Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Journal Article
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Conference Paper
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
Fulltext
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
Fulltext
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
Fulltext
2018Bändchenbondantennen
Ndip, Ivan
Patent
Fulltext
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Conference Paper
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Conference Paper
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Journal Article
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS: Presentation held at IFAAP 2018 - Session 31am-A05-Energy Harvesters, ISAF-FMA-AMF-AMEC-PFM (IFAAP) Joint Conference in Hiroshima, May 27th - June 1st, 2018
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Presentation
Fulltext
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Conference Paper
2018Kombinationsantenne
Ndip, Ivan
Patent
Fulltext
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Conference Paper
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
Fulltext
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
Fulltext
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Journal Article
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Journal Article
Fulltext
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
Fulltext
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
Fulltext
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
Fulltext
2017Antennenanordnung mit Richtstruktur
Ndip, Ivan; Curran, Brian
Patent
Fulltext
2017A comparison of typical surface finishes on the high frequency performances of transmission lines in PCBs
Curran, B.; Ndip, I.; Lang, K.-D.
Conference Paper
2017Effect of 3D stack-up integration on through silicon via characteristics
Dahl, D.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2017Experimental verification and analysis of analytical model of the shape of bond wire antennas
Ndip, I.; Huhn, M.; Brandenburger, F.; Ehrhardt, C.; Schneider-Ramelow, M.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2017Integration of a Ka-Band Front-End Components Using a Copper Core Printed Circuit Board
Curran, B.; Reyes, J.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Leiß, J.; Martinez-Vazquez, M.; Baggen, R.
Conference Paper
2017Miniaturization of power converters by piezoelectric transformers - chances and challenges: Presentation held at International Symposium on Piezocomposite Applications, ISPA 2017, September 13 - 15, 2017, Fraunhofer IKTS Dresden
Radecker, Matthias; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Reich, Torsten; Buhl, René; Yang, Yujia
Presentation
Fulltext
2017Power plane filter using higher order virtual ground fence
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Journal Article
2016Broadband dielectric material characterization of epoxy molding compound
Huhn, M.; Tschoban, C.; Pötter, H.; Ndip, I.; Braun, T.; Lang, K.-D.
Conference Paper
2016Determination of dielectric thickness, constant, and loss tangent from cavity resonators
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses
Curran, B.; Tschoban, C.; Ndip, I.; Lang, K.-D.; Kroener, H.; Ippich, A.
Conference Paper
2016Efficient total crosstalk analysis of large via arrays in silicon interposers
Dahl, D.; Reuschel, T.; Preibisch, J.B.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2016Glass based interposers for RF applications up to 100GHz
Woehrmann, M.; Juergensen, N.; Lutz, M.; Wilke, M.; Duan, X.; Ndip, I.; Töpper, M.; Lang, K.-D.
Conference Paper
2016High frequency characterization of silicon substrate and through silicon vias
Duan, X.; Boettcher, M.; Dahl, D.; Schuster, C.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2016Higher-order virtual ground fence design for filtering power plane noise
Engin, A.E.; Ndip, I.; Lang, K.-D.
Conference Paper
2016Non-overlapping power/ground planes for localized power distribution network design
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Conference Paper
2016On the Modeling, Characterization, and Analysis of the Current Distribution in PCB Transmission Lines With Surface Finishes
Curran, B.; Fotheringham, G.; Tschoban, C.; Ndip, I.; Lang, K.-D.
Journal Article
2016On the upper bound of total uncorrelated crosstalk in large through silicon via arrays
Dahl, D.; Reuschel, T.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2016Opportunities of fan-out wafer level packaging (FOWLP) for RF applications
Braun, T.; Töpper, M.; Becker, K.-F.; Wilke, M.; Huhn, M.; Maass, U.; Ndip, I.; Aschenbrenner, R.; Lang, K.-D.
Conference Paper
2016RF-MEMS for 5G mobile communications: A basic attenuator module demonstrated up to 50 GHz
Iannacci, J.; Tschoban, C.; Reyes, J.; Maaß, U.; Huhn, M.; Ndip, I.; Pötter, H.
Conference Paper
2016A rigorous approach for the modeling of through-silicon via pairs using multipole expansions
Duan, X.M.; Dahl, D.; Ndip, I.; Lang, K.D.; Schuster, C.
Journal Article
2015An accurate back to front design methodology for PT based load resonant converters
Yang, Yujia; Radecker, M.; Lang, K.-D.; Fischer, W.-J.
Conference Paper
2015Analytical models for calculating the inductances of bond wires in dependence on their shapes, bonding parameters, and materials
Ndip, I.; Oz, A.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2015Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz
Duan, X.; Böttcher, M.; Dobritz, S.; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method
Duan, Xiaomin; Dahl, D.; Schuster, C.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Efficient computation of localized fields for through silicon via modeling up to 500 GHz
Dahl, D.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Journal Article
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Low profile LED off-line phase-cut dimming ballast with piezoelectric transformer
Le, L.; Yang, Y.; Radecker, M.
Conference Paper
2015Optimization of the return current paths of interposer TSVs for frequencies up to 110GHz
Curran, B.; Lang, K.-D.; Ndip, I.; Pötter, H.
Conference Paper
2015Practical experience and results of an extensive pilot test of the ASTROSE® sensor network for high voltage power line monitoring
Voigt, S.; Pfeiffer, M.; Heibutzki, B.; Brockmann, C.; Großer, V.; Kurth, S.; Geßner, T.
Conference Paper
2015Through-the-wall detection with gated FMCW signals using optimized patch-like and Vivaldi antennas
Fioranelli, F.; Salous, S.; Ndip, I.; Raimundo, X.
