Journal Article
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Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.
Conference Paper
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Hoene, Eckart; Schneider-Ramelow, Martin; Feix, Gudrun; Ostmann, Andreas; Becker, Karl-Friedrich; Hutter, Matthias
Journal Article
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Conference Paper
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Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Conference Paper
2011Fortschritte beim Aufbau von Leistungshalbleitern
Hutter, Matthias; Göhre, Jens-Martin; Hoene, Eckart; Schneider-Ramelow, Martin; Oppermann, Hermann
Journal Article
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Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.
Journal Article
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Pötter, H.; Oestermann, U.; Jung, E.; Kallmayer, C.
Journal Article
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Schröder, H.; Brusberg, L.; Arndt-Staufenbiel, N.; Hofmann, J.; Marx, S.
Conference Paper
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Conference Paper
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Schmitz, S.; Schneider-Ramelow, M.; Schröder, S.
Journal Article
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Schröder, H.; Griese, E.
Book Article
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Goehre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.
Conference Paper
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Geissler, U.; Funck, J.; Schneider-Ramelow, M.; Engelmann, H.-J.; Rooch, I.; Müller, W.H.; Reichl, H.
Journal Article
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Sharma, A.; Rieth, L.; Tathireddy, P.; Harrison, R.; Oppermann, H.; Klein, M.; Töpper, M.; Jung, E.; Normann, R.; Clark, G.; Solzbacher, F.
Journal Article
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Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Modular microelectronics by system-in-packages with embedded components
Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
Conference Paper
2011Modular system packaging by embedding: Technologies, applications and perspectives
Böttcher, Lars; Manessis, D.; Karaszkiewicz, S.; Löher, T.; Ostmann, A.
Conference Paper
2011NCA flip-chip bonding with thermoplastic elastomer adhesives: Fundamental failure mechanisms and opportunities of polyurethane bonded NCA-interconnects
Foerster, Philipp; Linz, Torsten; Krshiwoblozki, Malte von; Walter, Hans; Kallmayer, Christine; Aschenbrenner, Rolf
Conference Paper
Fulltext
2011Novel approach for integrating electronics into textiles at room temperature using a force-fit interconnection
Simon, Erik; Kallmayer, Christine; Aschenbrenner, Rolf; Klaus-Dieter, Lang
Conference Paper
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Boettcher, L.; Karaszkiewicz, S.; Manessis, D.; Ostmann, A.
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Schreier-Alt, T.; Unterhofer, K.; Ansorge, F.; Lang, K.-D.
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Ostmann, A.; Bruehl, B.; Manessis, D.; Seckel, M.; Lang, K.-D.
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Geißler, U.; Funck, J.; Schneider-Ramelow, M.
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Brusberg, L.; Lang, G.; Schröder, H.
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Braun, T.; Becker, K.-F.; Voges, S.; Thomas, T.; Kahle, R.; Bader, V.; Bauer, J.; Piefke, K.; Krüger, R.; Aschenbrenner, R.; Lang, K.-D.
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2011Verfügbarkeit und Leistung - Synthese zweier Kennwerte für die anforderungsgerechte Planung intralogistischer Systeme
Ten Hompel, M.; Sadowsky, V.; Jung, E.-N.; Mosblech, C.
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Fulltext
2011Verfügbarkeit und Leistung - Synthese zweier Kennwerte für die anforderungsgerechte Planung intralogistischer Systeme
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2010Active Power Cycling for End of Life Tests of Heavy Wire Bond Interfaces on Power Semiconductors
Göhre, J.; Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.
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Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
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Dissertation
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Jung, E.
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Book Article
20094M network of excellence, Progress report 2009
Dimov, S.S.; Matthews, C.W.; Brousseau, E.; Bigot, S.; Grave, A. de; Fillon, B.; Weinzierl, M.; Engel, U.; Johander, P.; Jung, E.; Kirby, P.B.; Mattsson, L.; Richter, M.; Schoth, A.
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2009Advancements in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2009Analyse des Rissverlaufs in Dickdrahtbondverbindungen auf Leistungshalbleitern beim Active Power Cycling
Göhre, J.; Geißler, U.; Schneider-Ramelow, M.
Journal Article
2009Analysis of the friction processes in ultrasonic wedge/wedge-bonding
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
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2009Biocompatible lab-on-substrate technology platform
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Manessis, D.; Böttcher, L.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
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Galan, J.V.; Sanchis, P.; Marti, J.; Marx, S.; Schröder, H.; Mukhopadhyay, B.; Tekin, T.; Selvaraja, S.; Bogaerts, W.; Dumon, P.; Zimmermann, L.
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Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
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Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
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Bttcher L.; Manessis, D.; Ostmann, A.; Reichl, H.
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Becker, K.-F.; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
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2009Embedding technology development for a 77 GHz automotive radar system
Becker, Karl-Friedrich; Koch, M.; Kahle, R.; Braun, T.; Böttcher, L.; Ostmann, A.; Kostelnik, J.; Ebling, F.; Noack, E.; Sommer, J.P.; Richter, M.; Schneider, M.; Reichl, H.
Conference Paper
2009Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
Fulltext
2009Failure modeling of ACA-glued flip-chip on flex assemblies
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Conference Paper
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Patent
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Schreier-Alt, T.; Braun, T.; Becker, K.-F.; Rebholz, C.; Wunderle, B.; Reichl, H.
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Thomasius, R.; Jordan, G.; Kim, J.-U.; Schröder, H.; Reichl, H.
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2009FreshScan - Portables optisches Messsystem zur Überwachung des Frischegrades von Fleisch
Thomasius, R.; Kim, J.-U.; Nestler, V.; Reichl, H.; Jordan, G.; Schröder, H.; Lang, K.-D.; Maiwald, M.; Sumpf, B.; Schmidt, H.; Kronfeldt, H.-D.; Hengl, C.; Wulf, J.
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Conference Paper
2009Hardening and Softening in AlSi1 Bond Contacts During Ultrasonic Wire Bonding
Geißler, U.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2009Heterogeneous Integration
Reichl, H.; Aschenbrenner, R.; Töpper, M.; Pötter, H.
Book Article
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
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2009Innovative approaches for realisation of embedded chip packages - technological challenges and achievements
Manessis, D.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
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2009Innovative package realization by Chip Embedding Technologies
Böttcher, L.; Manessis, D.; Karaszkiewicz, S.; Ostmann, A.; Reichl, H.
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Pötter, H.; Hampicke, M.; Schmitz, S.; Lang, K.-D.; Reichl, H.
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Richter, M.D.; Becker, K.-F.; Bottcher, L.; Schneider, M.
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2009Kirkendall voiding in Au ball bond interconnects on Al chip metallization in the temperature range from 100 - 200°C after optimized intermetallic coverage
Schneider-Ramelow, M.; Schmitz, S.; Schuch, B.; Grübl, W.
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Braun, T.; Böttcher, L.; Bauer, J.; Jung, E.; Becker, K.-F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
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Schreier-Alt, T.; Ansorge, F.
Journal Article
2009Low-temperature contacts through SixNy-antireflection coatings for inverted a-Si:H/c-Si hetero-contact solar cells
Wünsch, F.; Klein, D.; Podlasly, A.; Ostmann, A.; Schmidt, M.; Kunst, M.
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Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2009Mikrooptisches Koppelelement mit integrierten optischen Wellenleitern
Tekin, T.; Schroeder, H.; Arndt-Staufenbiehl, N.; Brusberg, L.
Patent
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Vieroth, R.; Kallmayer, C.; Aschenbrenner, R.; Herbert, R.
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Jordan, G.; Thomasius, R.; Schröder, H.; Wulf, J.S.; Schlüter, O.; Sumpf, B.; Maiwald, M.; Schmidt, H.; Kronfeldt, H.-D.; Scheuer, R.; Schwägele, F.; Lang, K.-D.
Journal Article
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Schröder, Henning; Lars Brusberg; Tolga Tekin; N. Arndt-Staufenbiel
Conference Paper
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2009Out-of-plane coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.; Tekin, T.
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Jung, E.; Pötter, H.; John, L.-G.
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Brusberg, L.; Schröder, H.; Töpper, M.; Reichl, H.
Conference Paper
2009Photovoltaikmodul und Verfahren zur Herstellung eines Photovoltaikmoduls
Löher, T.; Ostmann, A.; Seckel, M.
Patent
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2009Plastic packaging for high temperature applications
Braun, T.; Becker, K.-F.; Bauer, J.; Koch, M.; Bader, V.; Kahle, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
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Jung, E.; Minkus, M.; Becker, K.F.; Koch, M.
Conference Paper
2009Preclinical evaluation of a novel fiber compound MR guidewire in vivo
Krämer, N.A.; Krüger, S.; Schmitz, S.; Linssen, M.; Schade, H.; Weiss, S.; Spüntrup, E.; Günther, R.W.; Bücker, A.; Krombach, G.A.
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Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.; Reichl, H.
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2009Simulation and experimental analysis of substrate overmolding
Schreier-Alt, T.; Ansorge, F.; Rebholz, C.
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Jung, E.; Becker, K.-F.; Braun, T.; Aschenbrenner, R.
Conference Paper
2009Solar concentrating systems using small mirror arrays
Goettsche, J.; Hoffschmidt, B.; Schmitz, S.; Sauerborn, M.; Buck, R.; Teufel, E.; Badstübner, K.; Ifland, D.; Rebholz, C.
Conference Paper
2009Stress measurement on chip level optimizes packaging and assembly of microsystems
Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H.
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2009Stretchable circuit board technology and application
Vieroth, R.; Löher, T.; Seckel, M.; Dils, C.; Kallmayer, C.; Ostmann, A.; Reichl, H.
Conference Paper
2009Stretchable circuit board technology in textile applications
Ostmann, A.; Vieroth, R.; Seckel, M.; Löher, T.; Reichl, H.
Conference Paper
2009Stretchable electronic systems: Realization and applications
Löher, T.; Seckel, M.; Vieroth, R.; Dils, C.; Kallmayer, C.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2009Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.
Journal Article
2009Thermo-mechanical stress analysis
Niehoff, K.; Schreier-Alt, T.; Schindler-Saefkow, F.; Ansorge, F.; Kittel, H.
Conference Paper
2009Thin glass based packaging technologies for optoelectronic modules
Brusberg, L.; Schröder, H.; Töpper, M.; Arndt-Staufenbiel, N.; Röder, J.; Lutz, M.; Reichl, H.
Conference Paper
2009Ultrasonic friction power during Al wire wedge-wedge bonding
Shah, A.; Gaul, H.; Schneider-Ramelow, M.; Reichl, H.; Mayer, M.; Zhou, Y.
Journal Article
2009Ventil zum Einsatz in einer Leitung zum Fuehren einer Fluessigkeit
Kunze, G.; Falkenhausen, C.; Ansorge, F.; Irlbauer, M.
