| Year | Title/Author | Document Type |
|---|---|---|
| Micromaterials and nanomaterials
Michel, B. | Journal | |
| 2019 | A comparison of log Kow (n‑octanol-water partition coefficient) values for non‑ionic, anionic, cationic and amphoteric surfactants determined using predictions and experimental methods
Hodges, Geoff; Eadsforth, Charles; Bossuyt, Bart; Bouvy, Alain; Enrici, Marie‑Helene; Geurts, Marc; Kotthoff, Matthias; Michie, Eleanor; Miller, Dennis; Müller, Josef; Oetter, Gunter; Roberts, Jayne; Schowanek, Diederik; Sun, Ping; Venzmer, Joachim | Journal Article Fulltext |
| 2019 | Correlation of structural and optical properties using virtual materials analysis
Badorreck, H.; Steinecke, M.; Jensen, L.; Ristau, D.; Jupé, M.; Müller, J.; Tonneau, R.; Moskovkin, P.; Lucas, P.; Pflug, A.; Grinevičiūtė, L.; Selskis, A.; Tolenis, T. | Journal Article Fulltext |
| 2019 | Electrocaloric temperature change in ferroelectric Si-doped hafnium oxide (HfO2) thin films: Presentation held at 37th Spring Meeting of the European Materials Research Society, E-MRS 2019, 27-31 May 2019, Nizza
Mart, C.; Kämpfe, T.; Pätzold, B.; Rudolph, M.; Czernohorsky, M.; Müller, J.; Weinreich, W. | Presentation |
| 2019 | Investigation of the temperature dependence of lithium plating onset conditions in commercial Li-ion batteries
Angeles Cabañero, Maria; Altmann, Johannes; Gold, Lukas; Boaretto, Nicola; Müller, Jana; Hein, Simon; Zausch, Jochen; Kallo, Josef; Latz, Arnulf | Journal Article |
| 2019 | The role of standards in the policy debate on the EU-US trade agreement
Blind, Knut; Müller, Jo-Ann | Journal Article |
| 2018 | 14nm Ferroelectric FinFET technology with steep subthreshold slope for ultra low power applications
Krivokapic, Z.; Rana, U.; Galatage, R.; Razavieh, A.; Aziz, A.; Liu, J.; Shi, J.; Kim, H.J.; Sporer, R.; Serrao, C.; Busquet, A.; Polakowski, P.; Müller, J.; Kleemeier, W.; Jacob, A.; Brown, D.; Knorr, A.; Carter, R.; Banna, S. | Conference Paper |
| 2018 | Barrier breakdown mechanism in nano-scale perpendicular magnetic tunnel junctions with ultrathin MgO barrier
Lv, Hua; Leitao, Diana C.; Hou, Zhiwei; Freitas, Paulo P.; Cardoso, Susana; Kämpfe, Thomas; Müller, Johannes; Langer, Juergen; Wrona, Jerzy | Journal Article Fulltext |
| 2018 | Datenschutz stärken, Innovationen ermöglichen. Policy paper: Wie man den Koalitionsvertrag ausgestalten sollte
Roßnagel, Alexander; Bile, Tamer; Geminn, Christian; Grigorjew, Olga; Johannes, Paul C.; Karaboga, Murat; Krämer, Nicole; Maier, Natalie; Martin, Nicholas; Müller, Johannes; Nebel, Maxi; Friedewald, Michael; Bremert, Benjamin | Report Fulltext |
| 2018 | Design of a photogrammetric measurement system for displacement and deformation on machine tools
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen | Conference Paper |
| 2018 | Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D. | Conference Paper |
| 2018 | Direct determination of diffusion coefficients in commercial Li-ion batteries
Cabañero, Maria Angeles; Boaretto, Nicola; Röder, Manuel; Müller, Jana; Kallo, Josef; Latz, Arnulf | Journal Article |
| 2018 | A FeFET based super-low-power ultra-fast embedded NVM technology for 22nm FDSOI and beyond
Dünkel, S.; Trentzsch, M.; Richter, R.; Moll, P.; Fuchs, C.; Gehring, O.; Majer, M.; Wittek, S.; Müller, B.; Melde, T.; Mulaosmanovic, H.; Slesazeck, S.; Müller, S.; Ocker, J.; Noack, M.; Löhr, D.-A.; Polakowski, P.; Müller, J.; Mikolajick, T.; Höntschel, J.; Rice, B.; Pellerin, J.; Beyer, S. | Conference Paper |
| 2018 | High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J. | Journal Article |
| 2018 | Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O. | Journal Article |
| 2018 | Ontology-based microservices architecture for industrial assistant systems
Singer, Adrian; Wenzel, Ken; Müller, Jan; Langer, Tino; Putz, Matthias | Conference Paper |
| 2018 | Silicon doped hafnium oxide (HSO) and hafnium zirconium oxide (HZO) based FeFET: A material relation to device physics
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Thrun, X.; Hanisch, N.; Steinke, P.; Calvo, J.; Müller, J. | Journal Article |
| 2018 | SmartStamp - ein Digitaler Zwilling für das Condition Monitoring an Pressen
Praedicow, Michael; Müller, Jan; Fischer, Jochen; Langer, Tino | Journal Article |
| 2018 | Thermography on machine tools
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen | Conference Paper |
| 2018 | Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B. | Conference Paper |
| 2018 | Tuning parameters and their impact on ferroelectric hafnium oxide: Presentation held at Materials Research Society Spring Meeting and Exhibit, 2-6 April 2018, Phoenix, Arizona, USA
Polakowski, Patrick; Büttner, Teresa; Ali, Tarek Nadi Ismail; Riedel, Stefan; Kämpfe, Thomas; Seidel, Konrad; Müller, Johannes; Pätzold, Björn | Presentation |
| 2017 | Capacitance maximization of ultra-thin Si-capacitors by atomic layer deposition of anti-ferroelectric HfO2 in high aspect ratio structures: Presentation held at 17th International Conference on Atomic Layer Deposition, ALD 2017, 15th - 18th July 2017, Denver, Colorado, USA
Riedel, Stefan; Weinreich, Wenke; Mart, Clemens; Müller, Johannes | Presentation |
| 2017 | Combined 15N-Labeling and TandemMOAC Quantifies Phosphorylation of MAP Kinase Substrates Downstream of MKK7 in Arabidopsis
Huck, N.V.; Leissing, F.; Majovsky, P.; Buntru, M.; Aretz, C.; Flecken, M.; Müller, J.P.J.; Vogel, S.; Schillberg, S.; Hoehenwarter, W.; Conrath, U.; Beckers, G.J.M. | Journal Article Fulltext |
| 2017 | A conceptual evaluation framework for promoting gender equality in research and innovation: Toolbox I - a synthesis report; EFFORTI - deliverable 3.3
Kalpazidou Schmidt, Evanthia; Bührer, Susanne; Schraudner, Martina; Reidl, Sybille; Müller, Jörg; Palmen, Rachel; Haase, Sanne; Graversen, Ebbe Krogh; Holzinger, Florian; Striebing, Clemens; Groó, Dora; Klein, Saskia; Rigler, Dorottya; Hog Utoft, Ea | Report Fulltext |
| 2017 | Drivers of companies' participation in supranational standardization
Blind, Knut; Müller, Jo-Ann | Conference Paper |
| 2017 | Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter | Conference Paper |
| 2017 | Ergebnisse der fünften Befragungsrunde des Deutschen Normungspanels
Blind, Knut; Müller, Jo-Ann | Journal Article |
| 2017 | Experimentelle Untersuchung des Beleuchtungseinflusses auf die Güte von Ellipsenmessungen
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen | Conference Paper |
| 2017 | Ferroelectric HfO2 thin film testing and whole wafer mapping with non-contact corona-Kelvin metrology
Marinskiy, D.; Polakowski, P.; Edelman, P.; Wilson, M.; Lagowski, J.; Metzger, J.; Binder, R.; Müller, J. | Journal Article |
| 2017 | Funktionsprinzip der messtechnisch basierten Korrektur thermischer Verlagerungen am Versuchsträger MAX
Riedel, Mirko; Müller, Jens; Klatte, Michel; Tzanetos, Filippos | Conference Paper |
| 2017 | Gewitter im Chip - Resistive Speicher für low-power Anwendungen
Seidel, Konrad; Riedel, Stefan; Kalishettyhalli Ma, Mamathamba; Polakowski, Patrick; Müller, Johannes | Conference Paper |
| 2017 | Hexabromocyclododecane diastereomers in fish and suspended particulate matter from selected European waters-trend monitoring and environmental quality standard compliance
Rüdel, Heinz; Müller, Josef; Nowak, Jens; Ricking, Mathias; Klein, Roland; Kotthoff, Matthias | Journal Article Fulltext |
| 2017 | Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O. | Journal Article |
| 2017 | Novel ferroelectric FET based synapse for neuromorphic systems
Mulaosmanovic, H.; Ocker, J.; Müller, S.; Noack, M.; Müller, J.; Polakowski, P.; Mikolajick, T.; Slesazeck, S. | Conference Paper |
| 2017 | Photogrammetric 6DOF measurement on machine tools: Poster presented at 2nd 3D Metrology Conference, 3DMC 2017, Aachen, October 9-12, 2017
Riedel, Mirko; Deutsch, Jessica; Ihlenfeldt, Steffen; Müller, Jens | Poster Fulltext |
| 2017 | Probing lithium-ion batteries' state-of-charge using ultrasonic transmission - concept and laboratory testing
Gold, Lukas; Bach, Tobias; Virsik, Wolfgang; Schmitt, Angelika; Müller, Jana; Staab, Torsten E.M.; Sextl, Gerhard | Journal Article |
| 2017 | Properties of ALD ferroelectric Si-doped HfO2 characterized with noncontact Corona-Kelvin metrology: Presentation held at 17th International Conference on Atomic Layer Deposition, ALD 2017, 15th - 18th July 2017, Denver, Colorado, USA
Polakowski, Patrick; Müller, Johannes; Marinskiy, Dmitriy; Findlay, Andrew; Edelman, Piotr; Wilson, Marshall; Lagowski, Jacek; Metzger, Joachim; Binder, Robert | Presentation |
| 2017 | PVD and ALD process development of advanced oxide-based RRAM-stacks
Kalishetthyhalli Mahadevaiah, Mamathamba; Müller, Johannes (Gutachter); Lakner, Hubert (Gutachter); Fischer, Wolf-Joachim (Gutachter) | Master Thesis |
| 2017 | Ressourceneffizienz durch Industrie 4.0: Potenziale für KMU des verarbeitenden Gewerbes
Schebek, Liselotte; Kannengießer, Jan; Campitelli, Alessio; Fischer, Julia; Abele, Eberhard; Bauerdick, Christoph; Anderl, Reiner; Haag, Sebastian; Sauer, Alexander; Mandel, Jörg; Lucke, Dominik; Bogdanov, Ivan; Nufer, Anne-Kathrin; Steinhilper, Rolf; Böhner, Johannes; Lothes, Gerald; Schock, Christoph; Zühlke, Detlef; Plociennik, Christiane; Bergweiler, Simon; Schlegel, Andreas (Fachl. Bearb.); Kirmes, Stefan (Fachl. Bearb.); Oberender, Christof (Fachl. Bearb.); Vogt, Martin (Fachl. Bearb.) | Study Fulltext |
| 2017 | Silicon-doped hafnium oxide anti-ferroelectric thin films for energy storage
Ali, F.; Liu, X.; Zhou, D.; Yang, X.; Xu, J.; Schenk, T.; Müller, J.; Schroeder, U.; Cao, F.; Dong, X. | Journal Article |
| 2017 | Switching kinetics in nanoscale hafnium oxide based ferroelectric field-effect transistors
Mulaosmanovic, Halid; Ocker, Johannes; Müller, Stefan; Schroeder, Uwe; Müller, Johannes; Polakowski, Patrick; Flachowsky, Stefan; Bentum, Ralf van; Mikolajick, Thomas; Slesazeck, Stefan | Journal Article |
| 2017 | Ultrasonically tinned PVD AL rear contacts on high-efficiency crystalline silicon solar cells for module integration
Nagel, H.; Eberlein, D.; Hoffmann, S.; Graf, M.; Steinhauser, B.; Feldmann, F.; Kraft, A.; Eitner, U.; Glatthaar, M.; Hermle, M.; Glunz, S.W.; Haverkamp, H.; Fischer, T.; Hain, A.; Wohlfart, P.; Mertens, V.; Müller, J.; Buck, T. | Conference Paper Fulltext |
| 2016 | A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs
Trentzsch, M.; Flachowsky, S.; Richter, R.; Paul, J.; Reimer, B.; Utess, D.; Jansen, S.; Mulaosmanovic, H.; Müller, S.; Slesazeck, S.; Ocker, J.; Noack, M.; Müller, J.; Polakowski, P.; Schreiter, J.; Beyer, S.; Mikolajick, T.; Rice, B. | Conference Paper |
| 2016 | Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2016 | Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P. | Conference Paper Fulltext |
| 2016 | Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2016 | Charge-trapping phenomena in HfO2-based FeFET-type nonvolatile memories
Yurchuk, Ekaterina; Müller, Johannes; Müller, Stefan; Paul, Jan; Pesic, Milan; Benthum, Ralf van; Schroeder, Uwe; Mikolajick, Thomas | Journal Article |
| 2016 | Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Correlation between the macroscopic ferroelectric material properties of Si:HfO2 and the statistics of 28nm FeFET memory arrays
Mueller, S.; Slesazeck, S.; Henker, S.; Flachowsky, S.; Polakowski, P.; Paul, J.; Smith, E.; Müller, J.; Mikolajick, T. | Journal Article |
| 2016 | Development and electrical characterization of a metal-ferroelectric-insulator semiconductor FET test structure
Ali, Tarek; Müller, Johannes (Betreuer); Lakner, Hubert (Betreuer); Heyns, Marc | Master Thesis Fulltext |
| 2016 | Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D. | Conference Paper |
| 2016 | Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2016 | High endurance strategies for hafnium oxide based ferroelectric field effect transistor
Müller, J.; Polakowski, P.; Müller, S.; Mulaosmanovic, H.; Ocker, J.; Mikolajick, T.; Slesazeck, S.; Flachowsky, S.; Trentzsch, T. | Conference Paper Fulltext |
| 2016 | HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen | Conference Paper |
| 2016 | Impact of field cycling on HfO2 based non-volatile memory devices
Schroeder, U.; Pesic, M.; Schenk, T.; Mulaosmanovic, H.; Slesazeck, S.; Ocker, J.; Richter, C.; Yurchuk, E.; Khullar, K.; Müller, J.; Polakowski, P.; Grimley, E.D.; LeBeau, J.M.; Flachowsky, S.; Jansen, S.; Kolodinski, S.; Bentum, R. van; Kersch, A.; Künneth, C.; Mikolajick, T. | Conference Paper |
| 2016 | Integration of high-frequency M-type hexagonal ferrite inductors in LTCC multilayer modules
Bierlich, Silvia; Reimann, Timmy; Barth, Stefan; Capraro, Beate; Bartsch, Heike; Müller, Jens; Töpfer, Jörg | Journal Article |
| 2016 | Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2016 | Möglichkeiten zur Reduzierung der Schwingungseinleitung an Lineardirektantrieben: Vortrag gehalten bei der VDI-Konferenz Schwingungen in Werkzeug- und Verarbeitungsmaschinen, 10. und 11. Mai 2016, Darmstadt
Drossel, Welf-Guntram; Pagel, Kenny; Junker, Tom; Großmann, Knut; Müller, Jens | Presentation Fulltext |
| 2016 | Nonlinear aging of cylindrical lithium-ion cells linked to heterogeneous compression
Bach, Tobias C.; Schuster, Simon F.; Fleder, Elena; Müller, Jana; Brand, Martin J.; Lorrmann, Henning; Jossen, Andreas; Sextl, Gerhard | Journal Article Fulltext |
| 2016 | Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K. | Conference Paper |
| 2016 | Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D. | Journal Article |
| 2016 | A review of green electronics research trends
Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D. | Conference Paper |
| 2016 | Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2016 | Soziale Teilhabe durch technikgestützte Kommunikation: Projekt SONIA
Selke, Stefan; Biniok, Peter; Kunze, Christophe; Müller, Jennifer; Renyi, Madeleine; Rombach, Elena; Menke, Iris; Gaugisch, Petra; Risch, Beate; Strunck, Stefan; Bratan, Tanja; Heyen, Nils; Kimpeler, Simone; Eschweiler, Gerhard W.; Kramer, Martin; Niebler, Raphael; Oedekoven, Christiane; Becker, Dietmar; Böhm, Luisa; Forstner, Johanna; Heusel, Christof; Brüstle, Karoline; Dinter, Jessica ; Hochschule Furtwangen; Fraunhofer-Institut für Arbeitswirtschaft und Organisation -IAO-, Stuttgart; Fraunhofer-Institut für System- und Innovationsforschung -ISI-, Karlsruhe; Geriatrisches Zentrum, Tübingen; Entwicklungszentrum Gut altwerden; Paul-Wilhelm-von-Keppler-Stiftung; Baden-Württemberg, Ministerium für Arbeit, Gesundheit und Sozialordnung, Stuttgart | Report Fulltext |
| 2016 | Status of ferroelectric HfO2 based 1T FeFET memories: Presentation held at Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Applications of Polar Dielectrics & Workshop on Piezoresponse Force Microscopy (ISAF/ECAPD/PFM), August 21-25, 2016, Darmstadt, Germany
Mikolajick, T.; Schroeder, U.; Slesazeck, S.; Müller, S.; Schenk, T.; Müller, J. | Presentation |
| 2016 | Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D. | Conference Paper |
| 2016 | A study of documentation in agile software projects
Voigt, Stefan; Garrel, Jörg von; Müller, Julia; Wirth, Dominik | Conference Paper |
| 2016 | A thermally robust and thickness independent ferroelectric phase in laminated hafnium zirconium oxide
Riedel, S.; Polakowski, P.; Müller, J. | Journal Article |
| 2016 | Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina | Study Fulltext |
| 2015 | Analytische Untersuchung zur Ressourceneffizienz im verarbeitenden Gewerbe: Studie, April 2015
Dückert, Elisabeth; Schäfer, Lorenz; Schneider, Ralph; Wahren, Sylvia; Oberender, Christof (Fachl. Bearb.); Weber, Manuel (Fachl. Bearb.) ; Fraunhofer-Institut für Produktionstechnik und Automatisierung -IPA-, Stuttgart; VDI Zentrum Ressourceneffizienz GmbH; Baden-Württemberg, Ministerium für Umwelt, Klima und Energiewirtschaft; Hessisches Ministerium für Wirtschaft, Energie, Verkehr und Landesentwicklung | Study Fulltext |
| 2015 | Aquatische Optische Technologien in Deutschland
Schulz, Jan; Möller, Klas Ove; Bracher, Astrid; Hieronymi, Martin; Cisewski, Boris; Zielinski, Olver; Voss, Daniela; Gutzeit, Enrico; Dolereit, Tim; Niedzwiedz, Gern; Kohlberg, Gesche; Schories, Dirk; Kiko, Rainer; Körtzinger, Arne; Falldorf, Claas; Fischer, Philipp; Nowald, Nicolas; Beisiegel, Kolja; Martinez-Arbizu, Pedro; Rüssmeier, Nick; Röttgers, Rüdiger; Büdenbender, Jan; Jordt-Sedlazeck, Anne; Koch, Reinhard; Riebesell, Ulf; Hvitfeldt Iversen, Morten; Köser, Kevin; Kwasnitschka, Tom; Wellhausen, Jens; Thoma, Christoph; Barz, Christina; Rohde, Sven; Nattkemper, Tim W.; Schoening, Timm; Peeters, Frank; Hofmann, Hilmar; Busch, Julia A.; Hircher, Hans-Jürgen; Niehoff, Barbara; Hildebrandt, Nicole; Stohr, Erik; Winter, Christian; Herbst, Gabriel; Konrad, Christian; Schmidt, Mark; Linke, Peter; Brey, Thomas; Bange, Hermann W.; Nolle, Lars; Krägefsky, Sören; Gröger, Joachim; Sauter, Eberhard; Schulz, Miriam; Müller, Jens; Rehder, Gregor; Stepputtis, Daniel; Beszteri, Bank; Kloster, Michael; Kauer, G | Report Fulltext |
| 2015 | Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D. | Journal Article |
| 2015 | Deutsches Normungspanel. Normungsforschung, -politik und -förderung. Indikatorenbericht 2015
Blind, Knut; Müller, Jo-Ann | Report Fulltext |
| 2015 | Effects of vibrations and shocks in electric vehicles on Li-ion batteries
Brand, M.J.; Schuster, S.F.; Bach, T.; Fleder, E.; Stelz, M.; Gläser, S.; Müller, J.; Sextl, G.; Jossen, A. | Conference Paper |
| 2015 | Effects of vibrations and shocks on lithium-ion cells
Brand, Martin J.; Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Stelz, Manfred; Gläser, Simon; Müller, Jana; Sextl, Gerhard; Jossen, Andreas | Journal Article |
| 2015 | Electric field and temperature scaling of polarization reversal in silicon doped hafnium oxide ferroelectric thin films
Zhou, D.Y.; Guan, Y.; Vopson, M.M.; Xu, J.; Liang, H.L.; Cao, F.; Dong, X.L.; Mueller, J.; Schenk, T.; Schroeder, U. | Journal Article |