Journal Article
2014Analysis and improvement of a spark plug for less radiated electromagnetic emissions
Marczok, C.; Maaß, U.; Hoene, E.; Ndip, I.; Lang, K.-D.; Hasselberg, D.
Conference Paper
2014Analysis of wave propagation along coaxial through silicon vias using a matrix method
Dahl, D.; Beyreuther, A.; Duan, X.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2014Analytical, numerical-, and measurement-based methods for extracting the electrical parameters of through silicon vias (TSVs)
Ndip, I.; Zoschke, K.; Löbbicke, K.; Wolf, M.J.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2014Development of a high density glass interposer based on wafer level packaging technologies
Töpper, Michael; Wöhrmann, Markus; Brusberg, Lars; Jürgensen, Nils; Ndip, Ivan; Lang, Klaus-Dieter
Conference Paper
2014A modeling approach for predicting the effects of dielectric moisture absorption on the electrical performance of passive structures
Curran, B.; Ndip, I.; Engin, E.; Bauer, J.; Pötter, H.; Lang, K.-D.; Reichl, H.
Journal Article
2014On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach
Ndip, I.; Löbbicke, K.; Tschoban, C.; Ranzinger, C.; Richlowski, K.; Contag, A.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2014Optimization of microstrip-to-via transition for high-speed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads
Duan, X.; Hardock, A.; Ndip, I.; Schuster, C.; Lang, K.-D.
Conference Paper
2014Sensorsystem zum Überwachen eines Objekts
Hefer, Jan; Rojahn, Johannes
Patent
Fulltext
2014Thin glass characterization in the radio frequency range
Ebberg, A.; Meggers, J.; Rathjen, K.; Fotheringham, G.; Ndip, I.; Ohnimus, F.; Tschoban, C.; Pieper, I.; Kilian, A.; Methfessel, S.; Letz, M.; Fotheringham, U.
Conference Paper
2014A wide range power cell for modular interleaving supplies
Radecker, M.; Yang, Y.; Nicollini, A.; Le, L.; Lang, K.-D.; Kruse, P.D.; Feistel, K.; Teixeira, L.; Dennstedt, D.; Herfurth, M.
Conference Paper
2013Application of the transverse resonance method for efficient extraction of the dispersion relation of arbitrary layers in silicon interposers
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2013Applying a physics-based via model for the simulation of Through Silicon Vias
Dahl, D.; Duan, X.; Beyreuther, A.; Ndip, I.; Lang, K.-D.; Schuster, C.
Conference Paper
2013Comparison of methods for impedance modeling of power distribution networks
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Conference Paper
2013Development of a 40 Watts 5 kV converter using Piezoelectric Transformer for Rheoelectrical damper application
Yang, Y.; Radecker, M.; Guttowski, S.; Lang, K.-D.; Fontana da Silva, B.; Bellinaso, L.V.; Engleitner, R.; Vazquez Carazo, A.
Conference Paper
2013Drahtlose Sensorsysteme für die zustandsorientierte Instandhaltung und Logistik
Thomasius, R.; Guttowski, S.; Brockmann, C.; Benecke, S.; Kravcenko, E.; Niedermayer, M.; Nachsel, R.
Journal Article
2013Electrical modeling of the power delivery to an LED array packaged in a textile
Curran, B.; Öz, A.; Linz, Torsten; Ndip, Ivan; Guttowski, Stephan; Lang, Klaus-Dieter
Conference Paper
Fulltext
2013Electromagnetic interactions between interconnected patch-ring (IPR) structures and planes in electronic packages and PCBs
Ndip, I.; Bierwirth, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
Fulltext
2013Introduction
Nowak, M.; Lee, C.; Ndip, I.; Goetz, M.
Conference Paper
2013Introduction
Ndip, I.; Yu, J.; Rouzaud, A.; Hoffmeyer, M.
Conference Paper
2013Modeling and minimizing the inductance of bond wire interconnects
Ndip, I.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Conference Paper
2013Modeling, fabrication and measurement of TSVs for advanced integration of RF/high-speed components
Lang, K.-D.; Ndip, I.; Guttowksi, S.
Conference Paper
2012Analysis and comparison of methods for extracting the inductance and capacitance of TSVs
Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Characterization of interconnects and RF components on glass interposers
Ndip, I.; Töpper, M.; Löbbicke, K.; Öz, A.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Journal Article
2012Impact of process tolerances on the performance of bond wire antennas at RF/microwave frequencies
Ndip, I.; Öz, A.; Tschoban, C.; Schmitz, S.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2012Introduction: 2011 International Symposium on Microelectronics
Sigliano, R.; Chiang, K.-N.; Ndip, I.; Chan, B.
Conference Paper
2012Mobiles optisches Analysegerät
Großer, V.; Gerritzen, A.; Jung, E.
Patent
Fulltext
2012Modeling and optimization of electronic packaging structures for signal and power integrity
Scogna, A.C.; Engin, A.E.; Ndip, I.
Conference Paper
2012Modelling the shape, length and radiation characteristics of bond wire antennas
Ndip, I.; Oz, A.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2012Novel conformal antenna concept for security applications
Tschoban, C.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.
Conference Paper
2012Optmized patch-like antennas for through the wall radar imaging and preliminary results with frequency modulated interrupted continuous wave
Fioranelli, F.; Salous, S.; Ndip, I.
Conference Paper
2012Packaging and integration concept for high-performance and cost-effective IQM-based transmitter module for 160 Gb/s applications
Delrosso, G.; Curran, B.; Rothermund, M.; Maaß, U.; Oppermann, H.; Ndip, I.
