Fraunhofer-Gesellschaft

YearTitle/AuthorDocument Type
Micromaterials and nanomaterials
Michel, B.
Journal
2019A comparison of log Kow (n‑octanol-water partition coefficient) values for non‑ionic, anionic, cationic and amphoteric surfactants determined using predictions and experimental methods
Hodges, Geoff; Eadsforth, Charles; Bossuyt, Bart; Bouvy, Alain; Enrici, Marie‑Helene; Geurts, Marc; Kotthoff, Matthias; Michie, Eleanor; Miller, Dennis; Müller, Josef; Oetter, Gunter; Roberts, Jayne; Schowanek, Diederik; Sun, Ping; Venzmer, Joachim
Journal Article
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2019Correlation of structural and optical properties using virtual materials analysis
Badorreck, H.; Steinecke, M.; Jensen, L.; Ristau, D.; Jupé, M.; Müller, J.; Tonneau, R.; Moskovkin, P.; Lucas, P.; Pflug, A.; Grinevičiūtė, L.; Selskis, A.; Tolenis, T.
Journal Article
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2019Electrocaloric temperature change in ferroelectric Si-doped hafnium oxide (HfO2) thin films: Presentation held at 37th Spring Meeting of the European Materials Research Society, E-MRS 2019, 27-31 May 2019, Nizza
Mart, C.; Kämpfe, T.; Pätzold, B.; Rudolph, M.; Czernohorsky, M.; Müller, J.; Weinreich, W.
Presentation
2019Investigation of the temperature dependence of lithium plating onset conditions in commercial Li-ion batteries
Angeles Cabañero, Maria; Altmann, Johannes; Gold, Lukas; Boaretto, Nicola; Müller, Jana; Hein, Simon; Zausch, Jochen; Kallo, Josef; Latz, Arnulf
Journal Article
2019The role of standards in the policy debate on the EU-US trade agreement
Blind, Knut; Müller, Jo-Ann
Journal Article
201814nm Ferroelectric FinFET technology with steep subthreshold slope for ultra low power applications
Krivokapic, Z.; Rana, U.; Galatage, R.; Razavieh, A.; Aziz, A.; Liu, J.; Shi, J.; Kim, H.J.; Sporer, R.; Serrao, C.; Busquet, A.; Polakowski, P.; Müller, J.; Kleemeier, W.; Jacob, A.; Brown, D.; Knorr, A.; Carter, R.; Banna, S.
Conference Paper
2018Barrier breakdown mechanism in nano-scale perpendicular magnetic tunnel junctions with ultrathin MgO barrier
Lv, Hua; Leitao, Diana C.; Hou, Zhiwei; Freitas, Paulo P.; Cardoso, Susana; Kämpfe, Thomas; Müller, Johannes; Langer, Juergen; Wrona, Jerzy
Journal Article
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2018Datenschutz stärken, Innovationen ermöglichen. Policy paper: Wie man den Koalitionsvertrag ausgestalten sollte
Roßnagel, Alexander; Bile, Tamer; Geminn, Christian; Grigorjew, Olga; Johannes, Paul C.; Karaboga, Murat; Krämer, Nicole; Maier, Natalie; Martin, Nicholas; Müller, Johannes; Nebel, Maxi; Friedewald, Michael; Bremert, Benjamin
Report
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2018Design of a photogrammetric measurement system for displacement and deformation on machine tools
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen
Conference Paper
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Conference Paper
2018Direct determination of diffusion coefficients in commercial Li-ion batteries
Cabañero, Maria Angeles; Boaretto, Nicola; Röder, Manuel; Müller, Jana; Kallo, Josef; Latz, Arnulf
Journal Article
2018A FeFET based super-low-power ultra-fast embedded NVM technology for 22nm FDSOI and beyond
Dünkel, S.; Trentzsch, M.; Richter, R.; Moll, P.; Fuchs, C.; Gehring, O.; Majer, M.; Wittek, S.; Müller, B.; Melde, T.; Mulaosmanovic, H.; Slesazeck, S.; Müller, S.; Ocker, J.; Noack, M.; Löhr, D.-A.; Polakowski, P.; Müller, J.; Mikolajick, T.; Höntschel, J.; Rice, B.; Pellerin, J.; Beyer, S.
Conference Paper
2018High Endurance Ferroelectric Hafnium Oxide-Based FeFET Memory Without Retention Penalty
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Steinke, P.; Calvo, J.; Zimmermann, K.; Müller, J.
Journal Article
2018Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O.
Journal Article
2018Ontology-based microservices architecture for industrial assistant systems
Singer, Adrian; Wenzel, Ken; Müller, Jan; Langer, Tino; Putz, Matthias
Conference Paper
2018Silicon doped hafnium oxide (HSO) and hafnium zirconium oxide (HZO) based FeFET: A material relation to device physics
Ali, T.; Polakowski, P.; Riedel, S.; Büttner, T.; Kämpfe, T.; Rudolph, M.; Pätzold, B.; Seidel, K.; Löhr, D.; Hoffmann, R.; Czernohorsky, M.; Kühnel, K.; Thrun, X.; Hanisch, N.; Steinke, P.; Calvo, J.; Müller, J.
Journal Article
2018SmartStamp - ein Digitaler Zwilling für das Condition Monitoring an Pressen
Praedicow, Michael; Müller, Jan; Fischer, Jochen; Langer, Tino
Journal Article
2018Thermography on machine tools
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen
Conference Paper
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Conference Paper
2018Tuning parameters and their impact on ferroelectric hafnium oxide: Presentation held at Materials Research Society Spring Meeting and Exhibit, 2-6 April 2018, Phoenix, Arizona, USA
Polakowski, Patrick; Büttner, Teresa; Ali, Tarek Nadi Ismail; Riedel, Stefan; Kämpfe, Thomas; Seidel, Konrad; Müller, Johannes; Pätzold, Björn
Presentation
2017Capacitance maximization of ultra-thin Si-capacitors by atomic layer deposition of anti-ferroelectric HfO2 in high aspect ratio structures: Presentation held at 17th International Conference on Atomic Layer Deposition, ALD 2017, 15th - 18th July 2017, Denver, Colorado, USA
Riedel, Stefan; Weinreich, Wenke; Mart, Clemens; Müller, Johannes
Presentation
2017Combined 15N-Labeling and TandemMOAC Quantifies Phosphorylation of MAP Kinase Substrates Downstream of MKK7 in Arabidopsis
Huck, N.V.; Leissing, F.; Majovsky, P.; Buntru, M.; Aretz, C.; Flecken, M.; Müller, J.P.J.; Vogel, S.; Schillberg, S.; Hoehenwarter, W.; Conrath, U.; Beckers, G.J.M.
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2017A conceptual evaluation framework for promoting gender equality in research and innovation: Toolbox I - a synthesis report; EFFORTI - deliverable 3.3
Kalpazidou Schmidt, Evanthia; Bührer, Susanne; Schraudner, Martina; Reidl, Sybille; Müller, Jörg; Palmen, Rachel; Haase, Sanne; Graversen, Ebbe Krogh; Holzinger, Florian; Striebing, Clemens; Groó, Dora; Klein, Saskia; Rigler, Dorottya; Hog Utoft, Ea
Report
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2017Drivers of companies' participation in supranational standardization
Blind, Knut; Müller, Jo-Ann
Conference Paper
2017Embedding technologies for heterogeneous integration of components in PCBs-an innovative modularisation approach with environmental impact
Manessis, Dionysios; Pawlikowski, Jakub; Ostmann, Andreas; Schischke, Karsten; Aschenbrenner, Rolf; Schneider-Ramelow, Martin; Krivec, Thomas; Podhradsky, Gerhard; Lang, Klaus-Dieter
Conference Paper
2017Ergebnisse der fünften Befragungsrunde des Deutschen Normungspanels
Blind, Knut; Müller, Jo-Ann
Journal Article
2017Experimentelle Untersuchung des Beleuchtungseinflusses auf die Güte von Ellipsenmessungen
Riedel, Mirko; Deutsch, Jessica; Müller, Jens; Ihlenfeldt, Steffen
Conference Paper
2017Ferroelectric HfO2 thin film testing and whole wafer mapping with non-contact corona-Kelvin metrology
Marinskiy, D.; Polakowski, P.; Edelman, P.; Wilson, M.; Lagowski, J.; Metzger, J.; Binder, R.; Müller, J.
Journal Article
2017Funktionsprinzip der messtechnisch basierten Korrektur thermischer Verlagerungen am Versuchsträger MAX
Riedel, Mirko; Müller, Jens; Klatte, Michel; Tzanetos, Filippos
Conference Paper
2017Gewitter im Chip - Resistive Speicher für low-power Anwendungen
Seidel, Konrad; Riedel, Stefan; Kalishettyhalli Ma, Mamathamba; Polakowski, Patrick; Müller, Johannes
Conference Paper
2017Hexabromocyclododecane diastereomers in fish and suspended particulate matter from selected European waters-trend monitoring and environmental quality standard compliance
Rüdel, Heinz; Müller, Josef; Nowak, Jens; Ricking, Mathias; Klein, Roland; Kotthoff, Matthias
Journal Article
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2017Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography
Middendorf, A.; Grams, A.; Janzen, S.; Lang, K.-D.; Wittler, O.
Journal Article
2017Novel ferroelectric FET based synapse for neuromorphic systems
Mulaosmanovic, H.; Ocker, J.; Müller, S.; Noack, M.; Müller, J.; Polakowski, P.; Mikolajick, T.; Slesazeck, S.
Conference Paper
2017Photogrammetric 6DOF measurement on machine tools: Poster presented at 2nd 3D Metrology Conference, 3DMC 2017, Aachen, October 9-12, 2017
Riedel, Mirko; Deutsch, Jessica; Ihlenfeldt, Steffen; Müller, Jens
Poster
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2017Probing lithium-ion batteries' state-of-charge using ultrasonic transmission - concept and laboratory testing
Gold, Lukas; Bach, Tobias; Virsik, Wolfgang; Schmitt, Angelika; Müller, Jana; Staab, Torsten E.M.; Sextl, Gerhard
Journal Article
2017Properties of ALD ferroelectric Si-doped HfO2 characterized with noncontact Corona-Kelvin metrology: Presentation held at 17th International Conference on Atomic Layer Deposition, ALD 2017, 15th - 18th July 2017, Denver, Colorado, USA
Polakowski, Patrick; Müller, Johannes; Marinskiy, Dmitriy; Findlay, Andrew; Edelman, Piotr; Wilson, Marshall; Lagowski, Jacek; Metzger, Joachim; Binder, Robert
Presentation
2017PVD and ALD process development of advanced oxide-based RRAM-stacks
Kalishetthyhalli Mahadevaiah, Mamathamba; Müller, Johannes (Gutachter); Lakner, Hubert (Gutachter); Fischer, Wolf-Joachim (Gutachter)
Master Thesis
2017Ressourceneffizienz durch Industrie 4.0: Potenziale für KMU des verarbeitenden Gewerbes
Schebek, Liselotte; Kannengießer, Jan; Campitelli, Alessio; Fischer, Julia; Abele, Eberhard; Bauerdick, Christoph; Anderl, Reiner; Haag, Sebastian; Sauer, Alexander; Mandel, Jörg; Lucke, Dominik; Bogdanov, Ivan; Nufer, Anne-Kathrin; Steinhilper, Rolf; Böhner, Johannes; Lothes, Gerald; Schock, Christoph; Zühlke, Detlef; Plociennik, Christiane; Bergweiler, Simon; Schlegel, Andreas (Fachl. Bearb.); Kirmes, Stefan (Fachl. Bearb.); Oberender, Christof (Fachl. Bearb.); Vogt, Martin (Fachl. Bearb.)
Study
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2017Silicon-doped hafnium oxide anti-ferroelectric thin films for energy storage
Ali, F.; Liu, X.; Zhou, D.; Yang, X.; Xu, J.; Schenk, T.; Müller, J.; Schroeder, U.; Cao, F.; Dong, X.
Journal Article
2017Switching kinetics in nanoscale hafnium oxide based ferroelectric field-effect transistors
Mulaosmanovic, Halid; Ocker, Johannes; Müller, Stefan; Schroeder, Uwe; Müller, Johannes; Polakowski, Patrick; Flachowsky, Stefan; Bentum, Ralf van; Mikolajick, Thomas; Slesazeck, Stefan
Journal Article
2017Ultrasonically tinned PVD AL rear contacts on high-efficiency crystalline silicon solar cells for module integration
Nagel, H.; Eberlein, D.; Hoffmann, S.; Graf, M.; Steinhauser, B.; Feldmann, F.; Kraft, A.; Eitner, U.; Glatthaar, M.; Hermle, M.; Glunz, S.W.; Haverkamp, H.; Fischer, T.; Hain, A.; Wohlfart, P.; Mertens, V.; Müller, J.; Buck, T.
Conference Paper
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2016A 28nm HKMG super low power embedded NVM technology based on ferroelectric FETs
Trentzsch, M.; Flachowsky, S.; Richter, R.; Paul, J.; Reimer, B.; Utess, D.; Jansen, S.; Mulaosmanovic, H.; Müller, S.; Slesazeck, S.; Ocker, J.; Noack, M.; Müller, J.; Polakowski, P.; Schreiter, J.; Beyer, S.; Mikolajick, T.; Rice, B.
Conference Paper
2016Abschätzung der Zyklenfestigkeit von elektrischen Durchkontaktierungen thermisch beanspruchter Leiterplatten mit Hilfe experimenteller und simulativer Methoden
Walter, Hans; Broll, M.; Dijk, M. van; Schneider-Ramelow, M.; Bader, V.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Achieving sustainable smart mobile devices lifecycles through advanced re-design, reliability, and re-use and remanufacturing technology
Regenfelder, Max; Schischke, Karsten; Ebelt, Stefan; Slowak, André P.
Conference Paper
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2016Ageing phenomena in isotropic conductive adhesive material investigated by experimental and simulation techniques
Hölck, O.; Dijk, M. van; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.-D.
Conference Paper
2016Charge-trapping phenomena in HfO2-based FeFET-type nonvolatile memories
Yurchuk, Ekaterina; Müller, Johannes; Müller, Stefan; Paul, Jan; Pesic, Milan; Benthum, Ralf van; Schroeder, Uwe; Mikolajick, Thomas
Journal Article
2016Combination of experimental and simulation methods for analysis of sintered Ag joints for high temperature applications
Weber, Constanze; Walter, Hans; Dijk, Marius van; Hutter, Matthias; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Correlation between the macroscopic ferroelectric material properties of Si:HfO2 and the statistics of 28nm FeFET memory arrays
Mueller, S.; Slesazeck, S.; Henker, S.; Flachowsky, S.; Polakowski, P.; Paul, J.; Smith, E.; Müller, J.; Mikolajick, T.
Journal Article
2016Development and electrical characterization of a metal-ferroelectric-insulator semiconductor FET test structure
Ali, Tarek; Müller, Johannes (Betreuer); Lakner, Hubert (Betreuer); Heyns, Marc
Master Thesis
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2016Ensuring system reliability of a piezoelectric energy harvester
Wittler, O.; Hölck, O.; Benecke, S.; Dobs, T.; Dijk, M. van; Keller, J.; Schulz, M.; Bittner, P.; Schlosser, I.; Vergara, F.; Yacoub, T.; Bader, V.; Braun, T.; Lang, K.-D.
Conference Paper
2016Experts view on the sustainability of the fairphone 2
Proske, M.; Schischke, K.; Sommer, P.; Trinks, T.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016High endurance strategies for hafnium oxide based ferroelectric field effect transistor
Müller, J.; Polakowski, P.; Müller, S.; Mulaosmanovic, H.; Ocker, J.; Mikolajick, T.; Slesazeck, S.; Flachowsky, S.; Trentzsch, T.
Conference Paper
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2016HOT-300 - a multidisciplinary technology approach targeting microelectronic systems at 300 °C operating temperature
Vogt, Holger; Altmann, Frank; Braun, Sebastian; Celik, Yusuf; Dietrich, Lothar; Dietz, Dorothee; Dijk, Marius van; Dreiner, Stefan; Döring, Ralf; Gabler, Felix; Goehlich, Andreas; Hutter, Matthias; Ihle, Martin; Kappert, Holger; Kordas, Norbert; Kokozinski, Rainer; Naumann, Falk; Nowak, Torsten; Oppermann, Hermann; Partsch, Uwe; Petzold, Matthias; Roscher, Frank; Rzepka, Sven; Schubert, Ralph; Weber, Constanze; Wiemer, Maik; Wittler, Olaf; Ziesche, Steffen
Conference Paper
2016Impact of field cycling on HfO2 based non-volatile memory devices
Schroeder, U.; Pesic, M.; Schenk, T.; Mulaosmanovic, H.; Slesazeck, S.; Ocker, J.; Richter, C.; Yurchuk, E.; Khullar, K.; Müller, J.; Polakowski, P.; Grimley, E.D.; LeBeau, J.M.; Flachowsky, S.; Jansen, S.; Kolodinski, S.; Bentum, R. van; Kersch, A.; Künneth, C.; Mikolajick, T.
Conference Paper
2016Integration of high-frequency M-type hexagonal ferrite inductors in LTCC multilayer modules
Bierlich, Silvia; Reimann, Timmy; Barth, Stefan; Capraro, Beate; Bartsch, Heike; Müller, Jens; Töpfer, Jörg
Journal Article
2016Modular products: Smartphone design from a circular economy perspective
Schischke, K.; Proske, M.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2016Möglichkeiten zur Reduzierung der Schwingungseinleitung an Lineardirektantrieben: Vortrag gehalten bei der VDI-Konferenz Schwingungen in Werkzeug- und Verarbeitungsmaschinen, 10. und 11. Mai 2016, Darmstadt
Drossel, Welf-Guntram; Pagel, Kenny; Junker, Tom; Großmann, Knut; Müller, Jens
Presentation
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2016Nonlinear aging of cylindrical lithium-ion cells linked to heterogeneous compression
Bach, Tobias C.; Schuster, Simon F.; Fleder, Elena; Müller, Jana; Brand, Martin J.; Lorrmann, Henning; Jossen, Andreas; Sextl, Gerhard
Journal Article
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2016Paradigm shift in green IT - extending the life-times of computers in the public authorities in Germany
Prakash, S.; Köhler, A.; Liu, R.; Stobbe, L.; Proske, M.; Schischke, K.
Conference Paper
2016Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars
Krüger, M.; Straube, S.; Middendorf, A.; Hahn, D.; Dobs, T.; Lang, K.-D.
Journal Article
2016A review of green electronics research trends
Nissen, N.F.; Stobbe, L.; Zedel, H.; Schischke, K.; Lang, K.-D.
Conference Paper
2016Simulation of the lifetime of wire bonds modified through wedge trenches for higher reliability
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2016Soziale Teilhabe durch technikgestützte Kommunikation: Projekt SONIA
Selke, Stefan; Biniok, Peter; Kunze, Christophe; Müller, Jennifer; Renyi, Madeleine; Rombach, Elena; Menke, Iris; Gaugisch, Petra; Risch, Beate; Strunck, Stefan; Bratan, Tanja; Heyen, Nils; Kimpeler, Simone; Eschweiler, Gerhard W.; Kramer, Martin; Niebler, Raphael; Oedekoven, Christiane; Becker, Dietmar; Böhm, Luisa; Forstner, Johanna; Heusel, Christof; Brüstle, Karoline; Dinter, Jessica ; Hochschule Furtwangen; Fraunhofer-Institut für Arbeitswirtschaft und Organisation -IAO-, Stuttgart; Fraunhofer-Institut für System- und Innovationsforschung -ISI-, Karlsruhe; Geriatrisches Zentrum, Tübingen; Entwicklungszentrum Gut altwerden; Paul-Wilhelm-von-Keppler-Stiftung; Baden-Württemberg, Ministerium für Arbeit, Gesundheit und Sozialordnung, Stuttgart
Report
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2016Status of ferroelectric HfO2 based 1T FeFET memories: Presentation held at Joint IEEE International Symposium on the Applications of Ferroelectrics, European Conference on Applications of Polar Dielectrics & Workshop on Piezoresponse Force Microscopy (ISAF/ECAPD/PFM), August 21-25, 2016, Darmstadt, Germany
Mikolajick, T.; Schroeder, U.; Slesazeck, S.; Müller, S.; Schenk, T.; Müller, J.
Presentation
2016Status of the RoHS directive and exemptions
Deubzer, O.; Baron, Y.; Nissen, N.; Lang, K.-D.
Conference Paper
2016A study of documentation in agile software projects
Voigt, Stefan; Garrel, Jörg von; Müller, Julia; Wirth, Dominik
Conference Paper
2016A thermally robust and thickness independent ferroelectric phase in laminated hafnium zirconium oxide
Riedel, S.; Polakowski, P.; Müller, J.
Journal Article
2016Wie nachhaltig ist das Fairphone 2? - Ergebnisse einer Expertenbefragung
Schischke, Karsten; Proske, Marina; Sommer, Philipp; Trinks, Tina
Study
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2015Analytische Untersuchung zur Ressourceneffizienz im verarbeitenden Gewerbe: Studie, April 2015
Dückert, Elisabeth; Schäfer, Lorenz; Schneider, Ralph; Wahren, Sylvia; Oberender, Christof (Fachl. Bearb.); Weber, Manuel (Fachl. Bearb.) ; Fraunhofer-Institut für Produktionstechnik und Automatisierung -IPA-, Stuttgart; VDI Zentrum Ressourceneffizienz GmbH; Baden-Württemberg, Ministerium für Umwelt, Klima und Energiewirtschaft; Hessisches Ministerium für Wirtschaft, Energie, Verkehr und Landesentwicklung
Study
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2015Aquatische Optische Technologien in Deutschland
Schulz, Jan; Möller, Klas Ove; Bracher, Astrid; Hieronymi, Martin; Cisewski, Boris; Zielinski, Olver; Voss, Daniela; Gutzeit, Enrico; Dolereit, Tim; Niedzwiedz, Gern; Kohlberg, Gesche; Schories, Dirk; Kiko, Rainer; Körtzinger, Arne; Falldorf, Claas; Fischer, Philipp; Nowald, Nicolas; Beisiegel, Kolja; Martinez-Arbizu, Pedro; Rüssmeier, Nick; Röttgers, Rüdiger; Büdenbender, Jan; Jordt-Sedlazeck, Anne; Koch, Reinhard; Riebesell, Ulf; Hvitfeldt Iversen, Morten; Köser, Kevin; Kwasnitschka, Tom; Wellhausen, Jens; Thoma, Christoph; Barz, Christina; Rohde, Sven; Nattkemper, Tim W.; Schoening, Timm; Peeters, Frank; Hofmann, Hilmar; Busch, Julia A.; Hircher, Hans-Jürgen; Niehoff, Barbara; Hildebrandt, Nicole; Stohr, Erik; Winter, Christian; Herbst, Gabriel; Konrad, Christian; Schmidt, Mark; Linke, Peter; Brey, Thomas; Bange, Hermann W.; Nolle, Lars; Krägefsky, Sören; Gröger, Joachim; Sauter, Eberhard; Schulz, Miriam; Müller, Jens; Rehder, Gregor; Stepputtis, Daniel; Beszteri, Bank; Kloster, Michael; Kauer, G
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2015Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Schneider-Ramelow, M.; Lang, K.-D.
Journal Article
2015Deutsches Normungspanel. Normungsforschung, -politik und -förderung. Indikatorenbericht 2015
Blind, Knut; Müller, Jo-Ann
Report
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2015Effects of vibrations and shocks in electric vehicles on Li-ion batteries
Brand, M.J.; Schuster, S.F.; Bach, T.; Fleder, E.; Stelz, M.; Gläser, S.; Müller, J.; Sextl, G.; Jossen, A.
Conference Paper
2015Effects of vibrations and shocks on lithium-ion cells
Brand, Martin J.; Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Stelz, Manfred; Gläser, Simon; Müller, Jana; Sextl, Gerhard; Jossen, Andreas
Journal Article
2015Electric field and temperature scaling of polarization reversal in silicon doped hafnium oxide ferroelectric thin films
Zhou, D.Y.; Guan, Y.; Vopson, M.M.; Xu, J.; Liang, H.L.; Cao, F.; Dong, X.L.; Mueller, J.; Schenk, T.; Schroeder, U.