| 2015 | Evidence of single domain switching in hafnium oxide based FeFETs: Enabler for multi-level FeFET memory cells
Mulaosmanovic, H.; Slesazeck, S.; Ocker, J.; Pesic, M.; Müller, S.; Flachowsky, S.; Müller, J.; Polakowski, J.; Paul, J.; Jansen, S.; Kolodinski, S.; Richter, C.; Piontek, S.; Schenk, T.; Kersch, A.; Künneth, C.; Bentum, R. van; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2015 | Ferroelectric hafnium oxide based materials and devices: Assessment of current status and future prospects
Müller, J.; Polakowski, P.; Mueller, S.; Mikolajick, T. | Journal Article |
| 2015 | Ferroelectricity and antiferroelectricity of doped thin HfO2-based films
Park, M.H.; Lee, Y.H.; Kim, H.J.; Kim, Y.J.; Moon, T.; Do Kim, K.; Müller, J.; Kersch, A.; Schroeder, U.; Mikolajick, T.; Hwang, C.S. | Journal Article |
| 2015 | Ferroelectricity in undoped hafnium oxide
Polakowski, P.; Müller, J. | Journal Article |
| 2015 | Ferroelektrizität in Hafniumdioxid und deren Anwendung in nicht-flüchtigen Halbleiterspeichern
Müller, Johannes | Dissertation Fulltext |
| 2015 | A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2015 | Herausforderungen im Handel mit China und den USA stehen in starkem Kontrast: Bereich Politik und Normung
Blind, Knut; Müller, Jo-Ann | Journal Article |
| 2015 | Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D. | Conference Paper |
| 2015 | Impulsentkopplung von Lineardirektantriebsachsen. Praxistaugliche Gestaltung impulsentkoppelter Lineardirektantriebsachsen Teil 2
Müller, J.; Pagel, Kenny; Junker, Tom; Großmann, Knut; Drossel, Welf-Guntram | Journal Article |
| 2015 | Integration challenges of ferroelectric hafnium oxide based embedded memory (Invited)
Müller, Johannes; Polakowski, Patrick; Paul, Jan; Riedel, Stefan; Hoffmann, Raik; Drescher, Maximilian; Slesazeck, Stefan; Müller, Stefan; Mulaosmanovic, Halid; Schröder, Uwe; Mikolajick, Thomas; Flachowsky, Stefan; Erben, Elke; Smith, Elliot; Binder, Robert; Triyoso, Dina H.; Metzger, Joachim; Kolodinski, Sabine | Conference Paper |
| 2015 | Integration of CaCu3Ti4O12 capacitors into LTCC multilayer modules
Löhnert, Romy; Capraro, Beate; Barth, Stefan; Bartsch, Heike; Müller, Jens; Töpfer, Jörg | Journal Article |
| 2015 | Investigations on the cyclic aging behavior of Li-ion cells: Reasons for an abrupt drop of capacity
Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Müller, Jana; Sextl, Gerhard; Jossen, Andreas | Conference Paper |
| 2015 | Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O. | Conference Paper |
| 2015 | Manufacturing 100-µm-thick silicon solar cells with efficiencies greater than 20% in a pilot production line
Terheiden, B.; Ballmann, T.; Horbelt, R.; Schiele, Y.; Seren, S.; Ebser, J.; Hahn, G.; Mertens, V.; Koentopp, M.B.; Scherff, M.; Müller, J.W.; Holman, Z.C.; Descoeudres, A.; Wolf, S. de; Nicolas, S.M. de; Geissbuehler, J.; Ballif, C.; Weber, B.; Saint-Cast, P.; Rauer, M.; Schmiga, C.; Glunz, S.W.; Morrison, D.J.; Devenport, S.; Antonelli, D.; Busto, C.; Grasso, F.; Ferrazza, F.; Tonelli, E.; Oswald, W. | Journal Article |
| 2015 | Methodology guidance - energy profiles and carbon footprint data for passive components and connectors: Version 1.2
Schischke, Karsten; Proske, Marina; Schulz, Gerd; Husemann, Jürgen; Trenner, Torger; Sonnenberg, Thea; Huck, Walter; Kelm, Klaus; Tempel, Norbert; Wunderlich, Peter; Dietrich, Marcus | Report Fulltext |
| 2015 | Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D. | Journal Article |
| 2015 | Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D. | Journal Article |
| 2015 | New approach for measurement & simulation in sheet metal forming: Presentation held at New Aspects in Industrial 3D Metrology, Inspection and Testing, GOM 3D Metrology Conference, September 21st-24th 2015, Braunschweig
Ackert, Patrick; Schwarz, Christian; Müller, Johannes; Landgrebe, Dirk | Presentation Fulltext |
| 2015 | Next-generation ferroelectric memories based on FE-HfO2
Müller, S.; Slesazeck, S.; Mikolajick, T.; Müller, Johannes; Polakowski, Patrick; Flachowsky, S. | Conference Paper |
| 2015 | Nonlinear aging characteristics of lithium-ion cells under different operational conditions
Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Müller, Jana; Brand, Martin; Sextl, Gerhard; Jossen, Andreas | Journal Article |
| 2015 | Nonlinear aging of lithium-ion cells linked to pressure differences: Degradation mechanisms and remedies
Bach, Tobias; Schuster, Simon; Fleder, Elena; Müller, Jana; Jossen, Andreas; Sextl, Gerhard | Abstract |
| 2015 | Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F. | Journal Article Fulltext |
| 2015 | Perfluoroalkyl and polyfluoroalkyl substances in consumer products
Kotthoff, Matthias; Müller, Josef; Jürling, Heinrich; Schlummer, Martin; Fiedler, Dominik | Journal Article Fulltext |
| 2015 | Prototyping new concepts beyond 4G - The Fraunhofer Open5GCore
Magedanz, Thomas; Carella, Giuseppe; Corici, Marius; Mueller, Julius; Weber, Andreas | Journal Article |
| 2015 | Radio frequency microelectromechanical system-platform based on silicon-ceramic composite substrates
Fischer, Michael S.; Gropp, S.; Nowak, Jacek; Capraro, Beate; Sommer, Ralf; Hoffmann, Martin J.F.; Müller, J. | Journal Article |
| 2015 | The Rayleigh law in silicon doped hafnium oxide ferroelectric thin films
Guan, Yan; Zhou, Dayu; Xu, Jin; Liu, Xiaohua; Cao, Fei; Dong, Xianlin; Müller, Johannes; Schenk, Tony; Schroeder, Uwe | Journal Article |
| 2015 | Recycling von Komponenten und strategischen Metallen aus elektrischen Fahrantrieben. Kennwort: MORE (Motor Recycling): Abschlussbericht zum Verbundvorhaben. Berichtszeitraum: Gesamtlaufzeit 01.05.2011 bis 31.08.2014
Bast, Ulrich; Blank, Rolf; Buchert, Matthias; Elwert, Tobias; Finsterwalder, Florian; Hörnig, Gabriele; Klier, Tobias; Langkau, Sabine; Marscheider-Weidemann, Frank; Müller, J.-O.; Thürigen, Christian; Treffer, Frank; Walter, T. | Report Fulltext |
| 2015 | Scaling and optimization of ferroelectric hafnium oxide for memory applications and beyond: Presentation held at International Conference on Solid State Devices and Materials; Sapporo, Japan, 27-30 September 2015
Müller, Johannes; Riedel, Stefan; Polakowski, Patrick | Presentation |
| 2015 | Verfahren zum Bestimmen einer Bondverbindung in einer Bauteilanordnung und Prüfvorrichtung
Middendorf, Andreas; Nowak, Torsten; Janzen, Sergei | Patent Fulltext |
| 2015 | Vergleich der zweiten und dritten Befragungswelle des Deutschen Normungspanels (DNP) - Auch kleine Unternehmen und Dienstleister zeigen erhöhtes Normungsengagement auf internationaler Ebene
Blind, Knut; Müller, Jo-Ann | Journal Article |
| 2014 | Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2014 | Ansätze zur stofflichen Verwertung von Tablets aus Sicht des Produktdesigns
Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Dimitrova, Gergana; Genz, Paul; Lang, Klaus-Dieter | Book Article Fulltext |
| 2014 | Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Aufnahme von perfluorierten Carbon- und Sulfonsäuren durch Pflanzen unter Feldbedingungen
Felizeter, S.; Voogt, P. de; Jürling, H.; Müller, J.; Kotthoff, M. | Abstract |
| 2014 | Bedeutung und Ausmaß der Werknormung: Ergebnisse aus dem Deutschen Normungspanel - Bereich Innovation - Ergebnisse der zweiten Befragung
Blind, Knut; Grossmann, Anne-Marie; Müller, Jo-Ann; Rauber, Julius | Journal Article |
| 2014 | Combined Loads and Mechanisms: Presentation held at the ECPE Workshop: Intelligent Reliability Testing; Nürnberg, 02.12. - 03.12.14
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter | Presentation Fulltext |
| 2014 | A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf | Conference Paper |
| 2014 | Design and implementation of a carrier grade software defined telecommunication switch and controller
Mueller, J.; Chen, Y.; Reichel, B.; Vlad, V.; Magedanz, T. | Conference Paper |
| 2014 | Deutsches Normungspanel. Indikatorenbericht 2014: Normungsforschung, -politik und -förderung
Blind, Knut; Großmann, Anne-Marie; Müller, Jo-Ann; Rauber, Julius | Report Fulltext |
| 2014 | Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version July 2014
Schischke, Karsten; Stobbe, Lutz; Dimitrova, Gergana; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F. | Report Fulltext |
| 2014 | Doped hafnium oxide - an enabler for ferroelectric field effect transistors
Mikolajick, T.; Müller, S.; Schenk, T.; Yurchuk, E.; Slesazeck, S.; Schröder, U.; Flachowsky, S.; Bentum, R. van; Kolodinski, S.; Polakowski, P.; Müller, J. | Conference Paper |
| 2014 | Drahtlose Tiefendiagnose: Energieautarke Funksensorik für Condition-Monitoring-Anwendungen
Niedermayer, M.; Hoherz, C.; Reinhardt, D.; Scholtz, H.; Benecke, S.; Middendorf, A. | Journal Article |
| 2014 | Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects
Krüger, Michael; Trampert, Stefan; Middendorf, Andreas; Schmitz, Stefan; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2014 | Establishing ecoreliability of electronic devices in manufacturing environments
Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2014 | Ferroelectric and antiferroelectric properties of Si-doped HfO2 thin films
Zhou, D.Y.; Xu, J.; Müller, J.; Schröder, U. | Journal Article |
| 2014 | Ferroelectric deep trench capacitors based on Al:HfO2 for 3D nonvolatile memory applications
Polakowski, Patrick; Riedel, Stefan; Weinreich, Wenke; Rudolf, M.; Sundqvist, Jonas; Seidel, Konrad; Müller, Johannes | Conference Paper |
| 2014 | Ferroelectric hafnium oxide based materials and devices: Assessment of current status and future prospects
Müller, Johannes; Polakowski, Patrick; Müller, Stefan; Mikolajick, Thomas | Conference Paper Fulltext |
| 2014 | Ferroelectric hafnium oxide: A game changer to FRAM?
Müller, J.; Polakowski, P.; Riedel, S.; Mueller, S.; Yurchuk, E.; Mikolajick, T. | Conference Paper |
| 2014 | Ferroelectricity in Si-doped HfO2 revealed: A binary lead-free ferroelectric
Martin, D.; Müller, J.; Schenk, T.; Arruda, T.M.; Kumar, A.; Strelcov, E.; Yurchuk, E.; Müller, S.; Pohl, D.; Schröder, U.; Kalinin, S.V.; Mikolajick, T. | Journal Article |
| 2014 | Flexible cross layer optimization for fixed and mobile broadband telecommunication networks and beyond
Müller, Julius; Magedanz, Thomas (Gutachter); Küpper, Axel (Gutachter); Kellerer, Wolfgang (Gutachter) | Dissertation Fulltext |
| 2014 | Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O. | Conference Paper |
| 2014 | Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process Control
Middendorf, Andreas; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Impact of different dopants on the switching properties of ferroelectric hafniumoxide
Schroeder, U.; Yurchuk, E.; Müller, J.; Martin, D.; Schenk, T.; Polakowski, P.; Adelmann, C.; Popovici, M.I.; Kalinin, S.V.; Mikolajick, T. | Journal Article |
| 2014 | Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Impact of scaling on the performance of HfO2-based ferroelectric field effect transistors
Yurchuk, E.; Müller, J.; Paul, J.; Schlösser, T.; Martin, D.; Hoffmann, R.; Müller, S.; Slesazeck, S.; Schroeder, U.; Boschke, R.; Bentum, R. van; Mikolajick, T. | Journal Article |
| 2014 | Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen
Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Interannual variation in land-use intensity enhances grassland multidiversity
Allan, Eric; Bossdorf, Oliver; Dormann, Carsten F.; Prati, Daniel; Gossner, Martin M.; Tscharntke, Teja; Blüthgen, Nico; Bellach, Michaela; Birkhofer, Klaus; Boch, Steffen; Böhm, Stefan; Börschig, Carmen; Chatzinotas, Antonis; Christ, Sabina; Daniel, Rolf; Diekötter, Tim; Fischer, Christiane; Friedl, Thomas; Glaser, Karin; Hallmann, Christine; Hodac, Ladislav; Hölzel, Norbert; Jung, Kirsten; Klein, Alexandra Maria; Klaus, Valentin H.; Kleinebecker, Till; Krauss, Jochen; Lange, Markus; Morris, E. Kathryn; Müller, Jörg; Nacke, Heiko; Pašalic, Esther; Rillig, Matthias C.; Rothenwöhrer, Christoph; Schall, Peter; Scherber, Christoph; Schulze, Waltraud; Socher, Stephanie A.; Steckel, Juliane; Steffan-Dewenter, Ingolf; Türke, Manfred; Weiner, Christiane N.; Werner, Michael; Westphal, Catrin; Wolters, Volkmar; Wubet, Tesfaye; Gockel, Sonja; Gorke, Martin; Hemp, Andreas; Renner, Swen C.; Schöning, Ingo; Pfeiffer, Simone; König-Ries, Birgitta; Buscot, François; Linsenmair, Karl Eduard; Schulze, Ernst-Detle | Journal Article |
| 2014 | Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter | Journal Article |
| 2014 | LCA to go for PV systems: Analysis tool for optimized PV design and green marketing
Arranz, Pol; Anzizu, Maria; Vallvé, Xavier; Schischke, Karsten; Helmy, Mohamed; Alonso, Juan Carlos; Rodrigo, Julio | Conference Paper Fulltext |
| 2014 | Life Cycle Assessment as a practical tool in the eco-design and promotion of eco-innovative electronics - the case of the IAMECO computers
Ospina, Jose Luis; Maher, Paul; Schischke, Karsten | Conference Paper Fulltext |
| 2014 | Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors
Hahn, Daniel; Straube, Stefan; Abelein, Ulrich; Middendorf, Andreas; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2014 | Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D. | Conference Paper |
| 2014 | Monitoring as a service for cloud environments
Mueller, Julius; Al-Hazmi, Yahya; Magedanz, Thomas; Palma, David; Landi, Giada; Soares, João; Parreira, Bruno; Metsch, Thijs; Gray, Peter; Georgiev, Alexander; Simões, Paulo | Conference Paper |
| 2014 | Ökodesign von Unterhaltungselektronik und IKT - Beispiele und Denkanstöße: Vortrag gehalten bei der ETV Donnerstagslektion, Berlin, 8.5.2014
Schischke, Karsten | Presentation Fulltext |
| 2014 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Journal Article |
| 2014 | Origin of the endurance degradation in the novel HfO2-based 1T ferroelectric non-volatile memories
Yurchuk, E.; Mueller, S.; Martin, D.; Slesazeck, S.; Schroeder, U.; Mikolajick, T.; Müller, J.; Paul, J.; Hoffmann, R.; Sundqvist, J.; Schlösser, T.; Boschke, R.; Bentum, R. van; Trentzsch, M. | Conference Paper |
| 2014 | Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg | Conference Paper |
| 2014 | Reliability improvements in electronic systems by combining condition monitoring approaches
Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Conference Paper Fulltext |
| 2014 | Role of the dielectric for the charging dynamics of the dielectric/barrier interface in AlGaN/GaN based metal-insulator-semiconductor structures under forward gate bias stress
Lagger, Peter; Steinschifter, P.; Reiner, M.; Stadtmüller, M.; Denifl, G.; Naumann, Andreas; Müller, Johannes; Wilde, Lutz; Sundqvist, Jonas; Pogany, D. | Journal Article |
| 2014 | Sustainable life cycle engineering of an integrated desktop PC: A small to medium enterprise perspective
Fitzpatrick, C.; Hickey, S.; Schischke, K.; Maher, P. | Journal Article |
| 2014 | Tablet PCs through the lens of environment - design trends and impacts on the environmental performance
Dimitrova, Gergana; Nissen, Nils; Stobbe, Lutz; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2014 | Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2014 | Towards Zero Waste in Industrial Networks: A case study of the D4R laptop
Hickey, Stewart; Fitzpatrick, Colin; Maher, Paul; Ospina, Jose; Schischke, Karsten; Beigl, Peter; Vidorreta, Itziar; Yang, Mona; Williams, Ian; den Boer, Emilia | Journal Article Fulltext |
| 2014 | Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook
Schischke, Karsten; Nissen, Nils; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2014 | US-spezifische Zertifizierungen und Normen wichtigste Handelshemmnisse für den Außenhandel mit den USA
Blind, Knut; Müller, Jo-Ann; Rauber, Julius | Journal Article |
| 2014 | Welding equipment under the energy-related products directive - the process of developing eco-design criteria
Schischke, K.; Nissen, N.F.; Lang, K.D. | Journal Article |
| 2013 | Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K. | Conference Paper |
| 2013 | Applying the software-to-data paradigm in next generation e-health hybrid clouds
Thuemmler, Christoph; Mueller, Julius; Covaci, Stefan; Magedanz, Thomas; Panfilis, Stefano de; Jell, Thomas; Schneider, Armin; Gavras, Anastasius | Conference Paper |
| 2013 | Approach for reliability of thermal interface materials in battery cell sensors
Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2013 | Aufbau einer Umgebung für die Simulation des Alterungsverhaltens von integrierten elektronischen Schaltungen
Müller, Leif; Müller, Jan (Betreuer); Jancke, Roland (Betreuer); Tetzlaff, Ronald (Verantwortl. Hochschullehrer) | Thesis Fulltext |
| 2013 | Design Features of Current Tablet Computers to Facilitate Disassembly and Repair
Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter | Conference Paper Fulltext |
| 2013 | Detection of fluorotelomer alcohols in indoor environments and their relevance for human exposure
Schlummer, Martin; Gruber, Ludwig; Fiedler, Dominik; Kizlauskas, Markus; Müller, Josef | Journal Article |
| 2013 | Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version August 2013
Schischke, Karsten; Stobbe, Lutz; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F. | Report Fulltext |
| 2013 | Downscaling ferroelectric field effect transistors by using ferroelectric Si-doped HfO2
Martin, Dominik; Yurchuk, Ekaterina; Müller, Stefan; Müller, Johannes; Paul, Jan; Sundquist, Jonas; Slesazeck, S.; Schlösser, T.; Bentum, R. van; Trentzsch, M.; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2013 | Elastic network design and adaptive flow placement in software defined networks
Mueller, Julius; Wierz, Andreas; Vingarzan, Dragos; Magedanz, Thomas | Conference Paper |
| 2013 | Ergebnisse der r²-Begleitforschung: Potenziale von Innovationen in rohstoffintensiven Produktionsprozessen
Ostertag, Katrin; Marscheider-Weidemann, Frank; Paitz, Patrick; Sartorius, Christian; Walz, Rainer; Moller, Björn P.; Seitz, Ralph; Woidasky, Jörg; Stier, Christian; Albrecht, Stefan; Brandstetter, Christian P.; Fröhling, Magnus; Trippe, Frederik; Müller, Josephine; Mayer, Wolfgang A.; Faulstich, Martin | Book Article |