Conference Paper
2012Robust 3D radio sensor systems with embedded active and passive components for industrial applications
Niedermayer, Michael; Scholtz, Hendrik; Bonim, Thomas; Guttowski, Stephan; Lang, Klaus-Dieter
Conference Paper
2012Sensoranordnung zur Feststellung von Unregelmäßigkeiten in oder an Fahrstromleitungen für schienengebundene Fahrzeuge
Großer, V.; Brockmann, C.
Patent
Fulltext
2012Sensornetzwerk zum Monitoring von Hochspannungsleitungen
Voigt, S.; Wolfrum, J.; Pfeiffer, M.; Keutel, T.; Brockmann, C.; Grosser, V.; Lissek, S.; During, H.; Rusek, B.; Braunschweig, M.; Kurth, S.; Gessner, T.
Conference Paper
2012Systematic design and optimization of bond wire antennas using the M3-approach
Ndip, I.; Guttowski, S.; Reichl, H.; Lang, K.D.
Conference Paper
2012Vorrichtung zum Erfassen und Entfernen von schädlichem Gewebe
Großer, V.; Gerritzen, A.
Patent
Fulltext
2012Wafer level 3D system integration based on silicon interposers with through silicon vias
Zoschke, Kai; Oppermann, Hermann; Manier, Charles-Alix; Ndip, Ivan; Puschmann, René; Ehrmann, Oswin; Wolf, Jürgen; Lang, Klaus-Dieter
Conference Paper
2012Wireless Sensor Networks in der industriellen Automation. Status & Trends
Hampicke, Maik; Pötter, Harald; Großer, Volker; Brockmann, Carsten; Niedermayer, Michael; Benecke, Stefan
Journal Article
Fulltext
2011Condition monitoring system adapted for photovoltaic power converter
Guenther, J.; Rothe, M.; Hefer, J.; Middendorf, A.; Lang, K.-D.
Conference Paper
2011Electronics condition monitoring for improving sustainability of power electronics
Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D.
Conference Paper
2011An energy-based heuristic operator method for resonant power circuit estimation predicting parameter sensitivity
Radecker, M.; Bisogno, F.E.; Zinchenko, L.
Conference Paper
2011From the technical chairs
Sigliano, R.; Chan, B.; Ndip, I.; Chiang, K.-N.
Journal Article
2011High-frequency modeling of TSVs for 3-D chip integration and silicon interposers considering skin-effect, dielectric quasi-TEM and slow-wave modes
Ndip, I.; Curran, B.; Lobbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.D.; Henke, H.
Journal Article
2011The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Curran, B.; Ndip, I.; Bauer, J.; Guttowski, S.; Lang, K.D.; Reichl, H.
Conference Paper
2011Integration and evaluation of electrically small 868 MHz PCB antennas for wireless USB stick
Ohnimus, F.; Hoherz, C.; Hampicke, M.; Maaß, U.; Ndip, I.; Guttowski, S.; Lang, K.-D.; Lumbeck, D.; Kreitmair, M.
Conference Paper
2011Integration of planar antennas considering electromagnetic interactions at board level
Ohnimus, F.; Fotheringham, G.; Ndip, I.; Engin, A.E.; Guttowski, S.; Reichl, H.; Lang, K.D.
Journal Article
2011Low temperature glass-thin-films for use in power applications
Leib, J.; Gyenge, O.; Hansen, U.; Maus, S.; Hauck, K.; Ndip, I.; Toepper, M.
Conference Paper
2011Modeling and optimization of bond wires as transmission lines and integrated antennas at RF/microwave frequencies
Ndip, I.; Tschoban, C.; Schmitz, S.; Ostmann, A.; Schneider-Ramelow, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2011Normalized statical analysis with frequency and load variation for the Class-E converter based on Piezoelectric Transformers
Engleitner, R.; Renes Pinheiro, J.; Ecke Bisogno, F.; Radecker, M.; Yang, Y.
Journal Article
2011Possibilities and limitations of wireless sensor systems
Hefer, J.; Brockmann, C.; Thomasius, R.
Conference Paper
2011Small-signal modeling of a DC-DC Class-E piezoconverter based on generalized averaging method
Engleitner, R.; Bisogno, F.E.; Pinheiro, J.R.; Rech, C.; Michels, L.; Radecker, M.
Conference Paper
2011Überwachungssystem für eine Vielzahl von Objekten
Guttowski, Stephan; Zurwehn, Volker; Hefer, J.; Wussow, K.
Patent
Fulltext
2011Vorrichtung zur induktiven Energieübertragung
Baganz, D.; Staaks, G.; Jauernik, O.; Wecke, N.; Jauernik, S.; Balzer, H.-U.; Großer, Volker; Brockmann, Carsten
Patent
Fulltext
20103-D thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer
Töpper, M.; Ndip, I.; Erxleben, R.; Brusberg, L.; Nissen, N.; Schröder, H.; Yamamoto, H.; Todt, G.; Reichl, H.
Conference Paper
2010An adapted filament model for accurate modeling of printed coplanar lines with significant surface roughness and proximity effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Journal Article
2010Design and Characterization of a Low Profile Miniaturized UHF PIFA for Compact Wireless Sensor Nodes
Ohnimus, F.; Erxleben, R.; Tschoban, C.; Ndip, I.; Niedermayer, M.; Scholtz, H.; Bonim, T.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and Characterization of a Small Encapsulated UHF RFID Tag for Wood Log Monitoring
Ohnimus, F.; Haberland, J.; Tschoban, C.; Ndip, I.; Heumann, K.; Kallmayer, C.; Guttowski, S.; Lang, K.-D.
