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2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP
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Title
2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP
Titel Supplements
Rome, Italy, 1 - 3 April 2009. Technical presentations of 2 conferences - CAD, design and test, Microfabrication, integration and packaging
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2009
Konferenz
Symposium on Design, Test, Integration and Packaging of MEMS, MOEMS (DTIP) 2009
Conference on CAD, Design and Test 2009
Conference on Microfabrication, Integration and Packaging 2009