Journal Article
2015Evidence of single domain switching in hafnium oxide based FeFETs: Enabler for multi-level FeFET memory cells
Mulaosmanovic, H.; Slesazeck, S.; Ocker, J.; Pesic, M.; Müller, S.; Flachowsky, S.; Müller, J.; Polakowski, J.; Paul, J.; Jansen, S.; Kolodinski, S.; Richter, C.; Piontek, S.; Schenk, T.; Kersch, A.; Künneth, C.; Bentum, R. van; Schröder, U.; Mikolajick, T.
Conference Paper
2015Ferroelectric hafnium oxide based materials and devices: Assessment of current status and future prospects
Müller, J.; Polakowski, P.; Mueller, S.; Mikolajick, T.
Journal Article
2015Ferroelectricity and antiferroelectricity of doped thin HfO2-based films
Park, M.H.; Lee, Y.H.; Kim, H.J.; Kim, Y.J.; Moon, T.; Do Kim, K.; Müller, J.; Kersch, A.; Schroeder, U.; Mikolajick, T.; Hwang, C.S.
Journal Article
2015Ferroelectricity in undoped hafnium oxide
Polakowski, P.; Müller, J.
Journal Article
2015Ferroelektrizität in Hafniumdioxid und deren Anwendung in nicht-flüchtigen Halbleiterspeichern
Müller, Johannes
Dissertation
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2015A geometry-independent lifetime modelling method for aluminum heavy wire bond joints
Grams, A.; Höfer, J.; Middendorf, A.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Conference Paper
2015Herausforderungen im Handel mit China und den USA stehen in starkem Kontrast: Bereich Politik und Normung
Blind, Knut; Müller, Jo-Ann
Journal Article
2015Improving the lifetime of a 3D radio frequency transceiver by finite element simulations
Dijk, M. van; Grams, A.; Kaletta, K.; Tschoban, C.; Wittler, O.; Ndip, I.; Lang, K.-D.
Conference Paper
2015Impulsentkopplung von Lineardirektantriebsachsen. Praxistaugliche Gestaltung impulsentkoppelter Lineardirektantriebsachsen Teil 2
Müller, J.; Pagel, Kenny; Junker, Tom; Großmann, Knut; Drossel, Welf-Guntram
Journal Article
2015Integration challenges of ferroelectric hafnium oxide based embedded memory (Invited)
Müller, Johannes; Polakowski, Patrick; Paul, Jan; Riedel, Stefan; Hoffmann, Raik; Drescher, Maximilian; Slesazeck, Stefan; Müller, Stefan; Mulaosmanovic, Halid; Schröder, Uwe; Mikolajick, Thomas; Flachowsky, Stefan; Erben, Elke; Smith, Elliot; Binder, Robert; Triyoso, Dina H.; Metzger, Joachim; Kolodinski, Sabine
Conference Paper
2015Integration of CaCu3Ti4O12 capacitors into LTCC multilayer modules
Löhnert, Romy; Capraro, Beate; Barth, Stefan; Bartsch, Heike; Müller, Jens; Töpfer, Jörg
Journal Article
2015Investigations on the cyclic aging behavior of Li-ion cells: Reasons for an abrupt drop of capacity
Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Müller, Jana; Sextl, Gerhard; Jossen, Andreas
Conference Paper
2015Laser cuts increase the reliability of heavy-wire bonds and enables on-line process control with thermography
Middendorf, A.; Grams, A.; Lang, K.-D.; Schmitz, S.; Wittler, O.
Conference Paper
2015Manufacturing 100-µm-thick silicon solar cells with efficiencies greater than 20% in a pilot production line
Terheiden, B.; Ballmann, T.; Horbelt, R.; Schiele, Y.; Seren, S.; Ebser, J.; Hahn, G.; Mertens, V.; Koentopp, M.B.; Scherff, M.; Müller, J.W.; Holman, Z.C.; Descoeudres, A.; Wolf, S. de; Nicolas, S.M. de; Geissbuehler, J.; Ballif, C.; Weber, B.; Saint-Cast, P.; Rauer, M.; Schmiga, C.; Glunz, S.W.; Morrison, D.J.; Devenport, S.; Antonelli, D.; Busto, C.; Grasso, F.; Ferrazza, F.; Tonelli, E.; Oswald, W.
Journal Article
2015Methodology guidance - energy profiles and carbon footprint data for passive components and connectors: Version 1.2
Schischke, Karsten; Proske, Marina; Schulz, Gerd; Husemann, Jürgen; Trenner, Torger; Sonnenberg, Thea; Huck, Walter; Kelm, Klaus; Tempel, Norbert; Wunderlich, Peter; Dietrich, Marcus
Report
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2015Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, M.S.; Geissler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.D.
Journal Article
2015Microstructural evulotion of ultrosonic-bonded aluminum wires
Broll, Marian Sebastian; Geißler, U.; Höfer, J.; Schmitz, S.; Wittler, O.; Lang, K.-D.
Journal Article
2015New approach for measurement & simulation in sheet metal forming: Presentation held at New Aspects in Industrial 3D Metrology, Inspection and Testing, GOM 3D Metrology Conference, September 21st-24th 2015, Braunschweig
Ackert, Patrick; Schwarz, Christian; Müller, Johannes; Landgrebe, Dirk
Presentation
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2015Next-generation ferroelectric memories based on FE-HfO2
Müller, S.; Slesazeck, S.; Mikolajick, T.; Müller, Johannes; Polakowski, Patrick; Flachowsky, S.
Conference Paper
2015Nonlinear aging characteristics of lithium-ion cells under different operational conditions
Schuster, Simon F.; Bach, Tobias; Fleder, Elena; Müller, Jana; Brand, Martin; Sextl, Gerhard; Jossen, Andreas
Journal Article
2015Nonlinear aging of lithium-ion cells linked to pressure differences: Degradation mechanisms and remedies
Bach, Tobias; Schuster, Simon; Fleder, Elena; Müller, Jana; Jossen, Andreas; Sextl, Gerhard
Abstract
2015Numerical modelling in design for reliability of power modules
Grams, Arian; Schneider-Ramelow, M.; Wittler, O.; Wüst, F.
Journal Article
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2015Perfluoroalkyl and polyfluoroalkyl substances in consumer products
Kotthoff, Matthias; Müller, Josef; Jürling, Heinrich; Schlummer, Martin; Fiedler, Dominik
Journal Article
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2015Prototyping new concepts beyond 4G - The Fraunhofer Open5GCore
Magedanz, Thomas; Carella, Giuseppe; Corici, Marius; Mueller, Julius; Weber, Andreas
Journal Article
2015Radio frequency microelectromechanical system-platform based on silicon-ceramic composite substrates
Fischer, Michael S.; Gropp, S.; Nowak, Jacek; Capraro, Beate; Sommer, Ralf; Hoffmann, Martin J.F.; Müller, J.
Journal Article
2015The Rayleigh law in silicon doped hafnium oxide ferroelectric thin films
Guan, Yan; Zhou, Dayu; Xu, Jin; Liu, Xiaohua; Cao, Fei; Dong, Xianlin; Müller, Johannes; Schenk, Tony; Schroeder, Uwe
Journal Article
2015Recycling von Komponenten und strategischen Metallen aus elektrischen Fahrantrieben. Kennwort: MORE (Motor Recycling): Abschlussbericht zum Verbundvorhaben. Berichtszeitraum: Gesamtlaufzeit 01.05.2011 bis 31.08.2014
Bast, Ulrich; Blank, Rolf; Buchert, Matthias; Elwert, Tobias; Finsterwalder, Florian; Hörnig, Gabriele; Klier, Tobias; Langkau, Sabine; Marscheider-Weidemann, Frank; Müller, J.-O.; Thürigen, Christian; Treffer, Frank; Walter, T.
Report
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2015Scaling and optimization of ferroelectric hafnium oxide for memory applications and beyond: Presentation held at International Conference on Solid State Devices and Materials; Sapporo, Japan, 27-30 September 2015
Müller, Johannes; Riedel, Stefan; Polakowski, Patrick
Presentation
2015Verfahren zum Bestimmen einer Bondverbindung in einer Bauteilanordnung und Prüfvorrichtung
Middendorf, Andreas; Nowak, Torsten; Janzen, Sergei
Patent
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2015Vergleich der zweiten und dritten Befragungswelle des Deutschen Normungspanels (DNP) - Auch kleine Unternehmen und Dienstleister zeigen erhöhtes Normungsengagement auf internationaler Ebene
Blind, Knut; Müller, Jo-Ann
Journal Article
2014Analysis of mechanical properties of thermal cycled Cu Plated-Through Holes (PTH)
Walter, H.; Kaltwasser, A.; Broll, M.; Huber, S.; Wittler, O.; Lang, K.-D.
Conference Paper
2014Ansätze zur stofflichen Verwertung von Tablets aus Sicht des Produktdesigns
Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Dimitrova, Gergana; Genz, Paul; Lang, Klaus-Dieter
Book Article
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2014Assessment of high temperature reliability of molded smart power modules
Thomas, Tina; Becker, Karl-Friedrich; Braun, Tanja; Dijk, Marius van; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Aufnahme von perfluorierten Carbon- und Sulfonsäuren durch Pflanzen unter Feldbedingungen
Felizeter, S.; Voogt, P. de; Jürling, H.; Müller, J.; Kotthoff, M.
Abstract
2014Bedeutung und Ausmaß der Werknormung: Ergebnisse aus dem Deutschen Normungspanel - Bereich Innovation - Ergebnisse der zweiten Befragung
Blind, Knut; Grossmann, Anne-Marie; Müller, Jo-Ann; Rauber, Julius
Journal Article
2014Combined Loads and Mechanisms: Presentation held at the ECPE Workshop: Intelligent Reliability Testing; Nürnberg, 02.12. - 03.12.14
Wittler, Olaf; Rothe, Michael; Grams, Arian; Schmitz, Stefan; Middendorf, Andreas; Lang, Klaus-Dieter
Presentation
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2014A critical review of corrosion phenomena in microelectronic systems
Wagner, Stefan; Lang, Klaus-Dieter; Hoeppner, Katrin; Toepper, Michael; Wittler, Olaf
Conference Paper
2014Design and implementation of a carrier grade software defined telecommunication switch and controller
Mueller, J.; Chen, Y.; Reichel, B.; Vlad, V.; Magedanz, T.
Conference Paper
2014Deutsches Normungspanel. Indikatorenbericht 2014: Normungsforschung, -politik und -förderung
Blind, Knut; Großmann, Anne-Marie; Müller, Jo-Ann; Rauber, Julius
Report
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2014Development of process and design criteria for stress management in through silicon vias
Hölck, Ole; Nuss, Max; Grams, Arian; Prewitz, Tobias; John, Peggy; Fiedler, Conny; Böttcher, Matthias; Walter, Hans; Wolf, M. Jürgen; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version July 2014
Schischke, Karsten; Stobbe, Lutz; Dimitrova, Gergana; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.
Report
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2014Doped hafnium oxide - an enabler for ferroelectric field effect transistors
Mikolajick, T.; Müller, S.; Schenk, T.; Yurchuk, E.; Slesazeck, S.; Schröder, U.; Flachowsky, S.; Bentum, R. van; Kolodinski, S.; Polakowski, P.; Müller, J.
Conference Paper
2014Drahtlose Tiefendiagnose: Energieautarke Funksensorik für Condition-Monitoring-Anwendungen
Niedermayer, M.; Hoherz, C.; Reinhardt, D.; Scholtz, H.; Benecke, S.; Middendorf, A.
Journal Article
2014Early-State Crack Detection Method for Heel-Cracks in Wire Bond Interconnects
Krüger, Michael; Trampert, Stefan; Middendorf, Andreas; Schmitz, Stefan; Lang, Klaus-Dieter
Conference Paper
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2014Establishing ecoreliability of electronic devices in manufacturing environments
Middendorf, Andreas; Benecke, Stephan; Nissen, Nils; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
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2014Ferroelectric and antiferroelectric properties of Si-doped HfO2 thin films
Zhou, D.Y.; Xu, J.; Müller, J.; Schröder, U.
Journal Article
2014Ferroelectric deep trench capacitors based on Al:HfO2 for 3D nonvolatile memory applications
Polakowski, Patrick; Riedel, Stefan; Weinreich, Wenke; Rudolf, M.; Sundqvist, Jonas; Seidel, Konrad; Müller, Johannes
Conference Paper
2014Ferroelectric hafnium oxide based materials and devices: Assessment of current status and future prospects
Müller, Johannes; Polakowski, Patrick; Müller, Stefan; Mikolajick, Thomas
Conference Paper
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2014Ferroelectric hafnium oxide: A game changer to FRAM?
Müller, J.; Polakowski, P.; Riedel, S.; Mueller, S.; Yurchuk, E.; Mikolajick, T.
Conference Paper
2014Ferroelectricity in Si-doped HfO2 revealed: A binary lead-free ferroelectric
Martin, D.; Müller, J.; Schenk, T.; Arruda, T.M.; Kumar, A.; Strelcov, E.; Yurchuk, E.; Müller, S.; Pohl, D.; Schröder, U.; Kalinin, S.V.; Mikolajick, T.
Journal Article
2014Flexible cross layer optimization for fixed and mobile broadband telecommunication networks and beyond
Müller, Julius; Magedanz, Thomas (Gutachter); Küpper, Axel (Gutachter); Kellerer, Wolfgang (Gutachter)
Dissertation
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2014Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, C.; Klingler, M.; Coutellier, D.; Naceur, H.; Grams, A.; Wittler, O.
Conference Paper
2014Heavy-Wire Bond Manipulation with Laser to Increase Reliability and as Enabler for Thermography based On-line Process Control
Middendorf, Andreas; Lang, Klaus-Dieter
Conference Paper
2014Impact of different dopants on the switching properties of ferroelectric hafniumoxide
Schroeder, U.; Yurchuk, E.; Müller, J.; Martin, D.; Schenk, T.; Polakowski, P.; Adelmann, C.; Popovici, M.I.; Kalinin, S.V.; Mikolajick, T.
Journal Article
2014Impact of RDL Polymer on Reliability of Flip Chip Interconnects in Thermal Cycling - Correlation of Experiments with Finite Element Simulations
Müller, Matthias; Wöhrmann, Markus; Wittler, Olaf; Bader, Volker; Töpper, Michael; Lang, Klaus-Dieter
Conference Paper
2014Impact of scaling on the performance of HfO2-based ferroelectric field effect transistors
Yurchuk, E.; Müller, J.; Paul, J.; Schlösser, T.; Martin, D.; Hoffmann, R.; Müller, S.; Slesazeck, S.; Schroeder, U.; Boschke, R.; Bentum, R. van; Mikolajick, T.
Journal Article
2014Improving the FE simulation of molded packages using warpage measurements
Huber, Saskia; Van Dijk, Marius; Walter, Hans; Wittler, Olaf; Thomas, Tina; Lang, Klaus-Dieter
Conference Paper
2014Indentation zur Ermittlung elastisch-plastischer Werkstoffeigenschaften von metallischen Mikrostrukturen
Broll, Marian; Walter, Hans; Kaltwasser, Arved; Schauer, Kai; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Interannual variation in land-use intensity enhances grassland multidiversity
Allan, Eric; Bossdorf, Oliver; Dormann, Carsten F.; Prati, Daniel; Gossner, Martin M.; Tscharntke, Teja; Blüthgen, Nico; Bellach, Michaela; Birkhofer, Klaus; Boch, Steffen; Böhm, Stefan; Börschig, Carmen; Chatzinotas, Antonis; Christ, Sabina; Daniel, Rolf; Diekötter, Tim; Fischer, Christiane; Friedl, Thomas; Glaser, Karin; Hallmann, Christine; Hodac, Ladislav; Hölzel, Norbert; Jung, Kirsten; Klein, Alexandra Maria; Klaus, Valentin H.; Kleinebecker, Till; Krauss, Jochen; Lange, Markus; Morris, E. Kathryn; Müller, Jörg; Nacke, Heiko; Pašalic, Esther; Rillig, Matthias C.; Rothenwöhrer, Christoph; Schall, Peter; Scherber, Christoph; Schulze, Waltraud; Socher, Stephanie A.; Steckel, Juliane; Steffan-Dewenter, Ingolf; Türke, Manfred; Weiner, Christiane N.; Werner, Michael; Westphal, Catrin; Wolters, Volkmar; Wubet, Tesfaye; Gockel, Sonja; Gorke, Martin; Hemp, Andreas; Renner, Swen C.; Schöning, Ingo; Pfeiffer, Simone; König-Ries, Birgitta; Buscot, François; Linsenmair, Karl Eduard; Schulze, Ernst-Detle
Journal Article
2014Korrosionsphänomene im mikroelektronischen System
Wagner, Stefan; Höppner, Katrin; Töpper, Michael; Wittler, Olaf; Lang, Klaus-Dieter
Journal Article
2014LCA to go for PV systems: Analysis tool for optimized PV design and green marketing
Arranz, Pol; Anzizu, Maria; Vallvé, Xavier; Schischke, Karsten; Helmy, Mohamed; Alonso, Juan Carlos; Rodrigo, Julio
Conference Paper
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2014Life Cycle Assessment as a practical tool in the eco-design and promotion of eco-innovative electronics - the case of the IAMECO computers
Ospina, Jose Luis; Maher, Paul; Schischke, Karsten
Conference Paper
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2014Mission Profiles as an Approach to Manage Specific Automotive Requirements for Robust Design of Automotive Semiconductors
Hahn, Daniel; Straube, Stefan; Abelein, Ulrich; Middendorf, Andreas; Lang, Klaus-Dieter
Conference Paper
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2014Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law
Grams, A.; Prewitz, T.; Wittler, O.; Schmitz, S.; Middendorf, A.; Lang, K.-D.
Conference Paper
2014Monitoring as a service for cloud environments
Mueller, Julius; Al-Hazmi, Yahya; Magedanz, Thomas; Palma, David; Landi, Giada; Soares, João; Parreira, Bruno; Metsch, Thijs; Gray, Peter; Georgiev, Alexander; Simões, Paulo
Conference Paper
2014Ökodesign von Unterhaltungselektronik und IKT - Beispiele und Denkanstöße: Vortrag gehalten bei der ETV Donnerstagslektion, Berlin, 8.5.2014
Schischke, Karsten
Presentation
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2014On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Journal Article
2014Origin of the endurance degradation in the novel HfO2-based 1T ferroelectric non-volatile memories
Yurchuk, E.; Mueller, S.; Martin, D.; Slesazeck, S.; Schroeder, U.; Mikolajick, T.; Müller, J.; Paul, J.; Hoffmann, R.; Sundqvist, J.; Schlösser, T.; Boschke, R.; Bentum, R. van; Trentzsch, M.
Conference Paper
2014Reliability assessment of molded smart power modules
Thomas, Tina; Lang, Klaus-Dieter; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Jörg
Conference Paper
2014Reliability improvements in electronic systems by combining condition monitoring approaches
Jerchel, K.; Kruger, M.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.
Conference Paper
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2014Role of the dielectric for the charging dynamics of the dielectric/barrier interface in AlGaN/GaN based metal-insulator-semiconductor structures under forward gate bias stress
Lagger, Peter; Steinschifter, P.; Reiner, M.; Stadtmüller, M.; Denifl, G.; Naumann, Andreas; Müller, Johannes; Wilde, Lutz; Sundqvist, Jonas; Pogany, D.
Journal Article
2014Sustainable life cycle engineering of an integrated desktop PC: A small to medium enterprise perspective
Fitzpatrick, C.; Hickey, S.; Schischke, K.; Maher, P.
Journal Article
2014Tablet PCs through the lens of environment - design trends and impacts on the environmental performance
Dimitrova, Gergana; Nissen, Nils; Stobbe, Lutz; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter
Conference Paper
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2014Thermo-mechanical simulation of sintered Ag die attach for high temperature applications
Moreira de Sousa, Micaela; Dijk, Marius van; Walter, Hans; Weber, Constanze; Hutter, Matthias; Oppermann, Hermann; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2014Towards Zero Waste in Industrial Networks: A case study of the D4R laptop
Hickey, Stewart; Fitzpatrick, Colin; Maher, Paul; Ospina, Jose; Schischke, Karsten; Beigl, Peter; Vidorreta, Itziar; Yang, Mona; Williams, Ian; den Boer, Emilia
Journal Article
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2014Translating product specifications into environmental evidence - Carbon Footprint Models explained on the example of a netbook, a consumer laptop and an ultrabook
Schischke, Karsten; Nissen, Nils; Lang, Klaus-Dieter
Conference Paper
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2014US-spezifische Zertifizierungen und Normen wichtigste Handelshemmnisse für den Außenhandel mit den USA
Blind, Knut; Müller, Jo-Ann; Rauber, Julius
Journal Article
2014Welding equipment under the energy-related products directive - the process of developing eco-design criteria
Schischke, K.; Nissen, N.F.; Lang, K.D.
Journal Article
2013Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
Wunderle, B.; Heilmann, J.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013Applying the software-to-data paradigm in next generation e-health hybrid clouds
Thuemmler, Christoph; Mueller, Julius; Covaci, Stefan; Magedanz, Thomas; Panfilis, Stefano de; Jell, Thomas; Schneider, Armin; Gavras, Anastasius
Conference Paper
2013Approach for reliability of thermal interface materials in battery cell sensors
Nowak, T.; Müller, M.; Walter, H.; Hölck, O.; Wüst, F.; Wittler, O.; Lang, K.-D.
Conference Paper
2013Aufbau einer Umgebung für die Simulation des Alterungsverhaltens von integrierten elektronischen Schaltungen
Müller, Leif; Müller, Jan (Betreuer); Jancke, Roland (Betreuer); Tetzlaff, Ronald (Verantwortl. Hochschullehrer)
Thesis
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2013Design Features of Current Tablet Computers to Facilitate Disassembly and Repair
Nissen, Nils F.; Stobbe, Lutz; Oerter, Markus; Scheiber, Sascha; Schlösser, Alexander; Schischke, Karsten; Lang, Klaus-Dieter
Conference Paper
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2013Detection of fluorotelomer alcohols in indoor environments and their relevance for human exposure
Schlummer, Martin; Gruber, Ludwig; Fiedler, Dominik; Kizlauskas, Markus; Müller, Josef
Journal Article
2013Disassembly analysis of slates: Design for repair and recycling evaluation. Final report: Version August 2013
Schischke, Karsten; Stobbe, Lutz; Scheiber, Sascha; Oerter, Markus; Nowak, Torsten; Schlösser, Alexander; Riedel, Hannes; Nissen, Nils F.
Report
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2013Downscaling ferroelectric field effect transistors by using ferroelectric Si-doped HfO2
Martin, Dominik; Yurchuk, Ekaterina; Müller, Stefan; Müller, Johannes; Paul, Jan; Sundquist, Jonas; Slesazeck, S.; Schlösser, T.; Bentum, R. van; Trentzsch, M.; Schröder, U.; Mikolajick, T.
Conference Paper
2013Elastic network design and adaptive flow placement in software defined networks
Mueller, Julius; Wierz, Andreas; Vingarzan, Dragos; Magedanz, Thomas
Conference Paper
2013Ergebnisse der r²-Begleitforschung: Potenziale von Innovationen in rohstoffintensiven Produktionsprozessen
Ostertag, Katrin; Marscheider-Weidemann, Frank; Paitz, Patrick; Sartorius, Christian; Walz, Rainer; Moller, Björn P.; Seitz, Ralph; Woidasky, Jörg; Stier, Christian; Albrecht, Stefan; Brandstetter, Christian P.; Fröhling, Magnus; Trippe, Frederik; Müller, Josephine; Mayer, Wolfgang A.; Faulstich, Martin
Book Article
2013Ferroelectric hafnium oxide: A CMOS-compatible and highly scalable approach to future ferroelectric memories
Müller, J.; Böscke, T.S.; Müller, S.; Yurchuk, E.; Polakowski, P.; Paul, J.; Martin, D.; Schenk, T.; Khullar, K.; Kersch, A.; Weinreich, W.; Riedel, S.; Seidel, K.; Kumar, A.; Arruda, T.M.; Kalinin, S.V.; Schlösser, T.; Boschke, R.; Bentum, R. van; Schröder, U.; Mikolajick, T.