Conference Paper
2010Design and comparison of 24 GHz patch antennas on glass substrates for compact wireless sensor nodes
Ohnimus, F.; Maaß, U.; Fotheringham, G.; Curran, B.; Ndip, I.; Fritsch, T.; Wolf, J.; Guttowski, S.; Lang, K.-D.
Journal Article
Fulltext
2010Equivalent circuit modeling of signal vias considering their return current paths
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Tschoban, C.; Bierwirth, M.; Guttowski, S.; Reichl, H.
Conference Paper
2010Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling
Brusberg, L.; Schröder, H.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010GlassPack - A 3D glass based interposer concept for sip with integrated optical interconnects
Schröder, H.; Brusberg, L.; Erxleben, R.; Ndip, I.; Töpper, M.; Nissen, N.F.; Reichl, H.
Conference Paper
2010High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Erxleben, R.; Ndip, I.; Brusberg, L.; Schroeder, H.; Toepper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2010Managing the return-currents of signal vias in organic and silicon substrates
Ndip, I.; Löbicke, K.; Bierwirth, M.; Tschoban, C.; Curran, B.; Erxleben, R.; Ohnimus, F.; Maaß, U.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A methodology for combined modeling of skin, proximity, edge, and surface roughness effects
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Miniaturized implantable wireless sensor system for realtime measurement of well-being of fishes
Brockmann, C.; Großer, V.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2010Modeling and analysis of coplanar bonding wires for high-speed applications
Tschoban, C.; Ndip, I.; Schmidt, S.; Guttowski, S.; Schneider-Ramelow, M.; Lang, K.-D.; Reichl, H.
Conference Paper
2010Modeling the impact of return-path discontinuity on interconnects for Gb/s applications
Ndip, I.; Löbbicke, K.; Tschoban, C.; Töpper, M.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2010Modeling, quantification, and reduction of the impact of uncontrolled return currents of vias transiting multilayered packages and boards
Ndip, I.; Ohnimus, F.; Löbbicke, K.; Bierwirth, M.; Tschoban, C.; Guttowski, S.; Reichl, H.; Lang, K.-D.; Henke, H.
Journal Article
2010Eine neue planare Funktionsstruktur zur Entkopplung hochfrequenter Störungen auf Schaltungsträgern
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Journal Article
2010Sensorsystem zum Implantieren in einen Körper
Großer, V.; Guttowski, S.; Niedermayer, M.
Patent
Fulltext
2010Simulation, measurement and analysis of electromagnetic band gap structures for noise suppression in electronic systems
Ndip, I.; Bierwirth, M.; Tschoban, C.; Maab, U.; Erxleben, R.; Guttowski, S.; Reichl, H.
Conference Paper
2010A small form-factor and low-cost opto-electronic package for short-reach 40 Gbit/s serial speed optical data links
Kropp, J.R.; Lott, J.A.; Ledentsov, N.N.; Otruba, P.; Drögemüller, K.; Fiol, G.; Bimberg, D.; Ndip, I.; Erxleben, R.; Maaß, U.; Klein, M.; Lang, G.; Oppermann, H.; Schröder, H.; Reichl, H.
Conference Paper
2010Smart universal control IC for high loaded factor resonant converters
Yang, Y.; Bisogno, F.E.; Nittayarumphong, S.; Radecker, M.; Fahlenkamp, M.; Fischer, W.J.
Conference Paper
2010A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H.
Conference Paper
2010Eine systematische Entwurfsmethode zur Sicherstellung der elektromagnetischen Zuverlässigkeit in Mikrosystemen
Ndip, I.; Fotheringham, G.; Guttowski, S.; Reichl, H.
Conference Paper
2010A SystemC based framework for the evaluation of proactive power-management approaches in distributed energy harvesting systems
Thomasius, R.; Guttowski, S.
Conference Paper
2010TSV modeling considering signal integrity issues
Ndip, I.; Curran, B.; Löbbicke, K.; Guttowski, S.; Reichl, H.; Lang, K.-D.
Conference Paper
2009A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
Erxleben, R.; Ndip, I.; Brusberg, L.; Schröder, H.; Töpper, M.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Comparison of electromagnetic field distribution in vicinity of patch and slot antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Comparison of Inductor-Half-Bridge and Class-E resonant topologies for piezoelectric transformer applications
Yang, Y.; Bisogno, F.E.; Schittler, A.; Nittayarumphong, S.; Radecker, M.; Fischer, W.-J.; Fahlenkamp, M.
Conference Paper
2009Design and integration of a planar EBG for UWB applications
Ndip, I.; Bierwirth, M.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical design and characterization of elevated antennas at PCB-level
Ohnimus, F.; Podlasly, A.; Bauer, J.; Ostmann, A.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Electrical modeling and analysis of the impact of slits on microstrip lines in thin film polymer layers
Ndip, I.; Töpper, M.; Becker, K.-F.; Hirte, M.; Eidner, I.; Fischer, T.; Curran, B.; Bauer, J.; Scheel, W.; Guttowski, S.; Reichl, H.
Conference Paper
2009Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes
Reichl, H.; Ndip, I.
Conference Paper
2009The impacts of dimensions and return current path geometry on coupling in single ended through silicon vias
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Improved Switching Characteristics of Fast Power MOSFETs Applying Solder Bump Technology
Dieckerhoff, S.; Wernicke, T.; Kallmayer, C.; Guttowski, S.; Reichl, H.