Patent
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2009Verfahren und Anordnung zur Herstellung einer Niedertemperaturkontaktierung für mikroelektronische Aufbauten
Bauer, J.; Becker, K.-F.; Kahle, R.
Patent
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2009Verfahren zum Betrieb eines Brennstoffzellensystems mit Standby-Funktion sowie Brennstoffzellensystem mit Standby-Funktion
Schwarz, T.; Schmitz, S.; Stobbe, S.; Turner, H.
Patent
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2009Verfahren zur Erzeugung eines elektronischen Systems, Verfahren zur Erzeugung einer Freiformflaeche mit einem solchen System, sowie elektronisches System und Freiformflaechen mit einem solchen System
Loeher, T.; Ostmann, A.; Seckel, M.
Patent
Fulltext
2009Verfahren zur Erzeugung metallisch kristalliner Oberflaechenstrukturen im Wege einer galvanischen Metallabscheidung
Schmidt, R.; Zwanzig, M.; Fiedler, S.; Ostmann, A.; Aschenbrenner, R.
Patent
Fulltext
2009Verfahren zur Herstellung einer elektronischen Baugruppe und elektronische Baugruppe
Ostmann, A.; Manessis, D.; Böttcher, L.; Karaszkiewicz, S.
Patent
Fulltext
2009Zuverlässigkeit von Intralogistiksystemen: Eine Aufgabe der Instandhaltung
Wenzel, S.; Bandow, G.; Kuhn, A.; Jung, E.-N.; Ten Hompel, M.
Conference Paper
20083-D capacitive interconnections with mono- and bi-directional capabilities
Fazzi, A.; Canegallo, R.; Ciccarelli, L.; Magagni, L.; Natali, F.; Jung, E.; Rolandi, P.; Guerrieri, R.
Journal Article
20083D capacitive interconnections for high speed interchip communication
Canegallo, R.; Fazzi, A.; Ciccarelli, L.; Magagni, L.; Natalia, F.; Rolandi, P.; Jung, E.; Cioccio, L. di; Guerrieri, R.
Conference Paper
2008Berührungslose Bestückverfahren - Neue Ansätze für die AVT von Mikrosystemen
Becker, K.-F.; Fiedler, S.; Bauer, J.; Kolesnik, I.; Jung, E.; Mollath, G.; Schreck, G.; Reichl, H.
Journal Article
2008Compact green laser source using butt-coupling between multi-section DFB-laser and SHG waveguide crystal
Wiedmann, J.; Brox, O.; Tekin, T.; Scholz, F.; Büttner, T.; Marx, S.; Lang, G.; Schröder, H.; Klehr, A.; Erbert, G.
Journal Article
2008A compact integrated green-light source by second harmonic generation of a GaAs distributed feedback laser diode
Tekin, T.; Schröder, H.; Wunderle, B.; Erbert, G.; Klehr, A.; Brox, O.; Wiedmann, J.; Scholz, F.
Conference Paper
2008Contactless component handling on PCB using EWOD principles
Braun, T.; Becker, K.-F.; Koch, M.; Lienemann, J.; Kahle, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Design and assembly of power semiconductors with double-sided water cooling
Schneider-Ramelow, M.; Baumann, T.; Hoene, E.
Conference Paper
2008Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.
Conference Paper
2008Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology
Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.
Conference Paper
2008Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development
Lee, J.-S.; Chu, K.-M.; Patzelt, R.; Manessis, D.; Ostmann, A.; Jeon, D.Y.
Journal Article
2008Electrical-optical circuit boards optical waveguides and coupling elements based on the thin glass layer concept
Schröder, H.; Arndt-Staufenbiehl, N.
Journal Article
2008Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides
Beier, A.; Schröder, H.; Arndt-Staufenbiel, N.; Ebling, F.; Franke, M.; Griese, E.; Intemann, S.; Kostelnik, J.; Kühler, T.; Mödinger, R.; Roda, I.; Schlosser, I.
Conference Paper
2008Embedded chip packages - technology and application
Böttcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding of chips for system in package realization - technology and applications
Boettcher, L.; Manessis, D.; Ostmann, A.; Karaszkiewicz, S.; Reichl, H.
Conference Paper
2008Embedding technologies for SiP manufacturing
Manessis, D.; Ostmann, A.
Journal Article
2008Embroidered interconnections and encapsulation for electronics in textiles for wearable electronics applications
Linz, Torsten; Vieroth, R.; Dils, C.; Koch, M.; Braun, T.; Becker, K.-F.; Kallmayer, C.; Hong, S.-M.
Conference Paper
Fulltext
2008ePIXpack - advanced smart packaging solutions for silicon photonics
Zimmermann, L.; Schröder, H.; Dumon, P.; Bogaerts, W.; Tekin, T.
Conference Paper
Fulltext
2008Evaluation of innovative nano-coated stencils in ultra-fine-pitch flip chip bumping processes
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Fibre-array optical interconnection for silicon photonics
Tekin, T.; Schröder, H.; Zimmermann, L.; Dumon, P.; Bogaerts, W.
Conference Paper
2008Flex Technology for Foldable Medical Flip Chip Devices
Pahl, B.; Löher, T.; Burkhard, H.; Link, J.; Aschenbrenner, R.
Conference Paper
2008g-Pack - a generic testbed package for silicon photonics devices
Zimmermann, L.; Schröder, H.; Tekin, T.; Bogaerts, W.; Dumon, P.
Conference Paper
Fulltext
2008"glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules
Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.
Conference Paper
2008"glassPack": A novel photonic packaging and integration technology using thin glass foils
Brusberg, L.; Schröder, H.; Arndt-Staufenbiel, N.; Wiemer, M.
Conference Paper
2008Highly integrated flexible electronic circuits and modules
Loher, T.; Seckel, M.; Pahl, B.; Böttcher, L.; Ostmann, A.; Reichl, H.
Conference Paper
2008Immersion Ag as an alternative in 'Green' COB technology
Schneider-Ramelow, M.; Müller, J.; Göhre, J.-M.; Reichl, H.
Conference Paper
2008Industrial and technical aspects of chip embedding technology
Ostmann, A.; Manessis, D.; Stahr, J.; Beesley, M.; Cauwe, M.; Baets, J. de
Conference Paper
2008An integrated electronic meniscus sensor for measurement of evaporative flow
Gazzola, D.; Iafelice, B.; Jung, E.; Scarselli, E.F.; Guerrieri, R.
Conference Paper
2008Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination
Lang, K.-D.; Goehre, J.; Schneider-Ramelow, M.
Conference Paper
2008KRAFAS - Einbetttechnologien für aktive Komponenten
Kostelnik, J.; Becker, K.-F.; Ebling, F.; Sommer, J.-P.; Noack, E.; Böttcher, L.
Journal Article
2008Lamination and laser structuring for a microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.; Iafelice, B.; Destro, F.; Gambari, R.
Journal Article
2008Latest developments in bumping technologies for flip chip and WLCSP packaging
Manessis, D.; Aschenbrenner, R.; Ostmann, A.; Reichl, H.
Conference Paper
2008Lieferempfehlung für Leiterplatten für die COB-Montage
Schneider-Ramelow, M.; Rudolf, F.
Journal Article
2008Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Low Temperature Au-Au Flip Chip Interconnections
Pahl, B.; Zwanzig, M.; Fiedler, S.; Kallmayer, C.; Töpper, M.; Schmidt, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Manufacturing Concepts for Stretchable Electronic Systems
Ostmann, A.; Löher, T.; Seckel, M.; Böttcher, L.; Reichl, H.
Conference Paper
2008Mechanische Prüfverfahren für Draht- und Bändchenbondver-bindungen extrem kleiner Geometrien.
Schneider-Ramelow, M.; Rudolf, F
Book Article
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Miniaturized camera system using advanced packaging techniques
Jung, E.; Koch, M.; Schmitz, S.; Boutte, R.; Harvey, I.; Meacham, T.; Solzbacher, F.
Conference Paper
2008More than moore, hetero system integration and smart system integration: Three approaches - one goal. Smarter products and processes
Reichl, H.; Aschenbrenner, R.; Pötter, H.; Schmitz, S.
Book Article
2008An MR guidewire based on micropultruded fiber-reinforced material
Krüger, S.; Schmitz, S.; Weiss, S.; Wirtz, D.; Linssen, M.; Schade, H.; Krämer, N.; Spüntrup, E.; Krombach, G.; Bücker, A.
Journal Article
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2008Neue Verfahren und Werkstoffe für Halbleiterkomponenten
Pötter, H.; Becker, K.-F.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Töpper, M.
Journal Article
2008Novel rapid prototyping processes - Building movable parts
Ansorge, F.; Badstübner, K.; Reichl, H.
Conference Paper
2008Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F.
Conference Paper
2008Optical coupling using thin glass based arrayed waveguide components
Schröder, H.; Arndt-Staufenbiehl, N.; Brusberg, L.; Tekin, T.
Conference Paper
2008Realization of system-in-package modules by embedding of chips
Boettcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2008Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Reliable Encapsulation of Microsystems for Automotive Use
Becker, K.-F.; Braun, T.; Koch. M.; Bauer, J.; Wunderle, B.; Sommer, J.-P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Stacking of ultra-thin film packages
Ko, C.-T.; Shih, Y.-C.; Chang, J.-Y.; Kuo, T.-Y.; Chen, Y.-H.; Ostmann, A.; Manessis, D.
Conference Paper
2008Stretchable electronic systems for wearable and textile applications
Löher, T.; Vieroth, R.; Seckel, M.; Ostmann, A.; Reichl, H.
Conference Paper
2008Sustainability by Using Used Assemblies in Automotive Electronics
Mente, T.; Schuch, B.; Ernst, C.; Schuster, A.; Böckhorst, S.; Friedrichs, L.; Halser, K.; Bochow-Neß, O.; Middendorf, A.
Conference Paper
2008System-in-package solutions with embedded active and passive components
Aschenbrenner, R.
Conference Paper
2008Systematical pull and shear test investigations on very small bond loops (wire <= 25 µm) and innovative alloys
Schneider-Ramelow, M.; Göhre, J.
Conference Paper
2008Systematische Pull- und Schertestuntersuchungen an Drahtbondbrücken mit kleinsten Geometrien (<= 25 µm) und innovativer Legierungszusammensetzung
Schneider-Ramelow, M.; Rudolf, F.
Conference Paper
2008Thin glass based electrical-optical circuit boards (EOCB) using ion-exchange technology for graded-index multimode waveguides
Schröder, H.; Arndt-Staufenbiel, N.; Beier, A.; Ebling, F.; Franke, M.; Griese, E.; Intemann, S.; Kostelnik, J.; Kühler, T.; Mödinger, R.; Roda, I.; Schlosser, I.