Conference Paper
2013From MFM capacitors toward ferroelectric transistors: Endurance and disturb characteristics of HfO2-based FeFET devices
Mueller, S.; Müller, J.; Hoffmann, R.; Yurchuk, E.; Schlösser, T.; Boschke, R.; Paul, J.; Goldbach, M.; Herrmann, T.; Zaka, A.; Schröder, U.; Mikolajick, T.
Journal Article
2013Hafnium oxide based CMOS compatible ferroelectric materials
Schroeder, U.; Mueller, S.; Mueller, J.; Yurchuk, E.; Martin, D.; Adelmann, C.; Schloesser, T.; Bentum, R. van; Mikolajick, T.
Journal Article
2013Impact of layer thickness on the ferroelectric behaviour of silicon doped hafnium oxide thin films
Yurchuk, E.; Müller, J.; Knebel, S.; Sundqvist, J.; Graham, A.P.; Melde, T.; Schröder, U.; Mikolajick, T.
Conference Paper
2013Impulsentkopplung von Lineardirektantriebsachsen: Praxistaugliche Gestaltung
Müller, Jens; Junker, Tom; Pagel, Kenny; Großmann, Knut; Drossel, Welf-Guntram
Journal Article
2013(Invited) Hafnium oxide based CMOS compatible ferroelectric materials
Schroeder, U.; Martin, D.; Müller, J.; Yurchuk, E.; Mueller, S.; Adelmann, C.; Schloesser, T.; Bentum, R. van; Mikolajick, T.
Journal Article
2013"LCA to go" - Environmental assessment of machine tools according to requirements of small and medium-sized enterprises (SMEs) - Development of the methodological concept
Pamminger, R.; Krautzer, F.; Wimmer, W.; Schischke, K.
Conference Paper
2013Life Cycle Engineering von Turbomaschinen mithilfe der Mikrosystemtechnik
Middendorf, Andreas; Jerchel, Kathleen; Günther, Julia; Rothe, Michael
Journal Article
2013Low-temperature sintered NTC thermistor ceramics for thick-film temperature sensors
Reimann, T.; Töpfer, J.; Barth, S.; Bartsch, H.; Müller, J.
Journal Article
2013LTCC Membrane mit integrierter Heizern, Temperatur- und Dehnungssensorik
Gutzeit, Nam; Appelfelder, Michael; Reinlein, Claudia; Fischer, Michael; Müller, Jens
Conference Paper
2013Manufacturing and characterization of a deformable membrane with integrated temperature sensors and heating structures in low temperature co-fired ceramics
Gutzeit, N.; Müller, J.; Reinlein, C.; Gebhardt, S.
Journal Article
2013Mechanically relevant chemical shrinkage of epoxy molding compounds
Sousa, M.F.; Hölck, O.; Braun, T.; Bauer, J.; Walter, H.; Wittler, O.; Lang, K.D.
Conference Paper
2013Mesoscopic analysis of leakage current suppression in ZrO2/Al2O3/ZrO2 nano-laminates
Martin, D.; Grube, M.; Weinreich, W.; Müller, J.; Weber, W.M.; Schröder, U.; Riechert, H.; Mikolajick, T.
Journal Article
2013Moisture induced swelling in epoxy moulding compounds
Walter, H.; Hölck, O.; Dobrinski, H.; Stuermann, J.; Braun, T.; Bauer, J.; Wittler, O.; Lang, K.D.
Conference Paper
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2013Moisture transport and swelling stresses at moulding-compound substrate interfaces investigated by molecular modeling and finite element simulations
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.; Lang, K.D.
Conference Paper
2013Network and control platforms
Corici, Marius; Müller, Julius; Vingarzan, Dragos; Magedanz, Thomas
Book Article
2013On the crack and delamination risk optimization of a Si-interposer for LED packaging
Auersperg, J.; Dudek, R.; Jordan, R.; Bochow-Neß, O.; Rzepka, S.; Michel, B.
Conference Paper
2013Performance investigation and optimization of Si:HfO2 FeFETs on a 28 nm bulk technology
Mueller, S.; Yurchuk, E.; Slesazeck, S.; Mikolajick, T.; Müller, J.; Herrmann, T.; Zaka, A.
Conference Paper
2013Product Design Trends and Impacts on Recyclability: The Case of Mobile IT Devices: Disassembly Analysis of Slates: Design for Repair and Recycling Evaluation
Dimitrova, Gergana; Schischke, Karsten; Stobbe, Lutz; Nissen, Nils F; Schlösser, Alexander
Presentation
Fulltext
2013QoE-aware resource provisioning and adaptation in IMS-based IPTV using OpenFlow
Truong, Thu-Huong; Thanh, Nguyen Huu; Hung, Nguyen Tai; Mueller, Julius; Magedanz, Thomas
Conference Paper
2013Reliability characteristics of ferroelectric Si: HfO2 thin films for memory applications
Mueller, S.; Müller, J.; Schroeder, U.; Mikolajick, T.
Journal Article
2013Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
Heilmann, J.; Wunderle, B.; Kumar, S.G.; Hoelck, O.; Walter, H.; Wittler, O.; Engelmann, G.; Wolf, M.J.; Beer, G.; Pressel, K.
Conference Paper
2013Retrospective monitoring of perfluorocarboxylates and perfluorosulfonates in human plasma archived by the German Environmental Specimen Bank
Schröter-Kermani, C.; Müller, Josef; Jürling, Heinrich; Conrad, A.; Schulte, C.
Journal Article
2013Scalable on-demand network management module for software defined telecommunication networks
Mueller, Julius; Wierz, Andreas; Magedanz, Thomas
Conference Paper
2013Schaffung einer Datenbasis zur Ermittlung ökologischer Wirkungen der Produkte der Informations- und Kommunikationstechnik (IKT): Teilvorhaben C des Gesamtvorhabens Ressourcenschonung im Aktionsfeld Informations- und Kommunikationstechnik (IKT)
Prakash, Siddharth; Liu, Ran; Schischke, Karsten; Stobbe, Lutz; Gensch, Carl-Otto
Study
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2013Simulation of an aluminum thick wire bond fatigue crack by means of the cohesive zone method
Grams, A.; Prewitz, T.; Wittler, O.; Kripfgans, J.; Schmitz, S.; Middendorf, A.; Müller, W.H.; Lang, K.-D.
Conference Paper
2013Structural properties of as deposited and annealed ZrO2 influenced by atomic layer deposition, substrate, and doping
Weinreich, W.; Wilde, L.; Müller, J.; Sundqvist, J.; Erben, E.; Heitmann, J.; Lemberger, M.; Bauer, A.J.
Journal Article
2013System reliability as a key for managing complex requirements, such as robust design of microsystems
Straube, Stefan; Hahn, Daniel; Jerchel, Kathleen; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
2013Telecom applications, APIs and service platforms
Blum, Niklas; Müller, Julius; Schreiner, Florian; Magedanz, Thomas
Book Article
2013Toward a full implementation of SCIM functional block in IMS framework
Hung, Nguyen Tai; Thanh, Nguyen Huu; Magedanz, Thomas; Mueller, Julius
Conference Paper
2013Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, Ole; Bauer, Jörg; Braun, Tanja; Walter, Hans; Wittler, Olaf; Wunderle, Bernhard; Lang, Klaus-Dieter
Journal Article
2013Wake-up effects in Si-doped hafnium oxide ferroelectric thin films
Zhou, D.Y.; Xu, J.; Li, Q.; Guan, Y.; Cao, F.; Dong, X.L.; Müller, J.; Schenk, T.; Schröder, U.
Journal Article
2012Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
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Conference Paper
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Conference Paper
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Krug, M.; Endler, I.; Benner, F.; Dirnstorfer, I.; Müller, J.; Sundqvist, J.; Rose, M.; Jakschik, S.; Weber, J.; Liepack, H.
Conference Paper
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Olsen, T.; Schröder, U.; Müller, S.; Krause, A.; Martin, D.; Singh, A.; Müller, J.; Geidel, M.; Mikolajick, T.
Journal Article
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Bierlich, Silvia; Töpfer, J.; Barth, Stefan; Pawlowski, B.; Müller, Jörg; Bartsch-Torres, H.
Conference Paper
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Wittler, O.; Jaeschke, J.; Bochow-Ness, O.; Middendorf, A.; Lang, K.-D.
Conference Paper
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Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Journal Article
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Largiller, G.; Bouvard, Didier; Carry, Claude Paul; Gabriel, Armand; Müller, Jean Damien; Staab, Torsten E.M.
Journal Article
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Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Journal Article
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Prakash, S.; Liu, R.; Schischke, K.; Stobbe, P.L.
Conference Paper
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Nissen, Nils F.; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
Conference Paper
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Middendorf, A.; Nissen, N.F.; Stobbe, L.; Wittler, O.; Lang, K.-D.
Conference Paper
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Reinlein, Claudia; Türke, Sascha; Gutzeit, Nam; Müller, Jens; Peschel, Thomas; Burkhardt, Thomas; Beckert, Erik; Tünnermann, Andreas
Conference Paper
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Lang, Klaus-Dieter; Nissen, Nils F.; Middendorf, Andreas; Chancerel, Perrine ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Conference Proceedings
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Bartsch, H.; Barth, S.; Müller, J.
Conference Paper
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Benecke, Stephan; Rückschloss, Jana; Middendorf, Andreas; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
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Ospina, J.L.; Maher, P.; Schischke, K.; Schlosser, A.
Conference Paper
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Benecke, S.; Rueckschloss, J.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.
Conference Paper
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Terheiden, B.; Horbelt, R.; Schiele, Y.; Seren, S.; Ebser, J.; Hahn, G.; Morrison, D.; Heasman, K.; Devenport, S.; Holman, Z.; Descoeudres, A.; Wolf, S. de; Baliff, C.; Saint-Cast, P.; Michl, B.; Schmiga, C.; Weber, B.; Glunz, S.W.; Koentopp, M.B.; Scherff, M.; Ballmann, T.; Müller, J.W.; Antonelli, D.; Busto, C.; Grasso, F.; Ferrazza, F.; Tonelli, E.; Baert, K.; Duerinckx, F.; Cacciato, A.; Oswald, W.
Conference Paper
Fulltext
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Mueller, J.; Siddiqui, A.; Becke, M.; Kleis, M.; Campowsky, K.
Conference Paper
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Schacht, R.; Nowak, T.; Walter, H.; Wunderle, B.; Abo Ras, M.; May, D.; Wittler, O.; Lang, K.-D.
Conference Paper
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Müller, J.; Yurchuk, E.; Schlösser, T.; Paul, J.; Hoffmann, R.; Müller, S.; Martin, D.; Slesazeck, S.; Polakowski, P.; Sundqvist, J.; Czernohorsky, M.; Seidel, K.; Kücher, P.; Boschke, R.; Trentzsch, M.; Gebauer, K.; Schröder, U.; Mikolajick, T.
Conference Paper
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Müller, J.; Böscke, T.S.; Schröder, U.; Mueller, S.; Bräuhaus, D.; Böttger, U.; Frey, L.; Mikolajick, T.
Journal Article
2012Fine line conductors in LTCC
Uhlig, P.; Stoepel, D.; Mueller, J.; Mosch, S.
Conference Paper
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Chancerel, P.; Deubzer, O.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2012HfO 2-based ferroelectric field-effect transistors with 260 nm channel length and long data retention
Yurchuk, E.; Müller, J.; Hoffmann, R.; Paul, J.; Martin, D.; Boschke, R.; Schlösser, T.; Müller, S.; Slesazeck, S.; Bentum, R. van; Trentzsch, M.; Schröder, U.; Mikolajick, T.
Conference Paper
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Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Chancerel, P.; Schischke, K.; Ruckschloss, J.; Campo, F.; Benito, G.
Conference Paper
2012In-situ - Characterization of moisture induced swelling behaviour of microelectronic relevant polymers
Walter, Hans; Bauer, Jörg; Braun, Tanja; Hölck, Ole; Wunderle, B.; Wittler, O.
Conference Paper
Fulltext
2012Incipient ferroelectricity in Al-doped HfO2 thin films
Mueller, Stefan; Mueller, Johannes; Singh, Aarti; Riedel, Stefan; Sundqvist, Jonas; Schroeder, Uwe; Mikolajick, Thomas
Journal Article
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Zhou, Dayu; Müller, J.; Xu, Jin; Knebel, S.; Bräuhaus, D.; Schröder, U.
Journal Article
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Lam, Carl W.; Pascualena Aguirre, Muskilda; Schischke, Karsten; Nissen, Nils F.; Ogunseitan, Oladele A.; Schoenung, Julie M.
Journal Article
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Müller, Jakob; Gruner, Natalie; Almstätter, Isabella; Kirsch, Frauke; Buettner, Andrea; Pfaffl, Michael W.
Journal Article
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Fliedner, Annette; Rüdel, Heinz; Jürling, Heinrich; Müller, Josef; Neugebauer, Frank; Schröter-Kermani, Christa
Journal Article
Fulltext
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Schischke, K.; Nissen, N.F.; Sherry, J.; O'Rafferty, S.; O'Connor, F.; Sitek, J.; Pamminger, R.; Wimmer, W.
Conference Paper
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Rückschloss, Jana; Schmidt, Ralf; Müller, Jutta; Kallmayer, Christine; Haberland, Julian
Conference Paper
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Gutzeit, N.; Müller, J.; Reinlein, C.; Gebhardt, S.
Conference Paper
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Gutzeit, Nam; Müller, Jens; Bruchmann, Claudia; Gebhardt, Sylvia
Conference Paper
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Marwede, M.; Chancerel, P.; Deubzer, O.; Jordan, R.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2012Methodology to identify design for recycling measures for high-tech sectors
Marwede, Max; Schischke, Karsten; Arranz, Pol; Hickey, Stewart; Fitzpatrick, Colin; Ospina, Jose; Yang, Mona; Nissen, Nils F.; Lang, Klaus-Dieter
Conference Paper
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Rüdel, Heinz; Müller, Josef; Quack, Markus; Klein, Roland
Journal Article
2012Nanosecond polarization switching and long retention in a novel MFIS-FET based on ferroelectric HfO2
Müller, J.; Böscke, T.S.; Schröder, U.; Hoffmann, R.; Mikolajick, T.; Frey, L.
Journal Article
2012Non-volatile data storage in HfO2-based ferroelectric FETs
Schroeder, U.; Yurchuk, E.; Mueller, S.; Mueller, J.; Slesazeck, S.; Schloesser, T.; Trentzsch, M.; Mikolajick, T.
Conference Paper
2012Overview of RoHS 2.0 and status of exemptions
Deubzer, O.; Nissen, N.F.; Lang, K.-D.
Conference Paper
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Arranz, Pol; Tarragó, Joan; Vallvé, Xavier; Marwede, Max; Boer, Emilia den; Rothe, Michael; Wuest, Felix; Middendorf, Andreas; Cocciantelli, Jean-Michel; Lippert, Michael
Conference Paper
2012Reducing hazardous substances in electronics
Deubzer, O.
Book Article
2012Secure and efficient validation of data traffic flows in fixed and mobile networks
Mueller, J.; Al-Hazmi, Y.; Sadikin, M.F.; Vingarzan, D.; Magedanz, T.
Conference Paper
Fulltext
2012SiCer - a substrate to combine ceramic and silicon based micro systems
Fischer, M.; Mache, T.; Pawlowski, B.; Schabbel, D.; Müller, J.
Conference Paper
2012SiCer - ein innovativer Substratwerkstoff für MEMS
Pawlowski, B.; Schabbel, D.; Barth, S.; Fischer, M.; Bartsch, H.; Hoffmann, M.; Müller, J.
Book Article
2012A Thermal Model for Non-linear Distortion in Printed Circuit Lines for Condition Monitoring of Electronics
Krueger, Michael; Middendorf, Andreas; Nissen, Nils F.; Reichl, Herbert; Lang, Klaus-Dieter
Conference Paper
2012Towards a generic application aware network resource control function for next-generation-networks and beyond
Mueller, J.; Magedanz, T.
Conference Paper
Fulltext
2012Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling
Hölck, O.; Bauer, J.; Braun, T.; Walter, H.; Wittler, O.; Wunderle, B.
Conference Paper
2012Untersuchungen zur Entwicklung eines Kultivierungsmediums für eine humane Amniocyten-Zelllinie
Müller, Janina; Lang, Siegmund (Referent); Ziehr, Holger (Koreferent)
Bachelor Thesis
201120%-Efficient Rear Side Passivated Solar Cells in Pilot Series Designed for Conventional Module Assembling
Mohr, A.; Engelhart, P.; Klenke, C.; Wanka, S.; Stekolnikov, A.; Scherff, M.; Seguin, R.; Tardon, S.; Rudolph, T.; Hofmann, M.; Stenzel, F.; Lee, J.; Diez, S.; Wendt, J.; Schmidt, S.; Müller, J.W.; Wawer, P.; Hofmann, M.; Saint-Cast, P.
Conference Paper
201160 GHz ultrawideband hybrid-integrated dual-polarized front-end in LTCC technology
Müller, R.; Ariza, A.P.; Xia, L.; Wollenschläger, F.; Schulz, A.; Lopez-Diaz, D.; Elkhouly, M.; Thomä, R.S.; Hein, M.; Müller, J.
Conference Paper
2011Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Wunderle, B.; Reichl, H.
Conference Paper
2011Application of hybrid methods to analyse interface properties of packaging materials on miniaturized specimens
Walter, Hans; Wunderle, Bernhard; Keller, Jürgen; Hölck, Ole; Wittler, Olaf; Michel, Bernd
Conference Paper
2011Audience behavior around large interactive cylindrical screens
Beyer, G.; Alt, F.; Müller, J.; Schmidt, A.; Isakovic, K.; Klose, S.; Schiewe, M.; Haulsen, I.
Conference Paper
2011Automated test system for in-situ testing of reliability and aging behaviour of thermal interface materials
AboRas, M.; Haug, R.; Schacht, R.; Monory-Plantier, C.; May, D.; Wunderle, B.; Winkler, T.; Michel, B.
Conference Paper
2011Automatisierte Justage von CO2-Laserstrahlführungssystemen
Brecher, Christian; Emonts, Michael; Stimpfl, Joffrey; Müller, Juliane
Journal Article
2011Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Journal Article
2011Can luminescence imaging replace lock-in thermography on solar cells?
Breitenstein, O.; Warta, W.; Schubert, M.C.; Kwapil, W.; Müller, J.; Hinken, D.; Bothe, K.; Bauer, J.
Journal Article
Fulltext
2011Carbon footprinting of information technology products based on ISO standards: Fujitsu case study
Böttner, H.; Schischke, K.; Nissen, N.F.
Conference Paper
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Bartsch, H.; Walther, F.; Krümmer, R.; Reimann, T.; Barth, S.; Müller, J.
Conference Paper
2011Characterization of deformation properties of metals in 3D ICs
Wittler, O.; Mroßko, R.; Huber, S.; Dowhan, L.; Lang, K.-D.
Conference Paper
2011Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination
Hölck, O.; Bauer, J.; Wittler, O.; Michel, B.; Wunderle, B.
Conference Paper
2011Condition monitoring system adapted for photovoltaic power converter
Guenther, J.; Rothe, M.; Hefer, J.; Middendorf, A.; Lang, K.-D.
Conference Paper
2011Degradation of moulding compounds during highly accelerated stress tests. A simple approach to study adhesion by performing button shear tests
Pufall, R.; Goroll, M.; Mahler, J.; Kanert, W.; Bouazza, M.; Wittler, O.; Dudek, R.
Conference Paper
2011Design for recycling measures for waste prevention in high-tech sectors: The case of laptop computers and photovoltaic modules
Marwede, Max; Schischke, Karsten; Hickey, Stewart; Arranz, Pol; Ospina, Jose; Ting, Angela
Conference Paper
2011Detection of FTOHs in indoor air of work places
Schlummer, Martin; Kizlauskas, Markus; Gruber, Ludwig; Fiedler, Dominik; Müller, Josef; Biegler-Engler, Annegret
Abstract
2011Eco-Reliability - A Fusion of GreenTech and HighTech
Nissen, N. F.; Wittler, O.; Middendorf, A.; Lang, K.-D.
Journal Article
2011Electronics condition monitoring for improving sustainability of power electronics
Middendorf, A.; Nissen, N.; Guttowski, S.; Lang, K.-D.
Conference Paper
2011Environmental monitoring of HBCD in Europe
Rüdel, H.; Nowak, J.; Müller, J.; Ricking, M.; Quack, M.; Klein, R.
Conference Paper
2011Evolution von Dienstkontrollmechanismen in Netzen der nächsten Generation und im Internet der Zukunft
Magedanz, T.; Müller, J.
Conference Paper
2011Evolutionary future internet service platforms enabling seamless cross layer interoperability
Lange, L.; Magedanz, T.; Müller, J.; Nehls, D.; Vingarzan, D.
Conference Paper
2011Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards
Nowak, T.; Schacht, R.; Walter, H.; Wunderle, B.; Ras, M.A.; May, D.; Wittler, O.; Lang, K.-D.
Conference Paper
2011Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
Hölck, Ole; Bauer, Jörg; Wittler, Olaf; Lang, Klaus Dieter; Michel, Bernd; Wunderle, Bernhard
Conference Paper
2011Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowha, L.; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.
Journal Article
2011Ferroelectric Zr0.5Hf0.5O2 thin films for nonvolatile memory applications
Müller, J.; Böscke, T.S.; Bräuhaus, D.; Schröder, U.; Böttger, U.; Sundqvist, J.; Kcher, P.; Mikolajick, T.; Frey, L.
Journal Article
2011Ferroelectricity in hafnium oxide thin films
Böscke, T.S.; Müller, J.; Bräuhaus, D.; Schröder, U.; Böttger, U.
Journal Article
2011Ferroelectricity in hafnium oxide: CMOS compatible ferroelectric field effect transistors
Boschke, T.S.; Müller, J.; Bräuhaus, D.; Schröder, U.; Böttger, U.
Conference Paper
2011Ferroelectricity in yttrium-doped hafnium oxide
Müller, J.; Schröder, U.; Böscke, T.S.; Müller, I.; Böttger, U.; Wilde, L.; Sundqvist, J.; Lemberger, M.; Kücher, P.; Mikolajick, T.; Frey, L.
Journal Article
2011Fracture-mechanical interface characterisation for thermo-mechanical co-design: An effcient and comprehensive method for critical mixed-mode data extraction
Wunderle, Bernhard; Schulz, Marcus; Keller, Jürgen; Schlottig, Gerd; Maus, Ingrid; May, Daniel; Hölck, Ole; Pape, Heinz; Michel, Bernd
Journal Article
2011Gain of blue and cyan InGaN laser diodes
Lermer, T.; Gomez-Iglesias, A.; Sabathil, M.; Müller, J.; Lutgen, S.; Strauss, U.; Pasenow, B.; Hader, J.; Moloney, J.V.; Koch, S.W.; Scheibenzuber, W.; Schwarz, U.T.
Journal Article
2011Gestaltung impulsentkoppelter Lineardirektantriebsachsen aus Anwendersicht - GiLdA
Großmann, Knut; Neugebauer, Reimund; Müller, Jens; Pagel, Kenny
Conference Paper
Fulltext
2011An industry perspective on the optimization of InGaN lasers and LEDs via modeling
Gomez-Iglesias, A.; Sabathil, M.; Lermer. T.; Müller, J.; Galler, B.; Eichler, C.; Avramescu, A.; Dini, D.; Pietzonka, I.; Tautz, S.; Breidenassel, A.; Bruederl, G.; Lell, A.; Meyer, T.; Peter, M.; Lutgen, S.; Strauss, U.; Pasenow, B.; Koch, S.W.; Scheibenzuber, W.; Schwarz, U.T.
Conference Paper
2011Investigation of thin films by nanoindentation with doe and numerical methods
Dowha, .; Wymysowski, A.; Wittler, O.
