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Wafer bonding and thinning techniques for materials intergration
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Title
Wafer bonding and thinning techniques for materials intergration
Titel Supplements
April 16 - 20, 2001, San Francisco, California, USA
Institut
Materials Research Society -MRS-
Verlag
MRS
Verlagsort
Warrendale, Pa.
Datum
2001
Serie
Materials Research Society Symposium Proceedings
ISSN
0272-9172
Konferenz
Symposium "Wafer Bonding and Thinning Techniques for Materials Intergration" 2001
Materials Research Society (Spring Meeting) 2001