Conference Paper
2008Through silicon vias as enablers for 3D systems
Jung, E.; Ostmann, A.; Ramm, P.; Wolf, J.; Toepper, M.; Wiemer, M.
Conference Paper
2008Trends in der Mikrosystemtechnik
Hampicke, M.; Reichl, H.; Lang, K.-D.; Schmitz, S.; Pötter, H.
Journal Article
2008Trends und Technologien - "More than Moore" und neue Konzepte der Aufbau- und Verbindungstechnik
Pötter, H.; Hampicke, M.; Lang, K.-D.; Schmitz, S.; Reichl, H.
Journal Article
2008Verfahren zur Bestimmung eines Gehalts oder Partialdrucks einer Gaskomponente einer Brennstoffzelle
Schmitz, S.; Ermatschenko, N.; Schwarz, T.
Patent
Fulltext
2008Verfahren zur Kontaktierung, Zusammensetzung fuer die Chipkontaktierung sowie deren Verwendung
Bauer, J.; Kallmayer, C.; Pahl, B.
Patent
Fulltext
2008Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A.
Conference Paper
20073-D capacitive interconnections for wafer-level and die-level assembly
Fazzi, A.; Magagni, L.; Mirandola, M.; Charlet, B.; Cioccio, L. di; Jung, E.; Canegallo, R.; Guerrieri, R.
Journal Article
20073D capacitive interconnections with mono- and Bi-directional capabilities
Fazzi, A.; Canegallo, R.; Ciccarelli, L.; Magagni, L.; Natali, F.; Jung, E.; Rolandi, P.L.; Guerrieri, R.
Conference Paper
2007Alternative UBM for Lead Free Solder Bumping using C4NP
Ruhmer, K.; Laine, E.; O'Donnell, K.; Kostetsky, J.; Hauck, K.; Manessis, D.; Ostmann, A.; Töpper, M.; Jürgensen, N.
Conference Paper
2007Aluminium printed circuit board technology for biomedical microdevices
Iafelice, B.; Destro, F.; Manessis, D.; Gazzola, D.; Jung, E.; Böttcher, L.; Borgatti, M.; Braun, T.; Bauer, J.; Gavioli, R.; Gambari, R.; Ostmann, A.; Guerrieri, R.
Conference Paper
2007Ausfallmechanismen bei Drahtbondverbindungen
Schneider-Ramelow, M.
Book Article
2007Characterization of parylene-C film as an encapsulation material for neural interface devices
Hsu, J.-M.; Rieth, L.; Kammer, S.; Jung, E.; Norman, A.R.; Solzbacher, F.
Conference Paper
2007Cost modelling for embedded component technology
Baets, J. de; Willems, G.; Ostmann, A.; Kriechbaum, A.; Kostner, H.
Conference Paper
2007Design and manufacture of a carbon fibre spindle rotor - Project results "Aerospin - development of a highly precise spindle prototype"
Brecher, C.; Schug, R.; Schmitz, S.; Börner, U.
Journal Article
2007Electric characteristics of planar interconnect technologies for power MOSFETs
Dieckerhoff, S.; Kirfo, T.; Wernicke, T.; Kallmayer, C.; Ostmann, A.; Jung, E.; Wunderle, B.; Reichl, H.
Conference Paper
2007Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer elektronischen Schaltungsanordnung
Rekofsky, A.; Wolf, D.; Kolb, A.; Ingenbleek, R.; Schoellhorn, R.; Jung, E.
Patent
Fulltext
2007Evaluation analytischer Verfahren zur Verfügbarkeitsberechnung intralogistischer Systeme
Ten Hompel, M.; Follert, G.; Jung, E.N.
Conference Paper
2007Fiber optic strain and structural health monitoring in polymer electronic packaging
Schreier-Alt, T.; Ansorge, F.; Reichl, H.
Conference Paper
2007Fokalflaeche und Detektor fuer optoelektronische Bildaufnahmesysteme, Herstellungsverfahren und optoelektronisches Bildaufnahmesystem
Ansorge, F.; Craubner, S.; Feil, M.; Platz, W.; Riedel, H.
Patent
Fulltext
2007Führungsdraht für Interventionen im Magnet- Resonanz-Tomographen
Brecher, C.; Schmitz, S.; Krüger, S.
Journal Article
2007Guide wire for intervention using magnetic-resonance tomography
Brecher, C.; Schmitz, S.; Krüger, S.
Journal Article
2007Hält Vergleich mit Stahl stand: Starke Fasern für minimalinvasive Operationen
Brecher, C.; Schmitz, S.
Journal Article
2007Heterogeneous integration: The bridge between micro/nanoelectronics and application
Aschenbrenner, R.
Conference Paper
2007High temperature and element alloying influences on Kirkendall voiding in Au ball bond interconnects on Al chip metallization
Schneider-Ramelow, M.; Schuch, B.; Lang, K.-D.; Reichl, H.
Conference Paper
2007Hochgeschwindigkeitsaufnahmen der Wedgebewegung beim US-Bonden/Wedge-Bonden
Schneider-Ramelow, M.; Gaul, H.; Schmitz, S.; Reichl, H.
Journal Article
2007Hochgeschwindigkeitsaufnahmen der Werkzeug- und Drahtschwingung beim US-Wedge/Wedge-Bonden
Gaul, H.; Schneider-Ramelow, M.; Reichl, H.
Journal Article
2007Innovative 3D-Montagetechnologie für Speicherchips mittels AlSi1-Drahtbonden
Schneider-Ramelow, M.; Milstrey, M.; Mattheier, L.
Journal Article
2007An integrated electronic meniscus sensor for measurement of evaporative flow
Gazzola, D.; Iafelice, B.; Jung, E.; Franchi, E.; Guerrieri, R.
Conference Paper
2007Integrated polymer multimode waveguides for microfluidic sensing applications
Otto, T.; Nestler, J.; Baum, M.; Schroeder, H.; Ebling, F.; Bruch, R.; Gessner, T.
Conference Paper
2007Interface reactions during Au-ball/wedge and AlSi1- Wedge/wedge bonding at room temperature
Schneider-Ramelow, M.; Lang, K.-D.; Geißler, U.; Scheel, W.; Reichl, H.
Conference Paper
2007Investigations on possibilities of inline inspection of high aspect ratio microstructures
Engelke, R.; Ahrens, G.; Arndt-Staufenbiehl, N.; Kopetz, S.; Wiesauer, K.; Löchel, B.; Schröder, H.; Kastner, J.; Neyer, A.; Stifter, D.; Grützner, G.
Conference Paper
2007Lamination and laser structuring for a DEP microwell array
Jung, E.; Manessis, D.; Neumann, A.; Böttcher, L.; Braun, T.; Bauer, J.; Reichl, H.
Conference Paper
2007Lamination process studies for realisation of chip embedding technologies-current applications and technical challenges
Manessis, D.; Ostmann, A.; Yen, S.-F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Low cost UBM for lead free solder bumping with C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Micro-Nanostructural Investigations of AlSi1 Bondcontacts
Geißler, U.; Schneider-Ramelow, M.; Reichl, H.
Conference Paper
2007Microtechnology for realization of dielectrophoresis enhanced microwells for biomedical applications
Braun, T.; Böttcher, L.; Bauer, J.; Manessis, D.; Jung, E.; Ostmann, A.; Becker, K.-F.; Aschenbrenner, R.; Reichl, H.; Guerrieri, R.; Gambari, R.
Conference Paper
2007Minimalinvasive Punktionsnadel aus Kunststoff
Brecher, C.; Schmitz, S.
Journal Article
2007Modellierung des Verfügbarkeitsverhaltens von Intralogistiksystemen
Jung, E.N.; Follert, G.; Ten Hompel, M.
Conference Paper
2007Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D.
Patent
Fulltext
2007New sensor packaging concept for avionic application
Aschenbrenner, R.; Jung, E.; Braun, T.; Oestermann, U.; Bauer, J.; Becker, K.-F.; Reichl, H.
Conference Paper
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Conference Paper
2007Overmolded FC-SiP for miniaturized devices
Jung, E.; Koch, M.; Becker, K.-F.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007Packaging design and testing for high temperature applications > 150 °C
Schreier-Alt, T.; Rebholz, C.; Ansorge, F.
Conference Paper
2007Printing solder paste in dry film - A low cost fine-pitch bumping technique
Baumgartner, T.; Manessis, D.; Töpper, M.; Hauck, K.; Ostmann, A.; Reichl, H.; Goncalo, C.T.; Jorge, P.; Yamada, H.
Conference Paper
2007Rapid interface reliability testing of flip chip encapsulants
Rau, I.; Becker, K.-F.; Wunderle, B.; Reichl, H.
Conference Paper
2007Realization of large area stretchable electronic systems using lamination processes
Loeher, T.; Manessis, D.; Ostmann, A.; Reichl, H.
Conference Paper
2007Reliability aspects of embedded chips
Ostmann, A.; Manessis, D.; Cauwe, M.; Sommer, J.-P.
Conference Paper
2007Schaltanordnung und Verfahren zu deren Herstellung
Jung, E.; Becker, K.-F.; Wunderle, B.
Patent
Fulltext
2007Smart System Integration - Grundlage zukünftiger Anwendungen im Maschinenbau
Pötter, H.; Großer, V.; Lang, K.-D.; Reichl, H.; Schmitz, S.; Wolf, J.
Journal Article
2007Stress monitoring in epoxy resins and embedded components during packaging and curing processes
Schreier-Alt, T.; Badstuebner, K.; Rebholz, C.; Reichl, H.; Ansorge, F.
Conference Paper
2007Technical understanding of resin-coated-copper (RCC) lamination processes for realization of reliable chip embedding technologies
Manessis, D.; Yen, S.F.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper
2007UBM structures for lead free solder bumping using C4NP
Ruhmer, K.; Laine, E.; Hauck, K.; Manessis, D.; Ostmann, A.; Toepper, M.
Conference Paper
2007Verfahren zur Herstellung einer elektronischen Baugruppe
Kostelnik, J.; Schaaf, U.; Kugler, A.; Becker, K.-F.; Neumann, A.
Patent
Fulltext
2007Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe
Kugler, A.; Liebing, G.; Becker, K.-F.
Patent
Fulltext
2007Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
Badstuebner, K.; Ansorge, F.
Patent
Fulltext
2006Assembly and reliability of ultrathin flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Töpper, M.; Klein, M.; Buschick, K.; Glaw, V.; Orth, K.; Ehrmann, O.; Hutter, M.; Oppermann, H.; Becker, K.-F.; Braun, T.; Ebling, F.; Reichl, H.; Kim, S.; Tathireddy, P.; Chakravarty, S.; Solzbacher, F.
Conference Paper
2006Chip embedding into polymer matrices of printed wiring boards: Presentation held at VLSI - 8th Very Large Scale Integration Workshop, Kyoto, Japan, 04.-05.12.06
Loeher, T.; Neumann, A.; Sommer, J.-P.; Ostmann, A.; Reichl, H.