Conference Paper
2011Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique
Vogel, D.; Rzepka, S.; Michel, B.; Gollhardt, A.
Conference Paper
2011Macroscopic and microscopic electrical characterizations of high-k ZrO 2 and ZrO2/Al2O3/ZrO2 metal-insulator-metal structures
Martin, D.; Grube, M.; Weinreich, W.; Müller, J.; Wilde, L.; Erben, E.; Weber, W.M.; Heitmann, J.; Schröder, U.; Mikolajick, T.; Riechert, H.
Journal Article
2011Massive deployment of small coverage area cells in the all-IP wireless system - Opportunities, issues and solutions
Corici, M.; Onofrei, A.; Vingarzan, D.; Mueller, J.; Magedanz, T.
Conference Paper
2011Eine Methodik zur Analyse erhöhter Beanspruchungen von Halbleiterkomponenten und deren AVT hinsichtlich geänderter Anforderungen im Automobil
Hahn, Daniel; Straube, Stefan; Middendorf, Andreas; Lochner, Helmut; Abelein, Ulrich; Lang, Klaus-Dieter
Conference Paper
2011Modeling and optimization of energy harvesting-systems under non-ideal operating temperatures with regard to availability of power-supply and reduction of environmental impacts
Benecke, S.; Middendorf, A.; Nissen, N.F.; Lang, K.-D.
Conference Paper
2011Modelling of metal degradation in power devices under active cycling conditions
Kanert, W.; Pufall, R.; Wittler, O.; Dudek, R.; Bouazza, M.
Conference Paper
2011New developments in thermo-optical-measurement devices
Staab, T.E.M.; Müller, J.; Winkler, D.; Diegeler, A.
Conference Paper
2011Non-energy related policy options to foster eco-design of electronics products
Maxwell, D.; McAndrew, L.; Schischke, K.; Stobbe, L.; Nissen, N.F.; White, O.
Conference Paper
2011Packaging of MEMS/MOEMS and nanodevices: Reliability, testing, and characterization aspects
Tekin, T.; Ngo, H.-D.; Wittler, O.; Bouhlal, B.; Lang, K.-D.
Conference Paper
2011Per- and polyfluorinated compounds in consumer products
Jürling, Heinrich; Müller, Josef; Schlummer, Martin; Biegel-Engler, Annegret
Abstract
2011Phase transitions in ferroelectric silicon doped hafnium oxide
Böscke, T.S.; Teichert, S.; Bräuhaus, D.; Müller, J.; Schröder, U.; Böttger, U.; Mikolajick, T.
Journal Article
2011Recent results of blue and green InGaN laser diodes for laser projection
Lutgen, S.; Dini, D.; Pietzonka, I.; Tautz, S.; Breidenassel, A.; Lell, A.; Avramescu, A.; Eichler, C.; Lermer, T.; Müller, J.; Bruederl, G.; Gomez-Iglesias, A.; Strauss, U.; Scheibenzuber, W.G.; Schwarz, U.T.; Pasenow, B.; Koch, S.
Conference Paper
2011Reliability analysis of low temperature low pressure Ag-sinter die attach
Mroßko, R.; Oppermann, H.; Wunderle, B.; Michel, B.
Conference Paper
2011Schichtholzherstellung im Hochfrequenzverfahren: Kalte Klebfugen rechtzeitig erkannt
Meinlschmidt, P.; Märgner, V.; Jacob, A.F.; Müller, J.
Journal Article
2011SiCer - an advanced substrate for 3D integrated nano and micro systems
Fischer, M.; Mache, T.; Bartsch, H.; Müller, J.; Pawlowski, B.; Barth, S.
Conference Paper
2011Skyfarming an ecological innovation to enhance global food security
Germer, J.; Sauerborn, J.; Asch, F.; Boer, J. de; Schreiber, J.; Weber, G.; Müller, J.
Journal Article
2011Smarte adaptive-optische Mikrosysteme - Aufbautechnologie und thermomechanische Charakterisierung
Burkhardt, T.; Bruchmann, C.; Kamm, A.; Hornaff, M.; Beckert, E.; Gebhardt, S.; Müller, J.; Hoffmann, M.; Eberhardt, R.; Tünnermann, A.
Conference Paper
2011Survey of patterns, levels, and trends of perfluorinated compounds in aquatic organisms and bird eggs from representative German ecosystems
Rüdel, H.; Müller, J.; Jürling, H.; Bartel-Steinbach, M.; Koschorreck, J.
Journal Article
2011The third IEEE international workshop on open NGN and IMS testbeds: ONIT 2011
Mueller, J.; Copeland, R.; Magedanz, T.
Conference Paper
2011UE & network initiated QoS reservation in NGN and beyond
Mueller, J.; Magedanz, T.; Corici, M.; Vingarzan, D.
Conference Paper
2011Welded seam inspection with high energy X-rays
Scholz, O.; Behrendt, R.; Wenzel, T.; Stocker, T.; Müller, J.
Report
2011Z-, Y- and M-type hexagonal ferrites for high-frequency inductive multilayer devices
Töpfer, J.; Bierlich, S.; Barth, S.; Pawlowski, B.; Bechtold, F.; Müller, J.
Conference Paper
2010Adhesion of moulding compounds on various surfaces: A study on moisture influence and degradation after high temperature storage
Pufall, R.; Goroll, M.; Bouazza, M.; Wittler, O.; Michel, B.
Conference Paper
2010Adhesion of moulding compounds. Can material pre-selection increase the reliability of electronic components?
Pufall, R.; Michel, B.; Kaulfersch, E.
Conference Paper
2010Advanced virtual qualification methods to reduce the time-to-market of microelectronic assemblies
Shirangi, M.H.; Koyuncu, M.; Keller, J.; Michel, B.
Conference Paper
2010Advanced virtual testing of structural integrity in microelectronic assemblies
Shirangi, M.H.; Otto, C.; Fischer, A.; Staa, P. van; Müller, W.H.; Michel, B.
Conference Paper
2010Advances in thermal interface technology: Mono-metal interconnect formation, processing and characterisation
Wunderle, B.; Klein, M.; Dietrich, L.; Abo Ras, M.; Mrossko, R.; May, D.; Schacht, R.; Oppermann, H.; Michel, B.; Reichl, H.
Conference Paper
2010Advantages of a new wafer level integration concept based on direct bonded silicon on LTCC
Müller, J.; Fischer, M.; Bartsch de Torres, H.; Pawlowski, B.; Barth, S.
Conference Paper
2010Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Dowha, .; Wymysowski, A.; Janus, P.; Ekwiska, M.; Wittler, O.
Conference Paper
2010Application of nanoindentation technique to extract properties of thin films through experimental and numerical analysis
Wymyslowski, A.; Dowha, L.; Wittler, O.; Mrossko, R.; Dudek, R.
Journal Article
2010Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhán, L.; Wymyslowski, A.; Wittler, O.; Mrosko, R.
Conference Paper
2010A comfortable world without standby - the zero Watt inside (ZeWIn) system
Deubzer, O.; Nissen, N.F.; Riedel, H.; Gaugele, J.; Ulmer, D.
Abstract
2010Comparative study of residual stress measurement techniques with high spatial resolution
Vogel, D.; Maus, I.; Schindler-Saefkow, F.; Michel, B.
Conference Paper
2010Condition Monitoring for Maintenance, Repair and ReUse: Abstract
Middendorf, A.; Günther, J.; Rothe, M.; Nissen, N.; Lang, K.-D.
Abstract
Fulltext
2010Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2010Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J.; Vogel, D.; Lehr, M.D.; Grillberger, M.; Michel, B.
Conference Paper
2010Design and development of a miniaturized black body device for in-situ IR-camera calibration
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B.
Conference Paper
2010DoE simulations and measurements with the microDAC stress chip for material and package investigations
Schindler-Saefkow, F.; Otto, A.; Rzepka, S.; Wittler, O.; Wunderle, B.; Michel, B.
Conference Paper
2010EuP and ErP Progress of Implementation: Abstract
Nissen, N.F.; Stobbe, L.; Schischke, K.; Schlösser, A.; Mudgal, S.; Thornton, A.
Abstract
Fulltext
2010fibDAC stress relief - A novel stress measurement approach with high spatial resolution
Vogel, D.; Maus, I.; Michel, B.
Conference Paper
2010Field trials using coordinated multi-point transmission in the downlink
Jungnickel, V.; Forck, A.; Jaeckel, S.; Bauermeister, S.; Schiffermueller, S.; Schubert, S.; Wahls, S.; Thiele, L.; Haustein, T.; Kreher, W.; Mueller, J.; Droste, H.; Kadel, G.
Conference Paper
2010Handelbare Flächenausweisungszertifikate: Experiment Spiel.Raum: Ergebnisse einer Simulation in 14 Kommunen
Küpfer, C.; Ostertag, K.; Müller, J.; Seifert, S.; Schleich, J.; Ehrhart, K.-M.
Journal Article
2010Heat-removal performance scaling of interlayer cooled chip stacks
Brunschwiler, T.; Paredes, S.; Drechsler, U.; Michel, B.; Cesar, W.; Leblebici, Y.; Wunderle, B.; Reichl, H.
Conference Paper
2010Helping SMEs to care for eco-innovation beyond legal compliance: Abstract
Chancerel, P.; Schischke, K.; Alonso, J.C.; Rodrigo, J.; Cañellas, N.; Campo, F.J.
Abstract
Fulltext
2010Hermeticity of eutectic bond layers for sensor packages on wafer-level
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010Highly integrated advanced power electronic systems for automotive applications
Sommer, J.-P.; Hofmann, Th.; Neumann, A.; Podlasly, A.; Michel, B.
Conference Paper
2010Human pose estimation with implicit shape models
Müller, J.; Arens, M.
Conference Paper
Fulltext
2010Influence of moisture on humidity sensitive material parameters of microelectronics relevant polymers
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Influence of moisture on humidity sensitive material parameters of polymers used in microelectronic applications
Walter, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2010Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
Abo Ras, M.; Wunderle, B.; May, D.; Oppermann, H.; Schacht, R.; Michel, B.
Conference Paper
2010Interface fracture mechanics evaluation by correlation of experiment and simulation
Keller, J.; Maus, I.; Schlottig, G.; Pape, H.; Wunderle, B.; Michel, B.
Conference Paper
2010Investigation of the Reliability of Electronic Components Under Combined Loads (Vibration, Humidity, Temperature)
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010Investigation on thermo-mechanical reliability of flip-chip assemblies using anisotropic conductive adhesive
Kallmayer, C.; Walter, H.; Aschenbrenner, R.; Michel, B.
Conference Paper
2010Lebensdauerprognostik unter Berücksichtigung realer Belastungen am Beispiel von Bondverbindungen bei thermomechanischen Wechselbeanspruchungen
Middendorf, A.
Dissertation
Fulltext
2010Local multi-modal image matching based on self-similarity
Bodensteiner, C.; Huebner, W.; Juengling, K.; Mueller, J.; Arens, M.
Conference Paper
2010Local stress measurement methods for packaging purposes- a comparison
Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2010Localized high-resolution stress measurements on MEMS structures
Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2010Lokalisierung in drahtlosen Ad-Hoc Netzen
Müller, J.; Golestani, A. (Prüfer); Krogmann, M.
Thesis
2010Microstructural characterization of Al doped Zro2 MIM capacitor using atom probe tomography
Shariq, A.; Wedderhoff, K.; Müller, J.; Teichert, S.
Abstract
2010Miniaturized black body radiator for IR- Detector calibration - Design and development
Schacht, R.; Gerner, Ch.; Nowak, T.; May, D.; Wunderle, B.; Michel, B.
Conference Paper
2010Modeling and Optimization of Energy Harvesting Systems with Regard to Availability of Power Supply and Minimization of Environmental Impacts: Abstract
Benecke, S.; Middendorf, A.; Wüst, F.; Bochow-Neß, O.; Nissen, N.F.
Abstract
Fulltext
2010Modellierung des Energie- und Ressourcenbedarfs von IKT
Stobbe, L.; Schischke, K.; Nissen, N.F.; Middendorf, A.; Reichl, H.
Conference Paper
2010Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Journal Article
2010Molecular modeling of a 3D-crosslinked epoxy resin and its interface to native SiO2 - property prediction in microelectronic packaging
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.; Reichl, H.
Conference Paper
2010Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Hölck, O.; Dermitzaki, E.; Wunderle, B.; Bauer, J.; Michel, B.
Conference Paper
2010Neue Instrumente für weniger Flächenverbrauch: Der Handel mit Flächenausweisungszertifikaten im Experiment
Ostertag, K.; Schleich, J.; Ehrhart, K.-M.; Goebes, L.; Müller, J.; Seifert, S.; Küpfer, C.
Study
Fulltext
2010Eine neue Methode zur Charakterisierung und Detektion der Degradation von Die-Attach Materialien durch In-Situ Zustandsüberwachung der thermischen Eigenschaften
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Conference Paper
2010A new Method for Detection of Degradation in Die-Attach Materials by In-Situ Monitoring of Thermal Properties
Mazloum Nejadari, S.A.; Wittler, O.; Michel, B.
Book Article
2010Novel test structures for hermeticity testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Abstract
2010Novel test structures for hermetictiy testing of wafer bonding technologies
Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.
Conference Paper
2010Peer assist live streaming overlay for next-generation-networks
Müller, J.; Magedanz, T.; Fiedler, J.
Journal Article
2010Pilot processing of 18.6% efficient rear surface passivated silicon solar cells with screen printed front contacts
Wolf, A.; Wotke, E.A.; Mack, S.; Nekarda, J.-F.; Biro, D.; Preu, R.; Schlegel, K.; Weber, T.; Lossen, J.; Böscke, T.; Grohe, A.; Engelhart, P.; Müller, J.W.; Schubert, G.; Plagwitz, H.; Gassenbauer, Y.
Conference Paper
Fulltext
2010Progress in thermal characterisation methods and thermal interface technology within the "Nanopack" project
Wunderle, B.; Ras, M.A.; Klein, M.; Mrossko, R.; Engelmann, G.; May, D.; Wittler, O.; Schacht, R.; Dietrich, L.; Oppermann, H.; Michel, B.
Conference Paper
2010Retrospective monitoring of perfluorinated compounds in archived herring gull eggs
Rüdel, H.; Müller, J.; Jürling, H.; Schröter-Kermani, C.
Book Article
Fulltext
2010Retrospektives Monitoring von Perfluorierten Verbindungen (PFCs) in archivierten Silbermöweneiern
Rüdel, H.; Müller, J.; Jürling, H.; Paulus, M.; Schröter-Kermani, C.
Journal Article
Fulltext
2010SiCer - ein innovativer Substratwerkstoff für MEMS
Pawlowski, B.; Schabbel, D.; Barth, S.; Fischer, M.; Bartsch, H.; Hoffmann, M.; Müller, J.
Journal Article
2010Simulationsgestützte Zuverlässigkeitsbewertung im Mikro-Nano Übergangsbereich
Wittler, O.; Huber, S.; Mroßko, R.; Walter, H.; Auerswald, E.; Michel, B.
Conference Paper
2010Smart Systems Integration and Reliability. Honorary Volume on the Occasion of Herbert Reichl's 65th Birthday
Michel, B.; Lang, K.-D.
Book
2010Special issue of the 8th International Workshop on High Aspect Ratio Micro Structure Technology, HARMST 2009: Editorial
Achenbach, S.; Klymyshyn, D.; Michel, B.
Journal Article
2010A system-oriented approach for modeling energy harvesting devices in wireless sensor-modules
Kravcenko, E.; Niedermayer, M.; Guttowski, S.; Nissen, N.F.; Benecke, S.; Middendorf, A.; Reichl, H.
Conference Paper
2010Untersuchungen zu den Grenzwerten des Einsatzes adaptronischer Komponenten zur Impulsentkopplung von linearmotorgetriebenen Werkzeugmaschinenachsen unter veränderlichen strukturmechanischen Umgebungsbedingungen
Jungnickel, G.; Drossel, W.-G.; Müller, J.; Pagel, K.
Book Article
Fulltext
2010Verfahren zur Bestimmung von Deformationen im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Maus, I.; Gollhardt, A.; Michel, B.
Conference Paper
2010Waveguide design of green InGaN laser diodes
Lermer, T.; Schillgalies, M.; Breidenassel, A.; Queren, D.; Eichler, C.; Avramescu, A.; Müller, J.; Scheibenzuber, W.; Schwarz, U.T.; Lutgen, S.; Strauss, U.
Journal Article
2010Zerstörungsfreie Beobachtung von Rissen in Leiterplattendurchkontaktierungen - Quantisierung der Risslänge mittels Impulsthermographie und FEM-Simulation
Schacht, R.; Abo Ras, M.; May, D.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2009Abschätzung des Energiebedarfs der weiteren Entwicklung der Informationsgesellschaft: Bearbeitungsnummer I D 4 - 02 08 15 - 43/08; Abschlussbericht an das Bundesministerium für Wirtschaft und Technologie
Stobbe, L.; Nissen, N.F.; Proske, M.; Middendorf, A.; Schlomann, B.; Friedewald, M.; Georgieff, P.; Leimbach, T.; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Fraunhofer-Institut für System- und Innovationsforschung -ISI-, Karlsruhe
Report
Fulltext
2009Characterisation and modelling of the nanoindentation experiment in Au layers
Wittler, O.; Mrossko, R.; Huber, S.; Gollhardt, A.; Michel, B.
Conference Paper
2009The collaboration between Int J Life Cycle Assess and J LCA Jpn
Matsuno, Y.; Kondo, Y.; Mishima, N.; Shibaoke, N.; Yashiro, T.; Yamamoto, Y.; Morioka, T.; Nissen, N.F.; Schischke, K.; Stobbe, L.; Reichl, H.; Kurihara, S.; Nakano, K.; Hirao, M.; Kai, H.; Ishibashi, Y.; Shimase, H.; Kamohara, S.; Takemasa, T.; Higo, M.; Dowaki, K.; Genchi, Y.; Motoshita, M.; Itsubo, N.; Inaba, A.; Torii, M.; Narita, N.; Ogawa, K.; Hondo, H.; Hirayama, Y.; Nakajima, K.; Yamada, S.; Fukuhara, I.
Journal Article
2009Coordinated multipoint trials in the downlink
Jungnickel, V.; Thiele, L.; Wirth, T.; Haustein, T.; Schiffermüller, S.; Forck, A.; Wahls, S.; Jäckel, S.; Schubert, S.; Gabler, H.; Juchems, C.; Luhn, F.; Zavrtak, R.; Droste, H.; Kadel, G.; Kreher, W.; Müller, J.; Störmer, W.; Wannemacher, G.
Conference Paper
2009Crack and delamination risk evaluation in low-k BEoL stacks under chip package interaction aspects
Auersperg, J.; Vogel, D.; Lehr, M.U.; Grillberger, M.; Michel, B.
Conference Paper
2009Crack tip localization of sub-critical crack growth by means of IR-imaging and pulse excitation
May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2009Detailed correlation of electrical and breakdown characteristics to the structural properties of ALD grown HfO2- and ZrO2-based capacitor dielectrics
Schroeder, U.; Weinreich, W.; Erben, E.; Mueller, J.; Wilde, L.; Heitmann, J.; Agaiby, R.; Zhou, D.; Jegert, G.; Kersch, A.
Conference Paper
2009Detection of degradation in die-attach materials by in-situ monitoring of thermal properties
Wittler, O.; Nejadari, A.M.; Michel, B.
Conference Paper
2009Determination of copper/EMC interface fracture toughness during manufacturing, moisture preconditioning and solder reflow process of semiconductor packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Conference Paper
2009Effect of nonlinear hygro-thermal and residual stresses on the interfacial fracture in plastic IC packages
Shirangi, M.H.; Müller, W.H.; Michel, B.
Conference Paper
2009EUCEMAN - recent activities from the European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Conference Paper
2009Extending an IMS client with peer-to-peer content delivery
Fiedler, J.; Magedanz, T.; Müller, J.
Conference Paper
2009Failure modeling of ACA-glued flip-chip on flex assemblies
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2009Foreword to special issue on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008
Courtois, B.; Michel, B.
Journal Article
2009Hotspot-optimized interlayer cooling in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Reichl, H.
Conference Paper
2009Impact of interface variations on J-V and C-V polarity asymmetry of MIM capacitors with amorphous and crystalline Zr(1-x)AlxO2 films
Weinreich, W.; Reiche, R.; Lemberger, M.; Jegert, G.; Müller, J.; Wilde, L.; Teichert, S.; Heitmann, J.; Erben, E.; Oberbeck, L.; Schröder, U.; Bauer, A.J.; Ryssel, H.
Conference Paper
2009Improved manufacturability of ZrO2 MIM capacitors by process stabilizing HfO2 addition
Müller, J.; Böscke, T.S.; Schröder, U.; Reinicke, M.; Oberbeck, L.; Zhou, D.; Weinreich, W.; Kücher, P.; Lemberger, M.; Frey, L.
Conference Paper
2009Influence of moisture on the time and temperature dependent properties of polymer systems
Walter, H.; Dermitzaki, E.; Shirangi, H.; Wunderle, B.; Hartmann, S.; Michel, B.
Conference Paper
2009Innovations- und Technikanalyse Autonomer Verteilter Mikrosysteme
Schischke, K.; Beucker, S.; Clausen, J.; Niedermayer, M.
Report
Fulltext
2009Integration of reliability and environmental aspects in early design stages of mechatronics
Middendorf, A.; Deyter, S.; Gausemeier, J.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Interlayer cooling potential in vertically integrated packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Journal Article
2009Lifetime modelling for microsystems integration: From nano to systems
Wunderle, B.; Michel, B.
Journal Article
2009Lignin in der Elektronikindustrie
Müller, J.; Schmidt, R.; Nissen, N.F.; Scheel, W.
Conference Paper
2009Measurement and Analysis of the Impact of Micrometer Scale Cracks on the RF Performance and Reliability of Transmission Lines
Krüger, M.; Middendorf, A.; Ndip, I.; Nissen, N.F.; Reichl, H.
Conference Paper
2009Methodology and utilization of simplified eco-assessments for policy making
Stobbe, L.; Nissen, N.F.; Schischke, K.; Reichl, H.
Conference Paper
2009Micro- and nanoreliability research in the micro materials center Chemnitz of Fraunhofer ENAS
Michel, B.; Dudek, R.; Auersperg, J.; Winkler, T.
Journal Article
2009Modeling cure shrinkage and viscoelasticity to enhance the numerical methods for predicting delamination in semiconductor packages
Wunderle, B.; Wittler, O.; Walter, H.; Michel, B.; Shirangi, M.H.
Conference Paper
2009Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling
Wunderle, B.; Dermitzaki, E.; Hölck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Rätzke, K.; Faupel, F.; Michel, B.; Reichl, H.
Conference Paper
2009Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications
Wunderle, B.; Dermitzaki, E.; Holck, O.; Bauer, J.; Walter, H.; Shaik, Q.; Ratzke, K.; Faupel, F.; Michel, B.
Conference Paper
2009MST special issue on the conference MicroNanoReliability 2007. Editorial
Michel, B.
Conference Paper
2009Neue Instrumente zur Verringerung des Flächenverbrauchs: Handelbare Zertifikate für Flächenausweisungen im Experiment
Ostertag, K.; Müller, J.; Seifert, S.
Journal Article
Fulltext
2009NNodeTree: A scalable peer-to-peer live streaming overlay architecture for next-generation-networks
Müller, J.; Magedanz, T.; Fiedler, J.
Journal Article
Fulltext
2009Nondestructive failure analysis and simulation of encapsulated 0402 multilayer ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Michel, B.; Reichl, H.
Journal Article
2009Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, A.; Wittler, O.; Mrossko, R.; Dudek, R.; Auersperg, J.; Dowhan, L.
Conference Paper
2009Pervasive advertising
Müller, J.; Holleis, P.; Schmidt, A.; May, M.
Conference Paper
2009Reliability concepts of microsystem integration
Wunderle, B.; Michel, B.
Conference Paper
2009Retrospektives Monitoring von Organozinnverbindungen in biologischen Proben aus Nord- und Ostsee - sind die Anwendungsbeschränkungen erfolgreich?