| 2013 | Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories
Müller, J.; Böscke, T.S.; Müller, S.; Yurchuk, E.; Polakowski, P.; Paul, J.; Martin, D.; Schenk, T.; Khullar, K.; Kersch, A.; Weinreich, W.; Riedel, S.; Seidel, K.; Kumar, A.; Arruda, T.M.; Kalinin, S.V.; Schlösser, T.; Boschke, R.; Bentum, R. van; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2013 | From MFM capacitors toward ferroelectric transistors: Endurance and disturb characteristics of HfO2-based FeFET devices
Mueller, S.; Müller, J.; Hoffmann, R.; Yurchuk, E.; Schlösser, T.; Boschke, R.; Paul, J.; Goldbach, M.; Herrmann, T.; Zaka, A.; Schröder, U.; Mikolajick, T. | Journal Article |
| 2013 | Hafnium oxide based CMOS compatible ferroelectric materials
Schroeder, U.; Mueller, S.; Mueller, J.; Yurchuk, E.; Martin, D.; Adelmann, C.; Schloesser, T.; Bentum, R. van; Mikolajick, T. | Journal Article |
| 2013 | Impact of layer thickness on the ferroelectric behaviour of silicon doped hafnium oxide thin films
Yurchuk, E.; Müller, J.; Knebel, S.; Sundqvist, J.; Graham, A.P.; Melde, T.; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2013 | Impulsentkopplung von Lineardirektantriebsachsen: Praxistaugliche Gestaltung
Müller, Jens; Junker, Tom; Pagel, Kenny; Großmann, Knut; Drossel, Welf-Guntram | Journal Article |
| 2013 | (Invited) Hafnium oxide based CMOS compatible ferroelectric materials
Schroeder, U.; Martin, D.; Müller, J.; Yurchuk, E.; Mueller, S.; Adelmann, C.; Schloesser, T.; Bentum, R. van; Mikolajick, T. | Journal Article |
| 2013 | "LCA to go" - Environmental assessment of machine tools according to requirements of small and medium-sized enterprises (SMEs) - Development of the methodological concept
Pamminger, R.; Krautzer, F.; Wimmer, W.; Schischke, K. | Conference Paper |
| 2013 | Life Cycle Engineering von Turbomaschinen mithilfe der Mikrosystemtechnik
Middendorf, Andreas; Jerchel, Kathleen; Günther, Julia; Rothe, Michael | Journal Article |
| 2013 | Low-temperature sintered NTC thermistor ceramics for thick-film temperature sensors
Reimann, T.; Töpfer, J.; Barth, S.; Bartsch, H.; Müller, J. | Journal Article |
| 2013 | LTCC Membrane mit integrierter Heizern, Temperatur- und Dehnungssensorik
Gutzeit, Nam; Appelfelder, Michael; Reinlein, Claudia; Fischer, Michael; Müller, Jens | Conference Paper |
| 2013 | Manufacturing and characterization of a deformable membrane with integrated temperature sensors and heating structures in low temperature co-fired ceramics
Gutzeit, N.; Müller, J.; Reinlein, C.; Gebhardt, S. | Journal Article |
| 2013 | Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, M.F.; Hölck, O.; Braun, T.; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.D. | Conference Paper |
| 2013 | Mesoscopic analysis of leakage current suppression in ZrO2/Al2O3/ZrO2 nano-laminates
Martin, D.; Grube, M.; Weinreich, W.; Müller, J.; Weber, W.M.; Schröder, U.; Riechert, H.; Mikolajick, T. | Journal Article |
| 2013 | Moisture induced swelling in epoxy moulding compounds
Walter, H.; Hölck, O.; Dobrinski, H.; Stuermann, J.; Braun, T.; Bauer, J.; Wittler, O.; Lang, K.D. | Conference Paper Fulltext |
| 2013 | Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.; Lang, K.D. | Conference Paper |
| 2013 | Network and control platforms
Corici, Marius; Müller, Julius; Vingarzan, Dragos; Magedanz, Thomas | Book Article |
| 2013 | On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B. | Conference Paper |
| 2013 | Performance investigation and optimization of Si:HfO2 FeFETs on a 28 nm bulk technology
Mueller, S.; Yurchuk, E.; Slesazeck, S.; Mikolajick, T.; Müller, J.; Herrmann, T.; Zaka, A. | Conference Paper |
| 2013 | Product Design Trends and Impacts on Recyclability: The Case of Mobile IT Devices: Disassembly Analysis of Slates: Design for Repair and Recycling Evaluation
Dimitrova, Gergana; Schischke, Karsten; Stobbe, Lutz; Nissen, Nils F; Schlösser, Alexander | Presentation Fulltext |
| 2013 | QoE-aware resource provisioning and adaptation in IMS-based IPTV using OpenFlow
Truong, Thu-Huong; Thanh, Nguyen Huu; Hung, Nguyen Tai; Mueller, Julius; Magedanz, Thomas | Conference Paper |
| 2013 | Reliability characteristics of ferroelectric Si: HfO2 thin films for memory applications
Mueller, S.; Müller, J.; Schroeder, U.; Mikolajick, T. | Journal Article |
| 2013 | Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K. | Conference Paper |
| 2013 | Retrospective monitoring of perfluorocarboxylates and perfluorosulfonates in human plasma archived by the German Environmental Specimen Bank
Schröter-Kermani, C.; Müller, Josef; Jürling, Heinrich; Conrad, A.; Schulte, C. | Journal Article |
| 2013 | Scalable on-demand network management module for software defined telecommunication networks
Mueller, Julius; Wierz, Andreas; Magedanz, Thomas | Conference Paper |
| 2013 | Schaffung einer Datenbasis zur Ermittlung ökologischer Wirkungen der Produkte der Informations- und Kommunikationstechnik (IKT): Teilvorhaben C des Gesamtvorhabens Ressourcenschonung im Aktionsfeld Informations- und Kommunikationstechnik (IKT)
Prakash, Siddharth; Liu, Ran; Schischke, Karsten; Stobbe, Lutz; Gensch, Carl-Otto | Study Fulltext |
| 2013 | Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D. | Conference Paper |
| 2013 | Structural properties of as deposited and annealed ZrO2 influenced by atomic layer deposition, substrate, and doping
Weinreich, W.; Wilde, L.; Müller, J.; Sundqvist, J.; Erben, E.; Heitmann, J.; Lemberger, M.; Bauer, A.J. | Journal Article |
| 2013 | System reliability as a key for managing complex requirements, such as robust design of microsystems
Straube, Stefan; Hahn, Daniel; Jerchel, Kathleen; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2013 | Telecom applications, APIs and service platforms
Blum, Niklas; Müller, Julius; Schreiner, Florian; Magedanz, Thomas | Book Article |
| 2013 | Toward a full implementation of SCIM functional block in IMS framework
Hung, Nguyen Tai; Thanh, Nguyen Huu; Magedanz, Thomas; Mueller, Julius | Conference Paper |
| 2013 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter | Journal Article |
| 2013 | Wake-up effects in Si-doped hafnium oxide ferroelectric thin films
Zhou, D.Y.; Xu, J.; Li, Q.; Guan, Y.; Cao, F.; Dong, X.L.; Müller, J.; Schenk, T.; Schröder, U. | Journal Article |
| 2012 | Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; May, D.; Maus, I.; Pape, H.; Michel, B. | Conference Paper |
| 2012 | Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
Wunderle, B.; Schulz, M.; Keller, J.; Maus, I.; Pape, H.; Michel, B. | Conference Paper |
| 2012 | Aluminium-, Titan- und Silizium-basierte Oxidschichten für verschiedene Anwendungen mittels ALD
Krug, M.; Endler, I.; Benner, F.; Dirnstorfer, I.; Müller, J.; Sundqvist, J.; Rose, M.; Jakschik, S.; Weber, J.; Liepack, H. | Conference Paper |
| 2012 | Co-sputtering yttrium into hafnium oxide thin films to produce ferroelectric properties
Olsen, T.; Schröder, U.; Müller, S.; Krause, A.; Martin, D.; Singh, A.; Müller, J.; Geidel, M.; Mikolajick, T. | Journal Article |
| 2012 | Cofiring behavior of multilayer inductors based on substituted Y- and M-type hexagonal ferrites
Bierlich, Silvia; Töpfer, J.; Barth, Stefan; Pawlowski, B.; Müller, Jörg; Bartsch-Torres, H. | Conference Paper |
| 2012 | Combined reliability testing: An approach to assure reliability under complex loading conditions
Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D. | Conference Paper |
| 2012 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Journal Article |
| 2012 | Deformation and cracking during sintering of bimaterial components processed from ceramic and metal powder mixes. Pt.I: Experimental investigation
Largiller, G.; Bouvard, Didier; Carry, Claude Paul; Gabriel, Armand; Müller, Jean Damien; Staab, Torsten E.M. | Journal Article |
| 2012 | Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R. | Journal Article |
| 2012 | Early replacement of notebooks considering environmental impacts
Prakash, S.; Liu, R.; Schischke, K.; Stobbe, P.L. | Conference Paper |
| 2012 | Eco-reliability - a combined approach to balance environment with reliability
Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Eco-reliability as a new approach of multi-criteria optimisation
Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2012 | Effect of internal silver conductor on heat spreading capability of LTCC membrane
Reinlein, Claudia; Türke, Sascha; Gutzeit, Nam; Müller, Jens; Peschel, Thomas; Burkhardt, Thomas; Beckert, Erik; Tünnermann, Andreas | Conference Paper |
| 2012 | Electronics Goes Green 2012+. Proceedings. CD-ROM: Joint International Conference and Exhibition; September 9 - 12, 2012, Berlin, Germany
Lang, Klaus-Dieter; Nissen, Nils F.; Middendorf, Andreas; Chancerel, Perrine ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Conference Proceedings |
| 2012 | Embedded ceramic capacitators in LTCC
Bartsch, H.; Barth, S.; Müller, J. | Conference Paper |
| 2012 | Energy Harvesting for Distributed Microsystems - The Link between Environmental Performance and Availability of Power Supply
Benecke, Stephan; Rückschloss, Jana; Middendorf, Andreas; Nissen, Nils F.; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Environmental product assessments for small computer and laptop companies - MicroPro's experience with Eco-design of product service systems
Ospina, J.L.; Maher, P.; Schischke, K.; Schlosser, A. | Conference Paper |
| 2012 | Environmentally conscious design of autonomous power supplies for distributed micro-systems
Benecke, S.; Rueckschloss, J.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2012 | The European Project 20PLµS: 20 percent efficiency on less than 100 µm thick industrially feasible crystalline-Si solar cells
Terheiden, B.; Horbelt, R.; Schiele, Y.; Seren, S.; Ebser, J.; Hahn, G.; Morrison, D.; Heasman, K.; Devenport, S.; Holman, Z.; Descoeudres, A.; Wolf, S. de; Baliff, C.; Saint-Cast, P.; Michl, B.; Schmiga, C.; Weber, B.; Glunz, S.W.; Koentopp, M.B.; Scherff, M.; Ballmann, T.; Müller, J.W.; Antonelli, D.; Busto, C.; Grasso, F.; Ferrazza, F.; Tonelli, E.; Baert, K.; Duerinckx, F.; Cacciato, A.; Oswald, W. | Conference Paper Fulltext |
| 2012 | Evaluating a future internet cross-layer composition prototype
Mueller, J.; Siddiqui, A.; Becke, M.; Kleis, M.; Campowsky, K. | Conference Paper |
| 2012 | Experimentelle und numerische Untersuchungen zur Lebensdauerabschätzung von Durchkontaktierungen in Leiterplatten
Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2012 | Ferroelectricity in HfO 2 enables nonvolatile data storage in 28 nm HKMG
Müller, J.; Yurchuk, E.; Schlösser, T.; Paul, J.; Hoffmann, R.; Müller, S.; Martin, D.; Slesazeck, S.; Polakowski, P.; Sundqvist, J.; Czernohorsky, M.; Seidel, K.; Kücher, P.; Boschke, R.; Trentzsch, M.; Gebauer, K.; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2012 | Ferroelectricity in simple binary ZrO2 and HfO2
Müller, J.; Böscke, T.S.; Schröder, U.; Mueller, S.; Bräuhaus, D.; Böttger, U.; Frey, L.; Mikolajick, T. | Journal Article |
| 2012 | Fine line conductors in LTCC
Uhlig, P.; Stoepel, D.; Mueller, J.; Mosch, S. | Conference Paper |
| 2012 | From CRT to flat displays - Consequences for collection and recycling
Chancerel, P.; Deubzer, O.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2012 | HfO 2-based ferroelectric field-effect transistors with 260 nm channel length and long data retention
Yurchuk, E.; Müller, J.; Hoffmann, R.; Paul, J.; Martin, D.; Boschke, R.; Schlösser, T.; Müller, S.; Slesazeck, S.; Bentum, R. van; Trentzsch, M.; Schröder, U.; Mikolajick, T. | Conference Paper |
| 2012 | How to support SMEs in the sustainable design of their products. the LiMaS project approach
Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Chancerel, P.; Schischke, K.; Ruckschloss, J.; Campo, F.; Benito, G. | Conference Paper |
| 2012 | In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O. | Conference Paper Fulltext |
| 2012 | Incipient ferroelectricity in Al-doped HfO2 thin films
Mueller, Stefan; Mueller, Johannes; Singh, Aarti; Riedel, Stefan; Sundqvist, Jonas; Schroeder, Uwe; Mikolajick, Thomas | Journal Article |
| 2012 | Insights into electrical characteristics of silicon doped hafnium oxide ferroelectric thin films
Zhou, Dayu; Müller, J.; Xu, Jin; Knebel, S.; Bräuhaus, D.; Schröder, U. | Journal Article |
| 2012 | International harmonization of models for selecting less toxic chemical alternatives: Effect of regulatory disparities in the United States and Europe
Lam, Carl W.; Pascualena Aguirre, Muskilda; Schischke, Karsten; Nissen, Nils F.; Ogunseitan, Oladele A.; Schoenung, Julie M. | Journal Article |
| 2012 | Investigation into the metabolism of 1,8-cineole in an intestinal cell culture model and acquisition of its immune-modulatory effect via gene expression analysis
Müller, Jakob; Gruner, Natalie; Almstätter, Isabella; Kirsch, Frauke; Buettner, Andrea; Pfaffl, Michael W. | Journal Article |
| 2012 | Levels and trends of industrial chemicals (PCBs, PFCs, PBDEs) in archived herring gull eggs from German coastal regions
Fliedner, Annette; Rüdel, Heinz; Jürling, Heinrich; Müller, Josef; Neugebauer, Frank; Schröter-Kermani, Christa | Journal Article Fulltext |
| 2012 | Life Cycle thinking in small and medium sized enterprises - Status quo and strategic needs in the electronics sector
Schischke, K.; Nissen, N.F.; Sherry, J.; O'Rafferty, S.; O'Connor, F.; Sitek, J.; Pamminger, R.; Wimmer, W. | Conference Paper |
| 2012 | Lignin in der Elektronik
Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian | Conference Paper |
| 2012 | LTCC membranes with integrated heating structures, temperature sensors and strain gauges
Gutzeit, N.; Müller, J.; Reinlein, C.; Gebhardt, S. | Conference Paper |
| 2012 | Manufacturing and characterization of a deformable LTCC membrane with integrated temperature sensors, strain gauges and heating structures
Gutzeit, Nam; Müller, Jens; Bruchmann, Claudia; Gebhardt, Sylvia | Conference Paper |
| 2012 | Mass flows of selected target materials in LED products
Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2012 | Methodology to identify design for recycling measures for high-tech sectors
Marwede, Max; Schischke, Karsten; Arranz, Pol; Hickey, Stewart; Fitzpatrick, Colin; Ospina, Jose; Yang, Mona; Nissen, Nils F.; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Monitoring of hexabromocyclododecane diastereomers in fish from European freshwaters and estuaries
Rüdel, Heinz; Müller, Josef; Quack, Markus; Klein, Roland | Journal Article |
| 2012 | Nanosecond polarization switching and long retention in a novel MFIS-FET based on ferroelectric HfO2
Müller, J.; Böscke, T.S.; Schröder, U.; Hoffmann, R.; Mikolajick, T.; Frey, L. | Journal Article |
| 2012 | Non-volatile data storage in HfO2-based ferroelectric FETs
Schroeder, U.; Yurchuk, E.; Mueller, S.; Mueller, J.; Slesazeck, S.; Schloesser, T.; Trentzsch, M.; Mikolajick, T. | Conference Paper |
| 2012 | Overview of RoHS 2.0 and status of exemptions
Deubzer, O.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2012 | Practical Demonstrator. Design for Recycling Photovoltaic System
Arranz, Pol; Tarragó, Joan; Vallvé, Xavier; Marwede, Max; Boer, Emilia den; Rothe, Michael; Wuest, Felix; Middendorf, Andreas; Cocciantelli, Jean-Michel; Lippert, Michael | Conference Paper |
| 2012 | Reducing hazardous substances in electronics
Deubzer, O. | Book Article |
| 2012 | Secure and efficient validation of data traffic flows in fixed and mobile networks
Mueller, J.; Al-Hazmi, Y.; Sadikin, M.F.; Vingarzan, D.; Magedanz, T. | Conference Paper Fulltext |
| 2012 | SiCer - a substrate to combine ceramic and silicon based micro systems
Fischer, M.; Mache, T.; Pawlowski, B.; Schabbel, D.; Müller, J. | Conference Paper |
| 2012 | SiCer - ein innovativer Substratwerkstoff für MEMS
Pawlowski, B.; Schabbel, D.; Barth, S.; Fischer, M.; Bartsch, H.; Hoffmann, M.; Müller, J. | Book Article |
| 2012 | A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter | Conference Paper |
| 2012 | Towards a generic application aware network resource control function for next-generation-networks and beyond
Mueller, J.; Magedanz, T. | Conference Paper Fulltext |
| 2012 | Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B. | Conference Paper |
| 2012 | Untersuchungen zur Entwicklung eines Kultivierungsmediums für eine humane Amniocyten-Zelllinie
Müller, Janina; Lang, Siegmund (Referent); Ziehr, Holger (Koreferent) | Bachelor Thesis |
| 2011 | 20%-Efficient Rear Side Passivated Solar Cells in Pilot Series Designed for Conventional Module Assembling
Mohr, A.; Engelhart, P.; Klenke, C.; Wanka, S.; Stekolnikov, A.; Scherff, M.; Seguin, R.; Tardon, S.; Rudolph, T.; Hofmann, M.; Stenzel, F.; Lee, J.; Diez, S.; Wendt, J.; Schmidt, S.; Müller, J.W.; Wawer, P.; Hofmann, M.; Saint-Cast, P. | Conference Paper |
| 2011 | 60 GHz ultrawideband hybrid-integrated dual-polarized front-end in LTCC technology
Müller, R.; Ariza, A.P.; Xia, L.; Wollenschläger, F.; Schulz, A.; Lopez-Diaz, D.; Elkhouly, M.; Thomä, R.S.; Hein, M.; Müller, J. | Conference Paper |
| 2011 | Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2011 | Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd | Conference Paper |
| 2011 | Audience behavior around large interactive cylindrical screens
Beyer, G.; Alt, F.; Müller, J.; Schmidt, A.; Isakovic, K.; Klose, S.; Schiewe, M.; Haulsen, I. | Conference Paper |
| 2011 | Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B. | Conference Paper |
| 2011 | Automatisierte Justage von CO2-Laserstrahlführungssystemen
Brecher, Christian; Emonts, Michael; Stimpfl, Joffrey; Müller, Juliane | Journal Article |
| 2011 | Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Journal Article |
| 2011 | Can luminescence imaging replace lock-in thermography on solar cells?
