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International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1995. Proceedings
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Title
International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium 1995. Proceedings
Titel Supplements
combines the Second International Flip Chip and Ball Grid Array Symposium with the Seventh International TAB and Advanced Packaging Symposium
Institut
Semiconductor Technology Center, Inc.
Verlag
Semiconductor Technology Center
Verlagsort
Neffs, Pa.
Datum
1995
Konferenz
International TAB and Advanced Packaging Symposium (ITAP) 1995
International Flip Chip, Ball Grid Array, TAB, and Advanced Packaging Symposium 1995