Rüdel, H.; Steinhanses, J.; Müller, J.; Schröter-Kermani, C.
Journal Article
2009Revision der Anhänge RoHS und ELV
Deubzer, O.
Conference Paper
2009Simulation based analysis of secondary effects on solder fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper
2009Simulation Based Analysis of Secondary Effects on Solder Fatigue
Dudek, R.; Doering, R.; Bombach, C.; Michel, B.
Conference Paper
2009The Solving the E-waste Problem (StEP) Intiative: Exploring Sustainable Solutions
Maurer, C.; Schischke, K.; Kuehr, R.
Conference Paper
2009Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2009Study on the effect of moisture and elevated temperature on the fracture properties of visco elastic polymers
Walter, H.; Shirangi, H.; Dermitzaki, E.; Wunderle, B.; Michel, B.
Conference Paper
2009Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Wunderle, B.; Becker, K.-F.; Sinning, R.; Wittler, O.; Schacht, R.; Walter, H.; Schneider-Ramelow, M.; Halser, K.; Simper, N.; Michel, B.; Reichl, H.
Journal Article
2009Verfahren und Vorrichtung zur thermischen Ueberwachung von Ausfallprozessen
Wittler, O.; Wunderle, B.; Mazloum Nejadari, S.; Schacht, R.; Michel, B.
Patent
Fulltext
2009Vorrichtung und Verfahren zum Aktivieren eines WLAN-tauglichen Geraets, WLAN-taugliches Geraet und WLAN-Zugriffspunkt
Deubzer, O.; Ulmer, D.
Patent
Fulltext
2009Was regelt REACH?: Regulation (EC) 1907/2006: Registration, Evaluation, Authorization and Restriction of Chemicals (REACH-VO)
Deubzer, O.
Journal Article
2008Advanced adhesives based on carbon nanotube technology
Fecht, H.-J.; Leson, A.; Michel, B.; Werner, M.
Conference Paper
2008Alba - development of high-effciency multi-crystalline Si EWT solar cells for industrial fabrication at Q-cells
Peters, C.; Engelhart, P.; Hlusiak, M.; Wade, R.; Jesswein, R.; Rychtarik, D.; Müller, J.W.; Ulzhöfer, C.; Spätlich, S.; Neubert, T.; Harder, N.-P.; Schmiga, C.; Kray, D.; Grohe, A.; Glunz, S.W.
Conference Paper
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2008Anwendung von Impedanzspektroskopie und Mikroelektroden-Arrays in der zellbasierten Sensorik
Jäger, M.; Poll, R.; Bussek, A.; Ravens, U.; Sonntag, F.; Müller, J.; Günther, F.
Conference Paper
2008Application opportunities of energy harvesting principles into "non-electric" output forms for small electronic systems
Tsunezawa, K.; Oberender, C.; Reichl, H.
Conference Paper
2008Approaches of local stress measurement on microsystem devices
Vogel, D.; Auerswald, E.; Gollhardt, A.; Luczak, F.; Sabate, N.; Michel, B.
Conference Paper
2008Assessment of toxicity potential of metallic elements in discarded electronics: A case study of mobile phones in China
Wu, B.Y.; Chan, Y.C.; Middendorf, A.; Gu, X.; Zhong, H.W.
Journal Article
2008The Basque Approach to EuP Compliance - a Reference for SMEs and Regional Policy Makers
Ruiz, N.; Schischke, K.; Reichl, H.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics
Auersperg, J.; Wunderle, B.; Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2008Challenges for multi-scale modeling of multiple failure modes in microelectronics packaging
Auersperg, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2008Characterization of dual-stage moisture diffusion, residual moisture content and hygroscopic swelling of epoxy molding compounds
Shirangi, H.; Auersperg, J.; Koyuncu, M.; Walter, H.; Müller, W.H.; Michel, B.
Conference Paper
2008Condition indicators for reliability monitoring of microsystems
Eckert, T.; Bochow-Ness, O.; Middendorf, A.; Tetzner, K.; Reichl, H.
Conference Paper
2008Condition monitoring of microsystems supporting sustainability
Bochow-Neß, O.; Eckert, T.; Nissen, N.F.; Jaeschke, J.; Middendorf, A.; Reichl, H.
Conference Paper
2008Deformation and stress measurement on electronic components with high spatial resolution
Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.
Conference Paper
2008Design support system for global environment conscious product
Kumazawa, T.; Hiroshige, Y.; Deubzer, O.
Conference Paper
2008Device Switching on Demand - A Standby Reducing System
Ulmer, D.; Franke, D; Deubzer, O.; Nissen, N.F.
Conference Paper
2008Eco-design, energy efficiency and cleaner production strategies: SME business cases from Thailand and Malaysia
Schischke, K.; Soon, C.; Ahmad, M.; Nee, T.; Wan Hussein, W.M.; Ramasamy, R.; Reichl, H.; et al.
Conference Paper
2008Eco-efficiency for smart microsystems
Reichl, H.; Middendorf, A.; Nissen, N.F.; Stobbe, L.
Conference Paper
2008Editorial to MST special issue: Colloquium on Micro-Production, Karlsruhe, Germany, November 2007
Kraft, O.; Michel, B.
Conference Paper
2008Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs
Schacht, R.; Wunderle, B.; May, D.; Abo Ras, M.; Faust, W.; Michel, B.; Reichel, H.
Conference Paper
2008Electronics Goes Green 2008+. Merging Technology and Sustainable Development. Proceedings: Joint International Congress and Exhibition "Electronics Goes Green 2008+". September 7 - 10, 2008, Berlin, Germany
Reichl, H.; Nissen, N.F.; Müller, J.; Deubzer, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Conference Proceedings
2008Encapsulation of systems in package - process characterization and optimization
Schreier-Alt, T.; Schindler-Saefkow, F.; Wittler, O.; Kittel, H.
Conference Paper
2008Energy efficiency meets ecodesign - technology impacts of the European EuP directive
Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H.
Conference Paper
2008Expanding the Technological Boundaries of the Biopolymer PHB in Electronic Products
Walachowicz, F.; Petermann, C.; Achatz, B.; Scherzer, D.; Schneller, A.; Scheel, W.; Schmidt, R.; Nissen, N.F.; Müller, J.
Conference Paper
2008Experimental Methods of Thermal Validation and Optimization for Micro-electronic Assemblies Focusing on the Non-Destructive Failure Analysis Using Passive and Active IR-Thermography
Schacht, R.; May, D.; Kreyßig, K.; Wittler, O.; Wunderle, B.; Michel, B.
Journal Article
2008Exploring factors that influence the combined use of mobile devices and public displays for pedestrian navigation
Müller, J.; Jentsch, M.; Kray, C.; Krüger, A.
Conference Paper
Fulltext
2008FEA Based Reliability Prediction for Different Sn-Based Solders Subjected to Fast Shear and Fatigue Loadings
Dudek, R.; Kaulfersch, E.; Rzepka, S.; Röllig, M.; Michel, B.
Conference Paper
2008Forced Convection Interlay Cooling in Vertically Integrated Packages
Brunschwiler, T.; Michel, B.; Rothuizen, H.; Kloter, U.; Wunderle, B.; Oppermann, H.; Reichl, H.
Conference Paper
2008Global responsibility for green electronics and ICT
Griese, H.; Reichl, H.; Stobbe, L.
Conference Paper
2008Heterointegration of Complete Systems Based on Polytronics
Bock, K.; Nissen, N.F.; Müller, J.
Conference Paper
2008High aspect ratio TSV copper filling with different seed layers
Wolf, M.J.; Dretschkow, T.; Wunderle, B.; Jürgensen, N.; Engelmann, G.; Ehrmann, O.; Uhlig, A.; Michel, B.; Reichl, H.
Conference Paper
2008Immersion Ag as an alternative in 'Green' COB technology
Schneider-Ramelow, M.; Müller, J.; Göhre, J.-M.; Reichl, H.
Conference Paper
2008In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
Wunderle, B.; Kleff, J.; Mrossko, R.; Abo Ras, M.; May, D.; Schacht, R.; Oppermann, H.; Keller, J.; Michel, B.
Conference Paper
2008Incorporating Advanced Fatigue and Fracture Mechanics Based Failure Analysis into Design-Optimization of Electronics Components
Auersperg, J.; Michel, B.
Conference Paper
2008Interdependencies between reliability and standby
Nissen, N.F.; Middendorf, A.; Stobbe, L.; Schlösser, A.; Reichl, H.
Conference Paper
2008Investigation of fracture toughness and displacement fields of copper/polymer interface using image correlation technique
Shirangi, M.H.; Gollhardt, A.; Fischer, A.; Müller, W.H.; Michel, B.
Conference Paper
2008Investigations of Reliability of Lead-Free Solder Joints
Faust, W.; Poller, T.; Dudek, R.; Michel, B.
Journal Article
2008Lifetime Model for Flip-Chip on Flex using Anisotropic Conductive Adhesive under Moisture and Temperature Loading
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Logistic Concepts for Take-Back-Systems for Used Electronic Automotive Spare Parts
Stobbe, I.; Metzler, S.; Hohaus, C.; Kaerger, W.; Groke, M.; Knode, M.; Oberender, C.
Conference Paper
2008Material characterization and non-destructive failure analysis by transient pulse generation and IR-thermography
May, D.; Wunderle, B.; Abo Ras, M.; Faust, W.; Gollhard, A.; Schacht, R.; Michel, B.
Conference Paper
2008Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2008Mechanism of moisture diffusion, hygroscopic swelling and adhesion degradation in Epoxy Molding Compounds
Shirangi, M.H.; Fan, X.J.; Michel, B.
Conference Paper
2008A method for reliability characterisation of die attach materials
Wittler, O.; Mazloum Nejadari, S.A.; Michel, B.
Conference Paper
2008Micro to nano - scaling packaging technologies for future microsystems
Braun, T.; Becker, K.-F.; Bauer, J.; Hausel, F.; Pahl, B.; Wittler, O.; Mrossko, R.; Jung, E.; Ostmann, A.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Micro- and nanoscale deformation measurements at interface crack tips
Keller, J.; Mayer, S.; Gollhardt, A.; Michel, B.
Conference Paper
2008MicroCar 2008: Micro materials, nano materials for automotives. Volume of abstracts: Leipzig, 27.2.2008
Michel, B.
Conference Proceedings
2008Microsecurity and nanosecurity - Security research using the advantages of smart system integration
Michel, B.; Winkler, T.
Conference Paper
2008A Model for Gaining Significant Data to Establish Energy Profiles of Passive Electronic Components
Körber, G.; Schulz, G.; Viehmann, K.-R.; Huck, W.; Dietrich, M.; Schischke, K.; Nissen, N.F.; Stobbe, L.; Reichl, H.
Conference Paper
2008Modelling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards
Schacht, R.; Wunderle, B.; May, D.; Michel, B.; Reichl, H.
Conference Paper
2008Nano-Computertomographie - ein wertvolles Hilfsmittel bei metallographischen Untersuchungen zur Schadensanalyse mikroelektronischer und mikrotechnischer Komponenten
Faust, W.; Noack, E.; Michel, B.
Conference Paper
2008Nano-particle enhanced encapsulants for improved humidity resistance
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2008Nano-Particle Filled Epoxy Resins with Improved Diffusion Barrier Functionality
Braun, T.; Hausel, F.; Bauer, J.; Wittler, O.; Mrossko, R.; Bouazza, M.; Becker, K.-F.; Oestermann, U.; Koch, M.; Bader, V.; Minge, C.; Aschenbrenner, R.; Reichl, H.
Journal Article
2008Nanoreliability - Reliability Research for Microsystem Technology on the way from Micro to Nano
Michel, B.; Winkler, T.; Werner, M.; Fecht, H.
Journal Article
2008Nanoscale deformation measurements - concepts for failure and reliability assessment at the nanoscale
Michel, B.; Gollhardt, A.; Keller, J.
Conference Paper
2008Nanoscale resolution deformation measurements at crack tips of nanostructured materials and interface cracks
Keller, J.; Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2008Negatively-chirped laser enables nonlinear excitation and nanoprocessing with sub-20-fs pulses
Uchugonova, A.; Müller, J.; Bückle, R.; Tempea, G.; Isemann, A.; Stingl, A.; König, K.
Conference Paper
2008Numerical Simulation and Micro Deformation Measurements for Sensor Design in Automotive Technology
Sommer, J.-P.; Noack, E.; Michel, B.; Becker, K.-F.
Conference Paper
2008On-line condition monitoring of power semiconductors
Wernicke, T.; Gegusch, R.; Dieckerhoff, S.; Middendorf, A.; Seliger, G.; Reichl, H.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Kittel, H.; Michel, B.
Conference Paper
2008Package Induced Stress Simulation and Experimental Verification
Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.
Conference Paper
2008Präventive Ansätze zur zuverlässigkeitsorientierten Produktentwicklung
Steffen, D.; Jaeschke, J.; Middendorf, A.
Journal Article
2008Reliability and environmental evaluation in early design stages of mechatronics
Middendorf, A.; Jaeschke, J.; Tsunezawa, K.; Reichl, H.
Conference Paper
2008Reliability Investigations on Highly Integrated TPMS
Kaulfersch, E.; Maaike, M.; Taklo, M.M.V.; Weber, J.; Wunderle, B.; Wittler, O.; Mroßko, R.
Journal Article
2008Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive
Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.; Reichl, H.
Conference Paper
2008Reliability of Several Sn-Based Solders under Test- and Field Fatigue Loadings
Dudek, R.; Ratchev, R.; Faust, W.; Michel, B.
Journal Article
2008Reliability-solutions and concepts for applications in high-tech regions
Michel, B.
Book Article
2008Residual stress measurements of high spatial resolution
Vogel, D.; Luczak, F.; Michel, B.
Conference Paper
2008Residual Stress Measurements on Semiconductor Layers Utilizing Stress Relief Techniques
Vogel, D.; Lehr, M.U.; Grillberger, M.; Jaschke, V.; Geisler, H.; Gollhardt, A.; Luczak, F.; Michel, B.
Conference Paper
2008Review of exemptions from electronics-related material bans - status of reviews, backgrounds and experiences of a reviewer
Deubzer, O.; Reichl, H.
Conference Paper
2008RoHS-like regulations worldwide
Müller, J.; Griese, H.; Nissen, N.F.; Reichl, H.
Conference Paper
2008Spare Part Management from the View of Sustainability
Oberender, C.; Hiller, V.; Reichl, H.
Conference Paper
2008Special Issue of the Conference Smart Sensors, Actuators and MEMS, Maspalomas, Gran Canaria, Spain, 2-4 May 2007
Michel, B.; Becker, T.; Schmid, U.
Journal Article
2008Special issue of the high-aspect-ratio micro-structure technology workshop, HARMST'07. Editorial: Besancon, France, 7-9 June 2007
Malek, C.K.; Saile, V.; Michel, B.
Conference Paper
2008Specifying mechatronic systems in early design phases for analysing sustainability aspects
Deyter, S.; Gausemeier, J.; Middendorf, A.; Reichl, H.; Steffen, D.; Tsunezawa, K.; Walachowicz, F.
Conference Paper
2008Structure Property Correlation of Epoxy Resins Under the Influence of Moisture and Temperature; and Comparison of Diffusion Coefficient with MD-Simulations
Dermitzaki, E.; Wunderle, B.; Bauer, J.; Walter, H.; Michel, B.
Conference Paper
2008Study of Moisture Diffusion of Eppoxy Molding Compounds for Reliability Assessments of Plastic IC Packages
Shirangi, H.; Müller, W.H.; Michel, B.
Conference Paper
2008Sustainability Assessment of Polymers Based on Renewable Resources for Electronic Products
Achatz, B.; Piepenbrink, M.; Saling, P.; Scherzer, D.; Walachowicz, F.; Petermann, C.; Nissen, N.F.; Müller, J.
Conference Paper
2008Sustainability by Using Used Assemblies in Automotive Electronics
Mente, T.; Schuch, B.; Ernst, C.; Schuster, A.; Böckhorst, S.; Friedrichs, L.; Halser, K.; Bochow-Neß, O.; Middendorf, A.
Conference Paper
2008Systemunabhängige Referenzprozesse für das PLM. Handbuch TFB 57
Schuh, G.; Schlick, C.; Schmitt, R.; Lenders, M.; Bender, D.; Bohl, A.; Gärtner, T.; Hatfield, S.; Müller, J.; Mütze-Niewöhner, S.
Book
Fulltext
2008Thermal test- and field cycling induced degradation and its Fe-based prediction for different SAC solders
Dudek, R.; Faust, W.; Ratchev, R.; Roellig, M.; Albrecht, H.-J.; Michel, B.
Conference Paper
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Thermo-mechanical pre-optimisation of radar sensor design by means of FEA and microDAC measurements
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2008Through silicon via technology - processes and reliability for wafer-level 3D system integration
Ramm, P.; Wolf, M.J.; Klumpp, A.; Wieland, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2008Vibration, Deformation and Reliability - an Overview about Measuring Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.
Conference Paper
2008Von RoHS, ELV, EuP zur WEEE: Aktuelle Gesetzgebung
Deubzer, O.
Conference Paper
2008Wireless Sensor Networks for Agriculture and Automation: Challenges and Chances for Sustainability
Beucker, S.; Clausen, J.; Schischke, K.; Mwanza, J.; Altendorf, P.; Reichl, H.
Conference Paper
2008Zuverlässigkeit von Aufbauten mit in die Leiterplatte integrierten Bauelementen
Sommer, J.-P.; Michel, B.; Noack, E.; Seiler, B.; Becker, K.-F.; Neumann, A.
Conference Paper
2008Zuverlässigkeits-Lösungsansätze und Konzepte für Anwendungen im Hightech Bereich
Michel, B.
Book Article
2007Applications of biopolymers in electronic products
Nissen, N.F.; Kleinert, G.; Petermann, C.; Mothes, G.; Müller, J.; Reichl, H.; Scheel, W.; Schmidt, R.
Conference Paper
2007Begrenzung von Schadstoffeinträgen bei Bewirtschaftungsmaßnahmen in der Landwirtschaft bei Düngung und Abfallverwertung: Teil 1: Stoffuntersuchungen; Teil 2: Bodenuntersuchungen. Forschungsbericht 202 33 305 und 202 74 271
Kördel, W.; Herrchen, M.; Müller, J.; Kratz, S.; Fleckenstein, J.; Schnug, E.; Saring, U.; Thomas, J.; Reinhold, J.
Report
2007The calcium test. A versatile tool for the investigation of barrier properties of polymers and reliability tests of encapsulation processes
Boeffel, C.; Müller, J.; Müller, R.; Bauer, M.
Conference Paper
2007Charakterisierungsmethodik für dünne Schichten im Sub-Mikrometerbereich
Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2007Condition Indicators for Reliability Monitoring of Microsystems
Bochow-Ness, O.; Eckert, T.; Fujino, M.; Middendorf, A.; Reichl, H.
Conference Paper
2007Design for reliability with AuSn interconnects
Dudek, R.; Wittler, O.; Faust, W.; Brämer, B.; Klein, M.; Jun, W.; Michel, B.
Conference Paper
2007Design, test, integration and packaging of MEMS/MOEMS, 2006: Editorial
Michel, B.; Courtois, B.
Conference Paper
2007Displayzelle mit kompartimentierter Fluessigkristallschicht, Verfahren zu deren Herstellung und hierfuer geeignete, ein Fluessigkristall-Material enthaltende Mischung
Bauer, M.; Kuschel, F.; Mueller, J.
Patent
Fulltext
2007Dynamic mechanical behavior of SnAgCu BGA solder joints determined by fast shear tests and FEM simulations
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B.
Conference Paper
2007Eco-design as the tool for decreasing the impact of electronic technology on environment
Szendiuch, I.; Schischke, K.
Conference Paper
2007Eco-design workflow process
Vasko, C.; Szendiuch, I.; Schischke, K.
Conference Paper
2007Enterprise interoperability II. New challenges and approaches. Selected conference papers
Gonçalves, R.J.; Müller, J.P.; Mertins, K.; Zelm, M.
Conference Proceedings
2007Entscheidungsfindung unter Nachhaltigkeitsgesichtspunkten
Oberender, C.
Conference Paper
2007EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Journal Article
2007EUCEMAN - The European Center for Microreliability and Nanoreliability
Michel, B.; Winkler, T.
Conference Paper
2007The EuP directive - current status and steps towards implementation
Nissen, N.F.; Schischke, K.; Stobbe, L.
Conference Paper
2007European environmental legislation - insights into the EuP process
Nissen, N.F.; Stobbe, L.; Schischke, K.; Müller, J.; Reichl, H.
Conference Paper
2007Experimental characterization of thin Copper foils
Auerswald, E.; Walter, H.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2007Experimental Determination of Fracture Parameters Within Small Regions by AFM Techniques
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2007Experimental Vibration Analyses by Laser Vibrometer under Vacuum Conditions
Schnitzer, R.; Rümmler, N.; Dost, Mi.; Michel, B.; Hauck, T.
Conference Paper
2007Experimental Vibration and Deformation Analyses for Increase Micro-Structure Reliability
Rümmler, N.; Schnitzer, R.; Michel, B.
Conference Paper
2007Explorative study into the sustainable use and substitution of soldering metals in electronics: Ecological and economical consequences of the ban of lead in electronics and lessons to be learned for the future
Deubzer, O.
Dissertation
2007Failure Analysis of Microelectronic Packages by Pulse IR Thermography
Wunderle, B.; May, D.; Schacht, R.; Michel, B.
Abstract
2007Fast Shear testing and FEM Simulations for Determination of Dynamic Mechanical Behavior of SnAgCu BGA Solder Joints
Kaulfersch, E.; Rzepka, S.; Ganeshan, V.; Müller, A.; Michel, B.
Conference Paper
2007Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept
Roellig, M.; Dudek, R.; Wiese, S.; Boehme, B.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Journal Article
2007FIB Based Local Residual Stress Measurement - Potentials and Challenges
Vogel, D.; Michel, B.
Conference Paper
2007FIB-based technique for stress characterization on thin films for reliability purposes
Sabaté, N.; Vogel, D.; Keller, J.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cané, C.; Michel, B.
Journal Article
2007Focused Ion Beam (FIB) as an Analytical Tool in Micro- and Nanotechnology
Gollhardt, A.; Michel, B.
Conference Paper
2007Fracture, delamination and fatigue evaluation within RSM/DOE concepts of enhanced smart systems
Auersperg, J.; Michel, B.
Conference Paper
2007Fully integrated one phase liquid cooling system for organic boards
May, D.; Wunderle, B.; Schindler-Saefkow, F.; Nguyen, B.; Schacht, R.; Michel, B.; Reichl, H.
Conference Paper
2007Global harmonization of RoHS-like regulations
Müller, J.; Griese, H.; Reichl, H.
Conference Paper
2007Global impacts of the e-waste problem
Deubzer, O.; Griese, H.; Reich, H.
Conference Paper
2007Global sustainable development needs advanced electronics
Griese, H.; Mueller, J.; Nissen, N.F.; Reichl, H.; Stobbe, L.
Conference Paper
2007HARMST, High Aspect Ratio Micro Structure Technology Workshop. Editorial: Gyenogju, Korea, 10-13 June 2005
Kwon, T.H.; Michel, B.
Conference Paper
2007Improvement options for external power supplies and battery chargers: Results of the EuP preparatory study
Schischke, K.; Mugdal, S.; Turunen, L.; Lescuyer, L.; Nissen, N.
Conference Paper
2007Improvement options for external power supplies and battery chargers results of the EuP preparatory study
Schischke, K.; Mugdal, S.; Turunen, L.; Lescuyer, L.; Nissen, N.
Conference Paper
2007In die Leiterplatte integrierte ICs - Verformungsanalyse mit numerischen und messtechnischen Methoden
Sommer, J.-P.; Noack, E.; Seiler, B.; Michel, B.
Conference Paper
2007In-line plasma etching at atmospheric pressue for edge isolation in crystalline Si solar cells
Heintze, M.; Hauser, A.; Möller, R.; Wanka, H.; Lopez, E.; Dani, I.; Hopfe, V.; Müller, J.W.; Huwe, A.