Breitenstein, O.; Warta, W.; Schubert, M.C.; Kwapil, W.; Müller, J.; Hinken, D.; Bothe, K.; Bauer, J. | Journal Article Fulltext |
| 2011 | Carbon footprinting of information technology products based on ISO standards: Fujitsu case study
Böttner, H.; Schischke, K.; Nissen, N.F. | Conference Paper |
| 2011 | Characteristics of buried capacitors in LTCC multilayer packages
Bartsch, H.; Walther, F.; Krümmer, R.; Reimann, T.; Barth, S.; Müller, J. | Conference Paper |
| 2011 | Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D. | Conference Paper |
| 2011 | Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B. | Conference Paper |
| 2011 | Condition monitoring system adapted for photovoltaic power converter
Guenther, J.; Rothe, M.; Hefer, J.; Middendorf, A.; Lang, K.-D. | Conference Paper |
| 2011 | Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R. | Conference Paper |
| 2011 | Design for recycling measures for waste prevention in high-tech sectors: The case of laptop computers and photovoltaic modules
Marwede, Max; Schischke, Karsten; Hickey, Stewart; Arranz, Pol; Ospina, Jose; Ting, Angela | Conference Paper |
| 2011 | Detection of FTOHs in indoor air of work places
Schlummer, Martin; Kizlauskas, Markus; Gruber, Ludwig; Fiedler, Dominik; Müller, Josef; Biegler-Engler, Annegret | Abstract |
| 2011 | Eco-Reliability - A Fusion of GreenTech and HighTech
Nissen, N. F.; Wittler, O.; Middendorf, A.; Lang, K.-D. | Journal Article |
| 2011 | Electronics condition monitoring for improving sustainability of power electronics
Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D. | Conference Paper |
| 2011 | Environmental monitoring of HBCD in Europe
Rüdel, H.; Nowak, J.; Müller, J.; Ricking, M.; Quack, M.; Klein, R. | Conference Paper |
| 2011 | Evolution von Dienstkontrollmechanismen in Netzen der nächsten Generation und im Internet der Zukunft
Magedanz, T.; Müller, J. | Conference Paper |
| 2011 | Evolutionary future internet service platforms enabling seamless cross layer interoperability
Lange, L.; Magedanz, T.; Müller, J.; Nehls, D.; Vingarzan, D. | Conference Paper |
| 2011 | Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards
Nowak, T.; Schacht, R.; Walter, H.; Wunderle, B.; Ras, M.A.; May, D.; Wittler, O.; Lang, K.-D. | Conference Paper |
| 2011 | Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard | Conference Paper |
| 2011 | Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O. | Journal Article |
| 2011 | Ferroelectric Zr0.5Hf0.5O2 thin films for nonvolatile memory applications
Müller, J.; Böscke, T.S.; Bräuhaus, D.; Schröder, U.; Böttger, U.; Sundqvist, J.; Kcher, P.; Mikolajick, T.; Frey, L. | Journal Article |
| 2011 | Ferroelectricity in hafnium oxide thin films
Böscke, T.S.; Müller, J.; Bräuhaus, D.; Schröder, U.; Böttger, U. | Journal Article |
| 2011 | Ferroelectricity in hafnium oxide: CMOS compatible ferroelectric field effect transistors
Boschke, T.S.; Müller, J.; Bräuhaus, D.; Schröder, U.; Böttger, U. | Conference Paper |
| 2011 | Ferroelectricity in yttrium-doped hafnium oxide
Müller, J.; Schröder, U.; Böscke, T.S.; Müller, I.; Böttger, U.; Wilde, L.; Sundqvist, J.; Lemberger, M.; Kücher, P.; Mikolajick, T.; Frey, L. | Journal Article |
| 2011 | Fracture-mechanical interface characterisation for thermo-mechanical co-design: An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd | Journal Article |
| 2011 | Gain of blue and cyan InGaN laser diodes
Lermer, T.; Gomez-Iglesias, A.; Sabathil, M.; Müller, J.; Lutgen, S.; Strauss, U.; Pasenow, B.; Hader, J.; Moloney, J.V.; Koch, S.W.; Scheibenzuber, W.; Schwarz, U.T. | Journal Article |
| 2011 | Gestaltung impulsentkoppelter Lineardirektantriebsachsen aus Anwendersicht - GiLdA
Großmann, Knut; Neugebauer, Reimund; Müller, Jens; Pagel, Kenny | Conference Paper Fulltext |
| 2011 | An industry perspective on the optimization of InGaN lasers and LEDs via modeling
Gomez-Iglesias, A.; Sabathil, M.; Lermer. T.; Müller, J.; Galler, B.; Eichler, C.; Avramescu, A.; Dini, D.; Pietzonka, I.; Tautz, S.; Breidenassel, A.; Bruederl, G.; Lell, A.; Meyer, T.; Peter, M.; Lutgen, S.; Strauss, U.; Pasenow, B.; Koch, S.W.; Scheibenzuber, W.; Schwarz, U.T. | Conference Paper |
| 2011 | Investigation of thin films by nanoindentation with doe and numerical methods
Dowha, .; Wymysowski, A.; Wittler, O. | Conference Paper |
| 2011 | Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A. | Conference Paper |
| 2011 | Macroscopic and microscopic electrical characterizations of high-k ZrO 2 and ZrO2/Al2O3/ZrO2 metal-insulator-metal structures
Martin, D.; Grube, M.; Weinreich, W.; Müller, J.; Wilde, L.; Erben, E.; Weber, W.M.; Heitmann, J.; Schröder, U.; Mikolajick, T.; Riechert, H. | Journal Article |
| 2011 | Massive deployment of small coverage area cells in the all-IP wireless system - Opportunities, issues and solutions
Corici, M.; Onofrei, A.; Vingarzan, D.; Mueller, J.; Magedanz, T. | Conference Paper |
| 2011 | Eine Methodik zur Analyse erhöhter Beanspruchungen von Halbleiterkomponenten und deren AVT hinsichtlich geänderter Anforderungen im Automobil
Hahn, Daniel; Straube, Stefan; Middendorf, Andreas; Lochner, Helmut; Abelein, Ulrich; Lang, Klaus-Dieter | Conference Paper |
| 2011 | Modeling and optimization of energy harvesting-systems under non-ideal operating temperatures with regard to availability of power-supply and reduction of environmental impacts
Benecke, S.; Middendorf, A.; Nissen, N.F.; Lang, K.-D. | Conference Paper |
| 2011 | Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M. | Conference Paper |
| 2011 | New developments in thermo-optical-measurement devices
Staab, T.E.M.; Müller, J.; Winkler, D.; Diegeler, A. | Conference Paper |
| 2011 | Non-energy related policy options to foster eco-design of electronics products
Maxwell, D.; McAndrew, L.; Schischke, K.; Stobbe, L.; Nissen, N.F.; White, O. | Conference Paper |
| 2011 | Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects
Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D. | Conference Paper |
| 2011 | Per- and polyfluorinated compounds in consumer products
Jürling, Heinrich; Müller, Josef; Schlummer, Martin; Biegel-Engler, Annegret | Abstract |
| 2011 | Phase transitions in ferroelectric silicon doped hafnium oxide
Böscke, T.S.; Teichert, S.; Bräuhaus, D.; Müller, J.; Schröder, U.; Böttger, U.; Mikolajick, T. | Journal Article |
| 2011 | Recent results of blue and green InGaN laser diodes for laser projection
Lutgen, S.; Dini, D.; Pietzonka, I.; Tautz, S.; Breidenassel, A.; Lell, A.; Avramescu, A.; Eichler, C.; Lermer, T.; Müller, J.; Bruederl, G.; Gomez-Iglesias, A.; Strauss, U.; Scheibenzuber, W.G.; Schwarz, U.T.; Pasenow, B.; Koch, S. | Conference Paper |
| 2011 | Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B. | Conference Paper |
| 2011 | Schichtholzherstellung im Hochfrequenzverfahren: Kalte Klebfugen rechtzeitig erkannt
Meinlschmidt, P.; Märgner, V.; Jacob, A.F.; Müller, J. | Journal Article |
| 2011 | SiCer - an advanced substrate for 3D integrated nano and micro systems
Fischer, M.; Mache, T.; Bartsch, H.; Müller, J.; Pawlowski, B.; Barth, S. | Conference Paper |
| 2011 | Skyfarming an ecological innovation to enhance global food security
Germer, J.; Sauerborn, J.; Asch, F.; Boer, J. de; Schreiber, J.; Weber, G.; Müller, J. | Journal Article |
| 2011 | Smarte adaptive-optische Mikrosysteme - Aufbautechnologie und thermomechanische Charakterisierung
Burkhardt, T.; Bruchmann, C.; Kamm, A.; Hornaff, M.; Beckert, E.; Gebhardt, S.; Müller, J.; Hoffmann, M.; Eberhardt, R.; Tünnermann, A. | Conference Paper |
| 2011 | Survey of patterns, levels, and trends of perfluorinated compounds in aquatic organisms and bird eggs from representative German ecosystems
Rüdel, H.; Müller, J.; Jürling, H.; Bartel-Steinbach, M.; Koschorreck, J. | Journal Article |
| 2011 | The third IEEE international workshop on open NGN and IMS testbeds: ONIT 2011
Mueller, J.; Copeland, R.; Magedanz, T. | Conference Paper |
| 2011 | UE & network initiated QoS reservation in NGN and beyond
Mueller, J.; Magedanz, T.; Corici, M.; Vingarzan, D. | Conference Paper |
| 2011 | Welded seam inspection with high energy X-rays
Scholz, O.; Behrendt, R.; Wenzel, T.; Stocker, T.; Müller, J. | Report |
| 2011 | Z-, Y- and M-type hexagonal ferrites for high-frequency inductive multilayer devices
Töpfer, J.; Bierlich, S.; Barth, S.; Pawlowski, B.; Bechtold, F.; Müller, J. | Conference Paper |
| 2010 | Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Pufall, R.; Michel, B.; Kaulfersch, E. | Conference Paper |
| 2010 | Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B. | Conference Paper |
| 2010 | Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B. | Conference Paper |
| 2010 | Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H. | Conference Paper |
| 2010 | Advantages of a new wafer level integration concept based on direct bonded silicon on LTCC
Müller, J.; Fischer, M.; Bartsch de Torres, H.; Pawlowski, B.; Barth, S. | Conference Paper |
| 2010 | Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O. | Conference Paper |
| 2010 | Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R. | Journal Article |
| 2010 | Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R. | Conference Paper |
| 2010 | A comfortable world without standby - the zero Watt inside (ZeWIn) system
Deubzer, O.; Nissen, N.F.; Riedel, H.; Gaugele, J.; Ulmer, D. | Abstract |
| 2010 | Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B. | Conference Paper |
| 2010 | Condition Monitoring for Maintenance, Repair and ReUse: Abstract
Middendorf, A.; Günther, J.; Rothe, M.; Nissen, N.; Lang, K.-D. | Abstract Fulltext |
| 2010 | Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Conference Paper |
| 2010 | Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B. | Conference Paper |
| 2010 | Design and development of a miniaturized black body device for in-situ IR-camera calibration
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | EuP and ErP Progress of Implementation: Abstract
Nissen, N.F.; Stobbe, L.; Schischke, K.; Schlösser, A.; Mudgal, S.; Thornton, A. | Abstract Fulltext |
| 2010 | fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B. | Conference Paper |
| 2010 | Field trials using coordinated multi-point transmission in the downlink
Jungnickel, V.; Forck, A.; Jaeckel, S.; Bauermeister, S.; Schiffermueller, S.; Schubert, S.; Wahls, S.; Thiele, L.; Haustein, T.; Kreher, W.; Mueller, J.; Droste, H.; Kadel, G. | Conference Paper |
| 2010 | Handelbare Flächenausweisungszertifikate: Experiment Spiel.Raum: Ergebnisse einer Simulation in 14 Kommunen
Küpfer, C.; Ostertag, K.; Müller, J.; Seifert, S.; Schleich, J.; Ehrhart, K.-M. | Journal Article |
| 2010 | Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2010 | Helping SMEs to care for eco-innovation beyond legal compliance: Abstract
Chancerel, P.; Schischke, K.; Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Campo, F.J. | Abstract Fulltext |
| 2010 | Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Conference Paper |
| 2010 | Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B. | Conference Paper |
| 2010 | Human pose estimation with implicit shape models
Müller, J.; Arens, M. | Conference Paper Fulltext |
| 2010 | Influence of moisture on humidity sensitive material parameters of microelectronics relevant polymers
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B. | Conference Paper |
| 2010 | Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B. | Conference Paper |
| 2010 | Lebensdauerprognostik unter Berücksichtigung realer Belastungen am Beispiel von Bondverbindungen bei thermomechanischen Wechselbeanspruchungen
Middendorf, A. | Dissertation Fulltext |
| 2010 | Local multi-modal image matching based on self-similarity
Bodensteiner, C.; Huebner, W.; Juengling, K.; Mueller, J.; Arens, M. | Conference Paper |
| 2010 | Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2010 | Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2010 | Lokalisierung in drahtlosen Ad-Hoc Netzen
Müller, J.; Golestani, A. (Prüfer); Krogmann, M. | Thesis |
| 2010 | Microstructural characterization of Al doped Zro2 MIM capacitor using atom probe tomography
Shariq, A.; Wedderhoff, K.; Müller, J.; Teichert, S. | Abstract |
| 2010 | Miniaturized black body radiator for IR- Detector calibration - Design and development
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B. | Conference Paper |
| 2010 | Modeling and Optimization of Energy Harvesting Systems with Regard to Availability of Power Supply and Minimization of Environmental Impacts: Abstract
Benecke, S.; Middendorf, A.; Wüst, F.; Bochow-Neß, O.; Nissen, N.F. | Abstract Fulltext |
| 2010 | Modellierung des Energie- und Ressourcenbedarfs von IKT
Stobbe, L.; Schischke, K.; Nissen, N.F.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2010 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Journal Article |
| 2010 | Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2010 | Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B. | Conference Paper |
| 2010 | Neue Instrumente für weniger Flächenverbrauch: Der Handel mit Flächenausweisungszertifikaten im Experiment
Ostertag, K.; Schleich, J.; Ehrhart, K.-M.; Goebes, L.; Müller, J.; Seifert, S.; Küpfer, C. | Study Fulltext |
| 2010 | Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Conference Paper |
| 2010 | A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B. | Book Article |
| 2010 | Novel test structures for hermeticity testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Abstract |
| 2010 | Novel test structures for hermetictiy testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H. | Conference Paper |
| 2010 | Peer assist live streaming overlay for next-generation-networks
Müller, J.; Magedanz, T.; Fiedler, J. | Journal Article |
| 2010 | Pilot processing of 18.6% efficient rear surface passivated silicon solar cells with screen printed front contacts
Wolf, A.; Wotke, E.A.; Mack, S.; Nekarda, J.-F.; Biro, D.; Preu, R.; Schlegel, K.; Weber, T.; Lossen, J.; Böscke, T.; Grohe, A.; Engelhart, P.; Müller, J.W.; Schubert, G.; Plagwitz, H.; Gassenbauer, Y. | Conference Paper Fulltext |
| 2010 | Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B. | Conference Paper |
| 2010 | Retrospective monitoring of perfluorinated compounds in archived herring gull eggs
Rüdel, H.; Müller, J.; Jürling, H.; Schröter-Kermani, C. | Book Article Fulltext |
| 2010 | Retrospektives Monitoring von Perfluorierten Verbindungen (PFCs) in archivierten Silbermöweneiern
Rüdel, H.; Müller, J.; Jürling, H.; Paulus, M.; Schröter-Kermani, C. | Journal Article Fulltext |
| 2010 | SiCer - ein innovativer Substratwerkstoff für MEMS
Pawlowski, B.; Schabbel, D.; Barth, S.; Fischer, M.; Bartsch, H.; Hoffmann, M.; Müller, J. | Journal Article |
| 2010 | Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B. | Conference Paper |
| 2010 | Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday
Michel, B.; Lang, K.-D. | Book |
| 2010 | Special issue of the 8th International Workshop on High Aspect Ratio Micro Structure Technology, HARMST 2009: Editorial
Achenbach, S.; Klymyshyn, D.; Michel, B. | Journal Article |
| 2010 | A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2010 | Untersuchungen zu den Grenzwerten des Einsatzes adaptronischer Komponenten zur Impulsentkopplung von linearmotorgetriebenen Werkzeugmaschinenachsen unter veränderlichen strukturmechanischen Umgebungsbedingungen
Jungnickel, G.; Drossel, W.-G.; Müller, J.; Pagel, K. | Book Article Fulltext |
| 2010 | Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2010 | Waveguide design of green InGaN laser diodes
Lermer, T.; Schillgalies, M.; Breidenassel, A.; Queren, D.; Eichler, C.; Avramescu, A.; Müller, J.; Scheibenzuber, W.; Schwarz, U.T.; Lutgen, S.; Strauss, U. | Journal Article |
| 2010 | Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Schacht, R.; Abo Ras, M.; May, D.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2009 | Abschätzung des Energiebedarfs der weiteren Entwicklung der Informationsgesellschaft: Bearbeitungsnummer I D 4 - 02 08 15 - 43/08; Abschlussbericht an das Bundesministerium für Wirtschaft und Technologie
Stobbe, L.; Nissen, N.F.; Proske, M.; Middendorf, A.; Schlomann, B.; Friedewald, M.; Georgieff, P.; Leimbach, T.; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Fraunhofer-Institut für System- und Innovationsforschung -ISI-, Karlsruhe | Report Fulltext |
| 2009 | Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2009 | The collaboration between Int J Life Cycle Assess and J LCA Jpn
Matsuno, Y.; Kondo, Y.; Mishima, N.; Shibaoke, N.; Yashiro, T.; Yamamoto, Y.; Morioka, T.; Nissen, N.F.; Schischke, K.; Stobbe, L.; Reichl, H.; Kurihara, S.; Nakano, K.; Hirao, M.; Kai, H.; Ishibashi, Y.; Shimase, H.; Kamohara, S.; Takemasa, T.; Higo, M.; Dowaki, K.; Genchi, Y.; Motoshita, M.; Itsubo, N.; Inaba, A.; Torii, M.; Narita, N.; Ogawa, K.; Hondo, H.; Hirayama, Y.; Nakajima, K.; Yamada, S.; Fukuhara, I. | Journal Article |
| 2009 | Coordinated multipoint trials in the downlink
Jungnickel, V.; Thiele, L.; Wirth, T.; Haustein, T.; Schiffermüller, S.; Forck, A.; Wahls, S.; Jäckel, S.; Schubert, S.; Gabler, H.; Juchems, C.; Luhn, F.; Zavrtak, R.; Droste, H.; Kadel, G.; Kreher, W.; Müller, J.; Störmer, W.; Wannemacher, G. | Conference Paper |
| 2009 | Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B. | Conference Paper |
| 2009 | Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Conference Paper |
| 2009 | Detailed correlation of electrical and breakdown characteristics to the structural properties of ALD grown HfO2- and ZrO2-based capacitor dielectrics
Schroeder, U.; Weinreich, W.; Erben, E.; Mueller, J.; Wilde, L.; Heitmann, J.; Agaiby, R.; Zhou, D.; Jegert, G.; Kersch, A. | Conference Paper |
| 2009 | Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B. | Conference Paper |
| 2009 | Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B. | Conference Paper |
| 2009 | Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B. | Conference Paper |
| 2009 | EUCEMAN - recent activities from the European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Conference Paper |
| 2009 | Extending an IMS client with peer-to-peer content delivery
Fiedler, J.; Magedanz, T.; Müller, J. | Conference Paper |
| 2009 | Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2009 | Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Courtois, B.; Michel, B. | Journal Article |
| 2009 | Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H. | Conference Paper |
| 2009 | Impact of interface variations on J-V and C-V polarity asymmetry of MIM capacitors with amorphous and crystalline Zr(1-x)AlxO2 films
Weinreich, W.; Reiche, R.; Lemberger, M.; Jegert, G.; Müller, J.; Wilde, L.; Teichert, S.; Heitmann, J.; Erben, E.; Oberbeck, L.; Schröder, U.; Bauer, A.J.; Ryssel, H. | Conference Paper |
| 2009 | Improved manufacturability of ZrO2 MIM capacitors by process stabilizing HfO2 addition
Müller, J.; Böscke, T.S.; Schröder, U.; Reinicke, M.; Oberbeck, L.; Zhou, D.; Weinreich, W.; Kücher, P.; Lemberger, M.; Frey, L. | Conference Paper |
| 2009 | Influence of moisture on the time and temperature dependent properties of polymer systems