Journal Article
Fulltext
2009Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and analysis of electromagnetic field distribution in vicinity of patch antennas at millimeter-wave frequencies
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and comparison of patch antenna configurations for 77 GHz radar applications
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009Modeling and Measurement of Coplanar Transmission Lines with Significant Proximity and Surface Roughness Effects
Curran, B.; Ndip, I.; Werner, C.; Ruttkowski, V.; Maiwald, M.; Wolf, H.; Zoellmer, V.; Domann, G.; Guttovski, S.; Gieser, H.; Reichl, H.
Conference Paper
2009Modeling and quantification of conventional and Coax-TSVs for RF applications
Ndip, I.; Curran, B.; Guttowski, S.; Reichl, H.
Conference Paper
2009A novel Interconnected Patch-Ring (IPR) structure for noise isolation
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines
Ndip, I.; Hirte, M.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification and improvement of the models for surface roughness
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009On the quantification of the state-of-the-art models for skin-effect in conductors, including those with non-rectangular cross-sections
Curran, B.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Parameterization of bent coils on curved flexible surface substrates for RFID applications
Fotheringham, G.; Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2009Reduction of signal line to power plane coupling using controlled-return- current transmission lines
Engin, A.E.; Ndip, I.
Conference Paper
2009RFID - Theoretische Konzepte und Anwendungsbeispiele
Fotheringham, G.; Ohnimus, F.; Maaß, U.; Ndip, I.; Guttowski, S.; Reichl, H.
Book Article
2009SENESCOPE: A design tool for cost optimization of wireless sensor nodes
Niedermayer, M.; Richter, C.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2009Study on shielding effectiveness of mushroom-type electromagnetic bandgap structures in close proximity to patch antennas
Ohnimus, F.; Ndip, I.; Engin, E.; Guttowski, S.; Reichl, H.
Conference Paper
2008Automatisierter Entwurf von vertikal integrierten System-In-Package-Lösungen
Richter, C.; Guttowski, S.; Reichl, H.
Journal Article
2008The Dawn of self-sufficient micro systems
Niedermayer, M.; Hefer, J.; Guttowski, S.
Journal Article
2008Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008An efficient and broadband slot antenna for 60 GHz Wireless applications
Ohnimus, F.; Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Instrument zum Einfuehren in unzugaengliche Raeume
Oberschmidt, D.; Grosser, V.; Uhlmann, E.
Patent
Fulltext
2008Managing losses in through silicon vias with different return current path configurations
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008Mikrosysteme zur Sicherung der Fleischqualität
Thomasius, R.; Kim, J.-U.; Guttowski, S.; Reichl, H.
Journal Article
2008Minimizing electromagnetic interference in power-ground cavities
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Novel multimodal high-speed structures using substrate integrated waveguides with shielding walls in thin film technology
Curran, B.; Ndip, I.; Guttovski, S.; Reichl, H.
Conference Paper
2008On the interactions between mushroom-type EBGs and striplines
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2008Studying the interactions between mushroom-type EBGs, transmission lines and vias
Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2008Vorrichtung zur Unterdrueckung der Ausbreitung einer elektromagnetischen Stoerung in einem elektrischen System und ein elektrisches System mit derselben
Ndip, I.; Guttowski, S.; Reichl, H.
Patent
Fulltext
2007Accurate characterization of package and board components for efficient system level signal integrity analysis
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007Daten direkt am Fleisch erfassen: Konzepte zur prozessbegleitenden Charakterisierung von Lebensmitteln auf Basis mikrosystemtechnischer Detektorvarianten
Schneider, J.; Großer, V.; Schmidt, H.; Schwägele, F.; Schlüter, O.
Journal Article
2007Design for miniaturization of wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Thomasius, R.; Polityko, D.-D.; Schrank, K.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Development of an M3-approach for optimal electromagnetic reliability in system packages
Ndip, I.; Guttowski, S.; Reichl, H.
Conference Paper
2007An efficient methodology for design and implementation of embedded bandpass filters for RF/wireless applications
Baba, M.; Guttowski, S.; Reichl, H.
Conference Paper
2007Experimental characterization methods for power MOSFET assemblies
Wernicke, T.; Dieckerhoff, S.; Kirfe, T.; Feix, G.; Guttowski, S.; Reichl, H.
Conference Paper
2007Kostenaspekte beim Entwurf von Funksensorknoten
Niedermayer, M.; Hefer, J.; Guttowski, S.; Thomasius, R.; Reichl, H.
Conference Paper
2007Leistungselektronisches Modul
Guttowski, S.
Patent
Fulltext
2007Linking geometrical and electrical parameters of flex substrate vertical interconnects for 2.5D system-in-package design
Maaß, U.; Polityko, D.-D.; Richter, C.; Ndip, I.; Hefer, J.; Guttowski, S.; Reichl, H.
Conference Paper
2007Measurement techniques for the thermal characterization of power modules
Wernicke, T.; Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Methodical design of EMI filters for power electronics
Hoene, E.; Lissner, A.; Guttowski, S.; Reichl, H.
Conference Paper
2007Modulares mikroelektronisches Bauteil
Niedermayer, M.; Ostmann, A.; Guttowski, S.; Grundmann, S.; Thomasius, R.; Polityko, D.
Patent
Fulltext
2007Novel methodologies for efficient and accurate modeling and optimization of system-in-package modules for RF/High-Speed applications
Ndip, I.N.
Dissertation
2007Optimal Electrical Design of System Packages and Integrated Components using the M3-Approach
Ndip, I.; Salhi, F.; Maaß, U.; Fotheringham, G.; Ohnimus, F.; Guttowski, S.; Reichl, H.
Conference Paper
2007Predicting the influence of placement of passive components on EMI behaviour
Lissner, E.; Hoene, S.; Guttowski, S.; Reichl, H.
Conference Paper
2007Prediction of EMI behaviour in terms of passive component placement
Hoene, E.; Lissner, A.; Guttowski, S.