Conference Paper
2007In-situ Microscopic Studies on Microstructural Degradation and FE Analyses for Miniaturized SAC Solder Joints under Thermal Test- and Field Cycling
Dudek, R.; Faust, W.; Döring, R.; Michel, B.
Conference Paper
2007Integration of reliability and environmental aspects in the early design stages of mechatronics
Tsunezawa, K.; Middendorf, A.; Nissen, N.F.; Reichl, H.; Walachowicz, F.
Conference Paper
2007Localized stress measurements - a new approach covering needs for advanced micro and nanoscale system development
Vogel, D.; Gollhardt, A.; Sabate, N.; Keller, J.; Michel, B.; Reichl, H.
Conference Paper
2007Lokale Eigenspannungsmessung im FIB - Potential und Herausforderung
Vogel, D.; Michel, B.
Conference Paper
2007Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions
Dudek, R.; Faust, W.; Wiese, S.; Röllig, M.; Michel, B.
Conference Paper
2007Measurement of stresses in MEMS structures by stress release
Vogel, D.; Sabate, N.; Gollhardt, A.; Michel, B.
Conference Paper
2007Messung von Bruchkenngrößen in sehr kleinen Werkstoffbereichen mit dem AFM
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2007A methodology to characterise thin films in the sub-micron range
Wittler, O.; Mroßke, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.
Conference Paper
2007Micro- and Nanosecurity - Security by Miniaturization in MST
Michel, B.; Winkler, T.
Conference Paper
2007Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique, in Micro- and Opto-Electronic Materials and Structures
Michel, B.; Keller, J.
Book Article
2007Microsecurity, Nanosecurity - Security Research in Europa Utilizing Advanced Micro- and Nanotechnologies
Michel, B.; Winkler, T.
Conference Paper
2007Microsecurity, Nanosecurity - Sicherheitsforschung in Europa unter Verwendung von Methoden der Mikro- und Nanotechnologien
Michel, B.; Winkler, T.
Conference Paper
2007Microstucture of Damaged Solder
Faust, W.; Dudek, R.; Michel, B.
Conference Paper
2007MMCB - The Micro Materials Center Berlin and Chemnitz at Fraunhofer IZM
Michel, B.
Conference Paper
2007Mobile E-Mail und Device Management: Vortrag gehalten auf der Mobile Computing Konferenz 2007, 9. Mai 2007, Schliersee-Spitzingsee, Germany
Dufft, Nicole; Müller, Jürgen
Presentation
Fulltext
2007Molecular Dynamics Simulation and Mechanical Characterisation of Epoxy Resins Examined at Different Temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Molecular dynamics simulation for the diffusion of water in amorphous polymers examined at different temperatures
Dermitzaki, E.; Bauer, J.; Walter, H.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Nano-Reliability within the Framework of Fraunhofer Marked-Oriented Nano-Scale Activities
Sommer, J.-P.; Michel, B.; Petzold, M.; Schönecker, A.; Kusnezoff, M.; Wunderle, B.
Conference Paper
2007NanoDAC - Object deformation measurements for micro and nanotechnology applications
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2007Nanodeformation Measurements for Reliability Studies of Nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2007Nanoreliability - Reliability Concepts for Micro-Nano Interface Regions
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper
2007Nanoreliability - Zuverlässigkeitskonzepte für den Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Wunderle, B.; Auersperg, J.
Conference Paper
2007Nanoscale deformation measurements for reliability assessment of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2007Netzwerk
Ulmer, D.; Bühler, O.; Müller, J.; Nissen, N.; Stobbe, L.; Middendorf, A.
Patent
Fulltext
2007Non-destructive failure analysis and modeling of encapsulated miniature SMD ceramic chip capacitors under thermal and mechanical loading
Wunderle, B.; Braun, T.; May, D.; Mazloum, A.; Bouazza, M.; Walter, H.; Wittier, O.; Schacht, R.; Becker, K.-F.; Schneider-Ramelow, M.; Michel, B.; Reichl, H.
Conference Paper
2007Numerical Analysis for Thermo-Mechanical Reliability of Polymers in Electronic Packaging
Dudek, R.; Walter, H.; Auersperg, J.; Michel, B.
Conference Paper
2007Occurrence of polycyclic musks in sewage sludge and their behaviour in soils and plants. Pt.2: Investigation of polycyclic musks in soils and plants
Litz, N.; Müller, J.; Böhmer, W.
Journal Article
2007Optimization and robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
Auersperg, J.; Klein, M.; Michel, B.
Conference Paper
2007Organic pollutants in compost and digestate: Part 2. Polychlorinated dibenzo-p-dioxins, and -furans, dioxin-like polychlorinated biphenyls, brominated flame retardants, perfluorinated alkyl substances, pesticides, and other compounds
Brandli, R.C.; Kupper, T.; Bucheli, T.D.; Zennegg, M.; Huber, S.; Ortelli, D.; Müller, J.; Schaffner, C.; Iozza, S.; Schmid, P.; Berger, U.; Edder, P.; Oehme, M.; Stadelmann, F.X.; Tarradellas, J.
Journal Article
2007Progressing from Micro to Nanoreliability in System Integration
Wunderle, B.; Michel, B.
Conference Paper
2007Pulse and Lock-In Infrared Thermography - Possibilities for Non-Destructive Reliability Analysis of Micro-Electronic Assemblies
May, D.; Schacht, R.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2007Reliability analysis for smart systems on the way from micro to nano
Michel, B.; Auersperg, J.; Vogel, D.
Conference Paper
2007Reliability Aspect Integration in Early Stages of Design Processes for Mechatronic Systems
Middendorf, A.; Keller, J.; Walter, H.; Reichl, H.
Conference Paper
2007Reliability of SnPb and Pb-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Journal Article
2007Reliablility of SnPb and Pb-Free Flip-Chips under Different Test Conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Journal Article
2007Residual stress measurement on a MEMS structure with high-spatial resolution
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B.
Journal Article
2007Retrospective monitoring of organotin compounds in freshwater fish from 1988 to 2003: Results from the German environmental specimen bank
Rüdel, H.; Müller, J.; Steinhanses, J.; Schröter-Kermani, C.
Journal Article
2007Risikobewertung von Chemikalien
Müller, J.
Journal Article
2007Schadensanalyse in der AVT am Beispiel bleifreier Lotverbindungen
Faust, W.; Dudek, R.; Michel, B.; Poller, T.
Conference Paper
2007State of RoHS (non) compliance in small and medium sized enterprises: Technical, economical and environmental evaluation of the transition process
Liu, R.; Schischke, K.; Bukat, K.; Koziol, G.; Sitek, J.; Zuber, K.-H.; Reichl, H.
Conference Paper
2007Status and impacts of RoHS-like regulations - the role of material bans in sustainable development
Deubzer, O.; Griese, H.; Zangl, S.; Andrae, A.; Reichl, H.
Conference Paper
2007System Integration on Wafer Level - Requirements and Technical Solutions
Wolf, M.J.; Michel, B.; Ramm, P.; Reichl, H.
Conference Paper
2007A test system for ensuring material reliability in micro- and nanoelectronics
Wittler, O.; Auerswald, E.; Dermitzaki, E.; Gollhardt, A.; May, D.; Schmitz, S.; Wunderle, B.; Michel, B.
Conference Paper
2007Testing of Microcomponents
Michel, B.; Walter, H.
Book Article
2007Thermo-mechanical reliability of 3D-integrated microstructures in stacked silicon
Wunderle, B.; Mrossko, R.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michl, B.; Reichl, H.
Conference Paper
2007Thermo-mechanical simulation of inter-chip via reliability for 3D-integration
Mrossko, R.; Wunderle, B.; Wittler, O.; Kaulfersch, E.; Ramm, P.; Michel, B.; Reichl, H.
Conference Paper
2007Towards a robust design of electronics assemblies under fracture, delamination and fatigue aspects
Auersperg, J.; Michel, B.
Conference Paper
2007Der Weg zu Ökodesignanforderungen für externe Netzteile: Entstehung und Inhalt der vorbereitenden EuP-Studie
Schischke, K.
Journal Article
2007Zuverlässigkeit für elektronische Bauelemente mit hoher Packungsdichte
Sommer, J.-P.; Dudek, R.; Michel, B.; Noack, E.; Seiler, B.
Conference Paper
2007Zuverlässigkeitsprobleme im Hightech-Bereich - Lösungsansätze und Konzepte
Michel, B.
Book Article
20063D-PCB-Packages mit Wasserkühlung für High-Power-Anwendungen
Schindler-Saefkow, F.; Schramm, H.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
20063D-PCB-packaging technology for high power applications with water cooling
Schindler-Saefkow, F.; May, D.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
Fulltext
2006Accelerated active high-temperature cycling test for power MOSFETs
Schacht, R.; Wunderle, B.; Auerswald, E.; Michel, B.; Reichl, H.
Conference Paper
2006Advanced packages with buried dies: Design support by means of FE analysis and deformation measurement in micro scale
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
2006AFM based fracture analysis in micro- and nanomaterials
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2006Bestimmung der Querkontraktionszahl von Polymeren in Abhängigkeit von der Temperatur mit Hilfe des UNIDAC-Verfahrens
Walter, H.; Seiler, B.; Bombach, C.; Michel, B.
Conference Paper
2006Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
Auersperg, J.; Michel, B.
Conference Paper
2006Characterization of thermal interface materials
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.
Conference Paper
2006Characterization of thermal interface materials to support thermal simulation
Schacht, R.; May, D.; Gollhardt, A.; Wittler, O.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2006Colloquium on Micro Production, Aachen, Germany, 2-3 March 2005: Editorial
Gatzen, H.H.; Michel, B.
Abstract
2006Combined fracture, delamination risk and fatigue evaluation of advanced microelectronics applications towards RSM/DOE concepts
Auersperg, J.; Dudek, R.; Michel, B.
Conference Paper
2006Deformation and fatigue behaviour of AuSn interconnects
Wittler, O.; Walter, H.; Dudek, R.; Faust, W.; Jun, W.; Michel, B.
Conference Paper
2006Design, test, integration and packaging of MEMS/MOEMS, 2005
Courtois, B.; Michel, B.
Conference Paper
2006Determination of sulfonylurea herbicides in water and food samples using sol-gel glass-based immunoaffinity extraction and liquid chromatography-ultraviolet/diode array detection or liquid chromatography-tandem mass spectrometry
Degelmann, P.; Egger, S.; Jürling, H.; Müller, J.; Niessner, R.; Knopp, D.
Journal Article
2006Development of a 21% back-contact monocrystalline silicon solar cell for large-scale production
Huljic, D.M.; Zerres, T.; Mohr, A.; Maydell, K. von; Petter, K.; Müller, J.W.; Feist, H.; Harder, N.-P.; Engelhart, P.; Brendemühl, T.; Grischke, R.; Meyer, R.; Brendel, R.; Granek, F.; Grohe, A.; Hermle, M.; Schultz, O.; Glunz, S.W.
Conference Paper
Fulltext
2006Diffusion of water in amorphous polymers at different temperatures using molecular dynamics simulation
Dermitzaki, E.; Bauer, J.; Wunderle, B.; Michel, B.
Conference Paper
2006Digital image correlation of nanoscale deformation fields for local stress measurement in thin films
Sabate, N.; Vogel, D.; Gollhardt, A.; Marcos, J.; Gracia, I.; Cane, C.; Michel, B.
Journal Article
2006Eco-Design: New part of technological integration
Szendiuch, I.; Schischke, K.
Conference Paper
2006Eco-design - New part of technological integration
Szendiuch, I.; Schischke, K.
Conference Paper
2006Eco-Design Strategies for Electronics Supply Chains Based on Product Material Declarations
Stobbe, L.; Schischke, K.; Hayashi, H.; Suga, T.; Griese, H.
Conference Paper
2006EcoDesign in european small and medium sized enterprises of the electrical and electronics sector: Status quo and the road towards EuP
Schischke, K.; Müller, J.; Reichl, H.
Conference Paper
2006Electronic assemblies with hidden dies - design support by means of FE analysis
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2006Electronic systems from the perspective of sustainability and reliability
Oberender, C.; Middendorf, A.; Bochow-Neß, O.; Griese, H.-J.; Reichl, H.
Conference Paper
2006Energy dispersive X-ray diffraction
Kämpfe, B.; Luczak, F.; Michel, B.
Journal Article
2006Environmental-based regulations for electronics - From regional variety to internationally harmonized guidelines
Griese, H.; Müller, J.; Stobbe, L.
Conference Paper
2006EUlegislation: RoHS, WEEE and EUP status and implications for companies
Nissen, N.F.; Schischke, K.
Conference Paper
2006EuP-Richtlinie. Von der Verabschiedung zu Durchführungsmaßnahmen
Müller, J.
Conference Paper
2006Evaluating customer requirements in Eco-VA
Sakao, T.; Oberender, C.; Krone, N.; Shimomura, Y.; Birkhofer, H.; Reichl, H.
Conference Paper
2006Experimental investigation for fracture analysis of solder joints in microelectronic and mems applications
Walter, H.; Bombach, C.; Dudek, R.; Faust, W.; Michel, B.
Conference Paper
2006Experimentelle Charakterisierung von Thermischen Interface Materialien für die thermische Simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2006Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls
Dudek, R.; Rzepka, S.; Dobritz, S.; Döring, R.; Kreißig, K.; Wiese, S.; Michel, B.
Conference Paper
2006A FE-study of solder fatigue compared to microstructural damage evaluation by in-situ laser scanning and FIB microscopy
Dudek, R.; Faust, W.; Gollhard, A.; Michel, B.
Conference Paper
2006FIB based measurement of local residual stresses on microsystems
Vogel, D.; Sabate, N.; Gollhardt, A.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2006FibDAC - residual stress determination by combination of focused ion beam technique and digital image correlation
Keller, J.; Gollhardt, A.; Vogel, D.; Auerswald, E.; Sabate, N.; Auersperg, J.; Michel, B.
Conference Paper
2006Grüne Elektronik - Umweltgesetzgebung und -vorschriften für Elektronikgeräte
Schischke, K.
Journal Article
2006High-resolution stress measurements for microsystem and semiconductor applications
Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2006Interface-Risse in Komponenten der Mikro- und Nanoelektronik
Auersperg, J.; Michel, B.; Walter, H.
Conference Paper
2006Investigation on value increase in inverse distribution process
Hayashi, H.; Suga, T.; Stobbe, L.; Schischke, K.; Griese, H.
Conference Paper
2006A laboratory 6-DOF parallel kinematic for evaluation of new methods
Schröder, T.; Otto-Adamczak, T.; Krabbes, M.; Müller, J.
Conference Paper
2006Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Middendorf, A.; Reichl, H.; Griese, H.
Conference Paper
2006Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale
Wunderle, B.; Dudek, R.; Vogel, D.; Michel, B.
Abstract
2006Lifetime prediction of SnPb and SnAgCu solder joints of chips on copper substrate based on crack propagation FE-analysis
Deplanque, S.; Nüchter, W.; Wunderle, B.; Schacht, R.; Michel, B.
Conference Paper
2006Measurement of residual stress by slot milling with focused ion-beam equipment
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Cane, C.; Gracia, I.; Morante, J.R.; Michel, B.
Journal Article
2006Measurement of residual stresses in micromachined structures in a microregion
Sabate, N.; Vogel, D.; Gollhardt, A.; Keller, J.; Michel, B.; Cane, C.; Gracia, I.; Morante, J.R.
Journal Article
2006Mercury-free cure shrinkage and thermal expansion measurements
Chowdhury, Y.; Bauer, A.; Müller, J.; Bauer, M.
Conference Paper
2006Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Michel, B.; Reichl, H.
Conference Paper
2006Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Lishchynska, M.; O'Mahony, C.; Slattery, O.; Wittler, O.
Conference Paper
2006Monitoring of natural and synthetic hormones in a polluted river
Barel-Cohen, K.; Shore, L.S.; Shemesh, M.; Wenzel, A.; Mueller, J.; Kronfeld-Schor, N.
Journal Article
2006NanoDAC/fibDAC - Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2006Nanoscale Deformation Measurements for Reliability Assessment of Material Interfaces
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2006Nanoscale Deformation Measurements to Improve Reliability Assessment of Sensors and MEMS
Michel, B.; Keller, J.; Walter, H.
Conference Paper
2006A new method for local strain field analysis near cracks in micro- and nanotechnology applications
Michel, B.; Vogel, D.; Sabaté, N.; Lieske, D.
Conference Paper
2006Die Nutzungsphase und ihre Bedeutung für die Entwicklung umweltgerechter Produkte
Oberender, C.
Dissertation
2006Occurrence of polycyclic musks in sewage sludge and their behaviour in soils and plants. Pt.1: Behaviour of polycyclic musks in sewage sludge of different treatment plants in summer and winter
Müller, J.; Böhmer, W.; Litz, N.T.
Journal Article
2006Öko-Design im Überblick: Grundlagen, Erfolgsfaktoren und Stand der Gesetzgebung
Schischke, K.
Journal Article
2006Progress in reliability research in the micro and nano region
Wunderle, B.; Michel, B.
Conference Paper
2006Renewable resources for electronics: Lignin-based polymers for printed circuit boards
Müller, J.; Nissen, N.F.; Scheel, W.; Schmidt, R.
Conference Paper
2006RoHS after July 2006: Presentation held at SMTA Vendor Days, October 5, 2006, University of Utah, Salt Lake City
Hutter, M.; Pape, U.; Müller, J.; Wunderle, B.
Presentation
Fulltext
2006Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging
Wittler, O.; Walter, H.; Keller, J.; Dudek, R.; Vogel, D.; Michel, B.
Conference Paper
2006Simulation of Interface Cracks in Microelectronic Packaging
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2006Solder Fatigue at High-Power IGBT Modules
Sommer, J.-P.; Licht, T.; Berg, H.; Appelhoff, K.; Michel, B.
Conference Paper
2006Status of ecodesign implementation and EUP readiness in electrical and electronics SMEs: Findings from the European awareness raising campaign
Schischke, K.; Nissen, N.F.; Mueller, J.; Reichl, H.
Journal Article
2006Thermal management in a 3D-PCB-package with water cooling
Schindler-Saefkow, F.; Wittler, O.; May, D.; Michel, B.
Conference Paper
Fulltext
2006Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging
Dudek, R.; Walter, H.; Döring, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2006Umweltaspekte lassen sich in jeden Entwurf integrieren: Praktische Erläuterungen am Beispiel Mikrosystemtechnik
Schischke, K.
Journal Article
2006Verfahren zur Erfassung von lokalen Eigenspannungen in Festkoerperobjekten mit einer Ionenstrahltechnik
Auersperg, J.; Lieske, D.; Keller, J.; Vogel, D.; Michel, B.; Gollhardt, A.; Dost, M.
Patent
Fulltext
2006Von RoHS und WEEE zur EuP - ein weltweiter Trend
Müller, J.; Schischke, K.
Conference Paper
2006Zuverlässige Bauteile mit neuen Werkstoffen
Michel, B.
Book Article
2006Zuverlässigkeitsprognostik von in der Leiterplatte integrierten Chips
Sommer, J.-P.; Döring, R.; Dost, M.; Michel, B.
Conference Paper
20053D deformation analysis of flow and gas sensors membranes for reliability assessment
Sabate, N.; Keller, J.; Gollhardt, A.; Vogel, D.; Gracia, I.; Cane, C.; Morante, J.R.; Michel, B.
Conference Paper
2005Accelerated failure test for high temperature applications of power MOSFETs by power cycling
Schacht, R.; Auerswald, E.; Sommer, J.-P.; Wunderle, B.; Michel, B.; Reichl, H.
Conference Paper
2005Approaches towards sustainable use and substitution of metals in electronics
Deubzer, O.; Griese, H.; Reichl, H.
Conference Paper
2005Auslegung einer sechsachsigen Parallelkinematik
Müller, J.
Thesis
2005Characterization of nanoscale modified polymers for automotive applications
Vogel, D.; Gollhardt, A.; Keller, J.; Holst, M.; Muzic, M.; Michel, B.
Abstract
2005Characterization of thermal interface materials for thermal simulation
Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2005Combination of nanoDAC and FEM for reliability analysis of materials in the micro-nano-transition scale
Kaulfersch, E.; Keller, J.; Michel, B.
Abstract
2005A combined simulative and experimental approach to reliability optimization of MEMS
Wittler, O.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2005A comparative study of solder fatigue evaluated by microscopic in-situ analysis, on-line resistance measurement and FE calculations
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2005Condition monitoring of automotive electronic systems with life cycle units
Middendorf, A.; Griese, H.; Hulsken, G.; Neß, O.; Reichl, H.; Schrank, K.
Conference Paper
2005Crack and delamination risk evaluation of thin silicon based microelectronics devices
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2005Damage and failure analysis of lead-free solder interconnects in automotive electronics
Faust, W.; Kreyßig, K.; Michel, B.
Abstract
2005Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2005Design methodology of microstructures for enhanced mechanical reliability
Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2005Development of a scalelable interconnection technology for nano packaging
Becker, K.-F.; Löher, T.; Pahl, B.; Wittler, O.; Jordan, R.; Bauer, J.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2005Digital image correlation - a versatile experimental tool to improve reliability, security and lifetime
Dost, M.; Seiler, B.; Erb, R.; Michel, B.
Abstract
2005Eco-design and beyond - key requirements for a global sustainable development
Griese, H.; Stobbe, L.; Reichl, H.; Stevels, A.
Conference Paper
2005Environmental aspects in automotive electronics
Pötter, H.; Griese, H.; Jürgens, G.; Müller, J.; Ness, O.; Reichl, H.
Conference Paper
2005Environmental, Economical and Logistical Implications of Lead-free Soldering
Deubzer, O.
Conference Paper
2005Experimental mechanics on the way from micro to nano
Michel, B.
Journal Article
2005FE analysis and experimental testing of a 4-pin ceramic test vehicle with tin-lead and tin-silver-copper solder joints
Spraul, M.; Nüchter, W.; Wunderle, B.; Michel, B.
Conference Paper
2005FIB based Measurements for Material Characterization on MEMS Structures
Vogel, D.; Lieske, D.; Gollhardt, A.; Keller, J.; Sabaté, N.; Morante, J.R.; Michel, B.
Conference Paper
2005fibDAC - A new Approach of Material Characterization for the Transition from Micro to Nano Scale
Vogel, D.; Sabaté, N.; Keller, J.; Auersperg, J.; Michel, B.
Conference Paper
2005Forum: Umstellung Bleifrei
Müller, J.; Griese, H.
Conference Paper
2005Fracture and Fatigue Behaviour of MEMS related Micro Materials
Walter, H.; Dudek, R.; Michel, B.
Conference Paper
2005Fracture Mechanics Based Crack and Delamination Risk Evaluation and RSM/DOE Concepts for Advanced Microelectronics Applications
Auersperg, J.; Seiler, B.; Cadalen, E.; Dudek, R.; Michel, B.
Conference Paper
2005Global sustainable development and technological innovations
Griese, H.; Stobbe, L.; Müller, J.; Deubzer, O.; Middendorf, A.
Conference Paper
2005Global sustainable development and technological innovations - Experiences from lead-free transition
Griese, H.; Stobbe, L.; Mueller, J.; Deubzer, O.; Middendorf, A.
Conference Paper
2005Green MST design from a designer's perspective: How to base decisions on environmental issues
Schischke, K.; Middendorf, A.; Reichl, H.; Griese, H.; Kasper, M.; Ong, K.
Conference Paper
2005Identification of Fitted Viscoelastic Material Parameters of Adhesives in Automotive Applications for Numerical Simulations using Genetic Algorithms
Göhler, J.; Michel, B.; Schaper, M.K.
Conference Paper
2005Implementation of eco design in the electronics sector
Szendiuch, I.; Schischke, K.
Conference Paper
2005In 80 Tagen um die Welt - Wenn aus Sand Computer werden und aus Computern Sand
Schischke, K.
Book Article
2005Interactive CSG trees inside complex scenes
Ohlenburg, J.; Müller, J.
Conference Paper
2005Is there a linkage between bioaccumulation and the effects of alkylphenols on male breams (Abramis brama)?