Walter, H.; Dermitzaki, E.; Shirangi, H.; Wunderle, B.; Hartmann, S.; Michel, B. | Conference Paper |
| 2009 | Innovations- und Technikanalyse Autonomer Verteilter Mikrosysteme
Schischke, K.; Beucker, S.; Clausen, J.; Niedermayer, M. | Report Fulltext |
| 2009 | Integration of reliability and environmental aspects in early design stages of mechatronics
Middendorf, A.; Deyter, S.; Gausemeier, J.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H. | Journal Article |
| 2009 | Lifetime modelling for microsystems integration: From nano to systems
Wunderle, B.; Michel, B. | Journal Article |
| 2009 | Lignin in der Elektronikindustrie
Müller, J.; Schmidt, R.; Nissen, N.F.; Scheel, W. | Conference Paper |
| 2009 | Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2009 | Methodology and utilization of simplified eco-assessments for policy making
Stobbe, L.; Nissen, N.F.; Schischke, K.; Reichl, H. | Conference Paper |
| 2009 | Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T. | Journal Article |
| 2009 | Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H. | Conference Paper |
| 2009 | Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H. | Conference Paper |
| 2009 | Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Wunderle, B.; Dermitzaki, E.; Holck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Ratzke, K.; Faupel, F.; Michel, B. | Conference Paper |
| 2009 | MST special issue on the conference MicroNanoReliability 2007. Editorial
Michel, B. | Conference Paper |
| 2009 | Neue Instrumente zur Verringerung des Flächenverbrauchs: Handelbare Zertifikate für Flächenausweisungen im Experiment
Ostertag, K.; Müller, J.; Seifert, S. | Journal Article Fulltext |
| 2009 | NNodeTree: A scalable peer-to-peer live streaming overlay architecture for next-generation-networks
Müller, J.; Magedanz, T.; Fiedler, J. | Journal Article Fulltext |
| 2009 | Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H. | Journal Article |
| 2009 | Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L. | Conference Paper |
| 2009 | Pervasive advertising
Müller, J.; Holleis, P.; Schmidt, A.; May, M. | Conference Paper |
| 2009 | Reliability concepts of microsystem integration
Wunderle, B.; Michel, B. | Conference Paper |
| 2009 | Retrospektives Monitoring von Organozinnverbindungen in biologischen Proben aus Nord- und Ostsee - sind die Anwendungsbeschränkungen erfolgreich?
Rüdel, H.; Steinhanses, J.; Müller, J.; Schröter-Kermani, C. | Journal Article |
| 2009 | Revision der Anhänge RoHS und ELV
Deubzer, O. | Conference Paper |
| 2009 | Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Conference Paper |
| 2009 | Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B. | Conference Paper |
| 2009 | The Solving the E-waste Problem (StEP) Intiative: Exploring Sustainable Solutions
Maurer, C.; Schischke, K.; Kuehr, R. | Conference Paper |
| 2009 | Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B. | Conference Paper |
| 2009 | Study on the effect of moisture and elevated temperature on the fracture properties of visco elastic polymers
Walter, H.; Shirangi, H.; Dermitzaki, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2009 | Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H. | Journal Article |
| 2009 | Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B. | Patent Fulltext |
| 2009 | Vorrichtung und Verfahren zum Aktivieren eines WLAN-tauglichen Geraets, WLAN-taugliches Geraet und WLAN-Zugriffspunkt
Deubzer, O.; Ulmer, D. | Patent Fulltext |
| 2009 | Was regelt REACH?: Regulation (EC) 1907/2006: Registration, Evaluation, Authorization and Restriction of Chemicals (REACH-VO)
Deubzer, O. | Journal Article |
| 2008 | Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M. | Conference Paper |
| 2008 | Alba - development of high-effciency multi-crystalline Si EWT solar cells for industrial fabrication at Q-cells
Peters, C.; Engelhart, P.; Hlusiak, M.; Wade, R.; Jesswein, R.; Rychtarik, D.; Müller, J.W.; Ulzhöfer, C.; Spätlich, S.; Neubert, T.; Harder, N.-P.; Schmiga, C.; Kray, D.; Grohe, A.; Glunz, S.W. | Conference Paper Fulltext |
| 2008 | Anwendung von Impedanzspektroskopie und Mikroelektroden-Arrays in der zellbasierten Sensorik
Jäger, M.; Poll, R.; Bussek, A.; Ravens, U.; Sonntag, F.; Müller, J.; Günther, F. | Conference Paper |
| 2008 | Application opportunities of energy harvesting principles into "non-electric" output forms for small electronic systems
Tsunezawa, K.; Oberender, C.; Reichl, H. | Conference Paper |
| 2008 | Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B. | Conference Paper |
| 2008 | Assessment of toxicity potential of metallic elements in discarded electronics: A case study of mobile phones in China
Wu, B.Y.; Chan, Y.C.; Middendorf, A.; Gu, X.; Zhong, H.W. | Journal Article |
| 2008 | The Basque Approach to EuP Compliance - a Reference for SMEs and Regional Policy Makers
Ruiz, N.; Schischke, K.; Reichl, H. | Conference Paper |
| 2008 | Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B. | Conference Paper |
| 2008 | Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B. | Conference Paper |
| 2008 | Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B. | Conference Paper |
| 2008 | Condition indicators for reliability monitoring of microsystems
Eckert, T.; Bochow-Ness, O.; Middendorf, A.; Tetzner, K.; Reichl, H. | Conference Paper |
| 2008 | Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2008 | Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B. | Conference Paper |
| 2008 | Design support system for global environment conscious product
Kumazawa, T.; Hiroshige, Y.; Deubzer, O. | Conference Paper |
| 2008 | Device Switching on Demand - A Standby Reducing System
Ulmer, D.; Franke, D; Deubzer, O.; Nissen, N.F. | Conference Paper |
| 2008 | Eco-design, energy efficiency and cleaner production strategies: SME business cases from Thailand and Malaysia
Schischke, K.; Soon, C.; Ahmad, M.; Nee, T.; Wan Hussein, W.M.; Ramasamy, R.; Reichl, H.; et al. | Conference Paper |
| 2008 | Eco-efficiency for smart microsystems
Reichl, H.; Middendorf, A.; Nissen, N.F.; Stobbe, L. | Conference Paper |
| 2008 | Editorial to MST special issue: Colloquium on Micro-Production, Karlsruhe, Germany, November 2007
Kraft, O.; Michel, B. | Conference Paper |
| 2008 | Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H. | Conference Paper |
| 2008 | Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings: Joint International Congress and Exhibition "Electronics Goes Green 2008+". September 7 - 10, 2008, Berlin, Germany
Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Conference Proceedings |
| 2008 | Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H. | Conference Paper |
| 2008 | Energy efficiency meets ecodesign - technology impacts of the European EuP directive
Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H. | Conference Paper |
| 2008 | Expanding the Technological Boundaries of the Biopolymer PHB in Electronic Products
Walachowicz, F.; Petermann, C.; Achatz, B.; Scherzer, D.; Schneller, A.; Scheel, W.; Schmidt, R.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2008 | Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B. | Journal Article |
| 2008 | Exploring factors that influence the combined use of mobile devices and public displays for pedestrian navigation
Müller, J.; Jentsch, M.; Kray, C.; Krüger, A. | Conference Paper Fulltext |
| 2008 | FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B. | Conference Paper |
| 2008 | Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H. | Conference Paper |
| 2008 | Global responsibility for green electronics and ICT
Griese, H.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2008 | Heterointegration of Complete Systems Based on Polytronics
Bock, K.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2008 | High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Immersion Ag as an alternative in 'Green' COB technology
Schneider-Ramelow, M.; Müller, J.; Göhre, J.-M.; Reichl, H. | Conference Paper |
| 2008 | In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B. | Conference Paper |
| 2008 | Incorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components
Auersperg, J.; Michel, B. | Conference Paper |
| 2008 | Interdependencies between reliability and standby
Nissen, N.F.; Middendorf, A.; Stobbe, L.; Schlösser, A.; Reichl, H. | Conference Paper |
| 2008 | Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B. | Conference Paper |
| 2008 | Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B. | Journal Article |
| 2008 | Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Logistic Concepts for Take-Back-Systems for Used Electronic Automotive Spare Parts
Stobbe, I.; Metzler, S.; Hohaus, C.; Kaerger, W.; Groke, M.; Knode, M.; Oberender, C. | Conference Paper |
| 2008 | Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
May, D.; Wunderle, B.; Abo Ras, M.; Faust, W.; Gollhard, A.; Schacht, R.; Michel, B. | Conference Paper |
| 2008 | Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2008 | Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in Epoxy Molding Compounds
Shirangi, M.H.; Fan, X.J.; Michel, B. | Conference Paper |
| 2008 | A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B. | Conference Paper |
| 2008 | Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Micro- and nanoscale deformation measurements at interface crack tips
Keller, J.; Mayer, S.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2008 | MicroCar 2008: Micro materials, nano materials for automotives. Volume of abstracts: Leipzig, 27.2.2008
Michel, B. | Conference Proceedings |
| 2008 | Microsecurity and nanosecurity - Security research using the advantages of smart system integration
Michel, B.; Winkler, T. | Conference Paper |
| 2008 | A Model for Gaining Significant Data to Establish Energy Profiles of Passive Electronic Components
Körber, G.; Schulz, G.; Viehmann, K.-R.; Huck, W.; Dietrich, M.; Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H. | Conference Paper |
| 2008 | Modelling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards
Schacht, R.; Wunderle, B.; May, D.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Nano-Computertomographie - ein wertvolles Hilfsmittel bei metallographischen Untersuchungen zur Schadensanalyse mikroelektronischer und mikrotechnischer Komponenten
Faust, W.; Noack, E.; Michel, B. | Conference Paper |
| 2008 | Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2008 | Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2008 | Nanoreliability - Reliability Research for Microsystem Technology on the way from Micro to Nano
Michel, B.; Winkler, T.; Werner, M.; Fecht, H. | Journal Article |
| 2008 | Nanoscale deformation measurements - concepts for failure and reliability assessment at the nanoscale
Michel, B.; Gollhardt, A.; Keller, J. | Conference Paper |
| 2008 | Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2008 | Negatively-chirped laser enables nonlinear excitation and nanoprocessing with sub-20-fs pulses
Uchugonova, A.; Müller, J.; Bückle, R.; Tempea, G.; Isemann, A.; Stingl, A.; König, K. | Conference Paper |
| 2008 | Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F. | Conference Paper |
| 2008 | On-line condition monitoring of power semiconductors
Wernicke, T.; Gegusch, R.; Dieckerhoff, S.; Middendorf, A.; Seliger, G.; Reichl, H. | Conference Paper |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B. | Conference Paper |
| 2008 | Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B. | Conference Paper |
| 2008 | Präventive Ansätze zur zuverlässigkeitsorientierten Produktentwicklung
Steffen, D.; Jaeschke, J.; Middendorf, A. | Journal Article |
| 2008 | Reliability and environmental evaluation in early design stages of mechatronics
Middendorf, A.; Jaeschke, J.; Tsunezawa, K.; Reichl, H. | Conference Paper |
| 2008 | Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R. | Journal Article |
| 2008 | Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B. | Journal Article |
| 2008 | Reliability-solutions and concepts for applications in high-tech regions
Michel, B. | Book Article |
| 2008 | Residual stress measurements of high spatial resolution
Vogel, D.; Luczak, F.; Michel, B. | Conference Paper |
| 2008 | Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B. | Conference Paper |
| 2008 | Review of exemptions from electronics-related material bans - status of reviews, backgrounds and experiences of a reviewer
Deubzer, O.; Reichl, H. | Conference Paper |
| 2008 | RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H. | Conference Paper |
| 2008 | Spare Part Management from the View of Sustainability
Oberender, C.; Hiller, V.; Reichl, H. | Conference Paper |
| 2008 | Special Issue of the Conference Smart Sensors, Actuators and MEMS, Maspalomas, Gran Canaria, Spain, 2-4 May 2007
Michel, B.; Becker, T.; Schmid, U. | Journal Article |
| 2008 | Special issue of the high-aspect-ratio micro-structure technology workshop, HARMST'07. Editorial: Besancon, France, 7-9 June 2007
Malek, C.K.; Saile, V.; Michel, B. | Conference Paper |
| 2008 | Specifying mechatronic systems in early design phases for analysing sustainability aspects
Deyter, S.; Gausemeier, J.; Middendorf, A.; Reichl, H.; Steffen, D.; Tsunezawa, K.; Walachowicz, F. | Conference Paper |
| 2008 | Structure Property Correlation of Epoxy Resins Under the Influence of Moisture and Temperature; and Comparison of Diffusion Coefficient with MD-Simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B. | Conference Paper |
| 2008 | Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages
Shirangi, H.; Müller, W.H.; Michel, B. | Conference Paper |
| 2008 | Sustainability Assessment of Polymers Based on Renewable Resources for Electronic Products
Achatz, B.; Piepenbrink, M.; Saling, P.; Scherzer, D.; Walachowicz, F.; Petermann, C.; Nissen, N.F.; Müller, J. | Conference Paper |
| 2008 | Sustainability by Using Used Assemblies in Automotive Electronics
Mente, T.; Schuch, B.; Ernst, C.; Schuster, A.; Böckhorst, S.; Friedrichs, L.; Halser, K.; Bochow-Neß, O.; Middendorf, A. | Conference Paper |
| 2008 | Systemunabhängige Referenzprozesse für das PLM. Handbuch TFB 57
Schuh, G.; Schlick, C.; Schmitt, R.; Lenders, M.; Bender, D.; Bohl, A.; Gärtner, T.; Hatfield, S.; Müller, J.; Mütze-Niewöhner, S. | Book Fulltext |
| 2008 | Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B. | Conference Paper |
| 2008 | Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B. | Conference Paper |
| 2008 | Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B. | Conference Paper |
| 2008 | Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2008 | Vibration, Deformation and Reliability - an Overview about Measuring Techniques
Rümmler, N.; Schnitzer, R.; Michel, B. | Conference Paper |
| 2008 | Von RoHS, ELV, EuP zur WEEE: Aktuelle Gesetzgebung
Deubzer, O. | Conference Paper |
| 2008 | Wireless Sensor Networks for Agriculture and Automation: Challenges and Chances for Sustainability
Beucker, S.; Clausen, J.; Schischke, K.; Mwanza, J.; Altendorf, P.; Reichl, H. | Conference Paper |
| 2008 | Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A. | Conference Paper |
| 2008 | Zuverlässigkeits-Lösungsansätze und Konzepte für Anwendungen im Hightech Bereich
Michel, B. | Book Article |
| 2007 | Applications of biopolymers in electronic products
Nissen, N.F.; Kleinert, G.; Petermann, C.; Mothes, G.; Müller, J.; Reichl, H.; Scheel, W.; Schmidt, R. | Conference Paper |
| 2007 | Begrenzung von Schadstoffeinträgen bei Bewirtschaftungsmaßnahmen in der Landwirtschaft bei Düngung und Abfallverwertung: Teil 1: Stoffuntersuchungen; Teil 2: Bodenuntersuchungen. Forschungsbericht 202 33 305 und 202 74 271
Kördel, W.; Herrchen, M.; Müller, J.; Kratz, S.; Fleckenstein, J.; Schnug, E.; Saring, U.; Thomas, J.; Reinhold, J. | Report |
| 2007 | The calcium test. A versatile tool for the investigation of barrier properties of polymers and reliability tests of encapsulation processes
Boeffel, C.; Müller, J.; Müller, R.; Bauer, M. | Conference Paper |
| 2007 | Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2007 | Condition Indicators for Reliability Monitoring of Microsystems
Bochow-Ness, O.; Eckert, T.; Fujino, M.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2007 | Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B. | Conference Paper |
| 2007 | Design, test, integration and packaging of MEMS/MOEMS, 2006: Editorial
Michel, B.; Courtois, B. | Conference Paper |
| 2007 | Displayzelle mit kompartimentierter Fluessigkristallschicht, Verfahren zu deren Herstellung und hierfuer geeignete, ein Fluessigkristall-Material enthaltende Mischung
Bauer, M.; Kuschel, F.; Mueller, J. | Patent Fulltext |
| 2007 | Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Conference Paper |
| 2007 | Eco-design as the tool for decreasing the impact of electronic technology on environment
Szendiuch, I.; Schischke, K. | Conference Paper |
| 2007 | Eco-design workflow process
Vasko, C.; Szendiuch, I.; Schischke, K. | Conference Paper |
| 2007 | Enterprise interoperability II. New challenges and approaches. Selected conference papers
Gonçalves, R.J.; Müller, J.P.; Mertins, K.; Zelm, M. | Conference Proceedings |
| 2007 | Entscheidungsfindung unter Nachhaltigkeitsgesichtspunkten
Oberender, C. | Conference Paper |
| 2007 | EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Journal Article |
| 2007 | EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T. | Conference Paper |
| 2007 | The EuP directive - current status and steps towards implementation
Nissen, N.F.; Schischke, K.; Stobbe, L. | Conference Paper |
| 2007 | European environmental legislation - insights into the EuP process
Nissen, N.F.; Stobbe, L.; Schischke, K.; Müller, J.; Reichl, H. | Conference Paper |
| 2007 | Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Experimental Vibration Analyses by Laser Vibrometer under Vacuum Conditions
Schnitzer, R.; Rümmler, N.; Dost, Mi.; Michel, B.; Hauck, T. | Conference Paper |
| 2007 | Experimental Vibration and Deformation Analyses for Increase Micro-Structure Reliability
Rümmler, N.; Schnitzer, R.; Michel, B. | Conference Paper |
| 2007 | Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future
Deubzer, O. | Dissertation |
| 2007 | Failure Analysis of Microelectronic Packages by Pulse IR Thermography
Wunderle, B.; May, D.; Schacht, R.; Michel, B. | Abstract |
| 2007 | Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B. | Conference Paper |
| 2007 | Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Journal Article |
| 2007 | FIB Based Local Residual Stress Measurement - Potentials and Challenges
Vogel, D.; Michel, B. | Conference Paper |
| 2007 | FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B. | Journal Article |
| 2007 | Focused Ion Beam (FIB) as an Analytical Tool in Micro- and Nanotechnology
Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
Auersperg, J.; Michel, B. | Conference Paper |
| 2007 | Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Global harmonization of RoHS-like regulations
Müller, J.; Griese, H.; Reichl, H. | Conference Paper |
| 2007 | Global impacts of the e-waste problem