Presentation
Fulltext
2006A cost-effective alternative technology for wafer bumping - Electroless Ni/Au UBM deposition and ultra fine pitch printing of solder paste
Boettcher, L.; Ostmann, A.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Development of a 3D wafer-level re-routing, using dielectric lamination technology
Böttcher, L.; Ostmann, A.; Manessis, D.; Polityko, D.; Reichl, H.
Conference Paper
2006Development of a nano-structure based interconnection technology: Presentation held at the Congress and Exhibition Nanotechnology in Northern Europe 2006, Helsinki, Finnland, 16-18.05.06
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Presentation
Fulltext
2006Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2006Electronic textiles
Reichl, Herbert; Kallmayer, Christine; Linz, Torsten
Book Article
Fulltext
2006Embedding of active and passive components into printed wiring boards: Presentation held at the IPC - Integrated Passive Components, Chelmsford, MA, USA, 03.-04.05.06
Löher, T.; Neumann, A.; Vieroth, R.; Ostmann, A.; Reichl, H.
Presentation
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2006Ergebnisdarstellung "SHIFT" - Chipintegrationstechnologie
Löher, T.; Kallmayer, C.; Neumann, A.; Pahl, B.; Ostmann, A.; Reichl, H.
Conference Paper
2006First results of the European project hiding dies: Presentation held at the System Packaging Japan Workshop 2006, 30.01.-01.02.06, Hakone
Aschenbrenner, R.; Ostmann, A.
Presentation
Fulltext
2006Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
Lee, J.-S.; Chu, K.-M.; Jeon, D.Y.; Patzelt, R.; Manessis, D.; Ostmann, A.
Conference Paper
2006Fully integrated EKG shirt based on embroidered electrical interconnections with conductive yarn and miniaturized flexible electronics
Linz, Torsten; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
Fulltext
2006High-temperature reliability of flip chip assemblies
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2006Identifying the reliability affecting parameters of SBB flip chip interconnections for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Auersperg, J.; Reichl, H.
Conference Paper
2006Improved reliability of leadfree flip chip assemblies using direct underfilling by transfer molding
Braun, T.; Wunderle, B.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Influence of assembly process - material properties and geometry on the reliability of flip chip interconnections on MID for automotive applications
Dreßler, M.; Rohde, H.; Liebing, G.; Becker, K.-F.; Wunderle, B.; Reichl, H.
Conference Paper
2006Innovative substrate technologies for new products
Aschenbrenner, R.; Löher, T.; Ostmann, A.; Kallmayer, C.; Scheel, W.; Reichl, H.
Conference Paper
2006Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichel, H.
Journal Article
2006Laminate Concepts for Chip Embedding: Process Technologies and Reliability Results
Löher, T.; Neumann, A.; Pahl, B.; Patzelt, R.; Ostmann, A.; Reichl, H.
Conference Paper
2006Lamination technology of Resin-Coated-Copper (RCC) films for chip and component embedding in printed circuit boards
Manessis, D.; Yen, S.-F.; Newmann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Latest Technological Advancements in Stencil Printing Processes for Ultra-Fine-Pitch Flip Chip Bumping up to 60µm Pitch
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Magnetic resonance imaging of the siliceous skeleton of the demosponge Lubomirskia baicalensis
Müller, W.E.G.; Kaluzhnaya, O.V.; Belikov, S.I.; Rothenberger, M.; Schröder, H.C.; Reiber, A.; Kaandorp, J.A.; Manz, B.; Mietchen, D.; Volke, F.
Journal Article
2006Methoden zur Zuverlässigkeitsqualifizierung neuer Technologien in der Aufbau- und Verbindungstechnik: Herausforderungen und Möglichkeiten
Wilde, J.; Schneider-Ramelow, M.; Petzold, M.; Scheel, W.
Book
2006Microsystem technologies for smart golf balls
Wolf, M.J.; Schmitz, S.; Amiri Jam, K.; Semionyk, P.; Grosser, V.; Lang, K.-D.
Journal Article
2006Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe
Polityko, D.; Wenzel, S.; Jung, E.; Hefer, J.; Niedermayer, M.; Guttowski, S.
Patent
Fulltext
2006Morphology and growth kinetics of intermetallic compounds in solid-state interfacial reaction of electroless Ni-P with Sn-based lead-free solders
Huang, M.L.; Löher, T.; Manessis, D.; Böttcher, L.; Ostmann, A.; Reichl, H.
Journal Article
2006Multi-Chip-Modul und Verfahren zum Herstellen eines Multi-Chip-Moduls
Landesberger, C.; Reichl, H.; Ansorge, F.; Ramm, P.; Ehrmann, O.
Patent
Fulltext
2006Nano-structured interconnects for system integration
Aschenbrenner, R.; Fiedler, S.; Löher, T.; Pahl, B.; Becker, K.-F.; Reichl, H.
Conference Paper
2006Optischer Sensor fuer die Montage auf einem Traegersubstrat sowie Verfahren zur Herstellung
Jung, E.; Tina, T.
Patent
Fulltext
2006Physics-of-failure-Modelle für Ausfallmechanismen
Schneider-Ramelow, M.; Wilde, J.; Janz, D
Book Article
2006Polymer optical interconnects - a scalable large-area panel processing approach
Uhlig, S.; Fröhlich, L.; Chen, M.; Arndt-Staufenbiel, N.; Lang, G.; Schröder, H.; Houbertz, R.; Popall, M.; Robertsson, M.
Journal Article
2006Predicting the shear strength of a wire bond using laser vibration measurements
Gaul, H.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2006Preventing of dewetting effects for inorganic-organic hybrid polymers applied in sequentially buildup (SBU) technology without surface pretreatments
Uhlig, S.; Domann, G.; Houbertz, R.; Fröhlich, L.; Schröder, H.; Krissler, J.; Lang, G.; Robertsson, M.
Journal Article
2006Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on various electroless nickel/gold metallizations
Manessis, D.; Böttcher, L.; Patzelt, R.; Ostmann, A.; Schild, B.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Rapid tooling for high reliability transfer molded devices
Becker, K.-F.; Koch, M.; Gramckow, J.; Braun, T.; Bader, V.; Jung, E.; Lang, K.-D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Raumtemperatur-Bondbarkeit und Zuverlässigkeitsbetrachtungen beim Au-TS-Ball/Wedge-Bonden
Schneider-Ramelow, M.; Schmitz, S.
Conference Paper
2006Reliability issues in Pb-free solder joint miniaturization
Huang, Z.; Conway, P.P.; Jung, E.; Thomson, R.C.; Liu, C.; Loeher, T.; Minkus, M.
Journal Article
2006Smart PWB manufacturing technologies
Löher, T.; Neumann, A.; Pahl, B.; Reich, H.; Ostmann, A.
Journal Article
Fulltext
2006Stapelbare Funktionsschicht fuer ein modulares mikroelektronisches System
Niedermayer, M.; Ostmann, A.; Morgenstern, H.; Guttowski, S.
Patent
Fulltext
2006Strategies for embedding of active components
Ostmann, A.; Manessis, D.; Löher, T.; Neumann, A.; Reichl, H.
Conference Paper
2006Stretchable electronic systems
Löher, T.; Manessis, D.; Heinrich, R.; Schmied, B.; Vanfleteren, J.; Baets, J. de; Ostmann, A.; Reichl, H.
Conference Paper
2006Substratbauteil mit eingebettetem Lichtwellenleiter und Strahlumlenkung und Verfahren zu dessen Herstellung
Bauer, J.; Beier, A.; Beil, P.; Demmer, P.; Ebling, F.; Franke, M.; Guenther, P.; Happel, T.; Kostelnik, J.; Moedinger, R.; Park, H.; Schroeder, H.
Patent
Fulltext
2006Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Haberland, J.; Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2006Tapelegetechnologie. Hochleistungsbauteile aus faserverstärkten Kunststoffen
Kölzer, P.; Schmitz, S.
Journal Article
2006Temperaturstabile Wellenleiter und optische Kopplung für elektro-optische Leiterplatten
Schröder, H.; Bauer, J.; Ebling, F.; Pfeiffer, K.
Conference Paper
2006Verfahren zum Herstellen einer Durchkontaktierung zwischen zwei Oberflaechen eines Halbleitersubstrats
Böttcher, L.; Ostmann, A.; Manessis, D.
Patent
Fulltext
2006Verfahren zum Herstellen eines dehnbaren Schaltungstraegers und dehnbarer Schaltungstraeger
Ostmann, A.; Seckel, M.; Löher, T.; Manessis, D.; Patzelt, R.
Patent
Fulltext
2006Verfahren zur elektrischen Kontaktierung mikroelektronischer Bauelemente auf einem Substrat
Ostmann, A.; Neumann, A.; Manessis, D.; Patzelt, R.
Patent
Fulltext
2006Verfahren zur Herstellung eines Gegenstands mit mindestens zwei beweglichen Bauteilen
Beck, J.; Badstuebner, K.; Ansorge, F.
Patent
Fulltext
2006Verfahren zur Uebertragung von Bauelementen auf eine Oberflaeche
Jung, E.
Patent
Fulltext
2006Vorrichtung zur Konzentration von Licht, insbesondere von Sonnenlicht
Ansorge, F.; Wolter, J.; Hanisch, H.; Hoffschmidt, B.; Reinl, M.
Patent
Fulltext
2006Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards
Schröder, H.; Bauer, J.; Ebling, F.; Franke, M.; Beier, A.; Demmer, P.; Süllau, W.; Kostelnik, J.; Mödinger, R.; Pfeiffer, K.; Ostrzinski, U.; Griese, E.
Conference Paper
2005A 0.14mW/Gbps high-density capacitive interface for 3D system integration
Fazzi, A.; Magagni, L.; Mirandola, M.; Canegallo, R.; Schmitz, S.; Guerrieri, R.
Conference Paper
2005The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps
Aschenbrenner, R.; Pfahl, R.C.; Bird, J.M.
Conference Paper
2005Applied encapsulation methods in mechatronics
Rebholz, C.; Badstübner, K.; Ansorge, F.; Reichl, H.
Conference Paper
2005Applied encapsulation methods and materials in mechatronics
Rebholz, C.; Badstübner, K.; Ansorge, F.
Conference Paper
2005Buried components in printed circuit boards
Ostmann, A.; Neumann, A.; Sommer, P.; Reichl, H.
Journal Article
2005Chip embedding in printed circuit board production
Ostmann, A.; Kriechbaum, A.; Baets, J. de; Kostner, H.
Conference Paper
2005Chip in duromer technology for system in package realization
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Chipmodul und Verfahren zur Herstellung eines Chipmoduls
Wegerer, G.; Ansorge, F.; Kallmayer, C.; Rebholz, C.