Klein, R.; Bartel, M.; He, X.; Müller, J.; Quack, M.
Journal Article
2005Konzepte für praxisnahe Bildungsmodule in der Mikrosystemtechnik
Schischke, K.; Kerl, R.; Kalisch, C.
Conference Paper
2005Lifetime estimation for wire bond interconnections using life-cycle-information modules with implemented models
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2005Marking of Electronic Components and Board Assemblies as RoHS Compatible: Information in the Supply Chain and Logistics
Stobbe, I.; Deubzer, O.; Griese, H.; Reichl, H.
Conference Paper
2005Materials Trends in Electronics - Life Cycle Implications
Schischke, K.; Griese, H.; Mueller, J.; Reichl, H.; Zuber, K.H.
Conference Paper
2005Measurement and Simulation of Stress on Microsystems Induced during Packaging Processes
Schreier-Alt, T.; Sehnert, J.; Rebholz, C.; Michel, B.; Ansorge, F.
Conference Paper
2005Micro and nanomechanical Deformation Analysis at Materials Interfaces
Keller, J.; Michel, B.
Conference Paper
2005Microreliability, Nanoreliability - Reliability approach for the micro-nano interface region
Michel, B.
Conference Paper
2005"Microreliability", "Nanoreliability" - Zuverlässigkeitsbewertung von Mikro- und Nanokomponenten unter Anwendung der Bruchmechanik
Michel, B.
Conference Paper
2005Microreliability, Nanoreliability- Zuverlässigkeitsbewertung von Polymer-Verbundsystemen im Mikro- und Nanobereich
Michel, B.
Conference Paper
2005Mikroprüftechnik
Michel, B.; Walter, H.
Book Article
2005Die Möglichkeiten der FIB-Technik bei der Schadensanalyse bleifreier Lote
Faust, W.; Gollhardt, A.; Michel, B.
Conference Paper
2005Nanodac - a method for fracture mechanical characterization on the nanoscale
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2005Nanodeformation analysis near small cracks by means of nanoDAC technique
Michel, B.; Keller, J.
Conference Paper
2005Nanoreliability - lifetime estimation for nanotechnology applications based on nanoDAC and FIBDAC techniques
Michel, B.; Keller, J.
Conference Paper
2005Nanoreliability for mechanically loaded devices
Vogel, D.; Sabate, N.; Wunderle, B.; Keller, J.; Michel, B.; Reichl, H.
Conference Paper
2005Nanoreliability-combined simulation and testing
Michel, B.
Conference Paper
2005Nanoscale deformation measurements for reliability analysis of sensors
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2005A new approach to micro deformation analysis by finite element based digital image correlation
Kühnert, R.; Meyer, R.; Vogel, D.; Michel, B.
Abstract
2005Novel test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Roellig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts
Röllig, M.; Dudek, R.; Wiese, S.; Wunderle, B.; Wolter, K.-J.; Michel, B.
Conference Paper
2005Numerical characterisation of electronic packaging solutions based on hidden dies
Sommer, J.-P.; Michel, B.; Ostmann, A.
Conference Paper
2005Öko-Design in der Elektronik: Umweltfreundliche, leicht zu recycelnde Materialien bzw. Materialverbunde sind gefragt
Middendorf, A.
Journal Article
2005Packaging reliability research on the way from micro to nano
Wunderle, B.; Michel, B.
Conference Paper
2005Probabilistic Approaches for Fracture and Reliability Estimations of Microsystems
Winkler, T.; Michel, B.; Wunderle, B.
Conference Paper
2005Prüfung und Zuverlässigkeitsbewertung für die Mikrosystemtechnik im Mikro- und Nanobereich
Michel, B.; Keller, J.
Conference Paper
2005Recombinant anti-EGFR immunotoxin 425(scFv)-ETA' demonstrates anti-tumor activity against disseminated human pancreatic cancer in nude mice
Bruell, D.; Bruns, C.J.; Yezhelyev, M.; Huhn, M.; Müller, J.; Ischenko, I.; Decken, V. von der; Fischer, R.; Finnern, R.; Jauch, K.W.; Barth, S.
Journal Article
2005Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders
Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B.
Conference Paper
2005Reliability Analyses of Pb- and SnAgCu Solder Interconnects at Ceramic Quartz Components Subjected to Several test and Field Conditions
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005Reliability on the Micro- and Nano-Scale - Experiment and Simulation
Wunderle, B.; Michel, B.
Conference Paper
2005Reliability Testing of Polytronics Components in the Micro-Nano Region
Michel, B.; Dudek, R.; Walter, H.
Conference Paper
2005Renewable resources for use in printed circuit boards
Nägele, H.; Pfitzer, J.; Lehnberger, C.; Landeck, H.; Birkner, K.; Viebahn, U.; Scheel, W.; Schmidt, R.; Hagelüken, M.; Müller, J.
Journal Article
2005State of the Art in Material Declarations: Compliance Management and Usability for Eco-Design
Schischke, K.; Griese, H.; Mueller, J.; Stobbe, I.
Conference Paper
2005Testing at Micro and Nanoscale
Michel, B.
Conference Paper
2005Thermal Analysis of Electronic Components and Systems
Wittler, O.; Schacht, R.; Wunderle, B.; Michel, B.
Conference Paper
2005Thermal and mechanical reliability analysis of an anisotropic magneto-resistive current measurement sensor
Vogel, J.; Kaulfersch, E.; Schmitt, J.; Doering, R.; Hoelzl, J.; Michel, B.
Conference Paper
2005Thermal Lap Shear Tests on MEMS Interconnect Solder joints
Vogel, J.; Dudek, R.; Faust, W.; Dost, M.; Michel, B.
Conference Paper
2005Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Journal Article
2005Thermo-mechanical and fracture mechanical characterization of lead-free solder joints in microelectronics
Walter, H.; Déplanque, S.; Nüchter, W.; Wunderle, B.; Michel, B.
Conference Paper
2005Thermo-mechanical design for reliability of WLPs with compliant interconnects
Dudek, R.; Walter, H.; Doering, R.; Michel, B.; Meyer, T.; Zapf, J.; Hedler, H.
Conference Paper
2005Thermo-mechanical reliability analysis on solder joints of ceramic components
Dudek, R.; Döring, R.; Michel, B.; Picault, A.; Autissier, J.-F.
Conference Paper
2005Towards sustainable solutions
Griese, H.
Conference Paper
2005Transition to lead free soldering - a great chance for a better understanding of materials and processes and green electronics
Müller, J.; Griese, H.; Schischke, K.; Stobbe, L.
Conference Paper
2005A Tribute to Albert Einstein: Fraunhofer Einstein-Ehrung; Berlin, 05.04.2005
Michel, B.
Journal Issue
2005Die Uhr tickt: Die Europäische Elektronikindustrie macht sich fit für die Ökodesign-Richtlinie
Schischke, K.; Mueller, J.
Journal Article
2005Vibration Analyses for Function and Reliability Estimation of Automotive Sensors by Laser Vibrometry
Rümmler, N.; Schnitzer, R.; Dost, Mi.; Michel, B.
Conference Paper
2005Vibration measurements on smart electronic structures by means of laser techniques
Ruemmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Conference Paper
2005Volume modelling and rendering based on 3D voxel grids
Müller, J.
Thesis
2005Zuverlässigkeit von Komponenten der Mikrosystemtechnik durch Einbeziehung von Nanoanalytik und Nanomechanik
Michel, B.; Wunderle, B.; Gollhardt, A.; Bombach, C.; Keller, J.
Conference Paper
2005Zuverlässigkeitskonzepte von "Mikro bis Nano" - Neue Anforderungen und Möglichkeiten der Zuverlässigkeitsbewertung für die Mikrosystemtechnik
Michel, B.
Conference Paper
2004Adhesives for specific requirements in production of MST-components
Dörfler, R.; Jansen, I.; Müller, J.; Beyer, E.
Book Article
2004Beyond the Walls of Semiconductor Fabs: Energy intensity of high grade materials
Plepys, A.; Schischke, K.
Conference Paper
2004Biogaseinsatz bei Mikrogasturbinen - Pilotanlage Gut Eichhof
Mueller, J.
Conference Paper
2004Bragg Gitter in Polymer- und Glasfasern: Dehnungs- und Temperaturbestimmung in der Mikroelektronik und Mechatronik
Alt, T.; Badstübner, K.; Ansorge, F.; Michel, B.; Reichl, H.
Conference Paper
2004Bruchmechanische Analyse von viskoelastischen Werkstoffen in elektronischen Bauteilen
Wittler, O.
Dissertation
Fulltext
2004Characterization approaches of nanoscale modified plastics
Vogel, D.; Keller, J.; Michel, B.; Holst, M.; Muzic, M.
Conference Paper
2004Characterization of materials with nanoscopic filler particles by AFM techniques
Vogel, D.; Keller, J.; Michel, B.
Conference Paper
2004Characterization of microcracks by application of digital image correlation to SPM images
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2004Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2004Determination of local stress intensity factor at crack tip using image correlation techniques
Tsai, Y.; Keller, J.; Eylon, D.; Vogel, D.; Michel, B.; Meyendorf, N.
Conference Paper
2004Displacement and strain field measurements from SPM images
Keller, J.; Vogel, D.; Schubert, A.; Michel, B.
Book Article
2004Driving forces for future electronics: Joint International Congress and Exhibition Electronics Goes Green 2004+; September 6 - 8, 2004, Berlin, Germany. Proceedings
Reichl, H.; Griese, H.; Pötter, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Conference Proceedings
2004Environmental Assessment of Future Smart Card Manufacturing using Embedded Chip Technology
Andræ, A.S.G.; Chen, C.; Schischke, K.; Hagelueken, M.; Liu, J.
Conference Paper
2004Environmental compatibility of electronics - a key towards local and global sustainable development
Griese, H.; Stobbe, L.; Middendorf, A.; Reichl, H.
Conference Paper
2004Environmental management in semiconductor and printed circuit board industry in India - Part I: Survey results and case studies
Pandey, U.C.; Sethi, V.C.; Schischke, R.; Griese, H.; Reichl, H.
Conference Paper
2004Environmental management in semiconductor and printed circuit board industry in India - Part II: Benchmarking and international best practice sharing
Schischke, K.; Pandey, U.C.; Sethi, V.C.; Griese, H.; Reichl, H.
Conference Paper
2004Evaluation of the primary and secondary creep of SnPb solder joint using a modified grooved-lap test specimen
Deplanque, S.; Nüchter, W.; Wunderle, B.; Walter, H.; Michel, B.
Conference Paper
2004FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Book Article
2004Foreword to the special section of the Asian Green Electronics Conference (AGEC)
Liu, J.; Griese, H.J.; Chan, Y.-C.
Journal Article
2004Fracture mechanical characterization of micro- and nano-filled polymers by a combined experimental and simulative procedure
Wunderle, B.; Dermitzaki, E.; Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2004Gebrauchte Rechner sind grün
Schischke, K.
Journal Article
2004Green Electronics Trends - Meeting the Requirements of the European Market
Schischke, K.; Griese, H.; Reichl, H.
Conference Paper
2004Implementing Cleaner Production in Semiconductor and Printed Circuit Board Industry in India
Sethi, V.C.; Pandey, U.C.; Schischke, K.; Griese, H.; Reichl, H.
Conference Paper
2004In-situ solder fatigue studies using a thermal lap shear test
Dudek, R.; Faust, W.; Vogel, J.; Michel, B.
Conference Paper
2004Increased reliability through assessment of standard components with life cycle units
Buchholz, A.; Middendorf, A.; Priyadip, R.; Reichl, H.; Seliger, G.
Conference Paper
2004Investigations on the reliability of lead-free CSP subjected to harsh environments
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2004Ion-assisted deposition processes: Industrial network IntIon
Ehlers, H.; Becker, K.-J.; Beckmann, R.; Beermann, N.; Brauneck, U.; Fuhrberg, P.; Gäbler, D.; Jakobs, S.; Kaiser, N.; Kennedy, M.; König, F.; Laux, S.; Müller, J.C.; Rau, B.; Riggers, W.; Ristau, D.; Schäfer, D.; Stenzel, O.
Conference Paper
2004IZM/EE-Toolbox - effiziente Screening-Bewertungsmethoden für ein Design umweltverträglicher elektronischer Produkte und Prozesse
Griese, H.; Stobbe, I.; Deubzer, O.; Hagelüken, M.; Middendorf, A.; Müller, J.; Pötter, H.; Schischke, K.; Zuber, K.-H.
Book Article
2004The lead-free challenge: Materials for assembly and packaging
Schischke, K.; Jung, E.
Journal Article
2004The Life Cycle of Mobile Phones - A School Teaching Project
Schmidt, C.; Wichmann, A.; Middendorf, A.; Schischke, K.
Conference Paper
2004Life cycle thinking for green electronics: Basics in EcoDesign and the UNEP/SETAC life cycle initiative
Mueller, J.; Griese, H.; Schischke, K.; Stobbe, I.; Norris, G.A.
Conference Paper
2004Life-cycle information units for monitoring and identification of product use conditions
Middendorf, A.; Buchholz, A.; Hefer, J.; Reichl, H.; Schrank, K.; Seliger, G.
Conference Paper
2004Materials mechanics for system integration and packaging
Michel, B.
Journal Issue
2004MAVIN - Ein neues Telekonferenzsystem für die Kardiologie
Lukas, U. von; Voskamp, J.; Boll, B.; Müller, J.
Book Article
2004Micro Systems Design Work Flows - Implementation of Environmental Driven Criteria
Ong, K.; Schischke, K.; Kasper, M.; Middendorf, A.; Reichl, H.
Conference Paper
2004MicroDAC - ein Messverfahren zur Ermittlung von Werkstoffeigenschaften im Mikro- und Nanobereich
Keller, J.; Vogel, D.; Michel, B.
Conference Paper
2004Microreliability, nanoreliability - issues for MEMS
Michel, B.
Book Article
2004Microsecurity - important capabilities for homeland security challenges
Michel, B.; Winkler, T.
Journal Article
2004Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B.; Auersperg, J.; Grosser, V.; Kaulfersch, E.; Wittler, O.; Michel, B.
Journal Article
2004Nanodac - an SPM-based nanodeformation measurement technique for reliability assessment of micro- and nanosystems
Keller, J.; Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper
2004Neue Regeln für alte Elektronik: Gesetzgebung für Elektronikschrott auf der Zielgeraden
Schischke, K.
Journal Article
2004Parametric FE-approach to flip-chip reliability under various loading conditions
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H.
Journal Article
2004Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2004Polytronics: Technology trends and environmental issues
Bock, K.; Burghart, M.; Klink, G.; Pötter, H.; Müller, J.; Hagelüken, M.
Conference Paper
2004Quality Challenges of Reused Components
Stobbe, I.; Pötter, H.; Griese, H.; Fotheringham, G.; Reichl, H.
Conference Paper
2004Reliability in Experiment and Simulation on the Micro- and Nano Scale
Wunderle, B.; Michel, B.
Conference Paper
2004Reliability of SnPb and PB-free flip-chips under different test conditions
Spraul, M.; Nüchter, W.; Möller, A.; Wunderle, B.; Michel, B.
Conference Paper
2004Renewable resources for use in printed circuit boards
Nägele, H.; Pfitzer, J.; Lehnberger, C.; Landeck, H.; Birkner, K.; Viebahn, U.; Scheel, W.; Schmidt, R.; Hagelüken, M.; Müller, J.
Conference Paper
2004Retrospective monitoring of alkylphenols and alkylphenol monoethoxylates in aquatic biota from 1985 to 2001: Results from the German environmental specimen bank
Wenzel, A.; Böhmer, W.; Müller, J.; Rüdel, H.; Schröter-Kermani, C.
Journal Article
2004Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation
Griese, H.; Pötter, H.; Schischke, K.; Ness, O.; Reichl, H.
Conference Paper
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Structural health monitoring by embedded fiber bragg gratings
Alt, T.; Badstuebner, K.; Michel, B.; Ansorge, F.
Conference Paper
2004Sustainable Development of Microelectronic Technology Processes
Griese, H.; Schischke, K.; Reichl, H.; Stobbe, L.
Conference Paper
2004Sustainable Use and Restrictions of Materials in the Electronics Industry
Deubzer, O.; Griese, H.; Reichl, H.; Madsen, J.; Wel, H. van der
Conference Paper
2004Technological Innovation started by Environmental Concerns
Müller, J.; Hagelüken, M.; Griese, H.; Reichl, H.
Conference Paper
2004Thermal fatigue modelling for SnAgCu and SnPb solder joints
Dudek, R.; Walter, H.; Döring, R.; Michel, B.
Conference Paper
2004Thermo-mechanical analysis of advanced electronic packages in early system design
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2004Thermo-mechanical design analysis of wafer level packages
Wittler, O.; Manessis, D.; Sommer, J.-P.; Michel, B.
Conference Paper
2004Thermo-mechanical reliability of power flip-chip cooling concepts
Wunderle, B.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2004Verfahren zum selektiven Gewinnen von Gold aus goldhaltigen Materialien
Schmidt, R.; Mueller, J.; Griese, H.; Hannemann, M.; Zuber, K.
Patent
Fulltext
2004Vibration and Deformation Measurements of smart Electronic Structures by means of Laser Techniques
Rümmler, N.; Schnitzer, R.; Michel, B.; Auersperg, J.; Kaulfersch, E.
Book Article
2004Welcome to the Jungle - Survival of the Fittest Environmental Screening Indicators?
Hagelüken, M.; Schischke, K.; Müller, J.; Griese, H.
Conference Paper
2004The world of electronic packaging and system integration: Anniversary edition 60th birthday of Herbert Reichl
Michel, B.; Aschenbrenner, R.
Book
2004Zuverlässigkeitsaspekte in Chip-in-Polymer-Applikationen
Auersperg, J.; Vogel, D.; Michel, B.
Conference Paper
2004Zuverlässigkeitsbewertung elektronischer Baugruppen mit modernen Mikro- und Nanomesstechniken in Kopplung zur Simulation
Michel, B.; Dudek, R.; Keller, J.; Luczak, F.
Conference Paper
2003Bestimmung der Querkontraktionszahl von Polymeren mittels Laserextensometrie und Grauwertkorrelationsanalyse
Walter, H.; Vogel, D.; Michel, B.; Grellmann, W.; Bierögel, C.
Conference Paper
2003Bleifreie elektronische Baugruppen: Umweltaspekte
Müller, J.; Griese, H.
Conference Paper
2003Challenges of advanced mechanical micro testing techniques
Walter, H.; Grellmann, W.; Seidler, S.; Michel, B.
Abstract
2003Combining DIC techniques and finite element analysis for reliability assessment on micro and nano scale
Vogel, D.; Dudek, R.; Keller, J.; Michel, B.
Conference Paper
2003Comparison of lifetime predictions with 3D finite element models of a high density flip chip without underfill on LTCC
Spraul, M.; Nüchter, W.; Möller, A.; Schubert, A.; Michel, B.
Conference Paper
2003Continuation and change
Michel, B.; Bhushan, B.
Journal Article
2003Cost-effectiveness and environmental aspects of flip chip bumping for system integration
Schischke, K.; Griese, H.; Müller, J.; Reichl, H.
Journal Article
2003Design process supporting simulations on wafer level packages
Sommer, J.-P.; Wittler, O.; Manessis, D.; Michel, B.
Conference Paper
2003Design von Kunststoffbaugruppen mit Unterstützung durch Finite-Elemente-Analysen
Michel, B.; Sommer, J.-P.
Conference Paper
2003Embedded Life-Cycle Information Module
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.
Conference Paper
2003Embedded life-cycle information module for monitoring and identification of product use conditions
Middendorf, A.; Griese, H.; Grimm, W.M.; Reichl, H.
Conference Paper
2003Environmental Risks of Mass Produced, Small and Cheap Products Regarding End-of-Life Scenarios
Müller, J.; Griese, H.; Hagelüken, M.; Reichl, H.
Conference Paper
2003Evaluating microdefect structures by AFM-based deformation measurement
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2003Fluidisch-Elektrisch-Thermisches 3D-Package mit Match-X Schnittstelle
Schindler-Saefkow, F.; May, D.; Großer, V.; Michel, B.
Conference Paper
2003The GA octodinucleotide repeat binding factor BBR participates in the transcriptional regulation of the homeobox gene Bkn3
Santi, L.; Wang, Y.; Stile, M.R.; Berendzen, K.; Wanke, D.; Roig, C.; Pozzi, C.; Müller, K.; Müller, J.; Rohde, W.; Salamini, F.
Journal Article
2003High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R.
Journal Article
2003How to detect Edgar Allan Poe's 'purloined letter' - Or: Cross correlation algorithms in digitised video images for object identification, movement evaluation and deformation analysis
Dost, M.; Vogel, D.; Winkler, T.; Vogel, J.; Erb, R.; Kieselstein, E.; Michel, B.
Conference Paper
2003Integrating ecodesign into the development of technology processes
Griese, H.; Schischke, K.; Reichl, H.; Suga, T.; Stobbe, L.
Conference Paper
2003Integration of environmental assessment tools in product development
Middendorf, A.; Petermann, C.; Reichl, H.; Griese, H.; Schrödl, J.; Reiner, A.
Conference Paper
2003Investigations on low cycle fatigue of electrodeposited thin copper and nickel films
Dudek, R.; Walter, H.; Michel, B.; Zapf, J.
Conference Paper
2003Konzeption und Test von Firewallmechanismen für Residential Gateways
Müller, J.
Thesis
2003The Micro Materials Center Berlin (MMCB)
Michel, B.; Winkler, T.
Abstract
2003Microdeformation analysis of packages and interconnects to improve finite element models for reliability assessments
Kaulfersch, E.; Vogel, D.; Michel, B.
Journal Article
2003MikroNetz: Development of Switched Power Supplies using Microsystem
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2003MikroNetz - development of switched power supplies using Microsystem technology
Middendorf, A.; Griese, H.; Reichl, H.
Conference Paper
2003Morphologie-Zähigkeits-Korrelationen an modifizierten Epoxidharzsystemen mittels bruchmechanischer Prüfmethoden an Miniaturprüfkörpern
Walter, H.; Michel, B.; Bierögel, C.; Grellmann, W.
Conference Paper
2003Multimedia workplace of the future
Fischer, Kai; Hoyer, J.; Laube, Manfred; Müller, J. P.; Schirmer, Jürgen; Steinmann, R.; Weiss, Manfred; Wiegand, Dietmar
Conference Paper
2003nanoDAC - A Method of Reliability Analysis for Micro and Nano Technology
Vogel, D.; Michel, B.
Abstract
2003Nanomechanics for Electronics in Automotive Application
Keller, J.; Michel, B.
Conference Paper
2003Recyclinggerechtes Design im Aufwind
Müller, J.; Griese, H.
Journal Article
2003Reliability Evaluations of Lead Free Soldered Packages
Walter, H.; Auerswald, E.; Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2003Reliability of micro- and nanosystems
Michel, B.
Conference Paper
2003Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Journal Article
2003Schadensanalyse an Komponenten der Mikrosystemtechnik und Mikroelektronik
Faust, W.; Dost, M.; Michel, B.
Conference Paper
2003A severe loss. In memoriam Dr.-Ing. Andreas Schubert
Michel, B.
Journal Article
2003Simulation and reliability on the way from micro to nano
Michel, B.; Wunderle, B.
Conference Paper
2003State-of-the-art mid-frequency sputtered ZnO films for thin film silicon solar cells and modules
Müller, J.; Schöpe, G.; Kluth, O.; Rech, B.; Sittinger, V.; Szyszka, B.; Geyer, R.; Lechner, P.; Schade, H.; Ruske, M.; Dittmar, G.; Bochem, H.-P.
Journal Article
2003Strategies to integrate life cycle engineering into technological developments - the 3G Greenbook Initiative
Griese, H.; Müller, J.; Stobbe, L.; Reichl, H.; Rick, K.
Conference Paper
2003A Study on the Trace of Appropriate EcoDesign Strategies: Applying
Chung, J.; Lee, H.; Middendorf, A.; Zuber, K.H.