Deubzer, O.; Griese, H.; Reich, H. | Conference Paper |
| 2007 | Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2007 | HARMST, High Aspect Ratio Micro Structure Technology Workshop. Editorial: Gyenogju, Korea, 10-13 June 2005
Kwon, T.H.; Michel, B. | Conference Paper |
| 2007 | Improvement options for external power supplies and battery chargers: Results of the EuP preparatory study
Schischke, K.; Mugdal, S.; Turunen, L.; Lescuyer, L.; Nissen, N. | Conference Paper |
| 2007 | Improvement options for external power supplies and battery chargers results of the EuP preparatory study
Schischke, K.; Mugdal, S.; Turunen, L.; Lescuyer, L.; Nissen, N. | Conference Paper |
| 2007 | In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B. | Conference Paper |
| 2007 | In-line plasma etching at atmospheric pressue for edge isolation in crystalline Si solar cells
Heintze, M.; Hauser, A.; Möller, R.; Wanka, H.; Lopez, E.; Dani, I.; Hopfe, V.; Müller, J.W.; Huwe, A. | Conference Paper |
| 2007 | In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B. | Conference Paper |
| 2007 | Integration of reliability and environmental aspects in the early design stages of mechatronics
Tsunezawa, K.; Middendorf, A.; Nissen, N.F.; Reichl, H.; Walachowicz, F. | Conference Paper |
| 2007 | Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Lokale Eigenspannungsmessung im FIB - Potential und Herausforderung
Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B. | Conference Paper |
| 2007 | Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2007 | Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B. | Conference Paper |
| 2007 | Micro- and Nanosecurity - Security by Miniaturization in MST
Michel, B.; Winkler, T. | Conference Paper |
| 2007 | Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique, in Micro- and Opto-Electronic Materials and Structures
Michel, B.; Keller, J. | Book Article |
| 2007 | Microsecurity, Nanosecurity - Security Research in Europa Utilizing Advanced Micro- and Nanotechnologies
Michel, B.; Winkler, T. | Conference Paper |
| 2007 | Microsecurity, Nanosecurity - Sicherheitsforschung in Europa unter Verwendung von Methoden der Mikro- und Nanotechnologien
Michel, B.; Winkler, T. | Conference Paper |
| 2007 | Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B. | Conference Paper |
| 2007 | MMCB - The Micro Materials Center Berlin and Chemnitz at Fraunhofer IZM
Michel, B. | Conference Paper |
| 2007 | Mobile E-Mail und Device Management: Vortrag gehalten auf der Mobile Computing Konferenz 2007, 9. Mai 2007, Schliersee-Spitzingsee, Germany
Dufft, Nicole; Müller, Jürgen | Presentation Fulltext |
| 2007 | Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B. | Conference Paper |
| 2007 | NanoDAC - Object deformation measurements for micro and nanotechnology applications
Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Nanoreliability - Reliability Concepts for Micro-Nano Interface Regions
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J. | Conference Paper |
| 2007 | Nanoreliability - Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J. | Conference Paper |
| 2007 | Nanoscale deformation measurements for reliability assessment of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2007 | Netzwerk
Ulmer, D.; Bühler, O.; Müller, J.; Nissen, N.; Stobbe, L.; Middendorf, A. | Patent Fulltext |
| 2007 | Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B. | Conference Paper |
| 2007 | Occurrence of polycyclic musks in sewage sludge and their behaviour in soils and plants. Pt.2: Investigation of polycyclic musks in soils and plants
Litz, N.; Müller, J.; Böhmer, W. | Journal Article |
| 2007 | Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Klein, M.; Michel, B. | Conference Paper |
| 2007 | Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Auersperg, J.; Klein, M.; Michel, B. | Conference Paper |
| 2007 | Organic pollutants in compost and digestate: Part 2. Polychlorinated dibenzo-p-dioxins, and -furans, dioxin-like polychlorinated biphenyls, brominated flame retardants, perfluorinated alkyl substances, pesticides, and other compounds
Brandli, R.C.; Kupper, T.; Bucheli, T.D.; Zennegg, M.; Huber, S.; Ortelli, D.; Müller, J.; Schaffner, C.; Iozza, S.; Schmid, P.; Berger, U.; Edder, P.; Oehme, M.; Stadelmann, F.X.; Tarradellas, J. | Journal Article |
| 2007 | Progressing from Micro to Nanoreliability in System Integration
Wunderle, B.; Michel, B. | Conference Paper |
| 2007 | Pulse and Lock-In Infrared Thermography - Possibilities for Non-Destructive Reliability Analysis of Micro-Electronic Assemblies
May, D.; Schacht, R.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D. | Conference Paper |
| 2007 | Reliability Aspect Integration in Early Stages of Design Processes for Mechatronic Systems
Middendorf, A.; Keller, J.; Walter, H.; Reichl, H. | Conference Paper |
| 2007 | Reliability of SnPb and Pb-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Journal Article |
| 2007 | Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Journal Article |
| 2007 | Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Journal Article |
| 2007 | Retrospective monitoring of organotin compounds in freshwater fish from 1988 to 2003: Results from the German environmental specimen bank
Rüdel, H.; Müller, J.; Steinhanses, J.; Schröter-Kermani, C. | Journal Article |
| 2007 | Risikobewertung von Chemikalien
Müller, J. | Journal Article |
| 2007 | Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T. | Conference Paper |
| 2007 | State of RoHS (non) compliance in small and medium sized enterprises: Technical, economical and environmental evaluation of the transition process
Liu, R.; Schischke, K.; Bukat, K.; Koziol, G.; Sitek, J.; Zuber, K.-H.; Reichl, H. | Conference Paper |
| 2007 | Status and impacts of RoHS-like regulations - the role of material bans in sustainable development
Deubzer, O.; Griese, H.; Zangl, S.; Andrae, A.; Reichl, H. | Conference Paper |
| 2007 | System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H. | Conference Paper |
| 2007 | A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B. | Conference Paper |
| 2007 | Testing of Microcomponents
Michel, B.; Walter, H. | Book Article |
| 2007 | Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H. | Conference Paper |
| 2007 | Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H. | Conference Paper |
| 2007 | Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Michel, B. | Conference Paper |
| 2007 | Der Weg zu Ökodesignanforderungen für externe Netzteile: Entstehung und Inhalt der vorbereitenden EuP-Studie
Schischke, K. | Journal Article |
| 2007 | Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B. | Conference Paper |
| 2007 | Zuverlässigkeitsprobleme im Hightech-Bereich - Lösungsansätze und Konzepte
Michel, B. | Book Article |
| 2006 | 3D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B. | Conference Paper |
| 2006 | 3D-PCB-packaging technology for high power applications with water cooling
Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B. | Conference Paper Fulltext |
| 2006 | Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Advanced packages with buried dies: Design support by means of FE analysis and deformation measurement in micro scale
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2006 | AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Bestimmung der Querkontraktionszahl von Polymeren in Abhängigkeit von der Temperatur mit Hilfe des UNIDAC-Verfahrens
Walter, H.; Seiler, B.; Bombach, C.; Michel, B. | Conference Paper |
| 2006 | Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Auersperg, J.; Michel, B. | Conference Paper |
| 2006 | Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2006 | Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Colloquium on Micro Production, Aachen, Germany, 2-3 March 2005: Editorial
Gatzen, H.H.; Michel, B. | Abstract |
| 2006 | Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B. | Conference Paper |
| 2006 | Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B. | Conference Paper |
| 2006 | Design, test, integration and packaging of MEMS/MOEMS, 2005
Courtois, B.; Michel, B. | Conference Paper |
| 2006 | Determination of sulfonylurea herbicides in water and food samples using sol-gel glass-based immunoaffinity extraction and liquid chromatography-ultraviolet/diode array detection or liquid chromatography-tandem mass spectrometry
Degelmann, P.; Egger, S.; Jürling, H.; Müller, J.; Niessner, R.; Knopp, D. | Journal Article |
| 2006 | Development of a 21% back-contact monocrystalline silicon solar cell for large-scale production
Huljic, D.M.; Zerres, T.; Mohr, A.; Maydell, K. von; Petter, K.; Müller, J.W.; Feist, H.; Harder, N.-P.; Engelhart, P.; Brendemühl, T.; Grischke, R.; Meyer, R.; Brendel, R.; Granek, F.; Grohe, A.; Hermle, M.; Schultz, O.; Glunz, S.W. | Conference Paper Fulltext |
| 2006 | Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation
Dermitzaki, E.; Bauer, J.; Wunderle, B.; Michel, B. | Conference Paper |
| 2006 | Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B. | Journal Article |
| 2006 | Eco-Design: New part of technological integration
Szendiuch, I.; Schischke, K. | Conference Paper |
| 2006 | Eco-design - New part of technological integration
Szendiuch, I.; Schischke, K. | Conference Paper |
| 2006 | Eco-Design Strategies for Electronics Supply Chains Based on Product Material Declarations
Stobbe, L.; Schischke, K.; Hayashi, H.; Suga, T.; Griese, H. | Conference Paper |
| 2006 | EcoDesign in european small and medium sized enterprises of the electrical and electronics sector: Status quo and the road towards EuP
Schischke, K.; Müller, J.; Reichl, H. | Conference Paper |
| 2006 | Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2006 | Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H. | Conference Paper |
| 2006 | Energy dispersive X-ray diffraction
Kämpfe, B.; Luczak, F.; Michel, B. | Journal Article |
| 2006 | Environmental-based regulations for electronics - From regional variety to internationally harmonized guidelines
Griese, H.; Müller, J.; Stobbe, L. | Conference Paper |
| 2006 | EUlegislation: RoHS, WEEE and EUP status and implications for companies
Nissen, N.F.; Schischke, K. | Conference Paper |
| 2006 | EuP-Richtlinie. Von der Verabschiedung zu Durchführungsmaßnahmen
Müller, J. | Conference Paper |
| 2006 | Evaluating customer requirements in Eco-VA
Sakao, T.; Oberender, C.; Krone, N.; Shimomura, Y.; Birkhofer, H.; Reichl, H. | Conference Paper |
| 2006 | Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B. | Conference Paper |
| 2006 | Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B. | Conference Paper |
| 2006 | A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B. | Conference Paper |
| 2006 | FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B. | Conference Paper |
| 2006 | FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B. | Conference Paper |
| 2006 | Grüne Elektronik - Umweltgesetzgebung und -vorschriften für Elektronikgeräte
Schischke, K. | Journal Article |
| 2006 | High-resolution stress measurements for microsystem and semiconductor applications
Vogel, D.; Keller, J.; Michel, B. | Conference Paper |
| 2006 | Interface-Risse in Komponenten der Mikro- und Nanoelektronik
Auersperg, J.; Michel, B.; Walter, H. | Conference Paper |
| 2006 | Investigation on value increase in inverse distribution process
Hayashi, H.; Suga, T.; Stobbe, L.; Schischke, K.; Griese, H. | Conference Paper |
| 2006 | A laboratory 6-DOF parallel kinematic for evaluation of new methods
Schröder, T.; Otto-Adamczak, T.; Krabbes, M.; Müller, J. | Conference Paper |
| 2006 | Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Middendorf, A.; Reichl, H.; Griese, H. | Conference Paper |
| 2006 | Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B. | Abstract |
| 2006 | Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis
Deplanque, S.; Nüchter, W.; Wunderle, B.; Schacht, R.; Michel, B. | Conference Paper |
| 2006 | Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B. | Journal Article |
| 2006 | Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R. | Journal Article |
| 2006 | Mercury-free cure shrinkage and thermal expansion measurements
Chowdhury, Y.; Bauer, A.; Müller, J.; Bauer, M. | Conference Paper |
| 2006 | Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Michel, B.; Reichl, H. | Conference Paper |
| 2006 | Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Lishchynska, M.; O'Mahony, C.; Slattery, O.; Wittler, O. | Conference Paper |
| 2006 | Monitoring of natural and synthetic hormones in a polluted river
Barel-Cohen, K.; Shore, L.S.; Shemesh, M.; Wenzel, A.; Mueller, J.; Kronfeld-Schor, N. | Journal Article |
| 2006 | NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Nanoscale Deformation Measurements to Improve Reliability Assessment of Sensors and MEMS
Michel, B.; Keller, J.; Walter, H. | Conference Paper |
| 2006 | A new method for local strain field analysis near cracks in micro- and nanotechnology applications
Michel, B.; Vogel, D.; Sabaté, N.; Lieske, D. | Conference Paper |
| 2006 | Die Nutzungsphase und ihre Bedeutung für die Entwicklung umweltgerechter Produkte
Oberender, C. | Dissertation |
| 2006 | Occurrence of polycyclic musks in sewage sludge and their behaviour in soils and plants. Pt.1: Behaviour of polycyclic musks in sewage sludge of different treatment plants in summer and winter
Müller, J.; Böhmer, W.; Litz, N.T. | Journal Article |
| 2006 | Öko-Design im Überblick: Grundlagen, Erfolgsfaktoren und Stand der Gesetzgebung
Schischke, K. | Journal Article |
| 2006 | Progress in reliability research in the micro and nano region
Wunderle, B.; Michel, B. | Conference Paper |
| 2006 | Renewable resources for electronics: Lignin-based polymers for printed circuit boards
Müller, J.; Nissen, N.F.; Scheel, W.; Schmidt, R. | Conference Paper |
| 2006 | RoHS after July 2006: Presentation held at SMTA Vendor Days, October 5, 2006, University of Utah, Salt Lake City
Hutter, M.; Pape, U.; Müller, J.; Wunderle, B. | Presentation Fulltext |
| 2006 | Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B. | Conference Paper |
| 2006 | Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B. | Conference Paper |
| 2006 | Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B. | Conference Paper |
| 2006 | Status of ecodesign implementation and EUP readiness in electrical and electronics SMEs: Findings from the European awareness raising campaign
Schischke, K.; Nissen, N.F.; Mueller, J.; Reichl, H. | Journal Article |
| 2006 | Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B. | Conference Paper Fulltext |
| 2006 | Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H. | Conference Paper |
| 2006 | Umweltaspekte lassen sich in jeden Entwurf integrieren: Praktische Erläuterungen am Beispiel Mikrosystemtechnik
Schischke, K. | Journal Article |
| 2006 | Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M. | Patent Fulltext |
| 2006 | Von RoHS und WEEE zur EuP - ein weltweiter Trend
Müller, J.; Schischke, K. | Conference Paper |
| 2006 | Zuverlässige Bauteile mit neuen Werkstoffen
Michel, B. | Book Article |
| 2006 | Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B. | Conference Paper |
| 2005 | 3D deformation analysis of flow and gas sensors membranes for reliability assessment
Sabate, N.; Keller, J.; Gollhardt, A.; Vogel, D.; Gracia, I.; Cane, C.; Morante, J.R.; Michel, B. | Conference Paper |
| 2005 | Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Approaches towards sustainable use and substitution of metals in electronics
Deubzer, O.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Auslegung einer sechsachsigen Parallelkinematik
Müller, J. | Thesis |
| 2005 | Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B. | Abstract |
| 2005 | Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Combination of nanoDAC and FEM for reliability analysis of materials in the micro-nano-transition scale
Kaulfersch, E.; Keller, J.; Michel, B. | Abstract |
| 2005 | A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2005 | A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B. | Conference Paper |
| 2005 | Condition monitoring of automotive electronic systems with life cycle units
Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K. | Conference Paper |
| 2005 | Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2005 | Damage and failure analysis of lead-free solder interconnects in automotive electronics
Faust, W.; Kreyßig, K.; Michel, B. | Abstract |
| 2005 | Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2005 | Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B. | Conference Paper |
| 2005 | Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2005 | Digital image correlation - a versatile experimental tool to improve reliability, security and lifetime
Dost, M.; Seiler, B.; Erb, R.; Michel, B. | Abstract |
| 2005 | Eco-design and beyond - key requirements for a global sustainable development
Griese, H.; Stobbe, L.; Reichl, H.; Stevels, A. | Conference Paper |
| 2005 | Environmental aspects in automotive electronics
Pötter, H.; Griese, H.; Jürgens, G.; Müller, J.; Ness, O.; Reichl, H. | Conference Paper |
| 2005 | Environmental, Economical and Logistical Implications of Lead-free Soldering
Deubzer, O. | Conference Paper |
| 2005 | Experimental mechanics on the way from micro to nano
Michel, B. | Journal Article |
| 2005 | FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints
Spraul, M.; Nüchter, W.; Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B. | Conference Paper |
| 2005 | fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B. | Conference Paper |
| 2005 | Forum: Umstellung Bleifrei
Müller, J.; Griese, H. | Conference Paper |
| 2005 | Fracture and Fatigue Behaviour of MEMS related Micro Materials
Walter, H.; Dudek, R.; Michel, B. | Conference Paper |
| 2005 | Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B. | Conference Paper |
| 2005 | Global sustainable development and technological innovations
Griese, H.; Stobbe, L.; Müller, J.; Deubzer, O.; Middendorf, A. | Conference Paper |
| 2005 | Global sustainable development and technological innovations - Experiences from lead-free transition
Griese, H.; Stobbe, L.; Mueller, J.; Deubzer, O.; Middendorf, A. | Conference Paper |
| 2005 | Green MST design from a designer's perspective: How to base decisions on environmental issues
Schischke, K.; Middendorf, A.; Reichl, H.; Griese, H.; Kasper, M.; Ong, K. | Conference Paper |
| 2005 | Identification of Fitted Viscoelastic Material Parameters of Adhesives in Automotive Applications for Numerical Simulations using Genetic Algorithms
Göhler, J.; Michel, B.; Schaper, M.K. | Conference Paper |
| 2005 | Implementation of eco design in the electronics sector
Szendiuch, I.; Schischke, K. | Conference Paper |
| 2005 | In 80 Tagen um die Welt - Wenn aus Sand Computer werden und aus Computern Sand
Schischke, K. | Book Article |
| 2005 | Interactive CSG trees inside complex scenes
Ohlenburg, J.; Müller, J. | Conference Paper |
| 2005 | Is there a linkage between bioaccumulation and the effects of alkylphenols on male breams (Abramis brama)?