Conference Paper
2007Smart System Integration - Grundlage zukünftiger Anwendungen im Maschinenbau
Pötter, H.; Großer, V.; Lang, K.-D.; Reichl, H.; Schmitz, S.; Wolf, J.
Journal Article
2007Technology aware modeling of 2.5D-SiP for automation in physical design
Richter, C.; Polityko, D.-D.; Hefer, J.; Gutowski, S.; Reichl, H.; Berger, M.; Nowak, U.; Schroeder, M.
Conference Paper
2007Zerstörungsfreie Erfassung von Fleisch-Daten vom Schlachthof bis zum Einzelhändler
Schneider, J.; Grosser, V.; Schmidt, H.; Schwagele, F.; Schlüter, O.
Journal Article
2006Behaelter und Vorrichtung zum Detektieren von in einem Innenraum des Behaelters befindlichen Gegenstaenden
Guttowski, S.; Niedermayer, M.
Patent
Fulltext
2006Efficient HF modeling and model parameterization of induction machines for time and frequency domain simulations
Schinkel, M.; Weber, S.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Entwurf kleinster energieautarker Funksensoren
Thomasius, R.; Niedermayer, M.; Polityko, D.-D.; Schrank, K.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Hochfrequenzsender sowie Verfahren zu dessen Betrieb
Niedermayer, M.; Hahn, R.; Guttowski, S.; Thomasius, R.; Morgenstern, H.; Schrank, K.
Patent
Fulltext
2006Integration technology parameters for physical design of vertical system-in-package
Polityko, D.; Guttowski, S.; Reichl, H.
Conference Paper
2006Microsystem technologies for smart golf balls
Wolf, M.J.; Schmitz, S.; Amiri Jam, K.; Semionyk, P.; Grosser, V.; Lang, K.-D.
Journal Article
2006Mikroantenne fuer Nahfeldkommunikation
Niedermayer, M.; Ndip, I.; Hahn, R.; Guttowski, S.
Patent
Fulltext
2006Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe
Polityko, D.; Wenzel, S.; Jung, E.; Hefer, J.; Niedermayer, M.; Guttowski, S.
Patent
Fulltext
2006Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies
Niedermayer, M.; Guttowski, S.; Thomasius, R.; Polityko, D.; Schrank, K.; Reichl, H.
Conference Paper
2006Miniaturized Wireless Sensors for Automotive Applications
Thomasius, R.; Grundmann, S.; Niedermayer, M.; Achterholt, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV
Weber, S.-P.; Linde, A.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006A novel methodology for defining the boundaries of geometrical discontinuities in electronic packages
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006Parasitic effects in EMI filters
Hoene, E.; Lissner, A.; Weber, S.-P.; Guttowski, S.; Reichl, H.
Conference Paper
2006Performance comparison of advanced power electronic packages for automotive applications
Dieckerhoff, S.; Guttowski, S.; Reichl, H.
Conference Paper
2006Predicting parasitics and inductive coupling in EMI-filters
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2006Reliable miniaturized wireless sensors for automotive applications
Thomasius, R.; Grundmann, S.; Niedermayer, M.; Achterholt, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
Fulltext
2006RF/Microwave Modeling of SiP Modules - A novel approach
Ndip, I.; Reichl, H.; Guttowski, S.
Conference Paper
2006Stapelbare Funktionsschicht fuer ein modulares mikroelektronisches System
Niedermayer, M.; Ostmann, A.; Morgenstern, H.; Guttowski, S.
Patent
Fulltext
2006Troubleshooting and fixing of inverter driven induction motor bearing currents in existing plants of large size: An evaluation of possible mitigation techniques in practical applications
Guttowski, S.; Weber, S.; Schinkel, M.; John, W.; Reichl, H.
Conference Paper
2006Vorhersage von magnetischen Kopplungen in Filterschaltungen
Lissner, A.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
20052,5-Dimensional System-In-Package Integration - Technology Oriented Parameter Model For Physical Design
Polityko, D.D.; Guttowski, S.; Reichl, H.
Conference Paper
2005Application of 3D-stacking technology for sensor integration and miniaturization
Amiri Jam, K.; Großer, V.; Lang, K.-D.; Reichl, H.
Conference Paper
2005Application of a microplant for the sulfonation of toluene with gaseous sulfur trioxide
Jähnisch, K.; Steinfeldt, N.; Dingerdissen, U.; Müller, A.; Horn, B.; Cominos, V.; Hessel, V.; Bazzanella, A.; Großer, V.; Hillmann, V.; Rinke, G.; Kraut, M.
Conference Paper
2005Characterization of bump arrays at RF/microwave frequencies
Ndip, I.N.; Sommer, G.; John, W.; Reichl, H.
Journal Article
2005Component design considerations for active AC EMI-filters
Schinkel, M.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Design and evaluation of feedforward active ripple filters
Zhu, M.; Perrault, D.J.; Caliskan, V.; Neugebauer, T.C.; Guttowski, S.; Kassakian, J.G.
Journal Article
2005Effects of discontinuities and technological fluctuations on the RF performance of BGA packages
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2005Efficient RF/microwave modeling of discontinuities in chip packages and boards
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2005Fluidic bus system for chemical process engineering in the laboratory and for small-scale production
Müller, A.; Cominos, V.; Hessel, V.; Horn, B.; Schürer, J.; Ziogas, A.; Jähnisch, K.; Hillmann, V.; Großer, V.; Jam, K.A.; Bazzanella, A.; Rinke, G.; Kraut, M.