Patent
Fulltext
2005Development of 3-D redistribution and balling technologies for fabrication of vertical power devices
Böttcher, L.; Manessis, D.; Ostmann, A.; Reichl, H.; Whitmore, M.; Staddon, M.
Journal Article
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Duromer MID technology for system-in-package generation
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.; Jung, E.
Journal Article
2005Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
Jeon, Y.D.; Paik, K.W.; Ostmann, A.; Reichl, H.
Journal Article
2005Einbettung aktiver Chips in die flexible Leiterplatte
Ostmann, A.
Conference Paper
2005Einbettung aktiver und passiver Komponenten in die Leiterplatte
Löher, T.; Pahl, B.; Haberland, J.; Vieroth, R.; Kallmeyer, C.; Neumann, A.; Böttcher, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric
Linz, Torsten; Kallmayer, C.
Conference Paper
Fulltext
2005Failure analysis of Sub-50 µm lead-free solder bumps on electroless Ni-P UBM for flip chip interconnects
Manessis, D.; Liang, M.; Loeher, T.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Film coating - large area encapsulation process for electronics packaging
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Film coatings as an encapsulation process for polymer electronics: Poster presentation
Becker, K.-F.; Braun, T.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Grenzflächenuntersuchungen beim US-Wedge/Wedge-Bonden von Al-Drähten verschiedener Drahtstärken
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Journal Article
2005Hetero System Integration - enabling technology for future products
Reichl, H.; Aschenbrenner, R.; Pötter, H.
Book Article
2005High temperature potential of flip chip assemblies for automotive applications
Braun, T.; Becker, K.-F.; Sommer, J.-P.; Löher, T.; Schottenloher, K.; Kohl, R.; Pufall, R.; Bader, V.; Koch, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005High-resolution electroformed stencil manufacturing method for ultra fine pitch wafer bumping technology
Pudas, M.; Manessis, D.; Patzelt, R.; Hagberg, J.; Leppävuori, S.; Vähäkangas, J.; Ostmann, A.; Reichl, H.
Conference Paper
2005Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages
Manessis, D.; Whitmore, M.; Staddon, M.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Industrially compatible PCB stacking technology for miniaturized sensor systems
Lang, K.D.; Großer, V.; Amiri Jam, K.; Wolf, J.; Semionyk, P.; Schmitz, S.; Rochlitzer, R.; Prietzsch, D.; Reichl, H.
Conference Paper
2005Integration of active and passive components using chip in polymer technology
Böttcher, L.; Neumann, A.; Ostmann, A.; Reichl, H.
Conference Paper
2005Investigations on TS bondability of different Au wires down to room temperature
Schneider-Ramelow, M.; Petzold, M.; Knoll, H.; Wohnig, M.
Conference Paper
2005Lead-free flip chip: A comparison between lead-free solder and adhesives
Vandecasteele, B.; Manessis, D.; Vanfleteren, J.; Ostmann, A.; Hagedorn, H.W.; Wiese, J.
Conference Paper
2005Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F.
Conference Paper
2005Mehrlagige Trittschall-Daemmschicht
Schroeder, H.
Patent
Fulltext
2005Micro-optical bench technology using ultra-precision milling
Schröder, H.; Oberschmidt, D.
Conference Paper
2005Mikrosystemtechnik: Die klassischen Systemgrenzen lösen sich auf
Aschenbrenner, R.; Jung, E.
Journal Article
2005Miniaturized optical module for projection of arbitrary images based on two-dimensional resonant micro scanning mirrors
Scholles, M.; Bräuer, A.; Frommhagen, K.; Gerwig, C.; Höfer, B.; Jung, E.; Lakner, H.; Schenk, H.; Schneider, B.; Schreiber, P.; Wolter, A.
Conference Paper
2005New Generation Interconnection Technology: Printed Circuit Boards with Integrated Optical Layers
Demmer, P.; Schröder, H.; Bauer, J.; Ebling, F.; Beil, P.; Albrecht, H.; Franke, M.; Beier, A.; Kostelnik, J.; Mödinger, R.; Pfeiffer, K.; Griese, E.
Conference Paper
2005New Interconnection Technologies for the Integration of Electronics on Textile Substrates
Linz, Torsten; Kallmayer, C.
Conference Paper
Fulltext
2005A new wafer level packaging approach: Encapsulation, metallization and laser structuring for advanced system in package manufacturing
Becker, K.-F.; Braun, T.; Neumann, A.; Ostmann, A.; Coko, E.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2005New-generation interconnect
Albrecht, H.; Beier, A.; Demmer, P.; Franke, M.; Mödinger, R.; Pfeiffer, K.; Beil, P.; Kostelnik, J.; Bauer, J.; Ebling, F.; Schröder, H.; Griese, E.
Conference Paper
2005Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2005The packaging and assembly of a waferscale system on chip
Veen, C. van; Samber, M. de; Bergveld, H.; Ackerveken, A.; Slob, C.; Manessis, D.; Ostmann, A.; Whitmore, M.
Conference Paper
2005Packaging challenges in miniaturization
Kallmayer, C.; Niedermayer, M.; Guttowski, S.; Reichl, H.
Book Article
2005Packaging of bio-MEMS: Strategies, technologies, and applications
Velten, T.; Ruf, H.H.; Barrow, D.; Aspragathos, N.; Lazarou, P.; Jung, E.; Malek, C.K.; Richter, M.; Kruckow, J.; Wackerle, M.
Journal Article
2005Polymerwellenleiter fuer opto-elektrische Schaltungstraeger
Pfeiffer, K.; Ostrzinski, U.; Schroeder, H.; Bauer, J.; Gruetzner, G.
Patent
Fulltext
2005Reliability potential of epoxy based encapsulants for automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M.L.; Löher, T.; Ostmann, A.; Reichl, H.
Journal Article
2005Smart PCBs manufacturing technologies
Löher, T.; Neumann, A.; Böttcher, L.; Pahl, B.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005System integration technologies for smart textiles
Kallmayer, Christine; Linz, Torsten; Aschenbrenner, Rolf; Reichl, Herbert
Journal Article
2005Technological advancements in lead-free wafer bumping using stencil printing technology
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
Fulltext
2005Technologien und Packaging für optische Wellenleiter in elektrisch-optischen Leiterplatten
Schröder, H.; Bauer, J.
Conference Paper
2005Ultrathin assemblies on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Verfahren zum Bearbeiten eines Halbleitersubstrats
Landesberger, C.; Ostmann, A.
Patent
Fulltext
2005Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik
Manke, I.; Becker, K.; Ostmann, A.; Reichl, H.
Patent
Fulltext
2005Von der Idee bis zur Serie: Punktionsnadeln aus Kohlenstofffaser verstärkten Kunststoffen
Brecher, Christian; Kölzer, Patrick; Schmitz, Sebastian; Lange, Sven
Conference Paper
2004Alternative determination of dynamic stiffness of thick insulating layers
Leistner, P.; Schröder, H.; Richter, B.
Conference Paper
2004Area array contacts to assemble a 3D transfomer for a miniaturized voltage converter
Jung, E.; Kolesnik, I.; Becker, K.F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Bond reliability of new quality Au and Cu wires at high temperature load > 175 ºC
Schneider-Ramelow, M.; Lang, K.-D.; Ferber, A.; Meier, P.
Journal Article
2004Bragg Gitter in Polymer- und Glasfasern: Dehnungs- und Temperaturbestimmung in der Mikroelektronik und Mechatronik
Alt, T.; Badstübner, K.; Ansorge, F.; Michel, B.; Reichl, H.
Conference Paper
2004Buried Components in Printed Circuit Boards
Ostmann, A.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Degradation of a nonylphenol single isomer by Sphingomonas sp. strain TTNP3 leads to a hydroxylation-induced migration product
Corvini, P.F.X.; Meesters, R.J.W.; Schäffer, A.; Schröder, H.F.; Vinken, R.; Hollender, J.
Journal Article
2004Einbettung aktiver Chips in die Leiterplatte - Stand und Herausforderungen
Ostmann, A.; Jung, E.; Neumann, A.; Sommer, J.-P.; Reichl, H.
Conference Paper
2004Evaluation of walking noise on floors
Schröder, H.; Richter, B.
Conference Paper
2004Evolution of WLP: From Redristribution to 3-D Packaging and MEMS Packaging
Töpper, M.; Glaw, V.; Zoschke, K.; Jung, E.; Becker, K.-F.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Flanking sound reduction of suspended ceilings
Richter, B.; Leistner, P.; Schröder, H.
Conference Paper
2004From packaging to system integration – the paradigm shift in microelectronics
Wolf, M.J.; Reichl, H.; Adams, J.; Aschenbrenner, R.
Book Article
2004Grenzflächenuntersuchungen beim Ultraschall-Wedge-Wedge-Bonden von 25 µm AlSi1-Draht
Schneider-Ramelow, M.; Geißler, U.; Lang, K.-D.; Reichl, H.
Journal Article
2004Längs oder durch ist nicht egal
Schröder, H.
Journal Article
2004Large-area processing of inorganic-organic hybrid polymers (ORMOCER®s) for optical backplane application
Uhlig, S.; Robertsson, M.; Schröder, H.; Lang, G.; Arndt-Staufenbiel, A.; Popall, M.; Fröhlich, L.; Houbertz, R.
Conference Paper
2004The lead-free challenge: Materials for assembly and packaging
Schischke, K.; Jung, E.
Journal Article
2004Long-time reliability study of soldered flip chips on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Mechanische Prüfverfahren für Mikroverbindungen elektronischer Schaltungen mit extrem verkleinerten Geometrien
Schneider-Ramelow, M.; Rudolf, F.
Journal Article
2004Messungen der dynamischen Steifigkeit und Vorzüge mehrlagiger Trittschalldämmung
Schröder, H.
Journal Article
Fulltext
2004Metallkundliche Phänomene und Grenzflächenreaktionen beim US-Bonden von 25µm-AlSi1-Draht
Geißler, U.; Schneider-Ramelow, M.; Lang, K.-D.
Conference Paper
2004METHODE UM LOETZINN AUF EINE ANORDNUNG ZU UEBERTRAGEN UND/ODER DIE ANORDNUNG ZU TESTEN
Kaskoun, K.; Jung, E.; Budweiser, W.
Patent
Fulltext
2004Mikrospiegelanwendungen im Automobil
Wolter, J.; Alt, T.; Hanisch, H.; Ansorge, F.; Auersperg, J.; Rümmler, N.
Conference Paper
2004Modelling and application of silicon microphone systems
Mammen, H.-T.; Stürmer, U.; Koch, M.; Köhne, H.; Becker, K.-F.; John, W.; Reichl, H.
Conference Paper
2004Modern wire bonding technologies - ready for the challenges of future microelectronic packaging
Lang, K.-D.; Harman, G.G.; Schneider-Ramelow, M.