Klein, R.; Bartel, M.; He, X.; Müller, J.; Quack, M. | Journal Article |
| 2005 | Konzepte für praxisnahe Bildungsmodule in der Mikrosystemtechnik
Schischke, K.; Kerl, R.; Kalisch, C. | Conference Paper |
| 2005 | Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Marking of Electronic Components and Board Assemblies as RoHS Compatible: Information in the Supply Chain and Logistics
Stobbe, I.; Deubzer, O.; Griese, H.; Reichl, H. | Conference Paper |
| 2005 | Materials Trends in Electronics - Life Cycle Implications
Schischke, K.; Griese, H.; Mueller, J.; Reichl, H.; Zuber, K.H. | Conference Paper |
| 2005 | Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F. | Conference Paper |
| 2005 | Micro and nanomechanical Deformation Analysis at Materials Interfaces
Keller, J.; Michel, B. | Conference Paper |
| 2005 | Microreliability, Nanoreliability - Reliability approach for the micro-nano interface region
Michel, B. | Conference Paper |
| 2005 | "Microreliability", "Nanoreliability" - Zuverlässigkeitsbewertung von Mikro- und Nanokomponenten unter Anwendung der Bruchmechanik
Michel, B. | Conference Paper |
| 2005 | Microreliability, Nanoreliability- Zuverlässigkeitsbewertung von Polymer-Verbundsystemen im Mikro- und Nanobereich
Michel, B. | Conference Paper |
| 2005 | Mikroprüftechnik
Michel, B.; Walter, H. | Book Article |
| 2005 | Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2005 | Nanodac - a method for fracture mechanical characterization on the nanoscale
Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2005 | Nanodeformation analysis near small cracks by means of nanoDAC technique
Michel, B.; Keller, J. | Conference Paper |
| 2005 | Nanoreliability - lifetime estimation for nanotechnology applications based on nanoDAC and FIBDAC techniques
Michel, B.; Keller, J. | Conference Paper |
| 2005 | Nanoreliability for mechanically loaded devices
Vogel, D.; Sabate, N.; Wunderle, B.; Keller, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2005 | Nanoreliability-combined simulation and testing
Michel, B. | Conference Paper |
| 2005 | Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2005 | A new approach to micro deformation analysis by finite element based digital image correlation
Kühnert, R.; Meyer, R.; Vogel, D.; Michel, B. | Abstract |
| 2005 | Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Conference Paper |
| 2005 | Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B. | Conference Paper |
| 2005 | Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A. | Conference Paper |
| 2005 | Öko-Design in der Elektronik: Umweltfreundliche, leicht zu recycelnde Materialien bzw. Materialverbunde sind gefragt
Middendorf, A. | Journal Article |
| 2005 | Packaging reliability research on the way from micro to nano
Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | Probabilistic Approaches for Fracture and Reliability Estimations of Microsystems
Winkler, T.; Michel, B.; Wunderle, B. | Conference Paper |
| 2005 | Prüfung und Zuverlässigkeitsbewertung für die Mikrosystemtechnik im Mikro- und Nanobereich
Michel, B.; Keller, J. | Conference Paper |
| 2005 | Recombinant anti-EGFR immunotoxin 425(scFv)-ETA' demonstrates anti-tumor activity against disseminated human pancreatic cancer in nude mice
Bruell, D.; Bruns, C.J.; Yezhelyev, M.; Huhn, M.; Müller, J.; Ischenko, I.; Decken, V. von der; Fischer, R.; Finnern, R.; Jauch, K.W.; Barth, S. | Journal Article |
| 2005 | Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B. | Conference Paper |
| 2005 | Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Conference Paper |
| 2005 | Reliability on the Micro- and Nano-Scale - Experiment and Simulation
Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | Reliability Testing of Polytronics Components in the Micro-Nano Region
Michel, B.; Dudek, R.; Walter, H. | Conference Paper |
| 2005 | Renewable resources for use in printed circuit boards
Nägele, H.; Pfitzer, J.; Lehnberger, C.; Landeck, H.; Birkner, K.; Viebahn, U.; Scheel, W.; Schmidt, R.; Hagelüken, M.; Müller, J. | Journal Article |
| 2005 | State of the Art in Material Declarations: Compliance Management and Usability for Eco-Design
Schischke, K.; Griese, H.; Mueller, J.; Stobbe, I. | Conference Paper |
| 2005 | Testing at Micro and Nanoscale
Michel, B. | Conference Paper |
| 2005 | Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | Thermal and mechanical reliability analysis of an anisotropic magneto-resistive current measurement sensor
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Doering, R.; Hoelzl, J.; Michel, B. | Conference Paper |
| 2005 | Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B. | Conference Paper |
| 2005 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Journal Article |
| 2005 | Thermo-mechanical and fracture mechanical characterization of lead-free solder joints in microelectronics
Walter, H.; Déplanque, S.; Nüchter, W.; Wunderle, B.; Michel, B. | Conference Paper |
| 2005 | Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H. | Conference Paper |
| 2005 | Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F. | Conference Paper |
| 2005 | Towards sustainable solutions
Griese, H. | Conference Paper |
| 2005 | Transition to lead free soldering - a great chance for a better understanding of materials and processes and green electronics
Müller, J.; Griese, H.; Schischke, K.; Stobbe, L. | Conference Paper |
| 2005 | A Tribute to Albert Einstein: Fraunhofer Einstein-Ehrung; Berlin, 05.04.2005
Michel, B. | Journal Issue |
| 2005 | Die Uhr tickt: Die Europäische Elektronikindustrie macht sich fit für die Ökodesign-Richtlinie
Schischke, K.; Mueller, J. | Journal Article |
| 2005 | Vibration Analyses for Function and Reliability Estimation of Automotive Sensors by Laser Vibrometry
Rümmler, N.; Schnitzer, R.; Dost, Mi.; Michel, B. | Conference Paper |
| 2005 | Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Conference Paper |
| 2005 | Volume modelling and rendering based on 3D voxel grids
Müller, J. | Thesis |
| 2005 | Zuverlässigkeit von Komponenten der Mikrosystemtechnik durch Einbeziehung von Nanoanalytik und Nanomechanik
Michel, B.; Wunderle, B.; Gollhardt, A.; Bombach, C.; Keller, J. | Conference Paper |
| 2005 | Zuverlässigkeitskonzepte von "Mikro bis Nano" - Neue Anforderungen und Möglichkeiten der Zuverlässigkeitsbewertung für die Mikrosystemtechnik
Michel, B. | Conference Paper |
| 2004 | Adhesives for specific requirements in production of MST-components
Dörfler, R.; Jansen, I.; Müller, J.; Beyer, E. | Book Article |
| 2004 | Beyond the Walls of Semiconductor Fabs: Energy intensity of high grade materials
Plepys, A.; Schischke, K. | Conference Paper |
| 2004 | Biogaseinsatz bei Mikrogasturbinen - Pilotanlage Gut Eichhof
Mueller, J. | Conference Paper |
| 2004 | Bragg Gitter in Polymer- und Glasfasern: Dehnungs- und Temperaturbestimmung in der Mikroelektronik und Mechatronik
Alt, T.; Badstübner, K.; Ansorge, F.; Michel, B.; Reichl, H. | Conference Paper |
| 2004 | Bruchmechanische Analyse von viskoelastischen Werkstoffen in elektronischen Bauteilen
Wittler, O. | Dissertation Fulltext |
| 2004 | Characterization approaches of nanoscale modified plastics
Vogel, D.; Keller, J.; Michel, B.; Holst, M.; Muzic, M. | Conference Paper |
| 2004 | Characterization of materials with nanoscopic filler particles by AFM techniques
Vogel, D.; Keller, J.; Michel, B. | Conference Paper |
| 2004 | Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Determination of local stress intensity factor at crack tip using image correlation techniques
Tsai, Y.; Keller, J.; Eylon, D.; Vogel, D.; Michel, B.; Meyendorf, N. | Conference Paper |
| 2004 | Displacement and strain field measurements from SPM images
Keller, J.; Vogel, D.; Schubert, A.; Michel, B. | Book Article |
| 2004 | Driving forces for future electronics: Joint International Congress and Exhibition Electronics Goes Green 2004+; September 6 - 8, 2004, Berlin, Germany. Proceedings
Reichl, H.; Griese, H.; Pötter, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Conference Proceedings |
| 2004 | Environmental Assessment of Future Smart Card Manufacturing using Embedded Chip Technology
Andræ, A.S.G.; Chen, C.; Schischke, K.; Hagelueken, M.; Liu, J. | Conference Paper |
| 2004 | Environmental compatibility of electronics - a key towards local and global sustainable development
Griese, H.; Stobbe, L.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2004 | Environmental management in semiconductor and printed circuit board industry in India - Part I: Survey results and case studies
Pandey, U.C.; Sethi, V.C.; Schischke, R.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Environmental management in semiconductor and printed circuit board industry in India - Part II: Benchmarking and international best practice sharing
Schischke, K.; Pandey, U.C.; Sethi, V.C.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen
Deplanque, S.; Nüchter, W.; Wunderle, B.; Walter, H.; Michel, B. | Conference Paper |
| 2004 | FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Book Article |
| 2004 | Foreword to the special section of the Asian Green Electronics Conference (AGEC)
Liu, J.; Griese, H.J.; Chan, Y.-C. | Journal Article |
| 2004 | Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Gebrauchte Rechner sind grün
Schischke, K. | Journal Article |
| 2004 | Green Electronics Trends - Meeting the Requirements of the European Market
Schischke, K.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Implementing Cleaner Production in Semiconductor and Printed Circuit Board Industry in India
Sethi, V.C.; Pandey, U.C.; Schischke, K.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B. | Conference Paper |
| 2004 | Increased reliability through assessment of standard components with life cycle units
Buchholz, A.; Middendorf, A.; Priyadip, R.; Reichl, H.; Seliger, G. | Conference Paper |
| 2004 | Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 2004 | Ion-assisted deposition processes: Industrial network IntIon
Ehlers, H.; Becker, K.-J.; Beckmann, R.; Beermann, N.; Brauneck, U.; Fuhrberg, P.; Gäbler, D.; Jakobs, S.; Kaiser, N.; Kennedy, M.; König, F.; Laux, S.; Müller, J.C.; Rau, B.; Riggers, W.; Ristau, D.; Schäfer, D.; Stenzel, O. | Conference Paper |
| 2004 | IZM/EE-Toolbox - effiziente Screening-Bewertungsmethoden für ein Design umweltverträglicher elektronischer Produkte und Prozesse
Griese, H.; Stobbe, I.; Deubzer, O.; Hagelüken, M.; Middendorf, A.; Müller, J.; Pötter, H.; Schischke, K.; Zuber, K.-H. | Book Article |
| 2004 | The lead-free challenge: Materials for assembly and packaging
Schischke, K.; Jung, E. | Journal Article |
| 2004 | The Life Cycle of Mobile Phones - A School Teaching Project
Schmidt, C.; Wichmann, A.; Middendorf, A.; Schischke, K. | Conference Paper |
| 2004 | Life cycle thinking for green electronics: Basics in EcoDesign and the UNEP/SETAC life cycle initiative
Mueller, J.; Griese, H.; Schischke, K.; Stobbe, I.; Norris, G.A. | Conference Paper |
| 2004 | Life-cycle information units for monitoring and identification of product use conditions
Middendorf, A.; Buchholz, A.; Hefer, J.; Reichl, H.; Schrank, K.; Seliger, G. | Conference Paper |
| 2004 | Materials mechanics for system integration and packaging
Michel, B. | Journal Issue |
| 2004 | MAVIN - Ein neues Telekonferenzsystem für die Kardiologie
Lukas, U. von; Voskamp, J.; Boll, B.; Müller, J. | Book Article |
| 2004 | Micro Systems Design Work Flows - Implementation of Environmental Driven Criteria
Ong, K.; Schischke, K.; Kasper, M.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2004 | MicroDAC - ein Messverfahren zur Ermittlung von Werkstoffeigenschaften im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Microreliability, nanoreliability - issues for MEMS
Michel, B. | Book Article |
| 2004 | Microsecurity - important capabilities for homeland security challenges
Michel, B.; Winkler, T. | Journal Article |
| 2004 | Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B. | Journal Article |
| 2004 | Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Neue Regeln für alte Elektronik: Gesetzgebung für Elektronikschrott auf der Zielgeraden
Schischke, K. | Journal Article |
| 2004 | Parametric FE-approach to flip-chip reliability under various loading conditions
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H. | Journal Article |
| 2004 | Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Conference Paper |
| 2004 | Polytronics: Technology trends and environmental issues
Bock, K.; Burghart, M.; Klink, G.; Pötter, H.; Müller, J.; Hagelüken, M. | Conference Paper |
| 2004 | Quality Challenges of Reused Components
Stobbe, I.; Pötter, H.; Griese, H.; Fotheringham, G.; Reichl, H. | Conference Paper |
| 2004 | Reliability in Experiment and Simulation on the Micro- and Nano Scale
Wunderle, B.; Michel, B. | Conference Paper |
| 2004 | Reliability of SnPb and PB-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B. | Conference Paper |
| 2004 | Renewable resources for use in printed circuit boards
Nägele, H.; Pfitzer, J.; Lehnberger, C.; Landeck, H.; Birkner, K.; Viebahn, U.; Scheel, W.; Schmidt, R.; Hagelüken, M.; Müller, J. | Conference Paper |
| 2004 | Retrospective monitoring of alkylphenols and alkylphenol monoethoxylates in aquatic biota from 1985 to 2001: Results from the German environmental specimen bank
Wenzel, A.; Böhmer, W.; Müller, J.; Rüdel, H.; Schröter-Kermani, C. | Journal Article |
| 2004 | Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation
Griese, H.; Pötter, H.; Schischke, K.; Ness, O.; Reichl, H. | Conference Paper |
| 2004 | Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F. | Conference Paper |
| 2004 | Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F. | Conference Paper |
| 2004 | Sustainable Development of Microelectronic Technology Processes
Griese, H.; Schischke, K.; Reichl, H.; Stobbe, L. | Conference Paper |
| 2004 | Sustainable Use and Restrictions of Materials in the Electronics Industry
Deubzer, O.; Griese, H.; Reichl, H.; Madsen, J.; Wel, H. van der | Conference Paper |
| 2004 | Technological Innovation started by Environmental Concerns
Müller, J.; Hagelüken, M.; Griese, H.; Reichl, H. | Conference Paper |
| 2004 | Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B. | Conference Paper |
| 2004 | Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2004 | Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2004 | Thermo-mechanical reliability of power flip-chip cooling concepts
Wunderle, B.; Dudek, R.; Michel, B.; Reichl, H. | Conference Paper |
| 2004 | Verfahren zum selektiven Gewinnen von Gold aus goldhaltigen Materialien
Schmidt, R.; Mueller, J.; Griese, H.; Hannemann, M.; Zuber, K. | Patent Fulltext |
| 2004 | Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E. | Book Article |
| 2004 | Welcome to the Jungle - Survival of the Fittest Environmental Screening Indicators?