Journal Article
2005Industrially compatible PCB stacking technology for miniaturized sensor systems
Lang, K.D.; Großer, V.; Amiri Jam, K.; Wolf, J.; Semionyk, P.; Schmitz, S.; Rochlitzer, R.; Prietzsch, D.; Reichl, H.
Conference Paper
2005Minimizing reflections and cross-talk in chip packages
Ndip, I.; John, W.; Reich, H.
Conference Paper
2005A novel approach for RF/microwave modeling and optimization of BGA packages
Ndip, I.; John, W.; Reichl, H.; Thiede, A.
Conference Paper
2005Packaging challenges in miniaturization
Kallmayer, C.; Niedermayer, M.; Guttowski, S.; Reichl, H.
Book Article
2005Physical design and technology parameters for vertical system-in-package integration
Polityko, D.-D.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Radio frequency characteristics of high power common-mode chokes
Weber, S.-P.; Schinkel, M.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2005Simulating Electromagnetic Interactions in High Power Density Converters
Hoene, E.; Guttowski, S.; Lissner, A.; Weber, S.; John, W.; Reichl, H.
Conference Paper
2004A 3D-package technology for fluidic applications based on match-X
Schindler-Saefkow, F.; Amiri Jam, K.; Großer, V.; Reichl, H.
Conference Paper
2004Demonstration of autarkic distributed microsystems with existing hybrid technologies
Lang, K.-D.; Grosser, V.; Rochlitzer, R.; Quaas, H.
Journal Article
2004Design aspects of self-sufficient distributed MicroSystems
Niedermayer, M.; Polityko, D.-D.; Fotheringham, G.; Guttowski, S.; John, W.
Journal Article
2004EMV-Design von Umrichtern in der Praxis
Hoene, E.; Guttowski, S.
Conference Paper
2004Methodology for Efficient Modeling of BGA Packages at RF/microwave Frequencies
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Conference Paper
2004Modeling induction machines for EMC-Analysis
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2004Modular 3D Packages in PCB Technology
Schindler-Saefkow, F.; Amiri Jam, K.; Hillmann, V.; Großer, V.
Book Article
2004Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B.
Journal Article
2004On coupling with EMI capacitors
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2004RF/microwave modeling and comparison of buried, blind and through-hole vias
Ndip, I.; John, W.; Reichl, H.
Conference Paper
2004Test und Integration von MEMS in fluidisch-elektrischen 3D-Packages aus FR4
Amiri Jam, K.; Schindler-Saefkow, F.; Großer, V.; Reichl, H.
Conference Paper
2003Bestimmung mechanischer Verschiebungsfelder an Siliziumobjekten
Grosser, V.; Helmert, J.; Bombach, C.
Patent
Fulltext
2003EMC issues in cars with electric drives
Guttowski, S.; Weber, S.; Hoene, E.; John, W.; Reichl, H.
Conference Paper
2003EMC issues of electric drives in automotive applications
Guttowski, S.; Weber, S.; Hoene, E.; John, W.; Reichl, H.
Conference Paper
2003EMI Coupling from Automotive Traction Systems
Weber, S.-P.; Hoene, E.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2003Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B.
Conference Paper
2003Match-X - A Methodology or Contruction Kit for Modular Microsystems
Großer, V.; Vogel, J.
Conference Paper
2003A novel modelling methodology of bump arrays for RF and high-speed applications
Ndip, I.; Sommer, G.; John, W.; Reichl, H.
Conference Paper
2003Packaging of micro devices for automotive applications
Jung, E.; Großer, V.; Becker, K.-F.; Koch, M.
Conference Paper
2003RF-properties of automotive traction batteries
Hoene, E.; Saikly, R.; Guttowski, S.; John, W.; Reichl, H.
Conference Paper
2003Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B.
Conference Paper
2003Verfahren zum Steuern und Kontrollieren von Prozessparametern und Anordnung hierfuer
Yacoub, T.; Kourosh, A.; Kaempfe, B.; Grosser, V.
Patent
Fulltext
2002A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G.
Conference Paper
2002Packaging for MEMS devices - Stumbling block or enabling solution?
Jung, E.; Wiemer, M.; Grosser, V.; Bock, K.; Wolf, J.
Journal Article
2001Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B.
Journal Article
2001From modular MEMS to a modular microfactory - the hybrid microfactory?
Großer, V.; Michel, B.; Schuenemann, M.; Reichl, H.
Journal Article
2001Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B.
Journal Article
2001MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B.
Journal Article
2001Overview and development trends in the field of MEMS packaging
Reichl, H.; Grosser, V.
Conference Paper
2000Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T.
Journal Article
2000Automated optical measurements under vacuum
Hillmann, V.; Großer, V.; Gentzsch, S.; Bloch, H.; Michel, B.
Conference Paper
2000Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Mechatronic solutions for modular MEMS
Amiri Jam, K.; Hillmann, V.; Braun, T.; Becker, K.-F.; Ansorge, F.; Großer, V.; Reichl, H.
Conference Paper
2000Mode shape analysis of microstructures by means of laser-optical methods
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B.
Conference Paper
2000UNIDAC: Cross correlation based deformation analysis at digitised micrographs to study material behaviour and parameters in MST
Dost, M.; Kieselstein, E.; Erb, R.; Seiler, B.; Vogel, J.; Bombach, C.; Großer, V.; Vogel, D.; Michel, B.
Conference Paper
1999Correlation analysis at grey scale patterns in an in-situ measuring module for microsystem technology
Dost, M.; Rümmler, N.; Kieselstein, E.; Erb, R.; Hillmann, V.; Großer, V.
Book Article
1999A design and production framework for modular microsystems
Großer, V.; Schünemann, M.; Michel, B.; Reichl, H.