Conference Paper
2003A study on the trace of appropriate ecodesign strategies applying "Instep-DfE" and "IZM-EE toolbox" on a PDA
Chung, J.; Lee, H.; Middendorf, A.; Zuber, K.-H.
Conference Paper
2003Thermal and mechanical analysis of micromachined gas sensors
Puigcorbe, J.; Vogel, D.; Michel, B.; Vila, A.; Gracia, I.; Cane, C.; Morante, J.R.
Journal Article
2003Thermal management in stacks of MATCH-X MOEMS
Schindler-Saefkow, F.; Wittler, O.; May, D.; Schacht, R.; Großer, V.; Michel, B.
Conference Paper
2003Thermal performance, mechanical reliability and technological features of different cooling concepts for high power chip modules
Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.
Conference Paper
2003Thermo-mechanical reliability aspects and finite element simulation in packaging
Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H.
Conference Paper
2003X-free mobile electronics - Strategy for sustainable development
Mueller, J.; Griese, H.; Hagelüken, M.; Middendorf, A.; Reichl, H.
Conference Paper
2003Zuverlässigkeitsbewertung von MEMS-Komponenten im Mikro-Nano-Übergangsbereich
Michel, B.; Winkler, T.; Auersperg, J.
Conference Paper
2002a46Parametric FE-approach to flip chip reliability under various loading situations
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.; Reichl, H.
Conference Paper
2002Delamination risk evaluation for plastic packages based on mixed mode fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Journal Article
2002Determination of packaging material properties utilizing image correlation techniques
Vogel, D.; Kühnert, R.; Dost, M.; Michel, B.
Journal Article
2002Development of environmentally sound gold plating and recycling processes
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R.
Conference Paper
2002Displacement and strain field measurements for nanotechnology applications
Vogel, D.; Keller, J.; Gollhardt, A.; Michel, B.
Conference Paper
2002Ecotoxicological testing of gas oils (daphnia magna test)
Müller, J.; Wenzel, A.; Hensel, R.
Book
2002Electronics Goes Green 2000+. A Challenge for the Next Millenium. Proceedings. Vol. 2: Special Lectures
Griese, H.; Pötter, H.; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Conference Proceedings
2002Fabric-based communication
Kallmayer, C.; Griese, H.
Journal Article
2002Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 2001/2002
Michel, B. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Electronic Publication
Fulltext
2002Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2001/2002
Michel, B.; Winkler, T.; Hinkel, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Annual Report
2002Generalized fracture mechanical integral concept J/sub G/ and its application in microelectronic packaging technology
Badri Ghavifekr, H.; Michel, B.
Journal Article
2002Lead-free solder interconnects - characterization, testing and reliability
Schubert, A.; Dudek, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.; Schuch, B.
Conference Paper
2002Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D.
Conference Paper
2002Micro andnanoDAC - a powerful technique for nondestructive microcrack evaluation
Michel, B.; Vogel, D.
Conference Paper
2002Micro Materials Center Berlin - materials research for MEMS packaging
Michel, B.; Winkler, T.
Conference Paper
2002Micro Materials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Conference Paper
2002Micro- and nanomaterials characterization by image correlation methods
Vogel, D.; Gollhardt, A.; Michel, B.
Journal Article
2002Micro/nanoDAC deformation measurement to analyze packaging components response to thermo-mechanical load
Vogel, D.; Gollhardt, A.; Michel, B.
Conference Paper
2002Micromaterials Center Berlin: Reliability research for MEMS
Michel, B.; Winkler, T.
Conference Paper
2002A modular fluidic demonstrator for the Match-X framework
Schindler-Saefkow, F.; Amiri Jam, K.; Luczak, F.; Großer, V.; Michel, B.; Günther, G.
Conference Paper
2002Occurrence of phthalates and bisphenol A and F in the environment
Fromme, H.; Küchler, T.; Otto, T.; Pilz, K.; Müller, J.; Wenzel, A.
Journal Article
2002Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages
Auersperg, R.; Dudek, R.; Michel, B.
Conference Paper
2002Reliability assessment of flip-chip assemblies with lead-free solder joints
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H.
Conference Paper
2002Special issue containing selected papers from the E-MRS proceedings of symposium-j - materials in microtechnologies and microsystems - Strasbourg, France - june 5-8, 2001. Preface
Morante, J.R.; Barbier, D.; Michel, B.
Journal Article
2002Special issue on Poly'2000, London - Foreword
Michel, B.; Kishimoto, K.
Journal Article
2002State-of-the-art mid-frequency sputtered ZnO films for thin film silicon solar cells and modules
Müller, J.; Schöpe, G.; Kluth, O.; Rech, B.; Sittinger, V.; Szyszka, B.; Geyer, R.; Lechner, P.; Schade, H.; Ruske, M.; Dittmar, G.; Bochem, H.-P.
Conference Paper
2002Studies on moisture diffusion and popcorn cracking
Dudek, R.; Walter, H.; Michel, B.
Conference Paper
2002Synthetische Moschusverbindungen in Umweltproben: Vortrag gehalten auf den Jahrestagungen GDCh-Fachgruppe Umweltchemie und Ökotoxikologie. SETAC-GLB. Braunschweig, 6.-8. Oktober 2002
Wenzel, A.; Müller, J.; Böhmer, W.
Presentation
Fulltext
2002Thermo-mechanical reliability of lead-free solder interconnects
Schubert, A.; Dudek, R.; Döring, R.; Walter, H.; Auerswald, E.; Gollhardt, A.; Michel, B.
Conference Paper
2002Using Life Cycle Information to Improve the Reliability of Electronic Assemblies
Middendorf, A.; Griese, H.; Neß, O.; Reichl, H.
Conference Paper
2002Using Life-Cycle Information for Reliability Assessment of Electronic Assemblies
Middendorf, A.; Griese, H.; Reichl, H.; Grimm, W.
Conference Paper
2002Vorrichtung zur Transformation einer Primaerspannung in eine Sekundaerspannung mit mindestens einem Schaltnetzteil
Geneiss, V.; Middendorf, A.; Griese, H.
Patent
Fulltext
2001Application of electroplating in MEMS-micromachining exemplified by a microrelay
Becker, M.; Notarp, D.L.; Vogel, J.; Kieselstein, E.; Sommer, J.P.; Brämer, K.; Grosser, V.; Benecke, W.; Michel, B.
Journal Article
2001Applied EcoDesign - Product characterization by sustainability indices
Griese, H.; Deubzer, O.; Müller, J.; Stobbe, L.
Conference Paper
2001Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil I
Zuber, K.-H.; Griese, H.; Müller, J.
Journal Article
2001Bleifreie Elektronik. Weltweite Anstrengungen zur Substitution. Teil II
Zuber, K.-H.; Griese, H.; Müller, J.
Journal Article
2001Calculating environmentally weighted recyclability of consumer eletronic products using different environmental assessment models
Huisman, J.; Stevels, A.; Middendorf, A.
Conference Paper
2001Challenging the Future - Ways Towards Sustainable Green Electronics
Müller, J.; Deubzer, O.; Griese, H.; Pötter, H.; Reichl, H.
Book Article
2001Characterization of electronic packaging materials and components by image correlation methods
Vogel, D.; Auersperg, J.; Michel, B.
Conference Paper
2001Constitution behaviour of lead-free solders vs. lead-containing solders - Experiments on bulk specimens and flip-chip joints
Wiese, S.; Schubert, A.; Walter, H.; Dudek, R.; Meusel, E.; Michel, B.
Conference Paper
2001Deformations- und Bruchverhalten von Mikrobauteilen aus Polymerverbunden
Michel, B.; Vogel, D.; Auersperg, J.
Conference Paper
2001Eco-analysis of wafer level bumping
Schischke, K.; Griese, H.; Müller, J.
Conference Paper
2001Electrical-properties of multicrystalline silicon produced by electromagnetic casting process - degradation and improvement
Boudaden, J.; Loghmarti, M.; Ballutaud, D.; Riviere, A.; Ludemann, R.; Slaoui, A.; Müller, J.C.
Journal Article
2001Elektronische Bauelemente: Qualitätssicherung bei der automatischen Entstückung
Stobbe, I.; Middendorf, A.
Journal Article
2001Environmental aspects of microelectronics
Muller, J.; Griese, H.; Zuber, K.H.; Reichl, H.; Schischke, K.
Conference Paper
2001Environmental friendly plating and deplating of gold in PCB manufacturing
Zuber, K.-H.; Griese, H.; Müller, J.; Schmidt, R.
Conference Paper
2001Environmental impacts of a mobile phone
Oiva, L.; Oppermann, W.; Middendorf, A.; Stobbe, I.
Journal Article
2001Experimentelle und numerische Methoden zur Charakterisierung von Mikrobauteilen
Sommer, J.-P.; Kieselstein, E.; Seiler, B.; Dost, M.; Michel, B.
Conference Paper
2001Fracture mechanical analysis of cracks in polymer encapsulated metal structures
Wittler, O.; Sprafke, P.; Auersperg, J.; Michel, B.; Reichl, H.
Journal Article
2001Fracture mechanics characterisation of epoxy resins by means of mini-compact-tension-specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Henning, H.; Michel, B.
Conference Paper
2001Fracture mechanics testing of modified epoxy resins with mini-compact tension (CT) specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B.
Book Article
2001Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2000
Michel, B.; Winkler, T.; Hinkel, O. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Annual Report
2001From modular MEMS to a modular microfactory - the hybrid microfactory?
Großer, V.; Michel, B.; Schuenemann, M.; Reichl, H.
Journal Article
2001Gains and challenges of parameterized finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Michel, B.
Journal Article
2001Global Responsibility of Electronics: Products and Sustainability
Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001Global responsibility of electronics - Products and sustainability
Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001Green polytronics
Griese, H.; Müller, J.; Hagelüken, M.; Reichl, H.; Zuber, K.-H.
Conference Paper
2001Highest efficiency rapid thermal processed multicrystalline silicon solar-cells
Noel, S.; Lautenschlager, H.; Müller, J.C.
Journal Article
2001How Electronics Technology Trends Translate into Environmental Trends
Nissen, N.F.; Griese, H.
Conference Paper
2001In-situ-Messungen an Komponenten der Mikroelektronik und Mikrosystemtechnik mit optischen Methoden
Faust, W.; Bombach, C.; Pritzke, B.; Michel, B.
Conference Paper
2001Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Journal Article
2001Interface cracks and reliability in microsystems
Michel, B.; Auersperg, J.; Schubert, A.; Kühnert, R.
Conference Paper
2001Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.
Journal Article
2001Lead-free soldering - Future aspects of toxicity, energy and resource consumption
Deubzer, O.; Griese, H.; Suga, T.
Conference Paper
2001Lead-free soldering - Toxicity, energy and resource consumption
Deubzer, O.; Hamano, H.; Suga, T.; Griese, H.
Conference Paper
2001Life cycle inventory analysis and identification of environmentally significant aspects in semiconductor
Schischke, K.; Stutz, M.; Ruelle, J.-P.; Griese, H.; Reichl, H.
Conference Paper
2001Life time prediction on polymer encapsulated components
Sonner, M.; Gollhardt, A.; Vogel, D.; Sprafke, P.; Michel, B.; Reichl, H.
Journal Article
2001Lifetime prediction of extended flip-chip packages under thermal and mechanical loading
Wunderle, B.; Nüchter, W.; Schubert, A.; Michel, B.
Conference Paper
2001LOESUNG UND VERFAHREN ZUM STROMLOSEN ABSCHEIDEN VON GOLDSCHICHTEN
Scheel, W.; Hannemann, M.; Schmidt, R.; Mueller, J.; Meyer, H.; Rehak, W.
Patent
Fulltext
2001Mechanical reliability of MEMS-structures under shock load
Wagner, U.; Franz, J.; Schweiker, M.; Bernhard, W.; Müller-Fiedler, R.; Michel, B.; Paul, O.
Journal Article
2001Meeting data requirements by using the IZM/EE-toolbox for a screening assessment of the environmental impacts of electronic products
Stobbe, I.; Middendorf, A.; Schischke, K.; Petermann, C.; Griese, H.; Müller, J.; Reichl, H.
Conference Paper
2001Messung von Materialkennwerten an Komponenten der Mikrotechnik
Vogel, D.; Sommer, J.-P.; Großer, V.; Michel, B.
Journal Article
2001Micro materials Center Berlin
Michel, B.; Schubert, A.; Winkler, T.
Journal Article
2001Microcrack evaluation for electronics components by AFM nano-DAC deformation measurements
Vogel, D.; Michel, B.
Conference Paper
2001The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Michel, B.; Dudek, R.; Vogel, D.
Conference Paper
2001MicroDAC strain measurement for electronics packaging structures
Vogel, D.; Grosser, V.; Schubert, A.; Michel, B.
Journal Article
2001Mixed mode interfacial fracture toughness evaluation for flip chip assemblies and CSP based on fracture mechanics approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001Mixed Mode Interfacial Fracture Toughness Evaluation for Flip-Chip Assemblies and CSP Based on Fracture Mechanics Approaches
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2001mTest - A new approach to measure material properties from microscopic specimens
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert, R.; Michel, B.
Conference Paper
2001On the way to green mobile products
Müller, J.; Griese, H.; Reichl, H.
Conference Paper
2001Ongoing research in the NanoMechanicsLab Berlin-Adlershof
Vogel, D.; Gollhardt, A.; Michel, B.
Journal Article
2001Optimized rapid thermal-process for high-efficiency silicon solar-cells
Noel, S.; Slaoui, A.; Peters, S.; Lautenschlager, H.; Schindler, R.; Müller, J.C.
Journal Article
2001Preface. Editorial
Michel, B.; Schubert, A.
Journal Article
2001Reliability prediction of area array solder joints
Dudek, R.; Döring, R.; Michel, B.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Conference Paper
2001Studies on parameters for popcorn cracking
Dudek, R.; Walter, H.; Michel, B.; Alpern, P.; Schmidt, R.; Tilgner, R.
Journal Article
2001Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders
Schubert, A.; Walter, H.; Dudek, R.; Michel, B.; Lefranc, G.; Otto, J.; Mitic, G.
Conference Paper
2001Upscaling of texture-etched zinc oxide substrates for silicon thin film solar cells
Müller, J.; Schöpe, G.; Kluth, O.; Bech, R.; Ruske, M.; Trube, J.; Szyszka, B.; Jiang, X.; Bräuer, G.
Conference Paper
2001Verbundwerkstoffe und Werkstoffverbunde in der Mikrosystemtechnik
Michel, B.
Conference Paper
2001Vibration measurements of micro assemblies by means of laser techniques
Rümmler, N.; Schnitzer, R.; Michel, B.
Journal Article
2001Werkzeuge für Grüne Elektronik
Middendorf, A.; Schischke, K.; Stobbe, I.; Griese, H.; Reichl, H.
Journal Article
2000Analyses of flip-chip attach reliability
Dudek, R.; Schubert, A.; Michel, B.
Conference Paper
2000Analysis of micromaterials
Schwencke, B.; Müller, J.; Griese, H.
Conference Paper
2000Analytics of printed circuit boards for environmental assessment
Schwencke, B.; Müller, J.; Griese, H.; Altendorf, P.
Conference Paper
2000Aufbau-, Verbindungs- und Verkapselungstechnik in der Mechatronik. Neuartige Systemlösungen
Ansorge, F.; Becker, K.-F.; Großer, V.; Michel, B.; Braun, T.
Journal Article
2000Automated optical measurements under vacuum
Hillmann, V.; Großer, V.; Gentzsch, S.; Bloch, H.; Michel, B.
Conference Paper
2000Case Study on the Environmental Impacts of a Mobile Phone
Oiva, L.; Oppermann, W.; Middendorf, A.; Zuber, K.-H.; Stobbe, I.
Conference Paper
2000Characterisation of micromaterials and microcomponents by combination of microbending test and UNIDAC
Seiler, B.; Kieselstein, E.; Dost, M.; Wielage, B.; Michel, B.
Conference Paper
2000Characterization of Micro Materials and Micro Components by Combination of the Micro-Bending Test and UNIDAC
Michel, B.; Seiler, B.; Dost, M.; Wielage, B.; Kieselstein, E.; Winkler, T.; Dudek, R.; Auersperg, J.; Schubert, A.; Schneider, W.
Conference Paper
2000Database for materials in micro systems
Villain, J.; Müller, T.; Michel, B.; Totzauer, W.
Conference Paper
2000Deformation behavior of micro mirror arrays under optical power
Kurth, S.; Kehr, K.; Kaufmann, C.; Faust, W.; Dötzel, W.; Michel, B.
Conference Paper
2000Determination of Materials Properties on Micro Components
Vogel, D.; Sommer, J.-P.; Kühnert, R.; Michel, B.
Conference Paper
2000Ecological and Economical Effects of Lead Free Soldering
Deubzer, O.; Suga, T.; Griese, H.
Conference Paper
2000EE-Toolbox - A modular assessment system for the environmental optimization of electronics
Middendorf, A.; Nissen, N.F.; Griese, H.; Müller, J.; Pötter, H.; Reichl, H.; Stobbe, I.
Conference Paper
2000Environmental assessment of lead free interconnection systems
Griese, H.; Müller, J.; Reichl, H.; Somi, G.; Stevels, A.; Zuber, K.-H.
Conference Paper
2000Environmental Assessment Using the IZM/EE Toolbox
Nissen, N.F.; Griese, H.; Müller, J.; Middendorf, A.; Stobbe, I.; Reichl, H.; Funk, T.
Conference Paper
2000Evaluation and testing of microsystems using optical methods
Großer, V.; Bombach, C.; Gentzsch, S.; Hillmann, V.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Evaluation of GlobTop materials for COB applications
Walter, H.; Schubert, A.; Schneider, W.; Kieselstein, E.; Auerswald, E.; Michel, B.
Conference Paper
2000Evaluation of the Toxic Effects of Waste Liquid Crystal Displays (LCD) to the Environment
Rau, F.; Kalnowski, G.; Heinze, L.; Müller, J.
Conference Paper
2000Experimental and numerical analyses of flip-chip attach reliability
Schubert, A.; Dudek, R.; Michel, B.
Conference Paper
2000Experimental and numerical investigations of microelectroplated sensors
Vogel, J.; Sommer, J.-P.; Noack, E.; Kieselstein, E.; Auerswald, E.; Gentzsch, S.; Großer, V.; Winkler, T.; Michel, B.
Conference Paper
2000Experimental and numerical reliability investigations of FCOB assemblies with process-induced defects
Schubert, A.; Dudek, R.; Kloeser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Finite-element investigation on testing devices for solder joint reliability evaluation
Kaulfersch, E.; Vogel, J.; Sommer, J.-P.; Michel, B.
Conference Paper
2000Fracture electronics and thermomechanical compatibility (TMC) of microcomponents in high tech systems
Michel, B.; Winkler, T.
Conference Paper
2000Fracture mechanics characterization of epoxy resins with Mini-Compact-Tension(CT)-Specimens
Walter, H.; Bierögel, C.; Grellmann, W.; Fedtke, M.; Michel, B.
Conference Paper
2000Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Annual Report 1999
Michel, B. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin
Annual Report
2000Future Power Supplies for Portable Electronics and Their Environmental Issues
Hahn, R.; Müller, J.
Conference Paper
2000Implementation of Environmental Issues in SMEs
Müller, J.; Griese, H.; Middendorf, A.; Nissen, N.F.; Teller, M.
Conference Paper
2000In situ measurement of deformations on microelectronic components by microscopic methods
Faust, W.; Bombach, C.; Michel, M.; Michel, B.
Conference Paper
2000Industrial Working Group for Lead Free Interconnection Systems in Electronics
Hahn, R.; Müller, J.
Conference Paper
2000Integration of micro-mechatronics in automotive applications
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Integration of micro-mechatronics in automotive applications using environmentally accepted materials
Ansorge, F.; Becker, K.-F.; Michel, B.; Leutenbauer, R.; Großer, V.; Aschenbrenner, R.; Reichl, H.
Conference Paper
2000Interface fracture investigations on micro components
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
Fulltext
2000Investigation of interface cracking in electronic packages
Kieselstein, E.; Seiler, B.; Winkler, T.; Auersperg, J.; Dudek, R.; Schubert, A.; Schneider, W.; Michel, B.
Conference Paper
2000Material Characterization and FE Analysis of Electroplated Microrelays
Vogel, J.; Sommer, J.-P.; Faust, W.; Kieselstein, E.; Michel, B.
Conference Paper
2000Materials science and engineering - a major topic in the future of microelectronic packaging
Reichl, H.; Michel, B.; Schubert, A.
Conference Paper
2000Measurement of material properties by a modified microDAC approach
Vogel, D.; Luczak, F.; Wittler, O.; Gollhardt, A.; Walter, H.; Michel, B.
Conference Paper
2000Measurement of Thermal Expansion in Micromaterials - cTest Microscopy
Kühnert, R.; Tränkner, K.; Herrmann, A.; Vogel, D.; Michel, B.
Conference Paper
2000Measurement of thermally induced strains on flip chip and chip scale packages
Vogel, D.; Kaulfersch, E.; Simon, J.; Kuehnert, R.; Schubert, A.; Michel, B.
Conference Paper
2000Mechanical design support by means of FEA for advanced millimeter wave communication devices
Sommer, J.-P.; Michel, B.; Döring, R.; Hager, W.; Rehme, F.
Conference Paper
2000A micro system tool for improved maintenance, quality assurance and recycling
Grudzien, W.; Seliger, G.; Middendorf, A.; Reichl, H.
Conference Paper
2000MicroDAC strain measurement for FEA support
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.; Michel, B.
Conference Paper
2000Mixed mode interfacial fracture toughness investigations for thermo-mechanical reliability enhancement of plastic packages
Auersperg, J.; Kieselstein, E.; Schubert, A.; Michel, B.
Conference Paper
2000Mode shape analysis of microstructures by means of laser-optical methods
Rümmler, N.; Schnitzer, R.; Großer, V.; Michel, B.
Conference Paper
2000Modular loading and measuring system for material characterization of microcomponents
Vogel, J.; Dost, M.; Seebacher, S.; Osten, W.; Fassler, R.; Köpp, N.; Döring, R.; Sommer, J.-P.; Michel, B.
Conference Paper
2000New investigations in materials research by confocal laser scanning microscopy
Kunath-Fandrei, G.; Faust, W.; Ullmann, P.; Michel, B.
Conference Paper
2000Numerical and experimental investigations of large IC flip chip attach
Schubert, A.; Dudek, R.; Leutenbauer, R.; Coskina, P.; Becker, K.-F.; Kloeser, J.; Michel, B.; Reichl, H.; Baldwin, D.; Qu, J.; Sitaraman, S.; Wong, C.P.; Tummala, R.
Conference Paper
2000Package reliability studies by experimental and numerical analysis
Schubert, A.; Dudek, R.; Michel, B.; Reichl, H.
Conference Paper
2000Parameterization in finite element modeling of microelectronics packages
Auersperg, J.; Döring, R.; Dudek, R.; Michel, B.
Book Article
2000Rapid prototyping of microcomponents and demonstrators in micro system technology
Fleischer, L.; Faust, W.; Dost, M.; Michel, B.; Vogel, J.; Zeidler, H.
Conference Paper
2000Reliability investigations of FCOB assemblies with process-induced defects
Schubert, K.; Dudek, R.; Klöser, J.; Michel, B.; Reichl, H.; Hauck, T.; Kaskoun, K.
Conference Paper
2000Reliability investigations of vibration excited circuit boards
Rümmler, N.; Schnitzer, R.; Döring, R.; Kaulfersch, E.; Faust, W.; Michel, B.
Conference Paper
2000Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism
Dudek, R.; Berek, H.; Fritsch, T.; Michel, B.
Journal Article
2000Results of Experimental Vibration Measurements as Input of Numerical Reliability Valuations
Schnitzer, R.; Rümmler, N.; Dudek, R.; Michel, B.
Conference Paper
2000Simulation for fatigue, crack and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Simulation for fatigue, cracks and delamination
Dudek, R.; Auersperg, J.; Michel, B.
Conference Paper
2000Strain measurement in solder interconnects of advanced electronic packages
Gollhardt, A.; Vogel, D.; Michel, B.
Conference Paper