Hagelüken, M.; Schischke, K.; Müller, J.; Griese, H. | Conference Paper |
| 2004 | The world of electronic packaging and system integration: Anniversary edition 60th birthday of Herbert Reichl
Michel, B.; Aschenbrenner, R. | Book |
| 2004 | Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B. | Conference Paper |
| 2004 | Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und Nanomesstechniken in Kopplung zur Simulation
Michel, B.; Dudek, R.; Keller, J.; Luczak, F. | Conference Paper |
| 2003 | Bestimmung der Querkontraktionszahl von Polymeren mittels Laserextensometrie und Grauwertkorrelationsanalyse
Walter, H.; Vogel, D.; Michel, B.; Grellmann, W.; Bierögel, C. | Conference Paper |
| 2003 | Bleifreie elektronische Baugruppen: Umweltaspekte
Müller, J.; Griese, H. | Conference Paper |
| 2003 | Challenges of advanced mechanical micro testing techniques
Walter, H.; Grellmann, W.; Seidler, S.; Michel, B. | Abstract |
| 2003 | Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B. | Conference Paper |
| 2003 | Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
Spraul, M.; Nüchter, W.; Möller, A.; Schubert, A.; Michel, B. | Conference Paper |
| 2003 | Continuation and change
Michel, B.; Bhushan, B. | Journal Article |
| 2003 | Cost-effectiveness and environmental aspects of flip chip bumping for system integration
Schischke, K.; Griese, H.; Müller, J.; Reichl, H. | Journal Article |
| 2003 | Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B. | Conference Paper |
| 2003 | Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P. | Conference Paper |
| 2003 | Embedded Life-Cycle Information Module
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H. | Conference Paper |
| 2003 | Embedded life-cycle information module for monitoring and identification of product use conditions
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H. | Conference Paper |
| 2003 | Environmental Risks of Mass Produced, Small and Cheap Products Regarding End-of-Life Scenarios
Müller, J.; Griese, H.; Hagelüken, M.; Reichl, H. | Conference Paper |
| 2003 | Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2003 | Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B. | Conference Paper |
| 2003 | The GA octodinucleotide repeat binding factor BBR participates in the transcriptional regulation of the homeobox gene Bkn3
Santi, L.; Wang, Y.; Stile, M.R.; Berendzen, K.; Wanke, D.; Roig, C.; Pozzi, C.; Müller, K.; Müller, J.; Rohde, W.; Salamini, F. | Journal Article |
| 2003 | High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Journal Article |
| 2003 | How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B. | Conference Paper |
| 2003 | Integrating ecodesign into the development of technology processes
Griese, H.; Schischke, K.; Reichl, H.; Suga, T.; Stobbe, L. | Conference Paper |
| 2003 | Integration of environmental assessment tools in product development
Middendorf, A.; Petermann, C.; Reichl, H.; Griese, H.; Schrödl, J.; Reiner, A. | Conference Paper |
| 2003 | Investigations on low cycle fatigue of electrodeposited thin copper and nickel films
Dudek, R.; Walter, H.; Michel, B.; Zapf, J. | Conference Paper |
| 2003 | Konzeption und Test von Firewallmechanismen für Residential Gateways
Müller, J. | Thesis |
| 2003 | The Micro Materials Center Berlin (MMCB)
Michel, B.; Winkler, T. | Abstract |
| 2003 | Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B. | Journal Article |
| 2003 | MikroNetz: Development of Switched Power Supplies using Microsystem
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2003 | MikroNetz - development of switched power supplies using Microsystem technology
Middendorf, A.; Griese, H.; Reichl, H. | Conference Paper |
| 2003 | Morphologie-Zähigkeits-Korrelationen an modifizierten Epoxidharzsystemen mittels bruchmechanischer Prüfmethoden an Miniaturprüfkörpern
Walter, H.; Michel, B.; Bierögel, C.; Grellmann, W. | Conference Paper |
| 2003 | Multimedia workplace of the future
Fischer, Kai; Hoyer, J.; Laube, Manfred; Müller, J. P.; Schirmer, Jürgen; Steinmann, R.; Weiss, Manfred; Wiegand, Dietmar | Conference Paper |
| 2003 | nanoDAC - A Method of Reliability Analysis for Micro and Nano Technology
Vogel, D.; Michel, B. | Abstract |
| 2003 | Nanomechanics for Electronics in Automotive Application
Keller, J.; Michel, B. | Conference Paper |
| 2003 | Recyclinggerechtes Design im Aufwind
Müller, J.; Griese, H. | Journal Article |
| 2003 | Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B. | Conference Paper |
| 2003 | Reliability of micro- and nanosystems
Michel, B. | Conference Paper |
| 2003 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Journal Article |
| 2003 | Schadensanalyse an Komponenten der Mikrosystemtechnik und Mikroelektronik
Faust, W.; Dost, M.; Michel, B. | Conference Paper |
| 2003 | A severe loss. In memoriam Dr.-Ing. Andreas Schubert
Michel, B. | Journal Article |
| 2003 | Simulation and reliability on the way from micro to nano
Michel, B.; Wunderle, B. | Conference Paper |
| 2003 | State-of-the-art mid-frequency sputtered ZnO films for thin film silicon solar cells and modules
Müller, J.; Schöpe, G.; Kluth, O.; Rech, B.; Sittinger, V.; Szyszka, B.; Geyer, R.; Lechner, P.; Schade, H.; Ruske, M.; Dittmar, G.; Bochem, H.-P. | Journal Article |
| 2003 | Strategies to integrate life cycle engineering into technological developments - the 3G Greenbook Initiative
Griese, H.; Müller, J.; Stobbe, L.; Reichl, H.; Rick, K. | Conference Paper |
| 2003 | A Study on the Trace of Appropriate EcoDesign Strategies: Applying
Chung, J.; Lee, H.; Middendorf, A.; Zuber, K.H. | Conference Paper |
| 2003 | A study on the trace of appropriate ecodesign strategies applying "Instep-DfE" and "IZM-EE toolbox" on a PDA
Chung, J.; Lee, H.; Middendorf, A.; Zuber, K.-H. | Conference Paper |
| 2003 | Thermal and mechanical analysis of micromachined gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R. | Journal Article |
| 2003 | Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B. | Conference Paper |
| 2003 | Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H. | Conference Paper |
| 2003 | Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H. | Conference Paper |
| 2003 | X-free mobile electronics - Strategy for sustainable development
Mueller, J.; Griese, H.; Hagelüken, M.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2003 | Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Auersperg, J. | Conference Paper |
| 2002 | a46Parametric FE-approach to flip chip reliability under various loading situations
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2002 | Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Journal Article |
| 2002 | Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B. | Journal Article |
| 2002 | Development of environmentally sound gold plating and recycling processes
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R. | Conference Paper |
| 2002 | Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Ecotoxicological testing of gas oils (daphnia magna test)
Müller, J.; Wenzel, A.; Hensel, R. | Book |
| 2002 | Electronics Goes Green 2000+. A Challenge for the Next Millenium. Proceedings. Vol. 2: Special Lectures
Griese, H.; Pötter, H.; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Conference Proceedings |
| 2002 | Fabric-based communication
Kallmayer, C.; Griese, H. | Journal Article |
| 2002 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2001/2002
Michel, B. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Electronic Publication Fulltext |
| 2002 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2001/2002
Michel, B.; Winkler, T.; Hinkel, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Annual Report |
| 2002 | Generalized fracture mechanical integral concept J/sub G/ and its application in microelectronic packaging technology
Badri Ghavifekr, H.; Michel, B. | Journal Article |
| 2002 | Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B. | Conference Paper |
| 2002 | Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Conference Paper |
| 2002 | Micro andnanoDAC - a powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D. | Conference Paper |
| 2002 | Micro Materials Center Berlin - materials research for MEMS packaging
Michel, B.; Winkler, T. | Conference Paper |
| 2002 | Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T. | Conference Paper |
| 2002 | Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article |
| 2002 | Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Micromaterials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T. | Conference Paper |
| 2002 | A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G. | Conference Paper |
| 2002 | Occurrence of phthalates and bisphenol A and F in the environment
Fromme, H.; Küchler, T.; Otto, T.; Pilz, K.; Müller, J.; Wenzel, A. | Journal Article |
| 2002 | Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B. | Conference Paper |
| 2002 | Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H. | Conference Paper |
| 2002 | Special issue containing selected papers from the E-MRS proceedings of symposium-j - materials in microtechnologies and microsystems - Strasbourg, France - june 5-8, 2001. Preface
Morante, J.R.; Barbier, D.; Michel, B. | Journal Article |
| 2002 | Special issue on Poly'2000, London - Foreword
Michel, B.; Kishimoto, K. | Journal Article |
| 2002 | State-of-the-art mid-frequency sputtered ZnO films for thin film silicon solar cells and modules
Müller, J.; Schöpe, G.; Kluth, O.; Rech, B.; Sittinger, V.; Szyszka, B.; Geyer, R.; Lechner, P.; Schade, H.; Ruske, M.; Dittmar, G.; Bochem, H.-P. | Conference Paper |
| 2002 | Studies on moisture diffusion and popcorn cracking
Dudek, R.; Walter, H.; Michel, B. | Conference Paper |
| 2002 | Synthetische Moschusverbindungen in Umweltproben: Vortrag gehalten auf den Jahrestagungen GDCh-Fachgruppe Umweltchemie und Ökotoxikologie. SETAC-GLB. Braunschweig, 6.-8. Oktober 2002
Wenzel, A.; Müller, J.; Böhmer, W. | Presentation Fulltext |
| 2002 | Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B. | Conference Paper |
| 2002 | Using Life Cycle Information to Improve the Reliability of Electronic Assemblies
Middendorf, A.; Griese, H.; Neß, O.; Reichl, H. | Conference Paper |
| 2002 | Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies
Middendorf, A.; Griese, H.; Reichl, H.; Grimm, W. | Conference Paper |
| 2002 | Vorrichtung zur Transformation einer Primaerspannung in eine Sekundaerspannung mit mindestens einem Schaltnetzteil
Geneiss, V.; Middendorf, A.; Griese, H. | Patent Fulltext |
| 2001 | Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B. | Journal Article |
| 2001 | Applied EcoDesign - Product characterization by sustainability indices
Griese, H.; Deubzer, O.; Müller, J.; Stobbe, L. | Conference Paper |
| 2001 | Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil I
Zuber, K.-H.; Griese, H.; Müller, J. | Journal Article |
| 2001 | Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil II
Zuber, K.-H.; Griese, H.; Müller, J. | Journal Article |
| 2001 | Calculating environmentally weighted recyclability of consumer eletronic products using different environmental assessment models
Huisman, J.; Stevels, A.; Middendorf, A. | Conference Paper |
| 2001 | Challenging the Future - Ways Towards Sustainable Green Electronics
Müller, J.; Deubzer, O.; Griese, H.; Pötter, H.; Reichl, H. | Book Article |
| 2001 | Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B. | Conference Paper |
| 2001 | Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B. | Conference Paper |
| 2001 | Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J. | Conference Paper |
| 2001 | Eco-analysis of wafer level bumping
Schischke, K.; Griese, H.; Müller, J. | Conference Paper |
| 2001 | Electrical-properties of multicrystalline silicon produced by electromagnetic casting process - degradation and improvement
Boudaden, J.; Loghmarti, M.; Ballutaud, D.; Riviere, A.; Ludemann, R.; Slaoui, A.; Müller, J.C. | Journal Article |
| 2001 | Elektronische Bauelemente: Qualitätssicherung bei der automatischen Entstückung
Stobbe, I.; Middendorf, A. | Journal Article |
| 2001 | Environmental aspects of microelectronics
Muller, J.; Griese, H.; Zuber, K.H.; Reichl, H.; Schischke, K. | Conference Paper |
| 2001 | Environmental friendly plating and deplating of gold in PCB manufacturing
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R. | Conference Paper |
| 2001 | Environmental impacts of a mobile phone
Oiva, L.; Oppermann, W.; Middendorf, A.; Stobbe, I. | Journal Article |
| 2001 | Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B. | Conference Paper |
| 2001 | Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H. | Journal Article |
| 2001 | Fracture mechanics characterisation of epoxy resins by means of mini-compact-tension-specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Henning, H.; Michel, B. | Conference Paper |
| 2001 | Fracture mechanics testing of modified epoxy resins with mini-compact tension (CT) specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B. | Book Article |
| 2001 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2000
Michel, B.; Winkler, T.; Hinkel, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Annual Report |
| 2001 | From modular MEMS to a modular microfactory - the hybrid microfactory?
Großer, V.; Michel, B.; Schuenemann, M.; Reichl, H. | Journal Article |
| 2001 | Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B. | Journal Article |
| 2001 | Global Responsibility of Electronics: Products and Sustainability
Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | Global responsibility of electronics - Products and sustainability
Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | Green polytronics
Griese, H.; Müller, J.; Hagelüken, M.; Reichl, H.; Zuber, K.-H. | Conference Paper |
| 2001 | Highest efficiency rapid thermal processed multicrystalline silicon solar-cells
Noel, S.; Lautenschlager, H.; Müller, J.C. | Journal Article |
| 2001 | How Electronics Technology Trends Translate into Environmental Trends
Nissen, N.F.; Griese, H. | Conference Paper |
| 2001 | In-situ-Messungen an Komponenten der Mikroelektronik und Mikrosystemtechnik mit optischen Methoden
Faust, W.; Bombach, C.; Pritzke, B.; Michel, B. | Conference Paper |
| 2001 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Journal Article |
| 2001 | Interface cracks and reliability in microsystems
Michel, B.; Auersperg, J.; Schubert, A.; Kühnert, R. | Conference Paper |
| 2001 | Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Conference Paper |
| 2001 | Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B. | Journal Article |
| 2001 | Lead-free soldering - Future aspects of toxicity, energy and resource consumption
Deubzer, O.; Griese, H.; Suga, T. | Conference Paper |
| 2001 | Lead-free soldering - Toxicity, energy and resource consumption
Deubzer, O.; Hamano, H.; Suga, T.; Griese, H. | Conference Paper |
| 2001 | Life cycle inventory analysis and identification of environmentally significant aspects in semiconductor
Schischke, K.; Stutz, M.; Ruelle, J.-P.; Griese, H.; Reichl, H. | Conference Paper |
| 2001 | Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H. | Journal Article |
| 2001 | Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B. | Conference Paper |
| 2001 | LOESUNG UND VERFAHREN ZUM STROMLOSEN ABSCHEIDEN VON GOLDSCHICHTEN
Scheel, W.; Hannemann, M.; Schmidt, R.; Mueller, J.; Meyer, H.; Rehak, W. | Patent Fulltext |
| 2001 | Mechanical reliability of MEMS-structures under shock load
Wagner, U.; Franz, J.; Schweiker, M.; Bernhard, W.; Müller-Fiedler, R.; Michel, B.; Paul, O. | Journal Article |
| 2001 | Meeting data requirements by using the IZM/EE-toolbox for a screening assessment of the environmental impacts of electronic products
Stobbe, I.; Middendorf, A.; Schischke, K.; Petermann, C.; Griese, H.; Müller, J.; Reichl, H. | Conference Paper |
| 2001 | Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B. | Journal Article |
| 2001 | Micro materials Center Berlin
Michel, B.; Schubert, A.; Winkler, T. | Journal Article |
| 2001 | Microcrack evaluation for electronics components by AFM nano-DAC deformation measurements
Vogel, D.; Michel, B. | Conference Paper |
| 2001 | The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D. | Conference Paper |
| 2001 | MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B. | Journal Article |
| 2001 | Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Conference Paper |
| 2001 | Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Conference Paper |
| 2001 | mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B. | Conference Paper |
| 2001 | On the way to green mobile products
Müller, J.; Griese, H.; Reichl, H. | Conference Paper |
| 2001 | Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B. | Journal Article |
| 2001 | Optimized rapid thermal-process for high-efficiency silicon solar-cells
Noel, S.; Slaoui, A.; Peters, S.; Lautenschlager, H.; Schindler, R.; Müller, J.C. | Journal Article |
| 2001 | Preface. Editorial
Michel, B.; Schubert, A. | Journal Article |
| 2001 | Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B. | Conference Paper |
| 2001 | Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R. | Conference Paper |
| 2001 | Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R. | Journal Article |
| 2001 | Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G. | Conference Paper |
| 2001 | Upscaling of texture-etched zinc oxide substrates for silicon thin film solar cells
Müller, J.; Schöpe, G.; Kluth, O.; Bech, R.; Ruske, M.; Trube, J.; Szyszka, B.; Jiang, X.; Bräuer, G. | Conference Paper |
| 2001 | Verbundwerkstoffe und Werkstoffverbunde in der Mikrosystemtechnik
Michel, B. | Conference Paper |
| 2001 | Vibration measurements of micro assemblies by means of laser techniques
Rümmler, N.; Schnitzer, R.; Michel, B. | Journal Article |
| 2001 | Werkzeuge für Grüne Elektronik
Middendorf, A.; Schischke, K.; Stobbe, I.; Griese, H.; Reichl, H. | Journal Article |
| 2000 | Analyses of flip-chip attach reliability
Dudek, R.; Schubert, A.; Michel, B. | Conference Paper |
| 2000 | Analysis of micromaterials
Schwencke, B.; Müller, J.; Griese, H. | Conference Paper |
| 2000 | Analytics of printed circuit boards for environmental assessment
Schwencke, B.; Müller, J.; Griese, H.; Altendorf, P. | Conference Paper |
| 2000 | Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T. | Journal Article |
| 2000 | Automated optical measurements under vacuum
Hillmann, V.; Großer, V.; Gentzsch, S.; Bloch, H.; Michel, B. | Conference Paper |
| 2000 | Case Study on the Environmental Impacts of a Mobile Phone
Oiva, L.; Oppermann, W.; Middendorf, A.; Zuber, K.-H.; Stobbe, I. | Conference Paper |
| 2000 | Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B. | Conference Paper |
| 2000 | Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W. | Conference Paper |
| 2000 | Database for materials in micro systems
Villain, J.; Müller, T.; Michel, B.; Totzauer, W. | Conference Paper |
| 2000 | Deformation behavior of micro mirror arrays under optical power
Kurth, S.; Kehr, K.; Kaufmann, C.; Faust, W.; Dötzel, W.; Michel, B. | Conference Paper |
| 2000 | Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B. | Conference Paper |
| 2000 | Ecological and Economical Effects of Lead Free Soldering
Deubzer, O.; Suga, T.; Griese, H. | Conference Paper |
| 2000 | EE-Toolbox - A modular assessment system for the environmental optimization of electronics
Middendorf, A.; Nissen, N.F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I. | Conference Paper |
| 2000 | Environmental assessment of lead free interconnection systems
Griese, H.; Müller, J.; Reichl, H.; Somi, G.; Stevels, A.; Zuber, K.-H. | Conference Paper |
| 2000 | Environmental Assessment Using the IZM/EE Toolbox
Nissen, N.F.; Griese, H.; Müller, J.; Middendorf, A.; Stobbe, I.; Reichl, H.; Funk, T. | Conference Paper |
| 2000 | Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B. | Conference Paper |
| 2000 | Evaluation of the Toxic Effects of Waste Liquid Crystal Displays (LCD) to the Environment
Rau, F.; Kalnowski, G.; Heinze, L.; Müller, J. | Conference Paper |
| 2000 | Experimental and numerical analyses of flip-chip attach reliability
Schubert, A.; Dudek, R.; Michel, B. | Conference Paper |
| 2000 | Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B. | Conference Paper |
| 2000 | Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K. | Conference Paper |
| 2000 | Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | Fracture electronics and thermomechanical compatibility (TMC) of microcomponents in high tech systems
Michel, B.; Winkler, T. | Conference Paper |
| 2000 | Fracture mechanics characterization of epoxy resins with Mini-Compact-Tension(CT)-Specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B. | Conference Paper |
| 2000 | Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1999
Michel, B. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin | Annual Report |
| 2000 | Future Power Supplies for Portable Electronics and Their Environmental Issues
Hahn, R.; Müller, J. | Conference Paper |
| 2000 | Implementation of Environmental Issues in SMEs
Müller, J.; Griese, H.; Middendorf, A.; Nissen, N.F.; Teller, M. | Conference Paper |
| 2000 | In situ measurement of deformations on microelectronic components by microscopic methods
Faust, W.; Bombach, C.; Michel, M.; Michel, B. | Conference Paper |
| 2000 | Industrial Working Group for Lead Free Interconnection Systems in Electronics
Hahn, R.; Müller, J. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H. | Conference Paper |
| 2000 | Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Conference Paper Fulltext |
| 2000 | Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B. | Conference Paper |
| 2000 | Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B. | Conference Paper |
| 2000 | Materials science and engineering - a major topic in the future of microelectronic packaging
Reichl, H.; Michel, B.; Schubert, A. | Conference Paper |
| 2000 | Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B. | Conference Paper |
| 2000 | Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B. | Conference Paper |
| 2000 | Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B. | Conference Paper |
| 2000 | Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F. | Conference Paper |
| 2000 | A micro system tool for improved maintenance, quality assurance and recycling
Grudzien, W.; Seliger, G.; Middendorf, A.; Reichl, H. | Conference Paper |
| 2000 | MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B. | Conference Paper |
| 2000 | Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B. | Conference Paper |
| 2000 | Mode shape analysis of microstructures by means of laser-optical methods
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B. | Conference Paper |
| 2000 | Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B. | Conference Paper |
| 2000 | New investigations in materials research by confocal laser scanning microscopy
Kunath-Fandrei, G.; Faust, W.; Ullmann, P.; Michel, B. | Conference Paper |
| 2000 | Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R. | Conference Paper |
| 2000 | Package reliability studies by experimental and numerical analysis
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H. | Conference Paper |
| 2000 | Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B. | Book Article |
| 2000 | Rapid prototyping of microcomponents and demonstrators in micro system technology
Fleischer, L.; Faust, W.; Dost, M.; Michel, B.; Vogel, J.; Zeidler, H. | Conference Paper |
| 2000 | Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K. | Conference Paper |
| 2000 | Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B. | Conference Paper |
| 2000 | Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R.; Berek, H.; Fritsch, T.; Michel, B. | Journal Article |
| 2000 | Results of Experimental Vibration Measurements as Input of Numerical Reliability Valuations
Schnitzer, R.; Rümmler, N.; Dudek, R.; Michel, B. | Conference Paper |
| 2000 | Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B. | Conference Paper |
| 2000 | Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B. | Conference Paper |
| 2000 | Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B. | Conference Paper |