Conference Paper
1999Optical measurement methods for MEMS applications
Großer, V.; Bombach, C.; Faust, W.; Vogel, D.; Michel, B.
Book Article
1999Reliability aspects of microassembly in microfactories
Großer, V.; Michel, B.; Reichl, H.
Book Article
1999Vibration measurement of microstructures by means of laseroptical modalanalysis
Schnitzer, R.; Rümmler, N.; Großer, V.; Michel, B.
Conference Paper
1998Design and Application of Modular Microsystems
Schünemann, M.; Bauer, G.; Schäfer, W.; Leutenbauer, R.; Grosser, V.; Zoeppig, V.
Conference Paper
1998The Design methodology of 3D-HDI
Amiri Jam, K.; Leutenbauer, R.; Großer, V.; Simsek, A.; Reichl, H.
Conference Paper
1998The development of a LTCC top-bottom-BGA (TB-BGA)
Bechtold, F.; Leutenbauer, R.; Grosser, V.; Polzer, E.K.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Schünemann, M.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998The Development of a Top-Bottom-BGA (TB-BGA)
Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.
Conference Paper
1998A highly flexible design and production framework for modularized microelectromechanical systems
Schünemann, M.; Grosser, V.; Leutenbauer, R.; Bauer, G.; Schäfer, W.; Reichl, H.
Conference Paper
1998Laseroptische Modalanalyse an Mikrobauteilen
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B.
Conference Paper
1998Modularization of Microsystems and Standardization of Interfaces
Schünemann, M.; Bauer, G.; Schäfer, W.; Leutenbauer, R.; Grosser, V.; Reichl, H.
Conference Paper
1998Reliability and testability of stacked 3D modules
Großer, V.; Sommer, J.-P.; Leutenbauer, R.; Michel, B.; Reichl, H.
Conference Paper
1998Reliability aspects of microassembly in microfactories
Michel, B.; Großer, V.; Reichl, H.
Conference Paper
1997Laseroptical deformation measurements on SAA-materials
Faust, W.; Bombach, C.; Oehmigen, M.; Großer, V.; Michel, B.
Conference Paper
1997Laseroptical in-situ-measurements for microfabrication techniques
Hillmann, V.; Bombach, C.; Großer, V.; Krüger, A.
Conference Paper
1997MicroDAC deformation measurement on microelectronic products
Vogel, D.; Bombach, C.; Großer, V.; Michel, B.
Conference Paper
1997Optical analysis of 3D-microstructures produced by additive technologies
Bombach, C.; Großer, V.; Gentzsch, S.; Engelmann, G.; Michel, B.
Conference Paper
1997Testing devices for well defined mechanical and thermal loading of microcomponents
Dost, M.; Dietrich, D.; Vogel, J.; Sommer, J.-P.; Großer, V.; Michel, B.
Conference Paper
1997Thermomechanical aspects of modular vertical integration technique (TB2GA)
Leutenbauer, R.; Großer, V.; Reichl, H.; Michel, B.
Conference Paper
1996Laseroptische Verformungsmessungen für die Aufbau- und Verbindungstechnik
Großer, V.; Bombach, C.
Book Article
1996Mikrofabrikationstechniken für modulare Mikrosysteme
Großer, V.; Reichl, H.; Hillmann, V.
Book Article
1995Laseroptische Analysen von Miniaturbauelementen
Bombach, C.; Großer, V.; Faust, W.; Michel, B.
Conference Paper
1995Laseroptische Verformungsmessungen an Mikroaufbauten
Großer, V.; Lindemann, G.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Mechanisch-thermische Versagensdetektion an Leiterplatten mittel numerischer und laseroptischer Verfahren
Großer, V.; Sommer, J.-P.; Faust, W.; Bombach, C.; Michel, B.
Conference Paper
1995Mikrofabrikationstechniken - myFab - für den Mittelstand
Großer, V.; Schäfer, W.
Conference Paper
1995Mikrofabrikationstechniken für die Mikrosytemtechnik
Großer, V.; Hillmann, V.; Reichl, H.
Conference Paper
1995Mikrofabrikationstechniken für Mikrosysteme - MyFab
Reichl, H.; Grosser, V.
Book Article
1995Optical measuring methods for integrated sensors
Großer, V.
Conference Paper
1995Thermische Verformungsuntersuchungen an Polymer-Abdeckmassen für Si-Chips - Simulation Tauchlötvorgang
Grosser, V.; Vogel, D.; Bombach, C.; Dudek, R.; Michel, B.
Book Article
1994Application of fracture machanics to micromechanics and microsystem technology
Michel, B.; Sommer, J.-P.; Großer, V.
Conference Paper
1994Experimental and numerical investigations of thermo-mechanically stressed micro-components
Michel, B.; Schubert, A.; Dudek, R.; Grosser, V.
Journal Article
1994Mikrobaugruppen mechanisch prüfen
Michel, B.; Großer, V.
Journal Article
1994Mikroskopische Deformationsmessungen mittels Laserinterferometrie
Großer, V.; Bombach, C.; Auersperg, J.; Michel, B.
Conference Paper
1993Lasermeßtechnik für Mikroaktuatoren
Großer, V.; Michel, B.; Bombach, C.
Book Article
1993Prüfen des Verformungsverhaltens mikromechanischer Bauelemente mittels Lasermeßtechniken
Michel, B.; Großer, V.
Conference Paper
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 1
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article
1993Zuverlässigkeitsbewertung hochbeanspruchter elektronischer Baugruppen. Teil 2
Michel, B.; Großer, V.; Dudek, R.; Kühnert, R.; Schubert, A.
Journal Article