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21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
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Title
21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
Titel Supplements
5-8 July 2020, Cracow, Poland, Virtual Event
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
IEEE
Verlagsort
Piscataway, NJ
Datum
2020
Konferenz
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2020