Book Article
2004New optical pin for 90 degree waveguide coupling in electrical-optical circuit boards (EOCB)
Schröder, H.; Bauer, J.; Ebling, F.; Franke, M.; Happel, T.; Kostelnik, J.
Conference Paper
2004Novel MEMS CSP to bridge the gap between development and manufacturing
Jung, E.; Wiemer, M.; Aschenbrenner, R.; Färber, A.
Conference Paper
2004Optimizing Processes and Materials for Flip Chip Reliability
Becker, K.-F.; Adams, T.
Journal Article
2004Process flow and manufacturing concept for embedded active devices
Aschenbrenner, R.; Ostmann, A.; Neumann, A.; Reich, H.
Conference Paper
2004Specific glass fiber technologies: Lensing and laser fusion
Arndt-Staufenbiel, N.; Lang, G.; Krissler, J.; Schröder, H.; Scheel, W.
Conference Paper
2004Stackable system-on-packages with integrated components
Becker, K.-F.; Jung, E.; Ostmann, A.; Braun, T.; Neumann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Stencil printing technology for 100m flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.
Journal Article
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Technical challenges of stencil printing technology for ultra-fine pitch flip-chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2004Ultra thin flip chip interconnects
Haberland, J.; Kallmayer, C.
Journal Article
2004Ultrathin soldered flip chip interconnections on flexible substrates
Pahl, B.; Loeher, T.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2004Ver- oder Entfestigung von Aluminiumdrähten beim Ultraschall-Wedge-Wedge-Bonden
Schneider-Ramelow, M.; Ferber, A.; Lang, K.-D.
Journal Article
2004Verfahren und Vorrichtung zum synchronen und mobilen Pruefen von Materialien, insbesondere Prueflingen groesserere Dicke und/oder komplizierter Geometrie, mittels Roentgenstrahlen
Kaempfe, B.; Petrick, H.; Holz, T.; Scheel, W.; Halser, K.
Patent
Fulltext
2004Verfahren zum Auftragen von Material auf einen Bereich eines elektrischen Bauteils
Manke, I.; Becker, K.; Ostmann, A.; Aschenbrenner, R.; Loeher, T.
Patent
Fulltext
2004The world of electronic packaging and system integration: Anniversary edition 60th birthday of Herbert Reichl
Michel, B.; Aschenbrenner, R.
Book
20033D system integration technologies
Ramm, P.; Klumpp, A.; Merkel, R.; Weber, J.; Wieland, R.; Ostmann, A.; Wolf, J.
Conference Paper
2003Aufbau eines Multi-Sensor-Datenloggers zur biomaritimen Erforschung tief tauchender Meerestiere
Schneider-Ramelow, M.; Lang, K.-D.; Bielau, M.; Driesen, H.-H.
Journal Article
2003Bauakustik-Datenbank
Schröder, H.
Conference Paper
2003Chip in polymer: 3D integration of active circuitry in polymeric substrate
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Flip chip technology for high temperature automotive applications
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Foreword special-issue on mems/nems packaging
Lee, Y.C.; Chiou, J.A.; Chen, S.C.; Jung, E.
Journal Article
2003Gehaeustes Bauelement und Verfahren zu dessen Herstellung
Reichl, H.; Aschenbrenner, R.; Ansorge, F.; Becker, K.; Ehrlich, R.; Oppermann, H.; Azdasht, G.
Patent
Fulltext
2003Gehgeräusche bei Massiv- und Holzbalkendecken
Leistner, P.; Schröder, H.; Richter, B.
Journal Article
2003Hot embossing for MEMS using silicon tools
Küchler, M.; Otto, T.; Gessner, T.; Ebling, F.; Schröder, H.
Journal Article
2003Innovative packaging concepts for ultrathin ICs
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Journal Article
2003Kontakthoecker mit profilierter Oberflaechenstruktur sowie Verfahren zur Herstellung
Oppermann, H.; Ostmann, A.; Nieland, C.
Patent
Fulltext
2003Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates
Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Micromirror applications in automobile
Wolter, J.; Auersperg, J.; Erdl, H.; Rümmler, N.; Ansorge, F.; Reichl, H.
Abstract
2003New assembly technologies for textile transponder systems
Kallmayer, C.; Pisarek, R.; Neudeck, A.; Cichos, S.; Gimpel, S.; Aschenbrenner, R.; Reichlt, H.
Conference Paper
2003Packaging of an electronic-microfluidic hybrid sensor
Jung, E.; Assmann, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Packaging of micro devices for automotive applications
Jung, E.; Großer, V.; Becker, K.-F.; Koch, M.
Conference Paper
2003Packaging options for MEMS devices
Jung, E.
Journal Article
2003Polymer BioMEMs with integrated optical and fluidic functionality
Windhorn, K.; Meixner, L.; Drost, S.; Schröder, H.; Kilgus, E.; Scheel, W.; Ebling, F.; Otto, T.; Küchler, M.; Nestler, J.; Geßner, T.
Conference Paper
2003Reduction of indirect sound transmission by additional layers
Schröder, H.
Conference Paper
2003Reliability of integrated passive components
Haberland, J.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Sensoren aus CFK - Sensorspitzen aus Faserverbundstoffen ermöglichen Inspektion kleiner Kavitäten
Depiereux, F.; Schmitz, S.; Lange, S.
Journal Article
2003Stackable packages with integrated components
Ostmann, A.; Neumann, A.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Stencil printing technology for 100 mum flip chip bumping
Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2003Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2003Verfahren und Vorrichtung zur Strukturierung, insbesondere Mikrostrukturierung, von Polymerfolien
Ebling, F.; Schroeder, H.; Lang, G.
Patent
Fulltext
2003Verfahren zum stoffschluessigen Verbinden mikrotechnischer Bauteile
Lang, G.; Arndt-Staufenbiel, N.; Schroeder, H.
Patent
Fulltext
2003Verfahren zur Erzeugung von erhabenen Strukturen, insbesondere Kontakthoeckern
Oppermann, H.; Ostmann, A.
Patent
Fulltext
2003Vom Wafer zum System-in-Package: Neue Konzepte zur Miniaturisierung
Braun, T.; Becker, K.-F.; Ostmann, A.
Journal Article
2003Wafer level encapsulation for system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Manessis, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Bump formation for flip chip and CSP by solder paste printing
Kloeser, J.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Journal Article
2002Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
Hutter, M.; Oppermann, H.; Engelmann, G.; Wolf, J.; Ehrmann, O.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Chip in polymer - Next step in miniaturization
Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H.
Journal Article
2002Development of an assembly process and reliability investigations for flip chip LEDs using AuSn soldering
Elger, G.; Hutter, M.; Oppermann, H.H.; Aschenbrenner, R.; Reichl, H.; Jäger, E.
Journal Article
2002Encapsulant characterization - valuable tools for process setup and failure analysis
Becker, K.F.; Braun, T.; Koch, M.; Vogel, D.; Aschenbrenner, R.; Reichl, H.; Hagedorn, H.W.; Neumann Rodekirch, J.
Conference Paper
2002Fabric-based communication
Kallmayer, C.; Griese, H.
Journal Article
2002Flip chip molding - highly reliable flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Flip chip molding - Recent progress in flip chip encapsulation
Braun, T.; Becker, K.F.; Koch, M.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Long time reliability of flip chip interconnections on flexible substrates
Pahl, B.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Modular systems for sensor integration
Klein, M.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Packaging for MEMS devices - Stumbling block or enabling solution?
Jung, E.; Wiemer, M.; Grosser, V.; Bock, K.; Wolf, J.
Journal Article
2002Packaging technologies for flexible systems
Kallmayer, C.; Bock, K.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Rakelsystem zum Aufbringen eines druckbaren Materials auf eine Oberflaeche
Oestermann, U.; Jung, E.; Coskina, P.
Patent
Fulltext
2002Realization of a stackable package using chip in polymer technology
Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Böttcher, L.; Reichl, H.
Conference Paper
2002Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2002Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
Oppermann, H.; Kalicki, R.; Anhöck, S.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Journal Article
2002Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
Manessis, D.; Patzelt, R.; Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2002Untersuchung von Gehgeräuschen
Richter, B.; Schröder, H.
Journal Article
Fulltext
2002Verbesserung der Längs-Schalldämmung durch Vorsatzschalen
Schröder, H.
Journal Article
Fulltext
2002Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
Aschenbrenner, R.; Azdasht, G.; Zakel, E.; Ostmann, A.; Motulla, G.
Patent
Fulltext
2002Verfahren zur Verbesserung der Druckqualitaet beim Einsatz von Druckschablonen
Coskina, P.; Jung, E.; Ostmann, A.
Patent
Fulltext
2002Wafer level encapsulation - a transfer molding approach to system in package generation
Braun, T.; Becker, K.-F.; Koch, M.; Bader, V.; Oystermann, U.; Manessis, D.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001(9-Oxo-9H-Fluoren-2-yl)-Phenyl-Iodonium Hexafluoroantimonate(V) - a photoinitiator for the cationic polymerisation of epoxides
Hartwig, A.; Harder, A.; Lühring, A.; Schröder, H.
Journal Article
2001Accelerated testing of flip chip packages under dynamic load
Rau, I.; Miessner, R.; Liebing, G.; Becker, K.-F.
Conference Paper
2001Advanced flip chip encapsulation: Transfer molding process for simultaneous underfiling and postencapsulation
Becker, K.-F.; Braun, T.; Koch, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Aktuelle Schalldämmwerte von Gipskartonständerwänden - welche Werte gelten nun für die Praxis?
Schröder, H.
Conference Paper
2001Convex corner undercutting of (100) silicon in anisotropic KOH etching: The new step-flow model of 3-D structuring and first simulation results
Schröder, H.; Obermeier, E.; Horn, A.; Wachutka, G.K.M.
Journal Article
2001Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications
Haberland, J.; Kallmeyer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Innovative packaging concepts for ultra thin integrated circuits
Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Kleben mit flüssigkristallinen Epoxidharzen
Hartwig, A.; Harder, A.; Schnurpfeil, G.; Schröder, H.; Wöhrle, D.
Journal Article
2001Lead free alloys for flip chip bumping
Jung, E.; Aschenbrenner, R.; Kallmayer, C.; Coskina, P.; Reichl, H.
Conference Paper
2001Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.
Journal Article
2001Maßgeschneiderte Systemlösungen durch Packaging
Aschenbrenner, R.; Ostmann, A.; Becker, K.-F.; Jung, E.; Kallmeyer, C.
Journal Article
2001Material mechanics and reliability issues of lead-free solder interconnects
Schubert, A.; Walter, H.; Jung, E.; Gollhardt, A.
Conference Paper
2001MOEMS - Technologie, Packaging und optische Verbindungstechnik
Schröder, H.; Scheel, W.
Journal Article
2001MOEMS - Technology, packaging and optical interconnection
Schröder, H.; Scheel, W.
Conference Paper
2001New dicing and thinning concept improves mechanical reliability of ultra thin silicon
Landesberger, C.; Klink, G.; Schwinn, R.; Aschenbrenner, R.
Conference Paper
2001Paper-thin ICs for Future Smart Label Applications
Klink, G.; Ansorge, F.
Conference Paper
2001Plastic encapsulation technologies - Processes and characterization
Ansorge, F.; Becker, K.-F.; Braun, T.; Jung, E.; Misawa, D.
Conference Paper
2001Polymer optical interconnects for PCB
Schröder, H.; Bauer, J.; Ebling, F.; Scheel, W.
Conference Paper
2001Processing design rules for reliable reflowable underfill application
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Synthesis and photoinitiated polymerization of nematic liquid-crystalline diepoxides
Schnurpfeil, G.; Harder, A.; Schröder, H.; Wöhrle, D.; Hartwig, A.; Hennemann, O.-D.
Journal Article
2001Test boards simplify flip chip underfill processing
Becker, K.-F.; Adams, T.
Journal Article
2001A thermode bonding process for fine pitch flip chip applications down to 40 micron
Pahl, B.; Nieland, S.; Kallmayer, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Ultra thin chips for miniaturized applications
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Ultra thin chips for miniaturized products
Jung, E.; Ostmann, A.; Wojakowski, D.; Landesberger, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2001Verfahren und Vorrichtung zum Erzeugen einer leitfaehigen Struktur auf einem Substrat
Nieland, C.; Kallmayer, C.; Miessner, R.; Aschenbrenner, R.; Ostmann, A.
Patent
Fulltext
2001Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P.
Patent
Fulltext
2001Wafer Level Burn-In (WLBI) for flip chip applications
Jung, E.; Aschenbrenner, R.; Wojakowski, D.; Reichl, H.
Conference Paper
2000Advanced flip chip technologies in RF, microwave and MEMS applications
Oppermann, H.H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Assembly of Ultra Thin and Flexible ICs
Adler, C.; Klink, G.; Feil, M.; Ansorge, F.; Reichl, H.
Conference Paper
2000Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T.
Journal Article
2000Avanzadas Tecnologias "Flip Chip"
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000BGA packaging technology for rapid prototyping supported by advanced analytics
Becker, K.-F.; Ansorge, F.; Aschenbrenner, R.; Krause, F.; Kämpfe, B.; Reichl, H.
Conference Paper
2000Comparison of flip chip technologies on rigid polyimide with respect to reliability and manufacturing costs
Mießner, R.; Aschenbrenner, R.; Reichl, H.; Ling, S.; Le, B.; Lew, A.; Benson, R.; Nhan, E.
Conference Paper
2000Concepts for ultra thin packaging technologies
Aschenbrenner, R.; Ansorge, F.; Feil, M.; Landesberger, C.; Jung, E.; Ostmann, A.; Reichl, H.
Conference Paper
2000Dynamic mechanical analysis (DMA) of an highly-filled epoxy resin in thin layers
Braun, T.; Mießner, R.; Becker, K.-F.
Conference Paper
2000Evaluation of flip chip bonding using ACA on polyester substrates
Mießner, R.; Nieland, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Immersion soldering - a new way for ultra fine pitch bumping
Nieland, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Influence of microstructure of electroless deposited Ni used as under bump metallization for high temperature solders
Anhöck, S.; Ostmann, A.; Nieland, C.; Auerswald, E.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Lead free solders for area array packaging
Klöser, J.; Kallmayer, C.; Jung, E.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Lead free solders for area array packaging
Jung, E.; Klöser, J.; Kallmayer, C.; Coskina, P.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Low cost bumping by stencil printing: Process qualification for 200 mu-m pitch
Kloeser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Journal Article
2000Manufacturing a CSP at wafer level
Simon, J.; Wolf, J.; Kallmayer, C.; Töpper, M.; Reichl, H.
Conference Paper
2000Manufacturing CSP's at waferlevel or flip chip without underfill
Simon, J.; Wolf, J.; Kallmayer, C.
Conference Paper
2000Mechatronic solutions for modular MEMS
Amiri Jam, K.; Hillmann, V.; Braun, T.; Becker, K.-F.; Ansorge, F.; Großer, V.; Reichl, H.
Conference Paper
2000Mechatronik - Kleiner - Funktioneller - Intelligenter
Ansorge, F.; Braun, T.; Jansen, M.; Aab, V.; Sporer, M.
Conference Paper
2000MST-BioMar-COB-Technik in hermetisch gekapselten Mikrosystemen
Funke, E.; Lang, K.-D.; Rudolf, F.; Schneider-Ramelow, M.
Journal Article
2000A new approach for system integrated packaging
Aschenbrenner, R.; Jung, E.; Ostmann, A.; Landesberger, C.; Reichl, H.
Conference Paper
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
2000The photochemistry of palladiumacetate-bisazide-systems adaptable for fully additive metal deposition on polymers
Stolle, T.; Schwencke, B.; Franzke, M.K.H.; Halser, K.
Journal Article
2000Qualification of the system electroless nickel bumps and PbSn5 for high temperature applications
Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Reliability of soldered nickel bumps for high temperature application
Anhöck, S.; Auerswald, E.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Study on reflowable underfill materials for different flip chip processes
Kallmayer, C.; Becker, K.-F.; Jung, E.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Surface modification due to technological treatment evaluated by SPM and XPS techniques
Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K.
Conference Paper
2000Synthesis and photoinduced polymerization of liquid crystalline diepoxides for bonding in the microsystem technique
Wöhrle, D.; Hartwig, A.; Schnurpfeil, G.; Harder, A.; Schröder, H.
Journal Article
2000Ultra Thin ICs Open New Dimensions for Microelectronic Systems
Klink, G.; Landesberger, C.; Feil, M.; Ansorge, F.; Aschenbrenner,R.
Journal Article
2000Wire-Bonding bleibt auf Draht - Herausforderungen und Entwicklungen in der Halbleiter Verbindungstechnik
Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M.
Journal Article
2000Wire-Bonding bleibt auf Draht. Herausforderungen und Entwicklungen in der Halbleiter-Verbindungstechnik
Lang, K.-D.; Meier, P.; Schilde, B.; Schneider-Ramelow, M.
Journal Article
1999Advanced flip chip technologies
Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Electroless plating on semiconductor wafers
Aschenbrenner, R.; Ostmann, A.; Reischl, H.
Conference Paper
1999Entwicklung eines CSP auf Waferebene
Simon, J.; Auersperg, J.; Becker, K.-F.; Busse, E.; Heinricht, K.; Kallmayer, C.; Schütt, J.; Töpper, M.; Reichl, H.
Book Article
1999Flip chip solder joint reliability
Schubert, A.; Dudek, R.; Vogel, D.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.
Conference Paper
1999Oberflächen- und Schichtcharakterisierung bei der Herstellung von Dünnfilm-NiCr-Widerständen
Töpper, M.; Scherpinski, K.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Journal Article
1999Reliability investigations of flip-chip solder bumps on palladium
Kallmayer, C.; Oppermann, H.; Kalicki, R.; Klein, M.; Anhöck, S.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Reliability of electroless nickel for high temperature applications
Anhöck, S.; Ostmann, A.; Oppermann, H.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1999Schablonendruck für Flip Chip and Waferlevel CSP
Töpper, M.; Coskina, P.; Kloeser, J.; Jung, E.; Achenbrenner, R.; Reichl, H.
Conference Paper
1999Single chip bumping and reliability for flip chip processes
Klein, M.; Oppermann, H.; Kalicki, R.; Aschenbrenner, R.; Reichl, H.
Journal Article
1999Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten
Zakel, E.; Ansorge, F.; Kasulke, P.; Ostmann, A.; Aschenbrenner, R.; Dietrich, L.
Patent
Fulltext
1999Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte
Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P.
Patent
Fulltext
1999Vorrichtung zur Beaufschlagung eines Drahtendes in einer Drahtbondeinrichtung mit einem Schutzmedium
Jung, E.; Kasulke, P.; Zakel, E.
Patent
Fulltext
1999Wafer Bumping for Wafer-Level CSPs and Flip Chips using Stencil Printing Technology
Töpper, M.; Coskina, P.; Krause, F.; Halser, K.; Ehrmann, O.; Scheel, W.; Reichl, H.
Conference Paper
1998Alternative solders for flip chip applications in the automotive environment
Jung, E.; Heinricht, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Antrieb für mechanische Pressen
Neugebauer, R.; Jung, E.
Patent
Fulltext
1998Characterization of adhesive materials for high circuit density applications
Aschenbrenner, R.; Mießner, R.; Becker, K.-F.; Reichl, H.
Conference Paper
1998Chipanordnung und Verfahren zur Herstellung einer Chipanordnung
Reichl, H.; Auersperg, J.; Simon, J.; Aschenbrenner, R.; Kloeser, J.; Jung, E.
Patent
Fulltext
1998Chipkarte
Aschenbrenner, R.; Zakel, E.
Patent
Fulltext
1998Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections
Mießner, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Einsatzerfahrungen mit einer Hexapod-Werkzeugmaschine im Werkzeug- und Formenbau
Neugebauer, Reimund; Wieland, F.; Hochmuth, C.; Jung, E.; Kretzschmar, W.
Conference Paper
1998Experience with a fully automatic flip-chip assembly line integrating SMT
Klöser, J.; Kutzner, K.; Jung, E.; Heinricht, K.; Lauter, L.; Töpper, M.
Conference Paper
1998Hydromechanische Pressenhauptantriebe auf der Basis sechsgliedriger Lenkerhebelgetriebe
Jung, E.
Dissertation
1998Implementation of flip chip technology into volume manufacturing demonstration of processes
Jung, E.; Heinricht, K.; Kutzner, K.; Klöser, J.; Aschenbrenner, R.; Reichl, H.; Brommelhaus, A.
Conference Paper
1998Influences of flip chip layout on the underfilling process
Becker, K.-F.; Schaub, M.; Mießner, R.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Integration of flip chip assembly in the SMT process: manufacturing and productivity issues
Jung, E.; Klöser, J.; Heinricht, K.; Lauter, L.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Low cost bumping by stencil printing. Process qualification for 200 mu m pitch
Klöser, J.; Heinricht, K.; Jung, E.; Lauter, L.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Mechanische Presse
Jung, E.; Seifert, V.; Päßler, T.
Patent
Fulltext
1998Quality and yield of ultra fine pitch stencil printing for flip chip assembly
Heinricht, K.; Klöser, J.; Lauter, L.; Ostmann, A.; Reichl, H.; Wolter, A.
Conference Paper
1998Reliability aspects of molded BGA's related to material properties
Ehrlich, R.; Becker, K.-F.; Badri Ghavifekr, H.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.; Sawai, K.; Tanaka, A.; Kumano, K.; Tenya, Y.; Chichon, M.; Hosokawa, H.
Conference Paper
1998Reliability investigations for flip chip on flex using different solder materials
Kallmayer, C.; Oppermann, H.; Anhöck, S.; Azadeh, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1998Reliability investigations of Sn/Pb and lead free solders for flip chip technology
Klöser, J.; Jung, E.; Heinricht, K.; Kutzner, K.; Ostmann, A.; Reichl, H.
Conference Paper
1998Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungstraegern
Meyer, H.; Mahlkow, H.; Aschenbrenner, R.
Patent
Fulltext
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article
1997Adhesive flip chip bonding on flexible substrates
Aschenbrenner, R.; Mießner, R.; Reichl, H.
Journal Article
1997Bondability of electroless metalfinishes for COB-technology
Ansorge, F.; Bader, V.; Zakel, E.; Reichl, H.
Conference Paper
1997Characterization of microsystem and packaging components by acoustic microscopy
Vogel, D.; Becker, K.-F.; Zakel, E.
Conference Paper
1997Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Traegersubstrat zur Kontaktierung von Chips
Aschenbrenner, R.; Zakel, E.; Oppermann, H.H.; Azdasht, G.
Patent
Fulltext
1997Evaluation of ORMOCERs for microelectronics applications
Dabek, A.; Popall, M.; Olsowski, B.; Kallmayer, C.; Reichl, H.
Conference Paper
1997Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Kloeser, J.; Heinricht, K.; Motulla, G.; Kutzner, K.; Jung, E.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1997Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Journal Article
1997Flip chip technology for multi chip modules
Jung, E.; Aschenbrenner, R.; Busse, E.; Reichl, H.
Conference Paper
1997Flip-Chip-Verbindung mit nichtleitendem Klebmittel
Aschenbrenner, R.; Gwiasda, J.; Zakel, E.; Eldring, J.
Patent
Fulltext
1997Herstellung galvanisch abgeformter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P.
Patent
Fulltext
1997Herstellung galvanisch/stromlos gestalteter Kontakthoecker
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Kasulke, P.
Patent
Fulltext
1997The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Kasulke, P.; Giebler, R.; Klöser, J.; Dietrich, L.; Ostmann, A.; Zakel, E.; Reichl, H.
Journal Article
1997Influences on the reliability of underfilled flip chips
Becker, K.-F.; Jiang, H.; Ansorge, F.; Jung, E.; Zakel, E.; Reichl, H.
Conference Paper
1997Low cost flip chip technologies on chemical nickel bumping and solder printing
Kloeser, J.; Gwiasda, J.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Bechtold, F.
Journal Article
1997A new approach to chip size package using meniscus soldering and FPC-bonding
Kallmayer, C.; Jung, E.; Kasulke, P.; Azadeh, R.; Azdasht, G.; Zakel, E.; Reichl, H.
Conference Paper
1997A new CSP-technology based on chip on flex
Azdasht, G.; Jung, E.; Zakel, E.; Reichl, H.
Conference Paper
1997A new production line for low cost flip chip assembly
Kutzner, K.; Kloeser, J.; Kappeler, U.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Recent progress in encapsulation technology and reliability investigation of mechatronic, CSP and BGA packages using flip chip interconnection technology
Ansorge, F.; Becker, K.-F.; Azdasht, G.; Ehrlich, R.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Recent progress in flexible molding and reliability investigation of CSP and BGA-packages using advanced interconnection technology
Becker, K.-F.; Ansorge, F.; Ehrlich, R.; Azdasht, G.; Bader, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
1997Thermische Einflüsse durch Prozess- und Raumtemperatur bei der Ultrapräzisionsdrehbearbeitung
Schröder, H.B.; Weck, M. (Prüfer)
Dissertation
1997Untermetallisierung fuer Lotmaterialien
Zakel, E.; Kallmayer, C.; Nave, J.
Patent
Fulltext
1996Chiptraeger-Anordnung sowie Chiptraeger zur Herstellung einer Chip-Gehaeusung
Zakel, E.; Lin, D.; Gwiasda, J.; Ostmann, A.
Patent
Fulltext
1996Einfluß der Schichteigenschaften auf die Bondbarkeit von Ni/Au-beschichteten Leiterplatten
Halser, K.; Nowottnick, M.; Schmidt, R.; Hannemann, M.
Book Article
1996Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
Aschenbrenner, R.; Ostmann, A.; Motulla, G.; Zakel, E.; Reichl, H.
Conference Paper
1996Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Azdasht, G.; Klöser, J.; Reichl, H.
Journal Article
1996Implementation of flip chip technology for BGA packages
Aschenbrenner, R.; Jung, E.; Becker, K.F.; Zakel, E.; Reichl, H.
Conference Paper
1996The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Jung, E.; Giebler, R.; Klöser, J.; Dietrich, L.; Zakel, E.; Reichl, H.; Kasulke, P.; Ostmann, A.
Conference Paper
1996Reliability investigations of different bumping processes for flip chip and TAB applications
Jung, E.; Klöser, J.; Nave, J.; Engelmann, G.; Dietrich, L.; Zakel, E.; Reichl, H.
Conference Paper
1996Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlussflaeche
Zakel, E.; Eldring, J.; Jung, E.
Patent
Fulltext
1996Verfahren zur Substratfixierung von elektronischen Bauelementen
Oppermann, H.H.; Zakel, E.; Kallmayer, C.; Kloeser, A.
Patent
Fulltext
1995Analyzing the dynamic performance of high precision machines
Weck, M.; Schröder, H.B.; Fraunhofer-Institut für Produktionstechnologie -IPT-, Aachen
Conference Proceedings
1995Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H.
Journal Article
1995Experimental results on the self-alignment process using Au/Sn metallurgy and the growth of the xi-phase during the reflow
Kallmayer, C.; Oppermann, H.; Klöser, J.; Zakel, E.; Reichl, H.
Conference Paper
1995Flip chip attachment using non-conductive adhesives and gold ball bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H.
Journal Article
1995Flip chip interconnection to organic substrates. A comparison between adhesive bonding and soldering
Jung, E.; Aschenbrenner, R.; Zakel, E.; Reichl, H.
Conference Paper
1995Flip chip soldering on printed wining boards using vapor phase reflow
Jung, E.; Eldring, J.; Ostmann, A.; Zakel, E.; Reichl, H.; Klöser, J.
Conference Paper
1995Flip-Chip-Montage mit nichtleitenden Kunststoffolien und Gold-Ball-Bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H.
Journal Article
1995Fluxless flip chip bonding on flexible substrates: A comparison between adhesive bonding and soldering
Aschenbrenner, R.; Zakel, E.; Azdasht, G.; Klöser, J.; Reichl, H.
Conference Paper
1995Fluxless flip chip bonding on flexible substrates
Zakel, E.; Aschenbrenner, R.; Gwiasda, J.; Azdasht, G.; Ostmann, A.; Eldring, J.; Reichl, H.; Klöser, J.
Conference Paper
1995Hybrid Visualization Component for Planning Cellular Radio Networks
Haase, H.; Lutze, K.; Oppermann, E.; Schröder, H.
Journal Article
1995Klebtechnologien für die Flip Chip Montage
Aschenbrenner, R.; Ostmann, A.; Zakel, E.; Reichl, H.
Conference Paper
1995Lothoecker fuer die Flip-Chip-Montage und Verfahren zu dessen Herstellung
Aschenbrenner, R.; Zakel, E.
Patent
Fulltext
1995Manufacturing of micromechanical components by diamond cutting - limits and chances -
Weck, M.; Luderich, J.; Vos, M.; Schröder, H.B.
Conference Paper
1995Mechanical bumping for flipchip application
Jung, E.; Nave, J.; Aschenbrenner, R.; Reichl, H.; Zakel, E.
Conference Paper
1995Mechanische Herstellung von Kontakthöckern zur Flipchip Montage
Eldring, J.; Jung, E.
Book Article
1995Mechanisches Bumping für die Flipchip Technologie
Eldring, J.; Jung, E.; Aschenbrenner, R.; Reichl, H.; Zakel, E.
Conference Paper
1995Reflow properties of electrodeposited PbSn 95/5 solder bumps for FC-assembly
Jung, E.; Zakel, E.; Beutler, U.; Klöser, J.; Reichl, H.
Conference Paper
1995Zuverlässigkeit von Lötverbindungen am Beispiel von SOT-Bauelementen
Halser, K.; Scheel, W.
Conference Paper
1995Zuverlässigkeit von SMT-Weichlötstellen
Halser, K.
Book Article
1994Cost effective flip chip interconnections on FR-4-boards
Klöser, J.; Zakel, E.; Ostmann, A.; Eldring, J.; Reichl, H.
Conference Paper
1994Electroless Nickel/Copper plating as a new bump metallization
Aschenbrenner, R.; Ostmann, A.; Beutler, U.; Simon, J.; Reichl, H.
Conference Paper
1994Flip Chip attachment using nonconductive adhesives and gold ball bumps
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H.
Conference Paper
1994Flip-Chip-Kontaktierungen auf organischen Substrat-Materialien
Klöser, J.; Zakel, E.; Gwiasda, J.; Ostmann, A.; Reichl, H.
Conference Paper
1994Gold ball bumps for adhesive flip chip assembly
Aschenbrenner, R.; Gwiasda, J.; Eldring, J.; Zakel, E.; Reichl, H.
Conference Paper
1994Präzision und Leistung. Kostenbewußte Optimierung von Maschinen und Anlagen
Weck, M.; Schröder, H.B.; Ostendarp, H.; Vos, M.; Wieners, A.
Journal Article
1993Thermal energy from machining process. A dominating factor on form in ultra- and high-precision-turning
Weck, U.; Schröder, H.B.
Conference Paper
1985Aufstellung einer Schlammbilanz für die Kläranlage Waiblingen und Untersuchung der klärtechnischen Randbedingungen im Hinblick auf die Faulgasproduktion
Kunz, P.; Schroeder, H.-U.; Fraunhofer-Institut für Systemtechnik und Innovationsforschung -ISI-, Karlsruhe
Book
1985Einflußfaktoren des Kläranlagenbetriebes auf die Nutzung der Abwasserwärme. Demonstrationsprojekt Absorptionswärmepumpenanlage in der Kläranlage Waiblingen
Bischof, J.; Kunz, P.; Mueller, A.; Schroeder, H.-U.; Fraunhofer-Institut für Systemtechnik und Innovationsforschung -ISI-, Karlsruhe
Book
1985Ermittlung der Einflüsse des Abwasserreinigungsbetriebes auf Abwasserwärme- und Faulgasanfall in der Kläranlage Waiblingen
Schröder, Hans-Ulrich
Report